CN103252597B - Hot-setting backing welding flux and preparation method thereof - Google Patents

Hot-setting backing welding flux and preparation method thereof Download PDF

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CN103252597B
CN103252597B CN201310220355.7A CN201310220355A CN103252597B CN 103252597 B CN103252597 B CN 103252597B CN 201310220355 A CN201310220355 A CN 201310220355A CN 103252597 B CN103252597 B CN 103252597B
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solder flux
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welding
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CN103252597A (en
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李晓泉
闫业良
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Jiangsu Jinyu Automation Engineering Co., Ltd
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Nanjing Institute of Technology
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Abstract

The invention discloses a hot-setting backing welding flux and a preparation method thereof, and belongs to the field of welding materials for union melt welding. The flux comprises the following components by mass percentage: 18% of aluminum oxide, 22% of magnesite, 5% of natural wollastonite, 9% of fluorite, 2% of silicon mud, 3% of zircon sand, 30% of reduced iron powder, 2% rutile, 3% of ferromanganese, 3% of silicon iron and 3% of ferro-aluminium. The welding flux is spread on the surface of a copper plate uniformly before welding; when the front is welded, the back of a root molten pool and the welding flux conduct partial metallurgical reaction, and the welding flux is heated and solidified to become a backing to assist in back welded joint forming simultaneously; the welding flux takes MgO, CaO, SiO2, TiO2, CaF2 and Al2O3 as basic slagging substances; and the welded joint quality is good. According to the preparation method, a hot-setting agent is added by a special fabrication mode, so that the welding flux forms solid blocks at 200-300 DEG C, no air hole is formed in the welded joint, and the welded joint quality is high.

Description

A kind of heat cure liner solder flux and preparation method thereof
Technical field
The invention belongs to Lincoln weld field of welding material, specifically, relate to a kind of solder flux, more particularly, relate to a kind of back bead heat cure liner assist formation sintered flux used in the automatic single face welding and double face shaping process of submerged arc and preparation method thereof.
Background technology
Lincoln weld is a kind of high-efficiency welding method, is widely used in the splicing processing and manufacturing of plane steel plate.Traditional welding procedure adopts the welding of first front, then by steel plate upset carbon arc air gouging trimming root, then carries out the welding procedure of reverse side shaping, but this welding procedure exists the defect in efficiency low and at substantial man-hour.Along with the maximization of processing steel plate, its upset is more and more subject to the restriction of hall space, and this makes two-sided welding manufacturing process be difficult to carry out.It is adopt single-side welding double-side forming that current one is more effectively improved one's methods, and namely while front carries out welding, the back side is also automatically formed and has certain reinforcement and the comparatively bright and clean circular arc welding bead in surface.Submerged-arc welding is difficult to the back bead forming such shape in the ordinary course of things, and certain technological measure must be adopted to carry out back bead assist formation.At present about single-side welding double-side forming method, people have employed ceramic substrate carbon dioxide gas arc welding single face welding and double face shaping method, copper lining method, flux backing process, flux copper-gasket method etc.Wherein flux copper-gasket method can meet back bead and liner fits tightly preferably, can effectively control sealing run reinforcement again, and be easy to obtain uniform back bead, because of but a kind of method preferably, but associated welds material also needs further exploitation." development of heat cure liner solder flux of RF method " (Liu Weiping, He Shaoqing, solder technology, 1997, the third phase) openly reports the development utilizing solder flux to make the submerged arc welding liner solder flux of liner, and the flux constituent that this report provides consists of: SiO 2+ TiO 2: 15% ~ 20%, CaO+MgO:15% ~ 20%, Al 2o 3: 5% ~ 10%, CaF 2: 10% ~ 15%, Fe:40%, other: 8% ~ 10%.But this report whole composition of unexposed solder flux and manufacturing process, be applicable to flux backing process one side welding with back formation technique.It is wayward to there is sealing run reinforcement in the method, is also not suitable for laying solder flux on copper coin surface and carries out auxiliary sealing run forming welding technique.China Patent No. ZL200910134768.7, publication date on October 28th, 2009, disclose the patent document that a name is called " single-side hidden arc welding liner solder flux and use its single-side hidden arc welding method ", single-side hidden arc welding liner solder flux for single-side hidden arc welding method uses together with copper coin as liner, the state that copper coin scatters with certain thickness is pressed against the groove back side of welded steel together with this copper coin, while form back bead from groove face side while weld, its pulverization rate is 3.0 ~ 10.0%.By the good compactness using such liner solder flux to guarantee the groove back side of liner solder flux and welded steel, shape, appearance stablity can be obtained, sound back bead.But this patent just can realize in theory, lacks effective solder flux.
Summary of the invention
The problem that 1, will solve
For prior art in the splicing processing and manufacturing of plane steel plate, the efficiency of submerged-arc welding is low, and cost is high, the problem of not easily processing, and the invention provides a kind of heat cure liner solder flux and preparation method thereof.Before the weldering of this solder flux, spreading, on copper coin surface, then fits tightly with steel plate to be welded groove position equably, during the welding of front root molten bath overleaf with solder flux generating portion metallurgical reaction while, solder flux is heated and is solidified into liner and is shaped with auxiliary sealing run; Solder flux is with MgO, CaO, SiO 2, TiO 2, CaF 2, Al 2o 3for basic slag making material, in solder flux, also add thermoplastic phenolic formaldehyde resin in proportion, make solder flux constipation between 200 DEG C ~ 300 DEG C become solid block but unlikelyly in weld seam, produce pore.
2, technical scheme
In order to solve the problem, the technical solution adopted in the present invention is as follows:
A kind of heat cure liner solder flux, its composition and mass percent are: aluminium oxide 18%, magnesia 22%, natural wollastonite 5%, fluorite 9%, silicon mud 2%, zircon sand 3%, reduced iron powder 30%, rutile 2%, ferromanganese 3%, ferrosilicon 3%, ferro-aluminum 3%.
Preferably, described aluminium oxide is the technical grade alpha-type aluminum oxide through 1450 DEG C of calcinings, and Task-size Controlling is at 80-200 order.Can fully ensure like this to remove its internal crystallization water.
Preferably, described magnesia is the fused magnesite after heat fused process, and wherein Mg content is not less than 90%, and the mass percent of sulphur, phosphorus content is all less than 0.04%, and granularity is 80-100 order; SiO in described natural wollastonite 2content is not less than 42%, CaO content is not less than 47%, and the mass percent of sulphur, phosphorus content is all less than 0.04%, granularity: 80-100 order.
Preferably, described fluorite meets the following conditions: CaF 2mass percent>=96%; The mass percent of sulphur, phosphorus content is all less than 0.03%, granularity: 80-100 order; Described silicon mud meets the following conditions: SiO 2mass percent>=90%, the mass percent of sulphur, phosphorus is all less than 0.03%, granularity: 200-250 order.
Preferably, described zircon sand meets the following conditions: ZrO 2mass percent>=60%, SiO 2mass percent≤32%, mass percent≤0.03% of S, mass percent≤0.09% of P, granularity 60-120 order; Described reduced iron powder meets the following conditions: mass percent>=98% of Fe, mass percent≤0.02% of S, mass percent≤0.02% of P, hydrogen loss≤0.5%, granularity: 100-150 order.
Preferably, described rutile meets the following conditions: TiO 2mass percent>=95%, the mass percent of sulphur, phosphorus is all less than 0.04%, granularity: 60-120 order; Described ferromanganese meets Mn>=75%, P≤0.33%, S≤0.03%, granularity: 80-120 order; Ferrosilicon meets Si:42%-47%, P≤0.04%, S≤0.02%, granularity: 80-120 order; Ferro-aluminum meets Al>=50%, P≤0.04%, S≤0.04%, granularity: 80-100 order.
A preparation method for foregoing heat cure liner solder flux, it comprises the following steps:
(1) prepare burden: the raw material meeting previous technique condition are mixed with mixed powder by formula composition;
(2) by dry mix mode, the mixed powder in step (1) is stirred, mix; And then add waterglass and carry out wet stirring, waterglass addition is the 15%-18% of mixed powder quality;
(3) screen cloth screening or comminutor carry out granulation, dry;
(4) thermoplastic phenolic formaldehyde resin is poured in anhydrous propanone dissolve, thermoplastic phenolic formaldehyde resin concentration is in acetone 0.5 grams per milliliter, hexamethylenetetramine is added again by the proportioning of 3.75 grams/100 milliliters, dry in 1000 grams the ratio of solution that solder flux add 200 milliliters of preparations until completely dissolved to pour in solder flux and to stir, then under normal temperature, acetone evaporated is removed, then pack.
Preferably, the waterglass in described step (2) is the waterglass that potassium sodium ratio is 1:1, modulus M=3.1, Baume concentration is 41-43 ° of Be '.
Preferably; 12 object screen clothes are selected in screen cloth screening in described step (3), and comminutor carries out granulation, and Task-size Controlling is below 11 orders; the oven dry of step (3) is the low temperature drying of 200 DEG C × 1h, and then curing through 450 DEG C × 1h.
Preferably, the oven dry in described step (4) is being no more than acetone volatilization removal at the temperature of 60 DEG C.
Heat cure solder flux provided by the invention can meet sealing run and well be shaped, for submerged-arc welding single face welding and double face shaping provides necessary consumptive material to ensure.
3, beneficial effect
Compared to prior art, beneficial effect of the present invention is:
(1) solder flux of the present invention is with MgO, CaO, SiO 2, TiO 2, CaF 2, Al 2o 3for basic slag making material, and other material matches making, and the appearance of weld welded is good;
(2) there is a small amount of metallurgical reaction and form the thin skull of one deck to ensure the fineness on sealing run surface in heat cure liner solder flux of the present invention molten bath root and solder flux in welding process, and the fineness of face of weld is good, attractive in appearance, and defect is few;
(3) in the preparation method of heat cure liner solder flux of the present invention, curing agent adds containing moisture, but the anhydrous propanone being easy under employing normal temperature volatilize makes solvent, the method is adopted to make an addition in solder flux, solvent composition can ensure fully to vapor away being no more than at the temperature of 60 DEG C preferably, and thus during welding, welding quality generally can not impact;
(4) also adopt special facture mode to add thermal curing agents in solder flux, make solder flux constipation between 200 DEG C ~ 300 DEG C become solid block but unlikelyly in weld seam, produce pore, the weldquality welded is high.
Detailed description of the invention
Further illustrate the present invention by the following examples.
Embodiment 1
Adopt method of the present invention, the present embodiment has prepared 5 kilograms of heat cure solder flux, the component of this solder flux and the mass percent of each component are: aluminium oxide is (through the technical grade alpha-type aluminum oxide of 1450 DEG C of calcinings, granularity: 80-100 order) 18%, (Mg content is 90% to magnesia, through electric smelting melt processed, the mass percent of sulphur, phosphorus content is all less than 0.04%, and granularity is 80-90 order) 22%, natural wollastonite (SiO 2: 42%, CaO:47%, the mass percent of sulphur, phosphorus content is all less than 0.04%, granularity: 80-90 order) 5%, fluorite (CaF 2: 96%, the mass percent of sulphur, phosphorus content is all less than 0.03%, granularity: 80-90 order) 9%, silicon mud (SiO 2: 98%, the mass percent of sulphur, phosphorus content is all less than 0.03%, granularity: 200-230 order) 2%, zircon sand (ZrO 2: 60%, SiO 2: 32%, the mass percent of sulphur is less than 0.03%, the mass percent of phosphorus content is less than 0.09%, granularity: 60-100 order) 3%, reduced iron powder (Fe:98%, the mass percent of sulphur, phosphorus content is all less than 0.02%, hydrogen loss≤0.5, granularity: 100-120 order) 30%, rutile (TiO 2: 95%, the mass percent of sulphur, phosphorus content is all less than 0.04%, granularity: 60-100 order) 2%, ferromanganese (Mn:75%, P≤0.33%, S≤0.03%, granularity: 80-100 order) 3%, ferrosilicon (Si:42%, P≤0.04%, S≤0.02%, granularity: 80-100 order) 3%, ferro-aluminum (Al:50%, P≤0.04%, S≤0.04%, granularity: 80-100 order) 3%.
This heat cure liner solder flux is prepared as follows:
(1) prepare burden: become mixed powder by meeting above-mentioned raw material by formulated.
(2), after batch mixing, first by dry mix mode, powder is mixed; And then to add potassium sodium mol ratio be that 1:1, modulus M=3.1, Baume concentration are not obvious to influential effect between 41-43 ° of Be ', the preferred Baume concentration of the present embodiment carries out wet stirring at the waterglass of 41 ° of Be ', and waterglass addition is 15% of mixed powder quality; To ensure that powder has certain viscosity, but unlikely caking is advisable, and notices that waterglass must not add excessive, otherwise is difficult to granulation after caking.
(3) carry out granulation with 12 object screen clothes, Task-size Controlling, below 11 orders, through the low temperature drying of 200 DEG C × 1h after granulation, and then cures and obtains required solder flux through 450 DEG C × 1h.
(4) thermoplastic phenolic formaldehyde resin is poured in anhydrous propanone dissolve, the concentration of thermoplastic phenolic formaldehyde resin is 0.5 grams per milliliter, hexamethylenetetramine is added again by the proportioning of 3.75 grams/100 milliliters, dry in every 1000 grams ratio that solder flux add 200 ml solns until completely dissolved to pour in solder flux and to stir, then below 60 DEG C of temperature, acetone volatilization is removed, pack again, prevent from during preservation making moist.
The solder flux that employing is prepared above utilizes three submerged arc welding machines to weld at shipyard.Welding steel is the D36 ship plate that 30mm is thick, opens the double V-groove of 56 °, and the root straight flange degree of depth is 7mm.Before weldering, obtained heat cure solder flux uniform spreading is sprinkling upon the copper coin surface bottom groove, then passes into air bag with compressed air and up push up pressure from copper coin bottom, make close contact bottom solder flux and steel plate to be welded.Shown in employing table 1, the welding wire of chemical composition makes packing material.Three root wire diameters are respectively front silk 4.8mm, middle silk 4.8mm, rear silk 6.4mm, and the NSH-50 Large Heat Input Welding sintered flux that front welding nippon provides welds, and welding parameter is as shown in table 2.
Table 1 base metals chemical composition (percentage by weight %)
C Si Mn P S Fe
0.16 0.37 1.50 0.014 0.006 Surplus
The welding parameter of table 2 embodiment 1
Welding result shows welding under the heat and the acting in conjunction of compressed air applying extruding force imported into bottom steel plate, and solder flux can be solidified into bulk and serve as liner effect; Simultaneously solder flux also can with molten bath bottom liquid metal there is certain metallurgical reaction, form the thin skull of one deck with the shaping of auxiliary sealing run, but be unlikely form pore in weld seam.
Carry out mechanical property test by welding the weld seam sampling obtained, deposited metal mechanical experimental results is in table 3.
Table 3 deposited metal mechanical experimental results
Yield strength σ s/MPa Tensile strength sigma b/Mpa V-notch impact value (0 DEG C)/J
422 546 70 68 80 (mean values 73)
Embodiment 2
Adopt method of the present invention, the present embodiment has prepared 5 kilograms of heat cure solder flux, the component of this solder flux and the mass percent of each component are: aluminium oxide is (through the technical grade alpha-type aluminum oxide of 1450 DEG C of calcinings, granularity: 80-100 order) 18%, (Mg content is 95% to magnesia, through electric smelting melt processed, the mass percent of sulphur, phosphorus content is all less than 0.04%, and granularity is 90-100 order) 22%, natural wollastonite (SiO 2: 45%, CaO:50%, the mass percent of sulphur, phosphorus content is all less than 0.04%, granularity: 90-100 order) 5%, fluorite (CaF 2: 98%, the mass percent of sulphur, phosphorus content is all less than 0.03%, granularity: 90-100 order) 9%, silicon mud (SiO 2: 90%, the mass percent of sulphur, phosphorus content is all less than 0.03%, granularity: 200-230 order) 2%, zircon sand (ZrO 2: 70%, SiO 2:≤25%, the mass percent of sulphur is less than 0.03%, the mass percent of phosphorus content is less than 0.09%, granularity: 60-100 order) 3%, reduced iron powder (Fe:99%, the mass percent of sulphur, phosphorus content is all less than 0.02%, hydrogen loss≤0.5, granularity: 130-150 order) 30%, rutile (TiO 2: 98%, the mass percent of sulphur, phosphorus content is all less than 0.04%, granularity: 60-100 order) 2%, ferromanganese (Mn:85%, P≤0.33%, S≤0.03%, granularity: 110-120 order) 3%, ferrosilicon (Si:47%, P≤0.04%, S≤0.02%, granularity: 110-120 order) 3%, ferro-aluminum (Al:54%, P≤0.04%, S≤0.04%, granularity: 100-120 order) 3%.
This heat cure liner solder flux is prepared as follows:
(1) prepare burden: become mixed powder by meeting above-mentioned raw material by formulated.
(2), after batch mixing, first by dry mix mode, powder is mixed; And then add potassium sodium mol ratio is 1:1, modulus M=3.1, Baume concentration are 43 ° of Be ' waterglass and carry out wet stirring, waterglass addition is that the 15%-18% of mixed powder quality can, to ensure that powder has certain viscosity, but unlikely caking is advisable, notice that waterglass must not add excessive, otherwise be difficult to granulation after caking, the weak effect between 15%-18% is apart from little, and the present embodiment adopts 17%; ;
(3) carry out granulation with 11 object screen clothes, Task-size Controlling, below 10 orders, through the low temperature drying of 200 DEG C × 1h after granulation, and then cures and obtains required solder flux through 450 DEG C × 1h.
(4) thermoplastic phenolic formaldehyde resin is poured in anhydrous propanone dissolve, the concentration of thermoplastic phenolic formaldehyde resin is 0.5 grams per milliliter, hexamethylenetetramine is added again by the proportioning of 3.75 grams/100 milliliters, dry solder flux by every 1000 grams until completely dissolved to add 200 ml solns and to pour in solder flux and to stir, then below 60 DEG C of temperature, acetone volatilization is removed, pack again, prevent from during preservation making moist.
With the heat cure solder flux prepared, utilize three submerged arc welding machines to weld at shipyard above, base metals is the AH32 ship plate of thickness 22mm, and open the double V-groove of 50 ° before weldering by plasma cut method, groove root retains 3mm linear side dimension.Heat cure solder flux is laid on copper coin surface, makes copper coin generation pressure on top surface upwards with the compressed air air bag passed into below copper coin, and solder flux and the steel plate back side to be welded of now copper coin and surface laying fit tightly.The Y-A type welding wire adopting nippon company to provide and NSH-50 make front solder flux and weld, and three gage of wires are respectively: front filament diameter 4.8mm, and middle silk and rear filament diameter are respectively 4.8mm, 6.4mm, and welding parameter is shown in Table 4.
Welding parameter in table 4 embodiment 2
Result of implementation shows, solder flux can form the block solder flux of solidification to hold bottom molten bath as liner under arc heat and the effect of air bag uplifting pressure, simultaneously in pad surfaces by reciprocation between slag and liquid metal, there is metallurgical reaction and form the thin slag uniform fold of one deck in back bead assist formation, back of weld is formed there is certain reinforcement, and the reverse side welding bead of any surface finish.Although containing certain organic substance in solder flux composition, and be unlikely the defect producing pore and so on.The thin slag that the back side is formed and sealing run have good separation property, show that de-slag is better, and along with the removal of gasbag pressure, the skull that comes off remains in solidification solder flux surface.
Carry out mechanical property test by welding the weld seam sampling obtained, deposited metal mechanical experimental results is in table 5.
Table 5 deposited metal mechanical experimental results
Tensile strength sigma b/MPa Percentage elongation (%) V-notch impact value (0 DEG C)/J
553 25 95 70 83 (mean values 83)
Above-mentioned test result show this heat cure liner solder flux in use butt welded seam mechanical property do not have an impact, performance meets CCS " steel ship construction rules " requirement to welding material.

Claims (10)

1. a heat cure liner solder flux, its composition and mass percent are: aluminium oxide 18%, magnesia 22%, natural wollastonite 5%, fluorite 9%, silicon mud 2%, zircon sand 3%, reduced iron powder 30%, rutile 2%, ferromanganese 3%, ferrosilicon 3%, ferro-aluminum 3%.
2. a kind of heat cure liner solder flux according to claim 1, is characterized in that, described aluminium oxide is the technical grade alpha-type aluminum oxide through 1450 DEG C of calcinings, and Task-size Controlling is at 80-200 order.
3. a kind of heat cure liner solder flux according to claim 1, it is characterized in that, described magnesia is the fused magnesite after heat fused process, and wherein Mg content is not less than 90%, the mass percent of sulphur, phosphorus content is all less than 0.04%, and granularity is 80-100 order; SiO in described natural wollastonite 2content is not less than 42%, CaO content is not less than 47%, and the mass percent of sulphur, phosphorus content is all less than 0.04%, granularity: 80-100 order.
4. a kind of heat cure liner solder flux according to claim 1, it is characterized in that, described fluorite meets the following conditions: CaF 2mass percent>=96%; The mass percent of sulphur, phosphorus content is all less than 0.03%, granularity: 80-100 order; Described silicon mud meets the following conditions: SiO 2mass percent>=90%, the mass percent of sulphur, phosphorus is all less than 0.03%, granularity: 200-250 order.
5. a kind of heat cure liner solder flux according to claim 1, it is characterized in that, described zircon sand meets the following conditions: ZrO 2mass percent>=60%, SiO 2mass percent≤32%, mass percent≤0.03% of S, mass percent≤0.09% of P, granularity 60-120 order; Described reduced iron powder meets the following conditions: mass percent>=98% of Fe, mass percent≤0.02% of S, mass percent≤0.02% of P, hydrogen loss≤0.5%, granularity: 100-150 order.
6., according to a kind of heat cure liner solder flux in claim 1-5 described in any one, it is characterized in that, described rutile meets the following conditions: TiO 2mass percent>=95%, the mass percent of sulphur, phosphorus is all less than 0.04%, granularity: 60-120 order; Described ferromanganese meets Mn>=75%, P≤0.33%, S≤0.03%, granularity: 80-120 order; Ferrosilicon meets Si:42%-47%, P≤0.04%, S≤0.02%, granularity: 80-120 order; Ferro-aluminum meets Al>=50%, P≤0.04%, S≤0.04%, granularity: 80-100 order.
7. a preparation method for heat cure liner solder flux according to claim 1, it comprises the following steps:
(1) prepare burden: the raw material meeting claim 1 condition are mixed with mixed powder by formula composition;
(2) by dry mix mode, the mixed powder in step (1) is stirred, mix; And then add waterglass and carry out wet stirring, waterglass addition is the 15%-18% of mixed powder quality;
(3) screen cloth screening or comminutor carry out granulation, dry;
(4) thermoplastic phenolic formaldehyde resin is poured in anhydrous propanone dissolve, thermoplastic phenolic formaldehyde resin concentration is in acetone 0.5 grams per milliliter, hexamethylenetetramine is added again by the proportioning of 3.75 grams/100 milliliters, dry in 1000 grams the ratio of solution that solder flux add 200 milliliters of preparations until completely dissolved to pour in solder flux and to stir, then under normal temperature, acetone evaporated is removed, then pack.
8. the preparation method of a kind of heat cure liner solder flux according to claim 7, is characterized in that, the waterglass in described step (2) is the waterglass that potassium sodium ratio is 1:1, modulus M=3.1, Baume concentration is 41-43 ° of Be '.
9. the preparation method of a kind of heat cure liner solder flux according to claim 7; it is characterized in that; 12 object screen clothes are selected in screen cloth screening in described step (3); comminutor carries out granulation; Task-size Controlling is below 11 orders; the oven dry of step (3) is the low temperature drying of 200 DEG C × 1h, and then curing through 450 DEG C × 1h.
10. the preparation method of a kind of heat cure liner solder flux according to claim 7 or 8 or 9, is characterized in that, the oven dry in described step (4) is being no more than acetone volatilization removal at the temperature of 60 DEG C.
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