CN106312328A - Laser cutting device - Google Patents
Laser cutting device Download PDFInfo
- Publication number
- CN106312328A CN106312328A CN201510394089.9A CN201510394089A CN106312328A CN 106312328 A CN106312328 A CN 106312328A CN 201510394089 A CN201510394089 A CN 201510394089A CN 106312328 A CN106312328 A CN 106312328A
- Authority
- CN
- China
- Prior art keywords
- laser
- laser head
- reflecting mirror
- cutting device
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a laser cutting device. The laser cutting device comprises a body and a base. The body is arranged in the middle of the base. A laser head is arranged at one end of the body. A temperature sensor and an alarm device are arranged on the laser head. The temperature sensor is arranged on a cooling chamber. The laser head is sleeved with the cooling chamber. A laser entrance port is formed in one side of the base. A reflector and a collecting lens are arranged in the base. The reflector is fixedly connected to a reflector base. A positioning sensor is arranged on the reflector base and connected with a positioning frame. A blow hole is further formed in the laser head and located below the collecting lens. According to the laser cutting device, the laser head temperature can be monitored and decreased in real time, and the laser head is protected against superheating damage; through the positioning frame and the positioning sensor, the accuracy of the output angle of laser beams can be ensured, and the cutting quality is ensured; and by forming the blow hole, the smoothness of a cutting face is improved.
Description
Technical field
The present invention relates to a kind of laser cutting device.
Background technology
Cut is commonly used for industry cutting processing field, the cut of laser cutting device
Head is the element of Output of laser, and in cutting process, the temperature of laser cutting head can be the highest, swashs
Light cutting head at high temperature can deform, and affects the precision of cut, and in cutting process
Have and rock and dust, cause the Quality Down of cutting.
Summary of the invention
It is an object of the invention to: a kind of laser cutting device is provided.
For achieving the above object, the technical solution used in the present invention is: a kind of laser cutting device,
Including body and pedestal, described body is arranged in the middle of pedestal, and one end of described body is arranged
Laser head；Temperature sensor and alarm, described temperature sensing it is provided with on described laser head
Device is arranged in cooling chamber, and described cooling chamber is set in the outside of laser head；The one of described pedestal
Side arranges laser light incident mouth, arranges reflecting mirror and condenser lens in described pedestal, and described reflecting mirror is solid
Surely it is connected on reflecting mirror base；It is provided with alignment sensor on described reflecting mirror base, and
It is connected with locating rack；Being additionally provided with gas hole on described laser head, described gas hole is arranged on
The lower section of condenser lens.
Described reflecting mirror and vertical direction are that 45° angle is arranged, and the minute surface of reflecting mirror enters with laser
Loophole is relative.
It is connected by screw thread or buckle between described laser head and pedestal.
Due to the application of technique scheme, the present invention compared with prior art has the most excellent
Point: by arranging temperature sensor, alarm and cooling chamber on laser head, it is possible in real time
Monitoring and cooling laser head temperature, it is to avoid the mistake cause thermal damage of laser head；By arrange locating rack with
And alignment sensor, it is possible to ensure that the output angle of laser beam is accurate, it is ensured that cut quality；
By arranging gas hole, it is achieved that blow away the impurity of facet while cutting, improve and cut
The fineness of face.
Accompanying drawing explanation
Accompanying drawing 1 is the embodiment of the present invention one structural representation.
In the figures above: 1, pedestal；2, laser head；3, temperature sensor；4, alarm；
5, cooling chamber；6, laser light incident mouth；7, reflecting mirror；8, locating rack；9, at the bottom of reflecting mirror
Seat.
Detailed description of the invention
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
Embodiment one: a kind of laser cutting device
As it is shown in figure 1, a kind of laser cutting device, including body and pedestal 1, described body
Being arranged in the middle of pedestal 1, one end of described body arranges laser head 2；Set on described laser head 2
Being equipped with temperature sensor 3 and alarm 4, described temperature sensor 3 is arranged in cooling chamber 5,
Described cooling chamber 5 is set in the outside of laser head 2；The side of described pedestal 1 arranges laser light incident
Mouth 6, arranges reflecting mirror 7 and condenser lens in described pedestal 1, described reflecting mirror 7 is fixedly connected on instead
Penetrate on mirror base 9；Alignment sensor, and and locating rack it is provided with on described reflecting mirror base 9
8 are connected；Being additionally provided with gas hole on described laser head 2, described gas hole is arranged on condenser lens
Lower section.Described reflecting mirror 7 and vertical direction are that 45° angle is arranged, and the minute surface of reflecting mirror 7 with
Laser light incident mouth 6 is relative.It is connected by screw thread or buckle between described laser head 2 and pedestal 1
Connect.By arranging temperature sensor, alarm and cooling chamber on laser head, it is possible in real time
Monitoring and cooling laser head temperature, it is to avoid the mistake cause thermal damage of laser head；By arrange locating rack with
And alignment sensor, it is possible to ensure that the output angle of laser beam is accurate, it is ensured that cut quality；
By arranging gas hole, it is achieved that blow away the impurity of facet while cutting, improve and cut
The fineness of face.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow ripe
The personage knowing technique will appreciate that present disclosure and implements according to this, can not limit with this
Protection scope of the present invention processed.All equivalences made according to spirit of the invention change or repair
Decorations, all should contain within protection scope of the present invention.
Claims (3)
1. a laser cutting device, it is characterised in that: include that body and pedestal, described body are arranged on pedestal
Centre, one end of described body arranges laser head；Temperature sensor and warning it is provided with on described laser head
Device, described temperature sensor is arranged in cooling chamber, and described cooling chamber is set in the outside of laser head；Described
The side of pedestal arranges laser light incident mouth, arranges reflecting mirror and condenser lens in described pedestal, and described reflecting mirror is solid
Surely it is connected on reflecting mirror base；Alignment sensor, and and locating rack it is provided with on described reflecting mirror base
It is connected；Being additionally provided with gas hole on described laser head, described gas hole is arranged on the lower section of condenser lens.
Laser cutting device the most according to claim 1, it is characterised in that: described reflecting mirror and vertical direction
Arrange in 45° angle, and the minute surface of reflecting mirror is relative with laser light incident mouth.
Laser cutting device the most according to claim 1, it is characterised in that: between described laser head and pedestal
It is connected by screw thread or buckle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510394089.9A CN106312328A (en) | 2015-07-07 | 2015-07-07 | Laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510394089.9A CN106312328A (en) | 2015-07-07 | 2015-07-07 | Laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106312328A true CN106312328A (en) | 2017-01-11 |
Family
ID=57728542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510394089.9A Pending CN106312328A (en) | 2015-07-07 | 2015-07-07 | Laser cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106312328A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11314187A (en) * | 1998-04-28 | 1999-11-16 | Amada Co Ltd | Machining head for thermal cutter |
| CN102497952A (en) * | 2009-07-20 | 2012-06-13 | 普雷茨特两合公司 | Laser machining head and method of compensating for the change in focal position of a laser machining head |
| CN103170744A (en) * | 2013-04-11 | 2013-06-26 | 深圳市大族激光科技股份有限公司 | Laser welding device and welding method |
| CN103252585A (en) * | 2013-05-15 | 2013-08-21 | 深圳市大族激光科技股份有限公司 | Laser cutting head and method for using laser cutting head to carry out small-hole machining |
| CN103394805A (en) * | 2013-08-05 | 2013-11-20 | 深圳市大族激光科技股份有限公司 | Laser cutting and punching device and method |
| CN203426600U (en) * | 2013-08-14 | 2014-02-12 | 常州市璟胜自动化科技有限公司 | Laser cutting head |
| FR2969520B1 (en) * | 2010-12-22 | 2014-02-14 | Commissariat Energie Atomique | SYSTEM FOR CUTTING A PIECE BY RADIATION AND CORRESPONDING CONTROL METHOD |
| CN204234969U (en) * | 2014-10-22 | 2015-04-01 | 佛山市宏石激光技术有限公司 | Bimirror adjustable focal length slave laser cutting head |
| CN204800155U (en) * | 2015-07-07 | 2015-11-25 | 王爱华 | Laser cutting device |
-
2015
- 2015-07-07 CN CN201510394089.9A patent/CN106312328A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11314187A (en) * | 1998-04-28 | 1999-11-16 | Amada Co Ltd | Machining head for thermal cutter |
| CN102497952A (en) * | 2009-07-20 | 2012-06-13 | 普雷茨特两合公司 | Laser machining head and method of compensating for the change in focal position of a laser machining head |
| FR2969520B1 (en) * | 2010-12-22 | 2014-02-14 | Commissariat Energie Atomique | SYSTEM FOR CUTTING A PIECE BY RADIATION AND CORRESPONDING CONTROL METHOD |
| CN103170744A (en) * | 2013-04-11 | 2013-06-26 | 深圳市大族激光科技股份有限公司 | Laser welding device and welding method |
| CN103252585A (en) * | 2013-05-15 | 2013-08-21 | 深圳市大族激光科技股份有限公司 | Laser cutting head and method for using laser cutting head to carry out small-hole machining |
| CN103394805A (en) * | 2013-08-05 | 2013-11-20 | 深圳市大族激光科技股份有限公司 | Laser cutting and punching device and method |
| CN203426600U (en) * | 2013-08-14 | 2014-02-12 | 常州市璟胜自动化科技有限公司 | Laser cutting head |
| CN204234969U (en) * | 2014-10-22 | 2015-04-01 | 佛山市宏石激光技术有限公司 | Bimirror adjustable focal length slave laser cutting head |
| CN204800155U (en) * | 2015-07-07 | 2015-11-25 | 王爱华 | Laser cutting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170111 |