CN103227264A - A light emitting apparatus - Google Patents

A light emitting apparatus Download PDF

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Publication number
CN103227264A
CN103227264A CN2013100384435A CN201310038443A CN103227264A CN 103227264 A CN103227264 A CN 103227264A CN 2013100384435 A CN2013100384435 A CN 2013100384435A CN 201310038443 A CN201310038443 A CN 201310038443A CN 103227264 A CN103227264 A CN 103227264A
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CN
China
Prior art keywords
light
wall portion
emitting component
opening
resin
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Granted
Application number
CN2013100384435A
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Chinese (zh)
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CN103227264B (en
Inventor
金田守人
濵田健作
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Nichia Corp
Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Publication of CN103227264A publication Critical patent/CN103227264A/en
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Publication of CN103227264B publication Critical patent/CN103227264B/en
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Abstract

The invention provides a light emitting apparatus. The light emitting apparatus achieves miniaturization and slimness and uses a structure preventing gaps from generating among resin, lead frames, and lead wires. Therefore, not only can components containing sliver metal be prevented from being vulcanized, but also light emitted from the light emitting apparatus can be effectively acquired. The light emitting apparatus comprises multiple light emitting elements (11a, 11b), lead frames (12a, 12b) holding the light-emitting elements, and a capsule (13) which is made from resin and which is provided with an opening (13a). The portion of lead frame is laid in the capsule, while the other portion is exposed to bottom surface of the opening (13a). A resin bottom (13e) exposed to the resin is disposed on the bottom surface of the opening (13a) of the capsule (13). The wall portion (13b) is located between light emitting elements and protruding from the bottom surface of the opening. The light emitting elements are connected with lead wires spanning the wall portion (13b).

Description

Light-emitting device
Technical field
The present invention relates to a kind of light-emitting device.
Background technology
In recent years, high brightness, high-power light-emitting component and small-sized light-emitting device are developed and are applied to various fields.That these light-emitting devices rely on is small-sized, low power consumption, characteristics such as in light weight, be used in for example mobile phone, LCD backlight light source, the light source of various instrument, various read sensors etc., carried out various trials (as patent documentation 1, patent documentation 2 etc.) in order further to realize miniaturization and high brightness.
An example as various trials, following a kind of scheme has been proposed: for example, adopt the metal parts of making by silver or silver alloy as the metal parts that is applied to lead frame, adopt the lead-in wire of making by silver or silver alloy as the lead-in wire that is applied to wire-bonded, further suppress absorption thus to the light that comes self-emission device, thus reverberation and take out light effectively.
In addition, in order to prevent the sulfuration of these silver or silver alloy, resin and the package material that is used for the sealed light emitting element proposed to have various schemes (as patent documentation 3, patent documentation 4 etc.).
Patent documentation 1:(Japan) spy opens the 2011-249807 communique
Patent documentation 2:(Japan) spy opens the 2008-153610 communique
Patent documentation 3:(Japan) spy opens the 2011-256326 communique
Patent documentation 4:(Japan) spy opens the 2011-178983 communique
Yet generally speaking, if with silver or the silver alloy material as lead frame and lead-in wire etc., these parts can vulcanize, and are accompanied by sulfuration and can cause that the problem of the usable reflection of light appears hindering in absorption to the light that comes self-emission device, result.
And, present situation is that even use the resin that consists of the sulfuration that can significantly suppress silver, gas and liquid also can be invaded by the minimum space of resin and resin or resin and lead frame etc., sulfuration beginning and expansion thus, the result can not suppress sulfuration effectively.
Summary of the invention
The present invention proposes for solving above-mentioned problem, its purpose is to provide a kind of light-emitting device, this light-emitting device has adopted and has not only realized miniaturization and slimming, and can prevent resin and resin in light-emitting device effectively, produce the structure in space between resin and lead frame, the lead-in wire etc., stoped the sulfuration of the metal parts of the argentiferous that is used for light-emitting device thus, and complemented each other, more effectively taken out the light that penetrates by light-emitting component with this structure.
The present invention includes following invention.
A kind of light-emitting device is characterized in that, comprising:
A plurality of light-emitting components;
The lead frame of the described light-emitting component of a plurality of lift-launchs;
Packaging body, it is formed by resin and has opening, and the part of described lead frame is embedded in described package interior, and another part is exposed to the bottom surface of described opening;
There is the resin bottom face that exposes described resin in bottom surface at the opening of described packaging body;
Have between the described light-emitting component in described opening from the outstanding wall portion in the bottom surface of described opening;
Described light-emitting component is connected with the lead-in wire that strides across described wall portion.
According to the present invention, the light-emitting device that possesses following effect can be provided, promptly in the miniaturization and slimming that realize light-emitting device, can also prevent resin and resin in light-emitting device effectively, produce the space between resin and lead frame, the lead-in wire etc., prevent to constitute corrosion and sulfuration packaging body or the interior metal parts that exists of packaging body thus reliably, can realize that brightness further improves, quality further improves.
Description of drawings
Figure 1A is the diagrammatic top view of taking out this light-emitting device that face (light emission face) sees from light that is used to illustrate light-emitting device of the present invention, and Figure 1B is A-A ' the line profile of the light-emitting device of Fig. 1.
Fig. 2 A is the end view of the light-emitting device of Fig. 1, and Fig. 2 B is a vertical view, and Fig. 2 C is a upward view, and Fig. 2 D is an end view.
Fig. 3 is the constructed profile of light-emitting device that is used to illustrate the inclination of wall portion of the present invention and the short side of opening.
Fig. 4 A, Fig. 4 B are the constructed profiles that is used for illustrating the light-emitting device major part of the lead-in wire connection status between the light-emitting device light-emitting component of the present invention.
Description of reference numerals
The 2n pad electrode
The 3p pad electrode
10 light-emitting devices
11a, the 11b light-emitting component
12a, the 12b lead frame
13 packaging bodies
The 13a opening
13b wall portion
The short side of 13c
The 13d long side surface
The 13e resin bottom face
The 13f recess
14 lead-in wires
Embodiment
For example, as shown in Figure 1, light-emitting device of the present invention is mainly by a plurality of light- emitting component 11a, 11b, lead frame 12a, and 12b and packaging body 13 constitute.As this light-emitting device, preferred so-called side-view luminous device, promptly preferably can as with the direction of installed surface approximate vertical on have the type that the light-emitting device of light emission face (light takes out face, below be called " upper surface " sometimes) is installed.
＜light-emitting component＞
As light-emitting component, adopt semiconductor light-emitting elements usually, but so long as be known as the element of light-emitting diode, the light-emitting component of what type all can.For example enumerate on substrate by nitride-based semiconductors such as InN, AlN, GaN, InGaN, AlGaN, InGaAlN, Ⅲ-ⅤZu Huahewubandaoti, various semiconductors such as group form the light-emitting component of the stepped construction that contains active layer.As semiconductor structure, homogeneity structures such as MIS knot, PIN knot, PN junction are for example arranged, heterojunction or double heterojunction in addition, also can be single quantum, the multi-quantum pit structures that the semiconductor active layer is formed the film that produces the quantum effect.Sometimes donor impurity and/or acceptor impurities such as Zn, Mg such as Si, Ge also can mix in active layer.The emission wavelength of the light-emitting component that obtains can change to red color area from the ultra-violet (UV) band along with the In amount among the InGaN of semi-conducting material, mixed crystal ratio, active layer, the dopant species that is entrained in the active layer change.
Light-emitting component carries on lead frame described later, has used attachment for this reason.For example, the light-emitting component that forms if send the making nitride semiconductor growing on sapphire substrate of blue light and green glow can use epoxy resin, silicones etc.In addition, the deterioration of considering the light and heat of self-emission device to cause can be aluminized to the light-emitting component back side, also can replace resin and uses solders such as scolders such as Au-Sn eutectic or low-melting-point metal.And, if the two sides of sending ruddiness that is formed by GaAs etc. is formed with the light-emitting component of electrode, also can use conductive pastes such as silver, gold, palladium etc. to carry out chip join.
In light-emitting device of the present invention, can carry plural a plurality of light-emitting component.In this case, the light-emitting component that sends different color light can be made up, also the light-emitting component that sends identical coloured light can be made up.For example, by making up a plurality of light-emitting components that send different color light accordingly, can improve color rendition with RGB.In addition, send a plurality of light-emitting components of identical coloured light, can improve light intensity by combination.
Need to prove, light-emitting component carries on light-emitting device by the installation that faces up, flip-chip installation etc., yet installation preferably faces up, it is the substrate (or semiconductor layer) of relative light-emitting component, pair of electrodes is formed on the one side side, and the face that will be formed with electrode is installed towards light emergence face.
In this case, the common and pair of electrodes wire-bonded of light-emitting component, so light-emitting component is formed with the pad electrode of answering with these electrode pairs.The pad electrode of a preferred side is near the periphery of light-emitting component, and the pad electrode of opposite side is positioned at the position to the skew of the inboard of light-emitting component.By the configuration of such pad electrode, the absorption that can seek light that lead-in wire is penetrated light-emitting component is suppressed at the MIN while, and the semiconductor layer that constitutes light-emitting component is powered equably.
In addition, but the zygosity of considering and going between, the upper space of preferred pad electrode is formed by the alloy of gold, platinum, aluminium, rhodium, iridium, ruthenium, silver or these metals etc., and more preferably the alloy by gold, platinum, aluminium or these metals forms.
＜lead frame＞
Lead frame is the parts that are used for element mounted, also plays the electrode that is electrically connected with light-emitting component and the effect of lead terminal.For this reason, the part of lead frame is buried underground and is fixed in the packaging body described later, and another part element mounted and in order to be electrically connected is exposed in the opening of packaging body (its bottom surface), remainder in the packaging body to giving prominence to outward.By lead frame is exposed on the part surface of opening bottom surface, can make the light reflection of self-emission device, take out light towards frontal effectively.
Need to prove that as described later, the lead frame that exposes in the opening bottom surface can be with the shape of opening or irrelevant with the shape of opening, its width can be different.In this case, preferably narrow at the end side width of opening, along with wide more the closer to the middle body width.At this, width need change in the scope of the function of the lead terminal that can guarantee electrode and power supply, for example, for Breadth Maximum, can be 30% with interior change, preferably 20% with interior change.
The quantity of the lead frame that light-emitting device has is usually more than two, and the quantity of lead frame can be more than (quantity of light-emitting component+1) be individual, perhaps also can be at more than two times of light-emitting component quantity.For example, under the situation that is equipped with two light-emitting components, a light-emitting component respectively is installed on two lead frames, the light-emitting component of one side is electrically connected by the lead frame of an electrode with a side of carrying it, and the light-emitting component of opposite side is electrically connected by the lead frame of an electrode with the opposite side that carries it, and the electrode of the light-emitting component that is connected with lead frame is not electrically connected each other.
Need to prove, in a plurality of lead frames except with lead frame that the electrode of described light-emitting component is electrically connected other lead frame essence power on and be configured in the packaging body isolator.
Lead frame can be in fact tabular, also can be that waveform is tabular or have concavo-convex tabular.There is no particular limitation to material, so long as can provide the material of suitable electric power to get final product to light-emitting component.In addition, preferably form by the bigger material of conductive coefficient.By forming by such material, the heat that produces of bulk storage light-emitting component effectively.Preference such as conductive coefficient are at 200W/(mK) more than material, material with bigger mechanical strength, perhaps carry out the material of punch process or etching and processing etc. easily.Specifically, can enumerate alloys such as metals such as copper, aluminium, gold, silver, tungsten, iron, nickel or iron-nickel alloy, phosphor bronze etc.In addition, in order to take out light effectively, preferably impose reflection plated film (for example, the plated film of implementing by silver or silver alloy) on the surface of lead frame from the light-emitting component that carries.The size of the light-emitting device that obtains according to hope, shape etc. can suitably be adjusted size, thickness, shape of lead frame etc.
According to carrying, can suitably adjust the shape that extends to the outer position (being lead terminal) of packaging body, size of lead frame etc. in the thermal diffusivity of the light-emitting component of light-emitting device and the use form (configuration space, allocation position etc.) of light-emitting device.In addition, according to using form, can suitably make lead terminal bending, distortion with the position relation of other electronic equipments etc.
Lead frame not only can not be electrically connected and element mounted with light-emitting component, element mounted and not being electrically connected with light-emitting component not yet.Such lead frame is preferably the surface area of one end for example, and to compare the surface area of part of the effect of playing lead terminal big.Thus, can play the heat that light-emitting component produced in the packaging body is transmitted to the effect of outside heat dissipation path and the effect of overvoltage protection.
＜packaging body 〉
Packaging body is with the lead frame overall fixed and light-emitting component and lead frame are guaranteed the parts of insulating properties when being used to protect light-emitting component.
Therefore, all can form packaging body so long as can guarantee the resin of above function.For example, resin such as thermoplastic resin, thermosetting resin, pottery etc.Specifically can enumerate polyimides (PI), polyamide (PA), polycarbonate resin, polyphenylene sulfide (PPS), liquid crystal polymer (LCP), ABS resin, epoxy resin, phenolic resins, acrylic resin, PBT resin, be used as the resin (for example resin of putting down in writing among TOHKEMY 2011-256326 number and the TOHKEMY 2011-178983 etc.) of package material etc. in this area.In addition, also various dyestuffs or pigment etc. can be blended in these materials as colouring agent or light diffusing agent.Thus, the photocontrol that the light-emitting component of packed bulk absorption can be penetrated perhaps can form the high white packaging body of reflectivity at bottom line.As colouring agent, can enumerate chromium oxide (Cr 2O 3), manganese dioxide (MnO 2), di-iron trioxide (Fe 2O 3), carbon black etc.As light diffusing agent, can enumerate calcium carbonate, aluminum oxide, titanium oxide etc.
In packaging body, in opening described later, be embedded with translucent resin usually usually, consider that packaging body and translucent resin are subjected to the influence of heat of generations such as light-emitting component and the connecting airtight property that takes place, preferably use both coefficient of thermal expansion differences materials with smaller.
There is no particular limitation to the size of packaging body and shape, its shape can be for example rounded, oval for profile when overlooking (flat shape), triangle, quadrangle, polygon or with shape of these shape approximations etc.Wherein, preferred shape of extending is along its length especially preferably extended and quadrangle or approximate tetragonal shape when overlooking along its length.
(opening)
Be formed with opening on the packaging body surface, this opening forms for element mounted and the light that takes out self-emission device.There is no particular limitation to the shape of opening, can be circle, ellipse, triangle, quadrangle or polygonal post, cheese, bowl-type etc. or with the shape of these shape approximations.Wherein, preferred shape of extending along its length, especially preferably extend along its length and be when overlooking quadrangle, approximate tetragonal polygon or with the shape of these shape approximations.
In addition, when alongst opening being set, its width in the longitudinal direction can be different, also can be roughly the same.
Preferred opening has one or a pair of long side surface that is provided with along its length at least.And preferred opening has the short side that or a pair of broad ways are provided with.Side with opening of such long side surface and/or short side can be vertical, however generally, its part or all to tilt the closer to the narrow more mode of the width of bottom surface opening.By such inclination, the light that can effectively light-emitting component be penetrated is to direction (upper surface direction) reflection of the face of taking-up.Such side can be according to its position with different inclined at inclination angles.For example, the angle of inclination of preferred side is in terminal part (as the short side) minimum of length direction.When the angle of inclination (angle of inclination of the short-and-medium side 13c of Fig. 3 is α) of short side than the angle of inclination of long side surface hour, can be in the light-emitting device of installing with its height setting in minimum value, thereby, improve the ejaculation rate of light at the terminal part of length direction reverberation effectively.For example, with respect to the opening bottom surface, preferred about 30～70 ° of the angle of inclination (α among Fig. 3) of short side is more preferably about 40～60 °.The angle of inclination of preferred long side surface is bigger than this angle of inclination, and purpose is that the space that light-emitting device is shared is along with the increase of tilting is suppressed at bottom line.
The size of opening and the degree of depth etc. can suitably be adjusted according to the quantity of the light-emitting component that carries and joint method etc.For example, preferred depth is about 1.5～10 times of thickness of described light-emitting component, more preferably about 1.5～5 times or about 2～5 times.Particularly, the degree of depth is about 0.1～1mm or about 0.2～0.6mm, more preferably about 0.25～0.35mm.Preferably increase the bottom surface of opening and/or the contact area of side, improve connecting airtight property with translucent resin described later through embossed or plasma treatment etc.
(the wall portion in the opening)
Packaging body has from the outstanding wall portion in the bottom surface of opening in opening and between the light-emitting component that carries.Corresponding with the quantity of light-emitting component, the quantity of wall portion can be one or more.Because opening has wall portion, the space that constitutes opening is separated, and as described later, is embedded in the thermal expansion of the translucent resin in the opening or thermal contraction usually and more effectively is suppressed in more in the narrow space.
The height of preferred wall portion is equal to or less than the height of the light-emitting component of lift-launch.Can not only not make the degree of depth of opening increase and stably form lead-in wire like this, can also separate the space that constitutes opening easily.
Preferred wall portion is configured in (with reference to the 13b of wall portion of Figure 1B) between the lead frame, in other words, preferably utilizes wall portion to make lead frame electricity isolation substantially.Need to prove that as long as wall portion is present between the lead frame, its part can extend to (with reference to the 13b of wall portion of Figure 1B) on the lead frame.When the part of wall portion extends on the lead frame, can improve the resin and the connecting airtight property of lead frame that constitute packaging body, make lead frame fixing in packaging body more firm.
Preferred wall portion all is connected with a pair of long side surface, and this a pair of long side surface is along the length direction setting that is configured in the opening in the packaging body that length direction extends.Like this, by being connected of wall portion and long side surface, the space that constitutes opening is separated, and can more effectively be suppressed at more in the narrow space being embedded in the thermal expansion of the translucent resin in the opening or thermal contraction usually.
In addition, preferred wall portion is wide more the closer to bottom width.At this, so-called " width is wide more ", as mentioned before, when referring to preferably that wall portion is connected with long side surface in the longitudinal direction width broaden.Need to prove that the whole and long side surface of preferred wall portion on its short transverse is connected, but also can the bottom surface of opening and near or below wall portion short transverse, partly be connected with long side surface.In this case, the closer to the bottom surface, with respect to the direction that a pair of long side surface is connected (for example direction of intersecting with the bearing of trend of long side surface), the width of wall portion can be wide more.
Wall portion is the degree that broadens of width in the longitudinal direction, for example with respect to the opening bottom surface, and the angle of inclination of wall portion side (inclination angle beta of Fig. 3 mesospore 13b of portion) preferred about 40～70 °, more preferably 50～60 °.By being arranged to such angle of inclination, can effectively the light that comes self-emission device that shines wall portion be reflected to removing direction.Need to prove that the angle of inclination (β among Fig. 3) of preferred wall portion side is bigger than the angle of inclination (α among Fig. 3) of the terminal part side (short side 13c) of length direction.
The size of wall portion can be according to the suitably adjustment such as size of employed light-emitting device, and for example, portion's width is about 0.05～0.2mm in the above, is about 0.3～0.5mm at the bottom surface sections width, highly is about 0.1～0.17mm.
(opening bottom surface)
The opening bottom surface also has the resin bottom face that exposes resin except a part of surface with lead frame.Preferred resin bottom surface and long side surface in abutting connection with or dispose along long side surface.The length of resin bottom face can be about 30 ~ 100% of long side surface length, and is preferred about 40 ~ 90%, more preferably about 50 ~ 80%.By disposing such resin bottom face, packaging body resin and translucent resin described later are connected airtight better.Particularly, when resin is exposed to the opening bottom surface, owing to there is not the resin, lead frame and the translucent resin three's described later that constitute packaging body border in the marginal portion, therefore, even between resin that constitutes packaging body and translucent resin, produced and peeled off or formed small space, also can prevent from effectively to contact with lead frame, thereby can very prevent silver-colored sulfuration effectively by moisture, gas, rubbish that these small spaces are invaded.
For example, about 1 ~ 30% of the Breadth Maximum of the preferred opening of width of resin bottom face, more preferably about 2 ~ 20%.And, preferred resin bottom surface width difference in the longitudinal direction.The variation of width is preferably in described scope in the longitudinal direction, particularly, and about 10 ~ 50% of the Breadth Maximum of the minimum widith preferred resin bottom surface of resin bottom face, more preferably about 20 ~ 40%.
Particularly, the width of resin bottom face preferably begins to the wall portion difference outstanding from the opening bottom surface described later from the distal portion of length direction, and is more preferably narrow more the closer to wall portion width.
Need to prove, as mentioned before, in the opening of packaging body, formed under the situation of the outstanding wall portion in bottom surface, even with long side surface in abutting connection with or along the position of long side surface, at wall portion and the position, bottom surface that is adjacent, also can not have resin bottom face.In other words, preferably occupied by the exposure of lead frame with the position of the opening bottom surface of wall portion adjacency.
With long side surface in abutting connection with or can be separated into more than two sections in the longitudinal direction along the resin bottom face of long side surface.Like this, because the existence of wall portion can prevent to constitute the resin of packaging body and peeling off of translucent resin effectively near wall portion.That is, as described later, translucent resin is generally than the easier thermal expansion of resin or the thermal contraction that constitute packaging body, but near wall portion, limits described translucent resin from three directions, thereby can suppress to cause the thermal expansion or the thermal contraction of peeling off.
(outer wall)
Preferably the part at the packaging body outer surface is formed with recess.This recess can form the inner surface (opening) that extends to the encapsulation body wall, forms protuberance at inner surface (opening).By such recess, can more effectively utilize the space (for example dead angle) that exists in the light-emitting device, thereby can further realize the miniaturization of light-emitting device.
For example, as long as guarantee a part that is projected into the lead frame of packaging body outside is accommodated in this recess, there is no particular limitation to the size of recess and shape, preferably guarantee the part of lead frame is accommodated in the recess space about its surperficial part is in together simultaneously with the outer surface that encapsulates body wall.At this, the meaning of " be in together one side " is smooth, only makes by being positioned on the installation base plate such as circuit substrate, lead terminal is electrically connected with circuit substrate, and firmly fixes." part of lead frame is accommodated form in the recess " and can enumerate, and the part of lead frame is configured in this recess 13f as Figure 1A and the recess 13f that forms incision-like in the so-called corner of packaging body 13 shown in Figure 2.
In light-emitting device of the present invention, except light-emitting component, can also carry protection component.Protection component can be one, also can be plural a plurality of.At this, there is no particular limitation for protection component, and the known elements of carrying on light-emitting device all can.Specifically enumerate the element that is used to prevent overheated, overvoltage, overcurrent, static and protective circuit etc.
(translucent resin)
In light-emitting device of the present invention, preferably in the opening of mounting light-emitting component, be embedded with translucent resin.
Translucent resin is with the part sealing of light-emitting component, lead-in wire and conductive component, protects it not to be subjected to the parts of the influence of rubbish, moisture and external force etc.The main material of translucent resin is preferably formed by the light transmissive material (transmissivity is preferred more than 70%) that light-emitting component is penetrated.
Specifically can enumerate add-on type or condensed type silicones, epoxy resin, phenolic resins, polycarbonate resin, acrylic resin, ABS resin, polybutylene terephthalate (PBT) resin, polyphthalamide resin, polyphenylene sulfide, liquid crystal polymer or contain more than one hybrid resin in these resins.
This translucent resin preferably also contains the slaine and/or the metal complex of zinc except above-mentioned main material.By containing zinc, can catch the gas of sulfur atom-containing especially effectively, thereby can suppress the sulfuration of silver.
For example, can enumerate the translucent resin of the zinc complex that contains acid or ester part that contains phosphate or phosphoric acid zinc salt, phosphate or phosphoric acid zinc salt.
Specifically, preferably contain two (acetylacetone,2,4-pentanedione root) and close zinc, carboxylates such as two (2 ethyl hexanoic acid) zinc, zinc methacrylate, zinc neodecanoate, zinc oxide, zinc etc.
By using such translucent resin, can suppress sulfurous gas significantly and touch the gold-plated of lead frame or lead frame surface or be used as the silver of lead-in wire or the sulfuration that silver alloy causes.
As translucent resin, can use for example resin of middle record such as TOHKEMY 2011-256326, TOHKEMY 2011-137140, TOHKEMY 2011-178983.
Translucent resin can contain diffusant or fluorescent material.Diffusant is the material that makes the light diffusion, can relax the directive property of the light of self-emission device to increase the visual angle.Fluorescent material is the material that conversion comes the light of self-emission device, can conversion injects to the light wavelength of packaging body outside from light-emitting component.During the short visible light of the only energy height that sends when light-emitting component, wavelength, being fit to use the perylene of organic fluorescent is derivative, perhaps ZnCdS:Cu, YAG:Ce, the nitrogenous CaO-Al that activated by Eu and/or Cr 2O 3-SiO 2Deng inorganic phosphor etc.In the present invention, in the time that white light will be obtained, particularly use the YAG:Ce fluorophor, according to its amount, not only can send the blue light from blue light emitting device, can also absorb the yellow that a part of blue light sends its complementary colours is light, thereby forms white color system light relatively simple and reliablely.Similarly, when using the nitrogenous CaO-Al that activates by Eu and/or Cr 2O 3-SiO 2During fluorophor,, not only can send blue light, can also absorb the red colour system light that a part of blue light sends its complementary colours, thereby form white color system light relatively simple and reliablely from blue light emitting device according to its amount.In addition, by precipitating fluorophor fully and removing bubble, can reduce the inhomogeneous of color.
Particularly, the modulus of elasticity of translucent resin is preferably less than 10MPa, for example, and more preferably 0.1 ~ 10MPa or 0.2 ~ 5MPa etc.At this, modulus of elasticity is the value of measuring according to the method for JIS K6911 or JIS K6249.By setting such modulus of elasticity for, can prevent in the opening that peeling off of the terminal part on the length direction of opening particularly can also be relaxed simultaneously the stress that is applied to lead-in wire etc.
In light-emitting device of the present invention, with before the translucent resin sealing, can be on the surface of lead-in wire, light-emitting component, lead frame covered with protective film.For the absorption of the light that will penetrate light-emitting component is suppressed at bottom line, preferred diaphragm is formed by the low material of light absorption of the wavelength that light-emitting component is penetrated, and certain thickness is arranged.As oxidation film, for example enumerated Al 2O 3, SiO 2, SiN, HfO, TiO 2, SiO xN yDeng, as nitride film, for example enumerate SiN, TiN etc., can make described monofilm or laminated film.Wherein, preferred aluminium oxide, silicon dioxide or contain the oxidation film material etc. of these compounds.In addition, the thickness of film preferably more than about 3nm, about 1 μ m below.Can form diaphragm by means commonly known in the art, still, preferably use for example atomic layer deposition method (ALD:atomic layer depo sition).
＜lead-in wire 〉
In light-emitting device of the present invention, power to light-emitting component in order to make the pair of electrodes that is formed on the light-emitting component, by lead-in wire this pair of electrodes is electrically connected with the electrode of the light-emitting component of lead frame and/or adjacency.
There is no particular limitation to the material of lead-in wire and diameter etc., can use material commonly used in this area.Particularly, preferably good with the ohmic contact characteristic of light-emitting element electrode, mechanical connection is good and conductivity and the good material of thermal conductivity.
Lead-in wire can use for example metal and alloy materials thereof such as gold, copper, platinum, aluminium, silver, and material of silver or silver alloy etc. is perhaps arranged in surface coverage.Wherein, as the high material of reflectivity, the alloy of preferred silver, copper, lead, aluminium, platinum or these metals, more preferably silver or silver alloy.For example can use the silver of selling on the market to account for 87.7 volume %, gold and account for the lead-in wire (trade name: SEA, Tanaka's noble metal society makes) that 8.7 volume %, palladium account for 3.6 volume %
There is no particular limitation to the diameter of lead-in wire, but can be about 10 μ m ~ 70 μ m, about preferred 15 ~ 50 μ m, more preferably about 18 ~ 30 μ m.
The conductive coefficient of lead-in wire is preferably at 0.01cal/Scm 2℃/cm about more than, more preferably at 0.5cal/Scm 2℃/cm.
According to lead connecting method, lead-in wire can adopt various forms usually in light-emitting device.In the present invention, preferred lead-in wire strides across between the wall portion connection light-emitting component that is configured in the described opening.Owing to make the position that be considered to the described translucent resin thermal expansion that be used to seal or thermal contraction degree maximum of lead-in wire in opening stride across wall portion, therefore, by occupying of wall portion, can suppress thermal expansion or thermal contraction, thereby relax the stress that lead-in wire is applied.
In addition, between the electrode of light-emitting component or between the electrode and lead frame of light-emitting component, promptly in the connection between their wire bonds, preferably make the amesiality wire bonds in high-order bit of lead-in wire.In the joint between the electrode of light-emitting component, preferably make the amesiality light-emitting component side in high-order bit of lead-in wire.
For example, in Fig. 4 A, n pad electrode 2 close light-emitting component 11a, the periphery of 11b, p pad electrode 3 is positioned at light-emitting component 11a, on the light-emitting zone of 11b and to light-emitting component 11a, the position of the inboard of 11b skew.To the periphery of a side light-emitting component 11b near i.e. first wire bonds of the n pad electrode 2(that is provided with) adjacent with the 13b of wall portion that is formed on opening in, and be second wire bonds across the 13b of this wall portion with the p pad electrode 3(that is provided with to the skew of the inboard of opposite side light-emitting component 11a) carry out wire bond.And the high-order bit of lead-in wire 14 is positioned at the position of moving to a side light-emitting component 11b lateral deviation that engages with n pad electrode 2 near the periphery setting.By adopting the form of such lead-in wire, can stably form the rising portions (position of Yan Shening upward) that erects from n pad electrode 2.This rising portions is the position of being broken easily, but, by this rising portions being configured in (m is shorter at Fig. 4 A middle distance) near the 13b of wall portion, can utilizing wall portion to reduce translucent resin, thereby can prevent effectively that the rising portions that goes between from being broken in this peripheral thermal expansion or thermal contraction.
In addition, in Fig. 4 B, represented the configuration of light-emitting component identical and wall portion with Fig. 4, the high-order bit that in this configuration, connects lead-in wire 14 between the light-emitting component be positioned to be arranged on the position that a side light-emitting component 11a lateral deviation that inboard p pad electrode 3 engages is moved.By such lead-in wire form, when using the emissivity lead-in wire, the lead-in wire that promptly is configured in the light-emitting zone top at the rising portions (position of Yan Shening upward) of p pad electrode 3 can prevent the absorption of light, utilizes the reflection (with reference to the q among Fig. 4 B) of lead-in wire can further improve light and takes out efficient.Usually, light is difficult to the transmission pad electrode, but, by making emanative lead-in wire extend (promptly at p pad electrode 3 sides configuration rising portions) to the top of this pad electrode, be increased in the ratio that goes between and occupied on the pad electrode, utilize light to offset light in the reduction of the transmissivity of pad electrode, thereby can realize that wind distributes in fact uniformly in the reflection of lead-in wire.
Below, describe the embodiment of light-emitting device of the present invention with reference to the accompanying drawings in detail.
Execution mode
As Figure 1A, 1B and shown in Figure 2, the light-emitting device 10 of present embodiment is mainly by a plurality of light-emitting component 11a, 11b, lead frame 12a, and 12b and packaging body 13 constitute, and constitute side-view type.
Light-emitting component 11a, 11b for example dispose n type semiconductor layer, luminescent layer and p type semiconductor layer successively on substrate, the local surfaces of n type semiconductor layer is exposed, and form the n electrode on this surface, and have the n pad electrode that is configured on this n electrode.In addition, form the p electrode on the about whole surface of p type semiconductor layer, and have the p pad electrode that is configured on this p electrode, this light-emitting component 11a, 11b face up and are installed in lead frame 12a, on the 12b.
Lead frame 12a, 12b have element mounted and the zone that is electrically connected with light-emitting component, bury and be fixed on the zone in the packaging body 13 underground and bury underground and fixing zone is projected into the outside and zone that work as lead terminal of packaging body from this.Lead frame 12a, 12b is formed by plate body, and this plate body is made by the copper alloy of iron content, in order to take out the light from the light-emitting component that carries effectively, implements silver-plated to the surface of lead frame 12a.
As the lead frame 12a that lead terminal works, 12b is bent processing, so that in the packaging body outside is housed in the recess 13f of end of the length direction that is present in packaging body.
Lead frame 12a, 12b respectively the resin by constituting packaging body by wall part described later from.
Packaging body 13 extends along its length and roughly is rectangular shape, takes out a pair of short side 13c that face (being upper surface) has the opening 13a that prolongs along its length, a pair of long side surface 13d that extends along its length and broad ways extension at its light.
In addition, opening 13c has the wall portion 13b outstanding from its bottom surface.
For example, the degree of depth of opening 13c is about 0.32 ~ 0.35mm, and the height of the 13b of wall portion is about 0.12 ~ 0.15mm.
Near the substantial middle of the long side surface 13d of opening 13c, the 13b of wall portion is connected with a pair of long side surface 13d.The 13b of wall portion is in the longitudinal direction the closer to bottom width wide more (as the 13b of Figure 1B and Fig. 3).For example, the width of the upper surface of the 13b of wall portion is set to about 0.1mm, and the width of bottom surface is set to about 0.4mm.
In the bottom surface of opening 13c, lead frame 12a, 12b exposes, and disposes resin bottom face 13e, long side surface 13d adjacency on the length direction of this resin bottom face 13e and opening 13c and extension along its length.
Lead frame 12a, 12b with the position of the 13b of wall portion adjacency, expose with the width identical with the bottom width of opening 13a, its width begins to have two kinds of different width towards the terminal part of length direction from the 13b of wall portion, promptly towards the terminal part narrowed width of length direction.For example, width is narrowed 0.37mm from 0.4mm, and then is narrowed 0.3mm.
On the other hand, the width of resin bottom face 13e begins the 13b towards wall portion from the terminal part of length direction, and difference is promptly narrow more towards the 13b of wall portion width, and in the bottom surface near the opening 13c of the 13b of wall portion, resin bottom face 13e does not exist, only leaded framework 12a, and 12b exposes.For example, width is narrowed about 0.015mm from about 0.05mm.
In opening 13c, be exposed to the lead frame 12a of opening bottom surface, the last mounting light-emitting component respectively of 12b 11a, 11b, lead frame 12a, 12b is connected with a lateral electrode of light-emitting component by lead-in wire as electrode.In addition, light-emitting component 11a, 11b is electrically connected by the lead-in wire 14 that strides across the 13b of wall portion.
Lead-in wire 14 is the lead-in wires made by silver alloy about diameter 18 ~ 30 μ m, particularly, at light-emitting component 11a, in the joint between the electrode of 11b, the amesiality light-emitting component side (with reference to 14 among Fig. 4 A and Fig. 4 B) in high-order bit of lead-in wire 14.Particularly, in the periphery setting of the pad electrode of the side that becomes the junction point of this employed light-emitting component near light-emitting component, and the inboard of the pad electrode of opposite side deflection light-emitting component is provided with, therefore, near between the pad electrode of the pad electrode of light-emitting component 11b periphery and deflection light-emitting component 11a inboard by wire-bonded.Thus, lead-in wire 14 is equivalent to the shape on leg-of-mutton both sides by its shape after the wire-bonded, and the high-order bit deflection of lead-in wire 14 is engaged with the light-emitting component 11b side on the pad electrode that is provided with near periphery.
Though do not illustrate, this light-emitting device 10 has protection component, the lead frame 12a in this protection component and the packaging body 13,12b is electrically connected.Protection component can be a Zener diode for example, can be configured in the lead frame 12a of element mounted, on the face of the opposition side of the one side of 12b.In addition, the package interior of the lead-line configuration that preferably is connected between lead frame 12a and lead frame 12b with protection component.Particularly, from being configured between the lead frame under the situation on the lead frame,, can shorten the lead-in wire that is connected with Zener diode by such configuration in wall portion, and can suppress the lead-in wire be disconnected.In addition, be not vulnerable to the influence of the thermal expansion of translucent resin, can prevent peeling off and elasticity of Zener diode better.
In this light-emitting device, opening bottom surface at packaging body, the exposure portion of lead frame and the exposure portion of resin with specific width configuration in certain location, as mentioned above, in open side, peel off or the space even produced between packaging body resin and the translucent resin, the metal parts that on their interface, does not have argentiferous, therefore, metal parts can not be exposed to from the extraneous air of this space intrusion and moisture etc., can prevent sulfuration effectively.Therefore, the absorption to the light that comes self-emission device that can avoid that the sulfuration of metal parts causes can provide the light-emitting device of high brightness.
In addition, by wall portion is set in opening, can be with the separated by spaces in the opening, therefore, can relax the thermal expansion that is embedded in the translucent resin in the opening or thermal contraction etc. effectively and cause the stress that lead-in wire or light-emitting component etc. are applied.
In other words, this light-emitting device has and can prevent effectively at resin and resin, produce the structure in space between resin and lead frame, the lead-in wire etc., therefore can stop the sulfuration of the argentiferous metal parts that is used for light-emitting device, and complement each other with this structure and effect, can access the light-emitting device of the high brightness that takes out the light that penetrates from light-emitting component more effectively.In addition, because this light-emitting device realized miniaturization and slimming, therefore improved the degree of freedom with the combination of other electronic equipments.
Industrial applicibility
Light-emitting device of the present invention has carried for example light-emitting diode die as light-emitting component, therefore, as from the packaging body side towards the surface-mount type light emitting device of the luminous type of side surface direction, not only can be applied to the lighting device of the image read-out in facsimile machine, photocopier, the hand-held scanner etc., can also be applied to illumination light source, the back light of light-emitting diode display, portable phone etc., the various lighting devices of traffic lights, lighting switch, vehicle-mounted parking lamp, various transducer, various indicator lights etc.

Claims (13)

1. a light-emitting device is characterized in that, comprising:
A plurality of light-emitting components;
A plurality of lead frames that are equipped with described light-emitting component;
Packaging body, it is formed by resin and has opening, and the part of described lead frame is embedded in described package interior, and another part is exposed to the bottom surface of described opening;
There is the resin bottom face that exposes described resin in bottom surface at the opening of described packaging body;
Have between the light-emitting component in described opening from the outstanding wall portion in the bottom surface of described opening;
Described light-emitting component is connected with the lead-in wire that strides across described wall portion.
2. light-emitting device as claimed in claim 1 is characterized in that described packaging body reaches the Width setting along its length, and described resin bottom face is its width difference in the longitudinal direction.
3. light-emitting device as claimed in claim 1 or 2 is characterized in that, described resin bottom face is narrow more the closer to its width of wall portion.
4. as each described light-emitting device in the claim 1 to 3, it is characterized in that the height of described wall portion is less than or equal to the height of the described light-emitting component of lift-launch.
5. as each described light-emitting device in the claim 1 to 4, it is characterized in that described packaging body has the shape of extending along its length, described opening has the long side surface that is provided with along its length, and described resin bottom face and long side surface are in abutting connection with configuration.
6. as each described light-emitting device in the claim 1 to 5, it is characterized in that, described wall portion is connected with a pair of long side surface, this a pair of long side surface extends along the length direction that is configured in the opening in the packaging body that length direction extends, and described wall portion is wide more the closer to the width of bottom surface on this length direction.
7. as each described light-emitting device in the claim 1 to 6, it is characterized in that,, occupied by the exposure of described lead frame with the position of described wall portion adjacency in the bottom surface of the opening of described packaging body.
8. as each described light-emitting device in the claim 1 to 7, it is characterized in that described wall portion is configured between the described lead frame.
9. as each described light-emitting device in the claim 1 to 8, it is characterized in that described wall portion is configured on the described lead frame between the described lead frame.
10. as each described light-emitting device in the claim 1 to 9, it is characterized in that described opening is embedded with translucent resin, the modulus of elasticity of this translucent resin is below 10MPa.
11. as each described light-emitting device in the claim 1 to 10, it is characterized in that, the described light-emitting component of one side has first wire bonds near periphery, the described light-emitting component of opposite side has second wire bonds that is positioned to the position of the inboard skew of light-emitting zone, described first wire bonds and described wall portion adjacency, and stride across this wall portion and engage with described second wire bonds, and the high-order bit of described lead-in wire is positioned at the position of moving to the described light-emitting component lateral deviation with first wire bonds.
12. as each described light-emitting device in the claim 1 to 10, it is characterized in that, the described light-emitting component of one side has first wire bonds near periphery, the described light-emitting component of opposite side has second wire bonds that is positioned to the position of the inboard skew of light-emitting zone, described first wire bonds and described wall portion adjacency, and stride across this wall portion and engage with described second wire bonds, and the high-order bit of described lead-in wire is positioned at the position of moving to the described light-emitting component lateral deviation with second wire bonds.
13., it is characterized in that described lead-in wire is made by silver or silver alloy as each described light-emitting device in the claim 1 to 12.
CN201310038443.5A 2012-01-31 2013-01-31 Light-emitting device Active CN103227264B (en)

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JP5678592B2 (en) 2009-12-02 2015-03-04 横浜ゴム株式会社 Heat-curable silicone resin composition for optical semiconductor encapsulation and optical semiconductor encapsulant using the same
JP4788837B2 (en) 2010-01-26 2011-10-05 横浜ゴム株式会社 Silicone resin composition and method for using the same, silicone resin, silicone resin-containing structure, and optical semiconductor element sealing body
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JP2008153610A (en) * 2006-11-22 2008-07-03 Nichia Chem Ind Ltd Semiconductor device
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CN102263098A (en) * 2010-05-24 2011-11-30 Lg伊诺特有限公司 Light emitting device and light unit having the same

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