CN103234483B - A kind of detection method of parallelism of camera chip and device - Google Patents
A kind of detection method of parallelism of camera chip and device Download PDFInfo
- Publication number
- CN103234483B CN103234483B CN201210582845.7A CN201210582845A CN103234483B CN 103234483 B CN103234483 B CN 103234483B CN 201210582845 A CN201210582845 A CN 201210582845A CN 103234483 B CN103234483 B CN 103234483B
- Authority
- CN
- China
- Prior art keywords
- planar
- camera
- circuit board
- camera chip
- place planar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention provides a kind of detection method and pick-up unit of parallelism of camera chip, the mode adopting a word laser to project on chip and circuit board obtains in the same detection plane crossing with chip and circuit board plane, and by calculating the angle between detection plane two lines crossing with chip and circuit board plane, by above-mentioned detection, final obtain camera chip and result whether parallel between circuit board.
Description
Technical field
The invention belongs to camera and manufacture field, particularly a kind ofly produce detection method and the pick-up unit of the depth of parallelism between detection camera chip and circuit board in camera process.
Background technology
The depth of parallelism refers to the degree of two planes or two straight line parallels, and in camera production run, the depth of parallelism of camera chip and circuit board is important parameter, is directly connected to the last image quality of camera.Because camera chip is special, contact method can not be used to measure, so the parallelism measuring instrument of traditional contact is inapplicable.The Parallel testing way of current camera chip and circuit board is for leaning on eye-observation, because eye-observation subjectivity is very large, the very large situation of camera chip and circuit board inclination angle can only be detected, for small inclination, human eye is difficult to tell, only when camera system test, judge the chip depth of parallelism according to image quality.If camera chip and the small not parallel camera imaging that causes of circuit board of poor quality, also camera to be taken apart, again paste chip, inefficiency.And the raising of human cost in recent years, be badly in need of replacing manual detection by machine vision means.
Summary of the invention
The object of the invention is to for above-mentioned existing problems and deficiency, propose a kind of camera chip and circuit board parallelism detecting device and method, the method belongs to non-cpntact measurement, can not damage camera chip, and demarcate simple, measuring speed is fast.
The present invention in order to the technical scheme completing its technical purpose and adopt is: a kind of detection method of parallelism of camera chip, comprises the following steps:
A, step with camera chip place planar S 1 and all crossing the first measurement plane S3 of circuit board place planar S 2 is set;
Angle between the straight line L2 that the straight line L1 that B, Calculation Plane S1 are crossing with planar S 3 and planar S 2 and planar S 3 intersect
step;
C, judge angle
whether be 0, if angle
be 0 and turn to step D, otherwise illustrate camera chip place planar S 1 and circuit board place planar S 2 not parallel, detection of end;
D, step with planar S 1 and all crossing the second measurement plane S4 of plane S2 is set, described planar S 4 and planar S 3 not parallel;
Angle between the straight line L4 that the straight line L3 that E, Calculation Plane S1 are crossing with planar S 4 and planar S 2 and planar S 4 intersect
step;
F, judge angle
whether be 0, if angle
be 0 and illustrate that camera chip place planar S 1 is parallel with circuit board place planar S 2, otherwise, illustrate camera chip place planar S 1 and circuit board place planar S 2 not parallel, detection of end.
Further, in the detection method of above-mentioned parallelism of camera chip: in described steps A and step D, planar S 3 or planar S 4 are the planes formed when camera chip and circuit board are irradiated by a word laser instrument.
Further, in the detection method of above-mentioned parallelism of camera chip: comprise the following steps respectively in described step B:
The laser stripe physical image that step 1, collected by camera one word laser illumination generate to camera chip and circuit board surface;
Step 2, get bounding method with column direction, extract the center line of the laser stripe of the laser stripe physical image that a word laser illumination generates to camera chip surface and circuit board surface respectively;
Step 3, use least square method, matching is carried out to the center line of laser stripe, simulates the laser rays L1 shone in camera chip respectively:
, and shine the laser rays light L2 of circuit board,
;
Step 4, calculated line L1, and the angle between straight line L2
tangent value:
.
Further, in the detection method of above-mentioned parallelism of camera chip: described planar S 3 is vertical with plane S4.
Present invention also offers a kind of pick-up unit of parallelism of camera chip, this device comprises a word laser instrument of directive camera chip place planar S 1 and circuit board place planar S 2; Take the camera of the laser stripe physical image in a word laser instrument directive camera chip place planar S 1 and circuit board place planar S 2; Receive camera laser stripe physical image and also carry out image procossing, the word laser stripes physical image obtained in camera chip place planar S 1 and circuit board place planar S 2 row relax of going forward side by side obtains the center line of the laser stripe of laser stripe physical image.
Further, in the pick-up unit of above-mentioned parallelism of camera chip: a described word laser instrument comprises horizontal and vertical the one one word laser instrument and the 21 word laser instrument being irradiated to camera chip place planar S 1 and circuit board place planar S 2 respectively; Described camera comprises primary optical axis and described the one one word laser instrument first camera at grade, primary optical axis and described the 21 word laser instrument second camera at grade.
Further, in the pick-up unit of above-mentioned parallelism of camera chip: the one one described word laser instrument and the 21 word laser instrument are perpendicular to camera chip place planar S 1 or circuit board place planar S 2; Described first camera becomes 45 ~ 60 degree of angles with second camera respectively with the vertical line of camera chip place planar S 1 or circuit board place planar S 2.
Further, in the pick-up unit of above-mentioned parallelism of camera chip: the one one described word laser instrument and the 21 word laser instrument are the red laser that wavelength is respectively 635nm and 650nm.
Further, in the pick-up unit of above-mentioned parallelism of camera chip: the primary optical axis of a described word laser instrument and described camera at grade, described camera chip place planar S 1 and circuit board place planar S 2 are on surface level, also comprise the mechanism vertically rotated by described circuit board.
Further, in the pick-up unit of above-mentioned parallelism of camera chip: a bandpass filter corresponding with a described word laser wavelength is set before described camera lens
A kind of camera chip that the present invention proposes and circuit board Parallel testing method and pick-up unit, have the following advantages with existing method:
1, adopt non-cpntact measurement, avoid causing damage to camera chip, measuring speed is fast, and precision is high.
2, respectively for two kinds of not parallel situations between camera chip and circuit board, propose respectively detection of straight lines angle situation to judge the depth of parallelism, demarcate simple, avoid required by angle two the camera coordinates proportionate relationships unanimously complicated Accurate Calibration process needed directly measuring two planes.
Below by with specific embodiments and the drawings, the present invention is further detailed.
Accompanying drawing explanation
Fig. 1 camera chip and the not parallel situation schematic diagram (1) of circuit board.
Fig. 2 camera chip and the not parallel situation schematic diagram (2) of circuit board.
Fig. 3 embodiment of the present invention 1 pick-up unit schematic diagram
Embodiment
As shown in Figure 1 and Figure 2, we know between camera chip and the circuit board welding this camera chip not parallel, are exactly the plane at camera chip place and the Plane intersects at circuit board place, have an angle, no matter this space angle, it can Direct Resolution one-tenth angle as shown in Figure 1, 2
with
.
As shown in Figure 3, it is the pick-up unit schematic diagram of the embodiment of the present invention 1, as shown in the figure, label 1 mod sum label 2 adopts Shenzhen China to be the 1300000 pixel black and white cameras of HV130UM by scientific and technological model, wherein first camera 1 lens focus is 12mm, and before camera lens, mounting center wavelength is 635nm, and bandwidth is the bandpass filter of 40nm, before second camera 2 camera lens, mounting center wavelength is 650nm, and bandwidth is the bandpass filter of 40nm.Label 3 mod sum label 4 is the one one word laser instrument and the 21 word laser instrument respectively, and the one one word laser instrument the 3 and the 21 word laser instrument 4 wavelength is respectively 635nm and 650nm.
First camera 1 primary optical axis and the one one word laser instrument 3 are in XOZ plane, and second camera 2 primary optical axis and the 21 word laser instrument 4 are in YOZ plane.One one word laser instrument the 3 and the 21 word laser instrument 4 is composed and laid out, and all perpendicular to worktable, the word laser rays that the one one word laser instrument 3 and the 21 word laser instrument 4 send is mutually vertical.
First camera 1 becomes 45 ~ 60 degree of angles with the primary optical axis of second camera 2 respectively with horizontal surface vertical line.
After describing above and shown in Fig. 3, device being installed, simultaneously external trigger first camera 1 and second camera 2, gathers and irradiates camera chip 5 and circuit board 6 surface by the one one word laser instrument 3 and the 21 word laser instrument 4 and the laser stripe physical image length and width that generate are the image of M, N
with
.
Adopt the square template pair of 3*3
with
carry out medium filtering, elimination noise, obtains image
with
.
By row search
the maximum value of often row pixel, record often row maximum position
(i=1,2 ... N), the position of fringe center is obtained.
If the one one word laser instrument 3 laser rays shone in camera chip is L1:
, the laser rays light shining circuit board is L2,
.Wherein
with
,
with
for coefficient to be determined.
Employing least square fitting laser instrument 3 shines the laser rays L1 in camera chip below.
Get K sampled point, if the position of each sampled point is shining on the laser stripe center line in camera chip
, majorized function as shown in the formula:
（1）
Order
,
, then:
（2）
Solve an equation (2) obtain
with
.
In like manner can be in the hope of
with
.
Calculated line L1, and the angle between straight line L2
tangent value:
.
Right
carry out process 4-5, calculate the angle of straight line L3 and L4 that the 21 word laser instrument 4 formed in camera chip and circuit board
tangent value
.
Embodiment 2, the difference of the present embodiment and embodiment 1 is only with an a set of word laser instrument and a set of camera, only with an a set of word laser instrument and a set of camera in the present embodiment, the primary optical axis of camera and a word laser instrument are at grade, camera chip place planar S 1 and circuit board place planar S 2 are on surface level, also comprise the mechanism vertically rotated by described circuit board.
At measurement L1, and the angle between straight line L2
tangent value:
after, by a word laser instrument and camera and between camera chip and circuit board relative position rotate to an angle, general 90-degree rotation angle, then calculate the angle between straight line L3 and L4 on camera chip and circuit board.
Specifically comprise the following steps:
A, step with camera chip place planar S 1 and all crossing the first measurement plane S3 of circuit board place planar S 2 is set; The plane that one word laser instrument is formed when camera chip and circuit board are irradiated is exactly S3.
Angle between the straight line L2 that the straight line L1 that B, Calculation Plane S1 are crossing with planar S 3 and planar S 2 and planar S 3 intersect
step; Specific as follows:
The laser stripe physical image that step 1, collected by camera one word laser illumination generate to camera chip and circuit board surface;
Step 2, get bounding method with column direction, extract the center line of the laser stripe of the laser stripe physical image that a word laser illumination generates to camera chip surface and circuit board surface respectively;
Step 3, use least square method, matching is carried out to the center line of laser stripe, simulates the laser rays L1 shone in camera chip respectively:
, and shine the laser rays light L2 of circuit board,
;
Step 4, calculated line L1, and the angle between straight line L2
tangent value:
.
C, judge angle
whether be 0, if angle
be 0 and turn to step D, otherwise illustrate camera chip place planar S 1 and circuit board place planar S 2 not parallel, detection of end;
D, first rotation circuit plate 90 degree, arrange the step with planar S 1 and all crossing the second measurement plane S4 of plane S2, described planar S 4 is vertical with planar S 3;
Angle between the straight line L4 that the straight line L3 that E, Calculation Plane S1 are crossing with planar S 4 and planar S 2 and planar S 4 intersect
step; Specific as follows:
The laser stripe physical image that step 1, collected by camera one word laser illumination generate to camera chip and circuit board surface;
Step 2, get bounding method with column direction, extract the center line of the laser stripe of the laser stripe physical image that a word laser illumination generates to camera chip surface and circuit board surface respectively;
Step 3, use least square method, matching is carried out to the center line of laser stripe, simulates the laser rays L3 shone in camera chip respectively:
, and shine the laser rays light L2 of circuit board,
;
Step 4, calculated line L3, and the angle between straight line L4
tangent value:
.
F, judge angle
whether be 0, if angle
be 0 and illustrate that camera chip place planar S 1 is parallel with circuit board place planar S 2, otherwise, illustrate camera chip place planar S 1 and circuit board place planar S 2 not parallel, detection of end.
This method can detect that whether camera chip is parallel with circuit board plane.
Claims (8)
1. a detection method for parallelism of camera chip, is characterized in that: comprise the following steps:
A, step with camera chip place planar S 1 and all crossing the first measurement plane S3 of circuit board place planar S 2 is set;
Angle theta between the straight line L2 that the straight line L1 that B, Calculation Plane S1 are crossing with planar S 3 and planar S 2 and planar S 3 intersect
1step;
C, judge angle theta
1whether be 0, if angle theta
1be 0 and turn to step D, otherwise illustrate camera chip place planar S 1 and circuit board place planar S 2 not parallel, detection of end;
D, step with planar S 1 and all crossing the second measurement plane S4 of plane S2 is set, described planar S 4 and planar S 3 not parallel;
Angle theta between the straight line L4 that the straight line L3 that E, Calculation Plane S1 are crossing with planar S 4 and planar S 2 and planar S 4 intersect
2step;
F, judge angle theta
2whether be 0, if angle theta
2be 0 and illustrate that camera chip place planar S 1 is parallel with circuit board place planar S 2, otherwise, illustrate camera chip place planar S 1 and circuit board place planar S 2 not parallel, detection of end;
In described steps A and step D, planar S 3 or planar S 4 are the planes formed when camera chip and circuit board are irradiated by a word laser instrument;
Comprise the following steps respectively in described step B:
The laser stripe physical image that step 1, collected by camera one word laser illumination generate to camera chip and circuit board surface;
Step 2, get bounding method with column direction, extract the center line of the laser stripe of the laser stripe physical image that a word laser illumination generates to camera chip surface and circuit board surface respectively;
Step 3, use least square method, carry out matching to the center line of laser stripe, simulate the laser rays L1:y shone in camera chip respectively
1=k
1x+b
1, and shine the laser rays light L2 of circuit board, y
2=k
2x+b
2;
Step 4, calculated line L1, and the angle theta between straight line L2
1tangent value:
2. claim requires the detection method of the parallelism of camera chip described in 1, it is characterized in that: described planar S 3 is vertical with plane S4.
3. a pick-up unit for parallelism of camera chip, is characterized in that: the word laser instrument comprising two directive camera chip place planar S 1 and circuit board place planar S 2; The camera of laser stripe physical image in two shooting one word laser instrument directive camera chip place planar S 1 and circuit board place planar S 2; Camera receives laser stripe physical image and also carries out image procossing, and the word laser stripes physical image obtained in camera chip place planar S 1 and circuit board place planar S 2 row relax of going forward side by side obtains the center line of the laser stripe of laser stripe physical image.
4. the pick-up unit of parallelism of camera chip according to claim 3, is characterized in that: a described word laser instrument comprises horizontal and vertical the one one word laser instrument and the 21 word laser instrument being irradiated to camera chip place planar S 1 and circuit board place planar S 2 respectively; Described camera comprises primary optical axis and described the one one word laser instrument first camera at grade, primary optical axis and described the 21 word laser instrument second camera at grade.
5. the pick-up unit of parallelism of camera chip according to claim 4, is characterized in that: the one one described word laser instrument and the 21 word laser instrument are perpendicular to camera chip place planar S 1 or circuit board place planar S 2; Described first camera becomes 45 ~ 60 degree of angles with second camera respectively with the vertical line of camera chip place planar S 1 or circuit board place planar S 2.
6. the pick-up unit of parallelism of camera chip according to claim 4, is characterized in that: the one one described word laser instrument and the 21 word laser instrument are the red laser that wavelength is respectively 635nm and 650nm.
7. the pick-up unit of parallelism of camera chip according to claim 3, it is characterized in that: the primary optical axis of a described word laser instrument and described camera at grade, described camera chip place planar S 1 and circuit board place planar S 2 are on surface level, also comprise the mechanism vertically rotated by described circuit board.
8. the pick-up unit of parallelism of camera chip according to claim 4, is characterized in that: before described first camera camera lens, arrange a bandpass filter corresponding with the one one described word laser wavelength; A bandpass filter corresponding with the 21 described word laser wavelength is set before described second camera camera lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582845.7A CN103234483B (en) | 2012-12-28 | 2012-12-28 | A kind of detection method of parallelism of camera chip and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582845.7A CN103234483B (en) | 2012-12-28 | 2012-12-28 | A kind of detection method of parallelism of camera chip and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103234483A CN103234483A (en) | 2013-08-07 |
| CN103234483B true CN103234483B (en) | 2016-03-09 |
Family
ID=48882535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210582845.7A Active CN103234483B (en) | 2012-12-28 | 2012-12-28 | A kind of detection method of parallelism of camera chip and device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103234483B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108020176B (en) * | 2016-11-04 | 2021-01-12 | 荣旗工业科技(苏州)股份有限公司 | Biplane angle measurement method and application thereof |
| CN109668524A (en) * | 2019-01-30 | 2019-04-23 | 深圳科瑞技术股份有限公司 | The method and system of detection battery main body appearance profile are illuminated based on linear type linear laser |
| CN111182296B (en) * | 2020-01-03 | 2021-08-27 | 歌尔光学科技有限公司 | Detection device and detection method of camera module and storage medium |
| CN112330737B (en) * | 2020-11-06 | 2023-08-29 | 歌尔光学科技有限公司 | Parallel detection method, device, storage medium and apparatus |
| CN112797895B (en) * | 2020-12-24 | 2022-07-22 | 上海智殷自动化科技有限公司 | Frame body positioning device based on vision and laser |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201653364U (en) * | 2010-03-19 | 2010-11-24 | 复华机械股份有限公司 | Wafer fixing frame detection device |
| TWI479168B (en) * | 2011-06-16 | 2015-04-01 | Hon Hai Prec Ind Co Ltd | Device for measuring static angle of voice coil motor |
| CN102278958A (en) * | 2011-06-24 | 2011-12-14 | 上海瑞伯德智能系统科技有限公司 | Visual detection system for planarity of aluminum plate |
| CN102419334A (en) * | 2011-09-13 | 2012-04-18 | 浙江中控太阳能技术有限公司 | Device and method capable of simultaneously detecting evenness and cleanness of plane mirror |
| CN102840836A (en) * | 2012-09-24 | 2012-12-26 | 常熟市晓创光电科技有限公司 | Assembly clearance detection method and device based on machine vision |
-
2012
- 2012-12-28 CN CN201210582845.7A patent/CN103234483B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103234483A (en) | 2013-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103234483B (en) | A kind of detection method of parallelism of camera chip and device | |
| CN110132420B (en) | Polarization measuring device, polarization measuring method, and optical alignment method | |
| CN102183524B (en) | Double-CCD (Charge Coupled Device) detecting method and system for apparent defect assessment of civil engineering structure | |
| CN103308007B (en) | The IC pin coplanarity measuring system of higher order reflection and grating image and method | |
| CN108332708B (en) | Automatic detection system and detection method for laser level meter | |
| CN105466334B (en) | The lens location calibration method of more camera lens vision collecting devices | |
| CN106556356A (en) | A kind of multi-angle measuring three-dimensional profile system and measuring method | |
| CN107003110A (en) | Image processing apparatus and image processing method | |
| CN103499302A (en) | Camshaft diameter online measuring method based on structured light visual imaging system | |
| CN104567728A (en) | Laser vision profile measurement system, measurement method and three-dimensional target | |
| CN102589484B (en) | Autocollimation indication error detection method and device using same | |
| CN104568963A (en) | Online three-dimensional detection device based on RGB structured light | |
| Staniek | Stereo vision method application to road inspection | |
| CN109919856B (en) | Asphalt pavement structure depth detection method based on binocular vision | |
| CN103615980A (en) | Method and system for measuring parameters of round holes in plate | |
| CN110966956A (en) | Binocular vision-based three-dimensional detection device and method | |
| CN204535658U (en) | A kind of high-precision section section bar laser measuring apparatus | |
| CN104180756B (en) | Method for measuring relative displacement of butt-joint pieces through laser displacement sensors | |
| CN102853777A (en) | Braking gap width measuring method and equipment based on image processing | |
| CN111369484B (en) | Rail profile detection method and device | |
| CN106289086A (en) | A kind of for optical indicia dot spacing from the double camera measuring method of Accurate Calibration | |
| RU2017124259A (en) | POSITIONING TWO BODIES OF VISING SYSTEM WITH DATA GLASSES | |
| KR20110080030A (en) | A measuring apparatus of tire profile | |
| CN204287060U (en) | A kind of online three-dimensional detection device based on RGB structured light | |
| CN103148935A (en) | Industrial laser beam parameter measuring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |