CN103239201A - Endoscope with light source - Google Patents
Endoscope with light source Download PDFInfo
- Publication number
- CN103239201A CN103239201A CN201210022239XA CN201210022239A CN103239201A CN 103239201 A CN103239201 A CN 103239201A CN 201210022239X A CN201210022239X A CN 201210022239XA CN 201210022239 A CN201210022239 A CN 201210022239A CN 103239201 A CN103239201 A CN 103239201A
- Authority
- CN
- China
- Prior art keywords
- endoscope
- wafer
- wafer scale
- shell
- light sources
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Endoscopes (AREA)
Abstract
An endoscope with a light source comprises a tube, a wafer-level module, a casing and the light source. The wafer-level module is coupled with the tail end of the tube. The casing is arranged to cover the wafer-level module. The light source is adhered onto the casing.
Description
[technical field]
The present invention is relevant a kind of endoscope, particularly about a kind of endoscope with light source.
[background technology]
Endoscope is that a kind of organ that inserts is with the instrument of examination organ inside.Endoscope generally includes a flexible pipe and a lens system, and wherein this lens system generally is arranged on the end of pipe, is used for collecting the image of organ inside.Yet the organ internal light is too dark, so that can't capture image comparatively clearly.
In addition, in order to dwindle the size of endoscope, need devote more time and energy at the processing procedure of lens system, so just improve whole cost.Consider cost and practicality, because traditional endoscope price height not only, and can't produce sharp image, and therefore, need the endoscope that proposes a kind of novelty badly, the phase can be got rid of the problems referred to above.
[summary of the invention]
In view of above-mentioned, one of purpose of the embodiment of the invention is to propose a kind of endoscope, and its end is to be made of in conjunction with light emitting diode the wafer scale image-forming module, therefore not only can reduce the whole cost of endoscope, also can obtain image more clearly.
The present invention discloses a kind of endoscope, and it comprises a pipe, a wafer scale module (wafer-level module), a shell and a light source.The wafer scale module is the end that is coupled to pipe.Shell is to arrange to cover the wafer scale module.Light source is to be bonded on the shell.
[description of drawings]
Fig. 1 is the side schematic view of the endoscope of one embodiment of the invention.
Fig. 2 A is the axonometric chart of the terminal part of one embodiment of the invention.
Fig. 2 B shows top view and the side view of the terminal part of one embodiment of the invention.
Fig. 3 is the axonometric chart of the terminal part of another embodiment of the present invention.
1 endoscope
11 pipes
13 terminal parts
21 shells
23 wafer scale image-forming modules
231 wafer-level lens
233 wafer scale CISs
25 light sources
27 perforates
[specific embodiment]
Please refer to Fig. 1, be the side schematic view of the endoscope of one embodiment of the invention.As shown in Figure 1, endoscope 1 comprises a pipe 11 and a terminal part 13.Terminal part 13 is the ends that are coupled to pipe 11.
Fig. 2 A is the axonometric chart of the terminal part 13 of one embodiment of the invention.Shown in Fig. 2 A, terminal part 13 comprises a wafer scale image-forming module 23 (wafer-level imaging module) (or being called for short wafer scale module (WLM)), and it comprises a wafer scale CIS (wafer-level image sensor) 233 and one wafer-level lens 231.Wafer scale CIS 233 is the surfaces that are seated in the end of pipe 11, and can be a complementary metal oxide semiconductor (CMOS) CIS (being abbreviated as CIS usually), but not as being limited to.Wafer-level lens (wafer-level optics) 231 as a camera lens, is the end that is positioned at away from pipe 11, and can be made by glass, but be not limited with the revealer.Wafer scale CIS 233 is to stick together with wafer-level lens 231, for example uses an adhesive.Compare with traditional endoscope, endoscope of the present invention utilize mass production and cheaply semiconductor technology make the imaging system of endoscope.Wafer scale module 23 is a kind of technology of using semiconductor technology to assemble small camera lens in wafer level, the processing procedure details of wafer scale image-forming module can be with reference to United States Patent (USP) the 7th, 564, No. 496, proposed by people such as Wolterink " Camera device; method of manufacturing a camera device, wafer scale package ".
Operation for convenience, the more bonding light source 25 of the present invention is on the surface of shell 21.Among one embodiment, light source can comprise at least one semiconductor light sources, as a light emitting diode (LED).Shown in example among the figure, four led light sources 25 are the edges that are arranged on the surface of shell 21 equidistantly, so can more even transmitting illuminant.Among one embodiment, the shape of these led light sources 25 can be rectangle, but is not limited with the revealer.In addition, light source 25 also can be bonded in shell 21 inside, as the interior survey of the upper surface of shell 21, shown in Fig. 2 B.
Then, please refer to Fig. 3, be the axonometric chart of the terminal part 13 of another embodiment of the present invention.Except led light source 25 is set equidistantly, led light source 25 also can be arranged on the edge on the surface of shell 21 circlewise, as shown in the figure.Among one embodiment, light source 25 can present the arc of protrusion, makes luminous more even.In addition, the shape of shell 21 is except as the cylinder in the illustration, in order to meet the shape of pipe 11, and also can the side's of employing body.
According to above-described embodiment, endoscope proposed by the invention is to have integrated wafer scale module and led light source, so that operation also can capture image more clearly, watches or examines for user.
The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of finishing under the spirit that invention discloses and changes or modify, and all should be included in the claim.
Claims (13)
1. endoscope comprises:
One pipe;
One wafer scale module is coupled to the end of this pipe;
One shell arranges to cover this wafer scale module; And
One light source is bonding on this shell.
2. endoscope as claimed in claim 1, wherein this wafer scale module comprises:
One wafer scale CIS; And
One wafer-level lens, bonding with this wafer scale CIS;
Wherein, this wafer scale CIS is the surface that is seated in the end of this pipe, and this wafer-level lens is the end that is positioned at away from this pipe.
3. endoscope as claimed in claim 2, wherein this wafer scale CIS comprises a complementary metal oxide semiconductor CIS.
4. endoscope as claimed in claim 2, wherein this wafer-level lens comprises a camera lens.
5. endoscope as claimed in claim 4, wherein this camera lens is to be made by glass.
6. endoscope as claimed in claim 1, wherein this light source comprises at least one semiconductor light sources.
7. endoscope as claimed in claim 6, wherein this semiconductor light sources comprises a light emitting diode.
8. endoscope as claimed in claim 6, wherein the quantity of this semiconductor light sources is greater than 1, and those semiconductor light sources are the edges that are arranged on the surface of this shell equidistantly.
9. endoscope as claimed in claim 8, wherein those semiconductor light sources is shaped as rectangle.
10. endoscope as claimed in claim 6, wherein this semiconductor light sources is the edge that is arranged on the surface of this shell circlewise.
11. endoscope as claimed in claim 10, wherein this semiconductor light sources is the arc that presents protrusion.
12. endoscope as claimed in claim 1, wherein this shell has a perforate and is positioned on this wafer scale module.
13. endoscope as claimed in claim 1, wherein this shell side of being body or cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022239XA CN103239201A (en) | 2012-02-01 | 2012-02-01 | Endoscope with light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210022239XA CN103239201A (en) | 2012-02-01 | 2012-02-01 | Endoscope with light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103239201A true CN103239201A (en) | 2013-08-14 |
Family
ID=48919326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210022239XA Pending CN103239201A (en) | 2012-02-01 | 2012-02-01 | Endoscope with light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103239201A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101013714A (en) * | 2006-02-03 | 2007-08-08 | 富士胶片株式会社 | Solid-state imaging device and electronic endoscope using the same |
| US20090054764A1 (en) * | 2000-04-10 | 2009-02-26 | C2Cure, Inc. | Three-dimensional image reconstruction using two light sources |
| US20090244259A1 (en) * | 2008-03-31 | 2009-10-01 | Olympus Corporation | Endoscope apparatus |
| CN101972134A (en) * | 2010-11-12 | 2011-02-16 | 上海飞锐光电科技有限公司 | Disposable-intubation bougie-containing video laryngoscope |
| TW201138707A (en) * | 2010-05-04 | 2011-11-16 | Medical Intubation Tech Corp | Endoscope apparatus with wafer level lens |
-
2012
- 2012-02-01 CN CN201210022239XA patent/CN103239201A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090054764A1 (en) * | 2000-04-10 | 2009-02-26 | C2Cure, Inc. | Three-dimensional image reconstruction using two light sources |
| CN101013714A (en) * | 2006-02-03 | 2007-08-08 | 富士胶片株式会社 | Solid-state imaging device and electronic endoscope using the same |
| US20090244259A1 (en) * | 2008-03-31 | 2009-10-01 | Olympus Corporation | Endoscope apparatus |
| TW201138707A (en) * | 2010-05-04 | 2011-11-16 | Medical Intubation Tech Corp | Endoscope apparatus with wafer level lens |
| CN101972134A (en) * | 2010-11-12 | 2011-02-16 | 上海飞锐光电科技有限公司 | Disposable-intubation bougie-containing video laryngoscope |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2809063A3 (en) | Image capturing apparatus and image processing method | |
| EP1845835A4 (en) | Endoscope with miniature imaging arrangement | |
| US10561306B2 (en) | Endoscopic device | |
| EP3146890A3 (en) | Radial scanner imaging system | |
| US20130128092A1 (en) | Camera module | |
| US20130162789A1 (en) | Endoscope with a light source | |
| US20140353501A1 (en) | Night vision attachment for smart camera | |
| KR102507746B1 (en) | Method for generating plural information using camera to sense plural wave bandwidth and apparatus thereof | |
| CN103239201A (en) | Endoscope with light source | |
| CN201498007U (en) | Hybrid fingerprint and palm print acquisition instrument | |
| KR100951187B1 (en) | Camera module | |
| JP2016118742A (en) | Imaging device | |
| CN103239198A (en) | Endoscope and wireless transmission system thereof | |
| KR101815164B1 (en) | Camera to capture multiple sub-images for generation of an image | |
| CN105100556A (en) | Image acquisition module | |
| CN205181290U (en) | Light field formula capsule endoscope camera with focus on function after shooing | |
| TWI567957B (en) | Wafer-level camera modules and manufacturing method thereof | |
| CN103239199A (en) | Endoscope capable of capturing three-dimensional (3D) image | |
| JP5554957B2 (en) | Imaging unit | |
| KR20150120219A (en) | Visual inspection apparatus comprising conical lighting part for testing camera module | |
| CN207010757U (en) | A kind of mobile terminal | |
| CN105898115A (en) | Image obtaining module | |
| EA200801981A1 (en) | DEVICE FOR RECEPTION OF THE IMAGE OF THE IRONS OF THE EYE | |
| TW200729924A (en) | Imaging system utilizing illumination and optical modules contained within rotating optical platens | |
| CN105025205A (en) | Image acquisition module with built-in dustproof structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130814 |