CN103252585B - Laser cutting head and use this laser cutting head to carry out the method for little hole machined - Google Patents
Laser cutting head and use this laser cutting head to carry out the method for little hole machined Download PDFInfo
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- CN103252585B CN103252585B CN201310180276.8A CN201310180276A CN103252585B CN 103252585 B CN103252585 B CN 103252585B CN 201310180276 A CN201310180276 A CN 201310180276A CN 103252585 B CN103252585 B CN 103252585B
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Abstract
The present invention designs a kind of laser cutting head, comprises light path system, regulating system, rotary system, dynamical system and transmission system; Light path system comprises reflecting optics assembly, hollow cavity and focus lamp, and the outgoing beam after the reflection of reflecting optics assembly is successively through hollow cavity and focus lamp, and focus lamp is fixed in the hollow structure of hollow cavity away from reflecting optics assembly one end; Regulating system is connected with reflecting optics assembly, for controlling the parallel close or parallel optical axis away from focus lamp of outgoing beam; Rotary system comprises ball bearing, and hollow cavity is fixed on ball bearing; Dynamical system is connected with transmission system, for driving transmission system; Transmission system is connected with hollow cavity, is rotated by ball bearing for making hollow cavity.This laser cutting head can process the less and good hole of circularity of the tapering that portals.The present invention also provides a kind of method using this laser cutting head to carry out little hole machined.
Description
Technical field
The present invention relates to laser drilling field, particularly relate to a kind of laser cutting head and use this laser cutting head to carry out the method for little hole machined.
Background technology
Along with the raising to capillary processing quality requirement, traditional capillary processing method can not meet the requirement of capillary processing aspect ratio.And laser boring is owing to having that efficiency is high, cost is low and the advantage such as overall economics remarkable benefit and enjoy people to pay attention to, and become indispensable in capillary processing gradually and a kind of drilling method of extensive use.It is industrial that laser boring is widely used in IT component, Aero-Space etc.
When adopting laser micropore processing cutter sweep to carry out laser boring, laser cutting head is by high power density (10
8~ 10
15w/cm
2) laser beam export on the surface of workpiece to be added, thus make the laser beam impinge of high power density workpiece to be added.Under the irradiation of the laser beam of high power density, the material of workpiece to be added melts gradually and evaporates, thus obtains the sizable hole with lasing beam diameter.Above-mentioned laser boring method can meet general punching requirement, but the hole obtained exists the larger problem of hole tapering, and can cause during punching and larger touch slag defect, and is difficult to get the good hole of circularity.
Summary of the invention
Based on this, being necessary to provide a kind of can portal the less and laser cutting head in the good hole of circularity of tapering in processing.
A kind of laser cutting head, comprises light path system, regulating system, rotary system, dynamical system and transmission system;
Described light path system comprises reflecting optics assembly, hollow cavity and focus lamp, outgoing beam after described reflecting optics assembly reflection is successively through described hollow cavity and described focus lamp, and described focus lamp is fixed in the hollow structure of described hollow cavity away from described reflecting optics assembly one end;
Described regulating system is connected with described reflecting optics assembly, for controlling the parallel close or parallel optical axis away from described focus lamp of described outgoing beam;
Described rotary system comprises ball bearing, and described hollow cavity is fixed on described ball bearing;
Described dynamical system is connected with described transmission system, for driving described transmission system;
Described transmission system is connected with described hollow cavity, is rotated by described ball bearing for making described hollow cavity.
Wherein in an embodiment, described reflecting optics assembly comprises parallel the first speculum of being oppositely arranged and the second speculum, and described second speculum is connected with described regulating system.
Wherein in an embodiment, described laser cutting head also comprises protective lens, and described protective lens is arranged on described rotary system on one end of described reflecting optics assembly.
Wherein in an embodiment, the number of described ball bearing is two, be respectively the first ball bearing and second ball bearing of relative spacing setting, described first ball bearing is near described reflecting optics assembly, described hollow cavity one end is fixed on described first ball bearing, the other end is fixed on described second ball bearing, and protrudes from described second ball bearing; Described transmission system is connected with the part between the second ball bearing at described first ball bearing with described hollow cavity.
Wherein in an embodiment, described laser cutting head also comprises the blowing nozzle assembly with hollow structure, the blowing nozzle that described blowing nozzle assembly comprises air blowing base and is fixed on air blowing base, described air blowing base is provided with groove away from the side of described blowing nozzle, and described groove is used for fixing described hollow cavity one end away from described reflecting optics assembly.
Wherein in an embodiment, described dynamical system comprises fixed head and is fixed on the motor on described fixed head, and described motor is connected with described transmission system.
Wherein in an embodiment, described transmission system comprises the first belt wheel, the second belt wheel and is coated on the annular belt on described first belt wheel and the second belt wheel belt wheel, described first belt wheel is connected with described dynamical system, and described second belt wheel is fixed on described hollow cavity.
Wherein in an embodiment, described laser cutting head also comprises housing, and described rotary system is fixed in described housing, and described hollow cavity protrudes from described housing away from one end of described reflecting optics assembly.
Wherein in an embodiment, described regulating system is amesdial.
Above-mentioned laser cutting head, by the injection direction of reflecting optics assembly adjustment laser beam, outgoing beam after the reflection of reflecting optics assembly is successively through hollow cavity and focus lamp, and focus lamp is fixed in the hollow structure of hollow cavity away from reflecting optics assembly one end.And rotary system, dynamical system and transmission system with the use of, drive hollow cavity to be rotated by ball bearing, the focus lamp making to be fixed in hollow cavity rotates.And regulating system can make the parallel close or parallel optical axis away from focus lamp of outgoing beam, outgoing beam is made to produce Departure displacement relative to the optical axis of focus lamp, thus the focal beam spot after outgoing beam line focus mirror is focused on carries out circular motion around optical axis, and then obtain there is higher circularity and the hole had compared with aperture tapering.And the size of the Departure displacement between outgoing beam and optical axis can be controlled by regulating system, and then the hole of different size can be obtained.
Use above-mentioned laser cutting head to carry out a method for little hole machined, comprise the steps:
Workpiece is provided;
Adjust the position of described workpiece, make the focal beam spot after described focus lamp focuses on be on described workpiece position to be punctured;
Regulate described regulating system, make the light shaft coaxle of the outgoing beam after described reflecting optics assembly reflection and described focus lamp, more described regulating system is made zero;
Regulate described regulating system according to the pore size in hole to be processed and formula L=(D-d)/2, wherein, L represents the size that need regulate described regulating system, and D represents the aperture in hole to be processed, and d is the diameter of focal beam spot, is 0.1 millimeter;
Laser cutting head moves to the position to be punctured of described workpiece, provides laser beam, and opens described dynamical system, makes described dynamical system from turning around, simultaneously auxiliary coaxial gas, and then on the position to be punctured of workpiece, get the hole in default aperture.
Said method technique is simple, easily processes the aperture that aperture is 0.1 ~ 1mm, and the aperture that processing obtains has higher circularity and has less hole tapering.
Accompanying drawing explanation
Fig. 1 is the structural representation of the laser cutting head of an embodiment;
Fig. 2 is the sectional view of the laser cutting head in Fig. 1 along A-A line.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, laser cutting head of the present invention and the method that uses this laser cutting head to carry out little hole machined are described more fully.Preferred embodiment of the present invention is given in accompanying drawing.But the present invention can realize in many different forms, is not limited to embodiment described herein.On the contrary, provide the object of these embodiments be make the understanding of disclosure of the present invention more comprehensively thorough.
It should be noted that, when element is called as " being fixed on " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.
Unless otherwise defined, all technology used herein and scientific terminology are identical with belonging to the implication that those skilled in the art of the present invention understand usually.The object of term used in the description of the invention herein just in order to describe specific embodiment, is not intended to be restriction the present invention.Term as used herein " and/or " comprise arbitrary and all combinations of one or more relevant Listed Items.
As shown in Figures 1 and 2, the laser cutting head 10 of an embodiment, comprises light path system 100, regulating system 200, rotary system 300, dynamical system 400 and transmission system 500.Laser beam 20 transfers to workpiece 30 through laser cutting head 10 and punches to it.
Light path system 100 comprises reflecting optics assembly 110, housing 120, protective lens 130, hollow cavity 140, focus lamp 150 and blowing nozzle assembly 160.
In the present embodiment, described reflecting optics assembly 110 comprises the first speculum 112 and the second speculum 114, first speculum 112 and the second speculum 114 is parallel is oppositely arranged, and the first speculum 112 and the second speculum 114 are 135 degree with horizontal plane angle.Second speculum 114 is fixed in regulating system 200 by installing plate 116.Outgoing beam after reflecting optics assembly 110 reflects is successively through protective lens 130, hollow cavity 140, focus lamp 150 and blowing nozzle assembly 160.Reflecting optics group 110 can be used for the exit direction adjusting laser beam 20, is convenient to the overall construction design of laser cutting head 10, and to make laser cutting head 10 more compact structure, volume is less.Therefore, be appreciated that in other embodiments, described reflecting optics assembly 110 also can only include the second speculum 114.
Housing 120 comprises integrated first housing parts 122 and the second housing parts 124.First housing parts 122 is near reflecting optics assembly 110, and the first housing parts 122 is hollow structure, and hollow space is cylindrical, for transmitting laser beam 20.
Protective lens 130 is fixed on rotary system 300 on one end of reflecting optics assembly 110 by protection base 132.Protective lens 130 and protection base 132 are all placed in the first housing parts 122, and protection base 132 is hollow structure, and its hollow space is cylindrical, and the internal diameter of cylindrical, hollow part is identical with the internal diameter of the hollow structure of the first housing parts 122.The Main Function of protective lens 130 prevents contamination by dust focus lamp 150.Therefore, be appreciated that in other embodiments, also can there is no protective lens 130.
Rotary system 300 is fixed in the second housing parts 124.In the present embodiment, rotary system 300 comprises the ball bearing that two relative spacings are arranged, be respectively the first ball bearing 310 and the second ball bearing 320, first ball bearing 310 is near reflecting optics assembly 110, and the first ball bearing 310 is near the surface of reflecting optics assembly 110 and the second housing parts 124 surperficial copline near reflecting optics assembly 110.Second ball bearing 320 is away from reflecting optics assembly 110, and the second ball bearing 320 is away from the surface of reflecting optics assembly 110 and the second housing parts 124 surperficial copline away from reflecting optics assembly 110.
Hollow cavity 140 is for having the cylinder of hollow structure, and its one end is fixed on the first ball bearing 310, and the other end on the second ball bearing 320, and protrudes from the second ball bearing 320.Thus hollow cavity 140 can be made by the first ball bearing 310 and the firm and stable rotation of the second ball bearing 320.Be appreciated that in other embodiments, rotary system 300 can only include the first ball bearing 310, and hollow cavity 140 can be made to be rotated by the first ball bearing 310.
Focus lamp 150 is fixed in the hollow structure of hollow cavity 140 away from reflecting optics assembly 110 one end, and the straight line at focus lamp 150 focus place is the optical axis of focus lamp 150.In the present embodiment, hollow cavity 110 protrudes from the second housing parts 124 away from one end of reflecting optics assembly 110, and therefore, focus lamp 150 can be positioned within the second housing parts 124, also can be positioned at outside the second housing parts 124.In the present embodiment, focus lamp 150 is positioned at outside the second housing parts 124, is more conducive to the replacing of focus lamp 150.
Blowing nozzle assembly 160 is hollow structure, does not affect the propagation of laser beam 20.Blowing nozzle assembly 160 comprises air blowing base 162 and is fixed on the blowing nozzle 164 on air blowing base 162.Side away from blowing nozzle 164 offers groove 166 to air blowing base 162, groove 166 is for fixing hollow cavity 140 one end away from reflecting optics assembly 110, also be, hollow cavity 140 protrudes from one end of the second housing parts 124, thus blowing nozzle assembly 160 is fixed on housing 120.Be appreciated that in other embodiments, hollow cavity 140 also can not protrude from the second housing parts 124, and now, blowing nozzle assembly 160 is directly fixed on the second surface of housing parts 124 away from reflecting optics assembly 110.
Blowing nozzle 164, for deriving the laser beam after line focus mirror 150 focusing, can be assisted with coaxial gas, the material of the workpiece 30 that be vaporized by the laser to be purged away in time, and then can reduce punched hole tapering simultaneously in blowing nozzle 164.Wherein, coaxial gas can be nitrogen, helium, argon gas etc.
Regulating system 200 is fixed on the first housing parts 122, for controlling the parallel close or parallel optical axis away from focus lamp 150 of the outgoing beam after reflecting optics assembly 110 reflects.Thus make the optical axis of laser beam 20 relative focus mirror 150 produce Departure displacement, also namely laser beam 20 is arranged with the optical axis parallel interval of focus lamp 150.And then when hollow cavity 140 rotates, the focal beam spot after laser beam 20 line focus mirror 150 focuses on moves in a circle around optical axis.In addition, regulating system 200 can also make laser beam 20 coaxial, avoids laser beam 20 to disperse.
In the present embodiment, regulating system 200 is amesdial.The connector 220 with screw that amesdial comprises adjusting rod 210 and is connected with adjusting rod 210, connector 220 is connected with installing plate 116.By regulating adjusting rod 210 to drive installing plate 116 to move through connector 220, and then realize the control to the second speculum 114.In embodiments, regulating system 200 is fixed on the first housing parts 122.
Dynamical system 400 is connected with transmission system 500, for driving transmission system 500.In the present embodiment, dynamical system 400 comprises fixed head 410 and is fixed on the motor 420 on fixed head 410.Fixed head 410 runs through the second housing parts 124 away from one end of motor 420 and is fixed on the second housing parts 124, thus makes the overall structure of laser cutting head 10 more succinct.
Transmission system 500 is connected with hollow cavity 140, is rotated by ball bearing for making hollow cavity 140.In the present embodiment, transmission system 500 comprises the first belt wheel 510, second belt wheel 530 and is coated on the annular belt 520 on the first belt wheel 510 and the second belt wheel 530.First belt wheel 510 is connected with dynamical system 400, second belt wheel 530 is fixed in the part of hollow cavity 140 between the first ball bearing 310 and the second ball bearing 320, thus dynamical system 400 can be realized drive transmission system 500 to drive hollow cavity 140 to be rotated by the first ball bearing 310 and the second ball bearing 320, focal beam spot after laser beam 20 line focus mirror 150 is focused on moves in a circle around optical axis, and then can laser boring be realized, obtain there is higher circularity and the hole had compared with aperture tapering.
Above-mentioned laser cutting head 10, the injection direction of laser beam 20 is adjusted by reflecting optics assembly 110, outgoing beam after reflecting optics assembly 110 reflects is successively through hollow cavity 140 and focus lamp 150, and focus lamp 150 is fixed in the hollow structure of hollow cavity 140 away from reflecting optics assembly 110 one end.And rotary system 300, dynamical system 400 and transmission system 500 with the use of, drive hollow cavity 140 to be rotated by ball bearing, the focus lamp 150 be fixed in hollow cavity 140 rotated.And regulating system 200 can make the parallel close or parallel optical axis away from focus lamp 150 of outgoing beam, outgoing beam is made to produce Departure displacement relative to the optical axis of focus lamp 150, thus the focal beam spot after outgoing beam line focus mirror 150 is focused on carries out circular motion around optical axis, and then obtain there is higher circularity and the hole had compared with aperture tapering.And the size of the Departure displacement between outgoing beam and optical axis can be controlled by regulating system 200, and then the hole of different size can be obtained.
Use above-mentioned laser cutting head 10 to carry out the method for little hole machined, comprise the steps:
Step S110, provides workpiece 30;
Step S120, is placed in the below of blowing nozzle 164 by workpiece 30, usual blowing nozzle 164 need vertically with workpiece 30 be placed; Then adjust workpiece 30 and the relative position of blowing nozzle 164, the focal beam spot after line focus mirror 150 focusing is on workpiece 30 position to be punctured.
Step S130, regulates regulating system 200, makes the light shaft coaxle of the outgoing beam (laser beam 20) after reflecting optics assembly 110 reflects and focus lamp 150.According to focal beam spot whether in blowing nozzle 164 centre, determine whether laser beam 20 is in coaxial state.Focal beam spot, in blowing nozzle 164 centre, is coaxial.After laser beam 20 is adjusted to coaxial state, then regulating system 200 is made zero.
Step S130, regulates regulating system 200 according to the pore size in hole to be processed and formula L=(D-d)/2.Wherein, L represents the size that need regulate regulating system 200, and D represents the aperture needing machining hole, and d is the diameter (for definite value 0.1 millimeter) of focal beam spot.Be 0.5 millimeter opening so that aperture need be processed, need the size regulating regulating system 200 to be 0.2 millimeter.According to formula, diameter is the focal beam spot of 0.1 millimeter, can process the hole that minimum-value aperture is 0.1 millimeter.The adjusting size that can realize due to regulating system 200 is limited, and therefore, the size in the hole that can process also is conditional.In the present embodiment, the maximum aperture that can process is the hole of 1 millimeter.
Step S140, laser cutting head 10 moves to the position to be punctured of workpiece 30, opens laser instrument, and the system 400 that turns on the power, make dynamical system 400 from turning around, simultaneously auxiliary coaxial gas, and then on the position to be punctured of workpiece 30, get the hole in default aperture.
Said method technique is simple, easily processes the aperture that aperture is 0.1 ~ 1mm, and the aperture that processing obtains has higher circularity and has less hole tapering.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a laser cutting head, is characterized in that, comprises light path system, regulating system, rotary system, dynamical system and transmission system;
Described light path system comprises reflecting optics assembly, hollow cavity and focus lamp, outgoing beam after described reflecting optics assembly reflection is successively through described hollow cavity and described focus lamp, and described focus lamp is fixed in the hollow structure of described hollow cavity away from described reflecting optics assembly one end;
Described regulating system is connected with described reflecting optics assembly, for controlling the parallel close or parallel optical axis away from described focus lamp of described outgoing beam;
Described rotary system comprises ball bearing, and described hollow cavity is fixed on described ball bearing;
Described dynamical system is connected with described transmission system, for driving described transmission system;
Described transmission system is connected with described hollow cavity, is rotated by described ball bearing for making described hollow cavity.
2. laser cutting head according to claim 1, is characterized in that, described reflecting optics assembly comprises parallel the first speculum of being oppositely arranged and the second speculum, and described second speculum is connected with described regulating system.
3. laser cutting head according to claim 1, is characterized in that, described laser cutting head also comprises protective lens, and described protective lens is arranged on described rotary system on one end of described reflecting optics assembly.
4. laser cutting head according to claim 1, it is characterized in that, the number of described ball bearing is two, be respectively the first ball bearing and second ball bearing of relative spacing setting, described first ball bearing is near described reflecting optics assembly, described hollow cavity one end is fixed on described first ball bearing, and the other end is fixed on described second ball bearing, and protrudes from described second ball bearing; Described transmission system is connected with the part between the second ball bearing at described first ball bearing with described hollow cavity.
5. laser cutting head according to claim 1, it is characterized in that, described laser cutting head also comprises the blowing nozzle assembly with hollow structure, the blowing nozzle that described blowing nozzle assembly comprises air blowing base and is fixed on air blowing base, described air blowing base is provided with groove away from the side of described blowing nozzle, and described groove is used for fixing described hollow cavity one end away from described reflecting optics assembly.
6. laser cutting head according to claim 1, is characterized in that, described dynamical system comprises fixed head and is fixed on the motor on described fixed head, and described motor is connected with described transmission system.
7. laser cutting head according to claim 1, it is characterized in that, described transmission system comprises the first belt wheel, the second belt wheel and is coated on the annular belt on described first belt wheel and the second belt wheel belt wheel, described first belt wheel is connected with described dynamical system, and described second belt wheel is fixed on described hollow cavity.
8. the laser cutting head according to any one of claim 1-7, it is characterized in that, described laser cutting head also comprises housing, and described rotary system is fixed in described housing, and described hollow cavity protrudes from described housing away from one end of described reflecting optics assembly.
9. the laser cutting head according to any one of claim 1-7, is characterized in that, described regulating system is amesdial.
10. use laser cutting head as claimed in any one of claims 1-9 wherein to carry out a method for little hole machined, it is characterized in that, comprise the steps:
Workpiece is provided;
Adjust the position of described workpiece, make the focal beam spot after described focus lamp focuses on be on described workpiece position to be punctured;
Regulate described regulating system, make the light shaft coaxle of the outgoing beam after described reflecting optics assembly reflection and described focus lamp, more described regulating system is made zero;
Regulate described regulating system according to the pore size in hole to be processed and formula L=(D-d)/2, wherein, L represents the size that need regulate described regulating system, and D represents the aperture in hole to be processed, and d is the diameter of focal beam spot, is 0.1 millimeter;
Laser cutting head moves to the position to be punctured of described workpiece, provides laser beam, and opens described dynamical system, makes described dynamical system from turning around, simultaneously auxiliary coaxial gas, and then on the position to be punctured of workpiece, get the hole in default aperture.
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CN201310180276.8A CN103252585B (en) | 2013-05-15 | 2013-05-15 | Laser cutting head and use this laser cutting head to carry out the method for little hole machined |
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CN201310180276.8A CN103252585B (en) | 2013-05-15 | 2013-05-15 | Laser cutting head and use this laser cutting head to carry out the method for little hole machined |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106312328A (en) * | 2015-07-07 | 2017-01-11 | 王爱华 | Laser cutting device |
CN105904105B (en) * | 2016-05-25 | 2020-05-26 | 广东工业大学 | Laser drilling device and method for improving hole taper |
CN112059409B (en) * | 2020-08-31 | 2022-06-21 | 深圳泰德激光技术股份有限公司 | Laser drilling device |
CN111992874A (en) * | 2020-09-22 | 2020-11-27 | 山东钢铁集团日照有限公司 | Method for adjusting laser light path of laser welding machine |
CN114939718B (en) * | 2022-06-30 | 2024-02-13 | 广东舜元激光科技有限公司 | Laser scribing device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2488635Y (en) * | 2001-08-02 | 2002-05-01 | 上海工程技术大学 | Water cooling and airflow protector in laser intensifying processor for surface of inner bore |
CN101053924A (en) * | 2007-05-24 | 2007-10-17 | 上海交通大学 | Beam splitting type laser roughing modulation device |
CN102039486A (en) * | 2010-11-09 | 2011-05-04 | 苏州德龙激光有限公司 | Laser helically rotating optical module applied to laser process equipment |
CN102554465A (en) * | 2012-02-08 | 2012-07-11 | 中国科学院福建物质结构研究所 | Rotary optical design applied to laser machining |
CN202622175U (en) * | 2011-12-20 | 2012-12-26 | 深圳市大族激光科技股份有限公司 | Fiber laser cutting head |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000271772A (en) * | 1999-03-23 | 2000-10-03 | Hitachi Constr Mach Co Ltd | Method and machine for laser beam machining |
DE102005047328B3 (en) * | 2005-06-28 | 2006-12-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for boring and material removal by laser beam has equalizing unit between image rotation and focusing device with parallel and angular adjustment |
-
2013
- 2013-05-15 CN CN201310180276.8A patent/CN103252585B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2488635Y (en) * | 2001-08-02 | 2002-05-01 | 上海工程技术大学 | Water cooling and airflow protector in laser intensifying processor for surface of inner bore |
CN101053924A (en) * | 2007-05-24 | 2007-10-17 | 上海交通大学 | Beam splitting type laser roughing modulation device |
CN102039486A (en) * | 2010-11-09 | 2011-05-04 | 苏州德龙激光有限公司 | Laser helically rotating optical module applied to laser process equipment |
CN202622175U (en) * | 2011-12-20 | 2012-12-26 | 深圳市大族激光科技股份有限公司 | Fiber laser cutting head |
CN102554465A (en) * | 2012-02-08 | 2012-07-11 | 中国科学院福建物质结构研究所 | Rotary optical design applied to laser machining |
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