CN103239199A

CN103239199A - Endoscope capable of capturing three-dimensional (3D) image

Info

Publication number: CN103239199A
Application number: CN 201210027459
Authority: CN
Inventors: 周益成; 钟永哲
Original assignee: Himax Imaging Inc
Current assignee: Himax Imaging Inc
Priority date: 2012-02-03
Filing date: 2012-02-03
Publication date: 2013-08-14

Abstract

An endoscope capable of capturing a three-dimensional (3D) image comprises a tube and a tail end portion. The tail end portion is coupled with the tail end of the tube and comprises a left wafer-level image sensor for capturing at least one left image and a right wafer-level image sensor for capturing at least one right image. The captured left image and the captured right image are combined to form the 3D image.

Description

The endoscope of fechtable 3D image

[technical field]

The present invention is relevant a kind of endoscope, particularly about a kind of endoscope of fechtable 3D image.

[background technology]

Endoscope is that a kind of organ that inserts is with the instrument of examination organ inside.Endoscope generally includes a flexible pipe and a lens system, and wherein this lens system generally is arranged on the end of pipe, is used for collecting the image of organ inside.

In order to dwindle the size of endoscope, need devote more time and energy at the processing procedure of lens system, so just improved whole cost.In addition, the collected image of lens system all was two dimension (2D) image in the past, watched shortage sense of reality.Consider cost and practicality, because traditional endoscope price height not only, and can't produce the 3D image, and therefore, need the endoscope that proposes a kind of novelty badly, the phase can be got rid of the problems referred to above.

[summary of the invention]

In view of above-mentioned, one of purpose of the embodiment of the invention is to propose a kind of endoscope, and its end is to be made of the wafer scale image-forming module that comprises left and right sides CIS, therefore not only can reduce the whole cost of endoscope, also can obtain the 3D image.

The present invention discloses a kind of endoscope, and it comprises a pipe and a terminal part.Terminal part is the end that is coupled to pipe, comprises that a left wafer scale CIS (wafer-level image sensor) and that is used for capturing at least one left image is used for capturing the right wafer scale CIS of at least one right image.Wherein, this left side image and this right side image that capture are combined into a 3D image.

[description of drawings]

Fig. 1 is the side schematic view of the endoscope of one embodiment of the invention.

Fig. 2 is the axonometric chart of the terminal part of one embodiment of the invention.

Fig. 3 is the axonometric chart of the terminal part of another embodiment of the present invention.

Fig. 4 is the axonometric chart of the terminal part of further embodiment of this invention.

1 endoscope

11 pipes

13 terminal parts

131a left side wafer scale CIS

133a left side wafer-level lens

The right wafer scale CIS of 131b

The right wafer-level lens of 133b

135a, 135b perforate

137 shells

[specific embodiment]

Please refer to Fig. 1, be the side schematic view of the endoscope of one embodiment of the invention.As shown in Figure 1, endoscope 1 comprises a pipe 11 and a terminal part 13.Terminal part 13 is the ends that are coupled to pipe 11.The terminal part 13 of present embodiment mainly comprises at least one wafer scale image-forming module (wafer-level imaging module) (or being called for short wafer scale module (WLM)) with two CISs.

Fig. 2 is the axonometric chart of the terminal part 13 of one embodiment of the invention.As shown in Figure 2, terminal part 13 comprises a left wafer scale module and a right wafer scale module.Left side wafer scale module comprises left wafer scale CIS (wafer-level image sensor) 131a and left wafer-level lens (wafer-level optics, WLO) 133a, and right wafer scale module comprises right wafer scale CIS 131b and right wafer-level lens 133b.Left side wafer scale CIS 131a and right wafer scale CIS 131b are the surfaces that is seated in the end of pipe 11, and can be a complementary metal oxide semiconductor (CMOS) CIS (being abbreviated as CIS usually), but not as being limited to.Left side wafer-level lens 133a and right wafer-level lens 133b as a camera lens, are the ends that is positioned at away from pipe 11, and can be made by glass, but be not limited with the revealer.Left side wafer scale CIS 131a and right wafer scale CIS 131b can stick together with left wafer-level lens 133a and right wafer-level lens 133b respectively, for example use an adhesive.Compare with traditional endoscope, endoscope of the present invention utilize mass production and cheaply semiconductor technology make the imaging system of endoscope.The wafer scale module is a kind of technology of using semiconductor technology to assemble small camera lens in wafer level, the processing procedure details of wafer scale image-forming module can be with reference to United States Patent (USP) the 7th, 564, No. 496, proposed by people such as Wolterink " Camera device; method of manufacturing a camera device, wafer scale package ".

Terminal part 13 more comprises a shell (holder) 137, is used for covering the left wafer scale module that includes left wafer scale CIS 131a and left wafer-level lens 133a and the right wafer scale module that includes right wafer scale CIS 131b and right wafer-level lens 133b.Left side wafer scale module and right wafer scale module are to be arranged on abreast in the shell 137, and among the embodiment, shell 137 has two perforate 135a, 135b in left wafer scale module and right wafer scale module, and alignment with it.Thus, left wafer scale CIS 131a can see through perforate 135a capture at least one left image, and right wafer scale CIS 131b can see through perforate 135b and capture at least one right image, and the left image that captures and right image just are processed into a 3D image.

Then, please refer to Fig. 3, be the axonometric chart of the terminal part 13 of another embodiment of the present invention.Except two wafer scale modules are set, also left wafer scale CIS 131a, right wafer scale CIS 131b, left wafer-level lens 133a and right wafer-level lens 133b can be incorporated in the single wafer scale module (wafer-level module), it is covered by shell 137, as shown in the figure.

At last, please refer to Fig. 4, be the axonometric chart of the terminal part 13 of further embodiment of this invention.Except the side's of employing body, the shape of shell 137 also can be cylinder, as shown in the figure, in order to meet the shape of pipe 11.

According to above-described embodiment, endoscope proposed by the invention be integrated about two wafer scale modules, in order to the left and right image that captures is combined into the 3D image, watches or examine for user.

The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of finishing under the spirit that invention discloses and changes or modify, and all should be included in the claim.

Claims

1. an endoscope is the display device of arranging in pairs or groups, and comprises:

One pipe; And

One terminal part is coupled to the end of this pipe, comprises:

One left wafer scale CIS is used for capturing at least one left image; And

One right wafer scale CIS is used for capturing at least one right image;

Wherein, this left side image and this right side image that capture are processed into a 3D image.

2. endoscope as claimed in claim 1, wherein this terminal part also comprises:

One left wafer-level lens, bonding with this left side wafer scale CIS; And

One right wafer-level lens, bonding with this right side wafer scale CIS;

Wherein, this left side wafer scale CIS and this right side wafer scale CIS are the surfaces that is seated in the end of this pipe, and should left side wafer-level lens and this right side wafer-level lens be the end that is positioned at away from this pipe.

3. endoscope as claimed in claim 2 wherein also comprises:

One shell arranges to cover this terminal part.

4. endoscope as claimed in claim 3 wherein should left side wafer scale CIS, this right side wafer scale CIS, this left side wafer-level lens and this right side wafer-level lens be contained in the single wafer scale module in being.

5. endoscope as claimed in claim 4, wherein this shell covers this single wafer scale module.

6. endoscope as claimed in claim 3, wherein should left side wafer scale CIS and this left side wafer-level lens be contained in the left wafer scale module in being, this right side wafer scale CIS and this right side wafer-level lens are contained in the right wafer scale module in being.

7. endoscope as claimed in claim 6, wherein this shell covers this left side wafer scale module and this right side wafer scale module, and should left side wafer scale module and this right side wafer scale module be to arrange abreast.

8. endoscope as claimed in claim 1, wherein should left side wafer scale CIS and this right side wafer scale CIS comprise a complementary metal oxide semiconductor CIS.

9. endoscope as claimed in claim 2, wherein should left side wafer-level lens and this right side wafer-level lens comprise a camera lens.

10. endoscope as claimed in claim 9, wherein this camera lens is to be made by glass.

11. endoscope as claimed in claim 5, wherein this shell has a perforate and is positioned on this single wafer scale module.

12. endoscope as claimed in claim 7, wherein this shell has at least one perforate and is positioned on this left side wafer scale module and this right side wafer scale module.

13. endoscope as claimed in claim 2, wherein this shell side of being body or cylinder.