CN103196996A - Eddy current detecting device used for performing metal defect detection and eddy current probe thereof - Google Patents
Eddy current detecting device used for performing metal defect detection and eddy current probe thereof Download PDFInfo
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- CN103196996A CN103196996A CN201310133460.7A CN201310133460A CN103196996A CN 103196996 A CN103196996 A CN 103196996A CN 201310133460 A CN201310133460 A CN 201310133460A CN 103196996 A CN103196996 A CN 103196996A
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Abstract
The invention discloses an eddy current detecting device used for performing metal defect detection and an eddy current probe thereof. The eddy current probe comprises more than one orthogonal combination probe, wherein each orthogonal combination probe comprises one exciting coil and two induction coils, the geometric centers of the two induction coils are overlapped, the central cross sections of the two induction coils pass by the geometric center of the exciting coil, and the central cross sections of the exciting coil and the two induction coils are pairwise vertical. If more than two orthogonal combination probes are arranged, the central cross sections of the exciting coils of all the orthogonal combination probes are located on the same plane, and the geometric centers of all exciting coils are located on the same straight line. The eddy current detecting device comprises a controller, a signal generating circuit, a wave filtering and amplifying circuit, a phase-sensitive wave detecting circuit, a signal collecting card, a host computer, a first high-speed analogue switch, a second high-speed analogue switch and the eddy current probe. According to the eddy current detecting device and the eddy current, the detection sensitivity is high and the detection speed is fast.
Description
Technical field
The present invention relates to a kind of metal material defective Non-Destructive Testing sensor construction and corresponding testing circuit.
Background technology
The defects detection of metal material is significant according to electromagnetic induction principle at military industry field, the coil that is loaded with alternating current can induce eddy current near in its metal material, the eddy current of induction can influence magnetic test coil original Distribution of Magnetic Field on every side conversely, eddy current has carried the thickness of metal material thereby the measurement impedance that causes inductive coil changes, information such as defective, conductivity, change and to know the relevant physical parameter of metal material by inference by measuring the coil impedance that causes because of eddy current, as whether there being defective etc.
Conventional EDDY CURRENT, inductive coil have original induced voltage signal output in testing process, for enlarging the input dynamic range, improve detection sensitivity, generally adopt the differential probe structure.When metal was carried out defects detection, two coils of differential probe need place identical electromagnetic environment, and the initial voltage signal that just can make eddy current probe is zero, and this is in actual detected, and difficulty realizes sometimes.General bigger drive coil and two the identical little inductive coils of structure of adopting of perturbation detection technique are formed.Two parallel placements of inductive coil, all perpendicular to drive coil, two inductive coil positions are reciprocity fully.This perturbed structure can make the eddy current sensor that is positioned on the derby below metal when not having defective, two differential output signals of little inductive coil are almost equal to zero, the advantage of this detection architecture is defective very responsive, can detect atomic little defective.In the eddy current test, generally can only can obviously cut off the flow through direction in path of inductive loop at one and carry out effective detection of defective, generally simultaneously adopt single probe to detect, these are all restricting the detection efficiency of eddy detection system to a certain extent.
Summary of the invention
The purpose of this invention is to provide a kind of be used to carrying out eddy current testing device and the eddy current probe thereof that metal defect detects, to overcome all or part of defective of prior art.
For achieving the above object, the technical solution used in the present invention is:
The present invention comprises an above Orthogonal Composite probe for the eddy current probe that carries out the metal defect detection, each Orthogonal Composite probe comprises a drive coil and two inductive coils, the geometric center of described two inductive coils overlaps, the center cross-sectional of described two inductive coils is all passed through the geometric center of drive coil, and the center cross-sectional of drive coil and two inductive coils is vertical in twos.
Further, Orthogonal Composite probe of the present invention is more than two, and the center cross-sectional of the drive coil of all Orthogonal Composite probes is on same plane, and the geometric center of all drive coils is on same straight line.
The eddy current testing device that the present invention contains above-mentioned eddy current probe comprises controller, signal generating circuit, filtering and amplifying circuit, phase-sensitive detection circuit, data acquisition card, host computer, first high-speed analog switch, second high-speed analog switch and described eddy current probe, controller respectively with signal generating circuit, filtering and amplifying circuit, first high-speed analog switch, second high-speed analog switch connects, the output terminal of filtering and amplifying circuit is connected with the input end of phase-sensitive detection circuit, the output terminal of phase-sensitive detection circuit and signals collecting card connection, data acquisition card is connected with host computer, signal generating circuit is connected with first high-speed analog switch, and filtering and amplifying circuit are connected with second high-speed analog switch; Each drive coil in the described eddy current probe is connected with first high-speed analog switch, and each inductive coil in the eddy current probe is connected with second high-speed analog switch.
Further, signal generating circuit of the present invention is sinusoidal signal generation circuit.
Further, eddy current testing device of the present invention also comprises mechanical scanner, and eddy current probe is fixed on the described mechanical scanner.
Further, controller of the present invention is single-chip microcomputer.
Further, the output current of first high-speed analog switch of the present invention is more than 100 milliamperes.
Compared with prior art, advantage of the present invention is:
(1) absolute type can be measured atomic little cracks of metal surface based on the sonde configuration of perturbation principle.
(2) two quadrature inductive coils can be realized the two dimensional surface defects detection of both direction same precision in length and breadth.
(3) array probe has improved defects detection efficient greatly, to each probe timesharing excitation, has reduced the interference between probe, has simplified follow-up hardware handles circuit.
(4) adopt the high-speed analog switch chip that can lead to big electric current, guaranteed intensity and system's accuracy of detection of exciting field.
(5) the present invention has higher detection sensitivity and detection speed.
Description of drawings
Fig. 1 is the drive coil top Distribution of Magnetic Field figure (magnetic line of force expansion constantly) of eddy current probe of the present invention;
Fig. 2 is eddy current drive coil top Distribution of Magnetic Field figure (magnetic line of force shrinks constantly);
Fig. 3 is a certain moment Distribution of Magnetic Field vertical view in eddy current drive coil top;
Fig. 4 is a kind of structural representation that only contains the eddy current probe of single Orthogonal Composite probe of the present invention;
Fig. 5 is a kind of structural representation that contains the eddy current probe of two above Orthogonal Composite probes of the present invention;
Fig. 6 is that the working method of two kinds of eddy current probes compares synoptic diagram, wherein, (a) contains single Orthogonal Composite probe, (b) contains a plurality of Orthogonal Composite probes;
Fig. 7 is the structured flowchart of a kind of eddy current testing device of the present invention;
Fig. 8 is a kind of circuit diagram of first high-speed analog switch of the present invention;
Fig. 9 is a kind of circuit diagram of second high-speed analog switch of the present invention.
Embodiment
The structure of a kind of eddy current probe of the present invention as shown in Figure 4.Wherein, 2 is drive coil, and 5,6 are respectively inductive coil.Eddy current probe shown in Figure 4 comprises an Orthogonal Composite probe, and this Orthogonal Composite probe comprises a drive coil 2, inductive coil 5 and inductive coil 6.Wherein, the geometric center of inductive coil 5 and inductive coil 6 overlaps, the geometric center that the center cross-sectional of inductive coil 5 and inductive coil 6 is all passed through drive coil 2, and drive coil 2, inductive coil 5 are vertical in twos with inductive coil 6 threes' center cross-sectional.Eddy current probe of the present invention can place two inductive coils 5,6 inside (as shown in Figure 4) of drive coil 2, also can as shown in Figure 5 two inductive coils 5,6 be placed the outside of drive coil 2.Under the symmetric prerequisite of damage field not, drive coil 2 can adopt the column type coaxial coil, and inductive coil 5,6 can be square coil.When eddy current probe is popped one's head in side-by-side forming array probe by the identical Orthogonal Composite formula of a plurality of structures (as shown in Figure 5), the center cross-sectional of the drive coil 2 of all Orthogonal Composite probes is on same plane 7, and the geometric center of all drive coils 2 is on same straight line.When carrying out EDDY CURRENT, contain the scan mode of the eddy current probe of single Orthogonal Composite probe and the array eddy current probe that contains a plurality of Orthogonal Composite probes respectively shown in Fig. 6 (a), Fig. 6 (b).Wherein, the array eddy current probe is the linear array that the on all four Orthogonal Composite probe of a plurality of structures is formed, and adopts the array eddy current probe to detect a flaw and can improve detection efficiency greatly.
The structure of a kind of eddy current testing device of the present invention as shown in Figure 7, it comprises controller, signal generating circuit, filtering and amplifying circuit, phase-sensitive detection circuit, data acquisition card, host computer, first high-speed analog switch, second high-speed analog switch and eddy current probe of the present invention.Wherein, controller is connected with signal generating circuit, filtering and amplifying circuit, first high-speed analog switch, second high-speed analog switch respectively, the output terminal of filtering and amplifying circuit is connected with the input end of phase-sensitive detection circuit, the output terminal of phase-sensitive detection circuit and signals collecting card connection, data acquisition card is connected with host computer, signal generating circuit is connected with first high-speed analog switch, and filtering and amplifying circuit are connected with second high-speed analog switch; Each drive coil 2 in the described eddy current probe is connected with first high-speed analog switch, and each inductive coil in the eddy current probe is connected with second high-speed analog switch.Wherein, signal generating circuit can use sinusoidal signal generation circuit, for example uses the dds(digital frequency synthesizer) chip.Controller can use single-chip microcomputer.
Under Single-chip Controlling, the dds(digital frequency synthesizer) chip produces the input port that sinusoidal excitation signal is sent to the first high-speed analog switch chip, sinusoidal excitation signal encourages the drive coil of each Orthogonal Composite probe in the array probe successively under Single-chip Controlling, the vortex induction signal of each inductive coil enters filtering successively by the second high-speed analog switch chip and amplifying circuit is handled in the Orthogonal Composite probe, then by phase-sensitive detection circuit the vortex induction signal is transferred to and inductive coil impedance corresponding simulating direct current signal by AC signal, behind data acquisition card, be sent to host computer and show and handle.
When using the present invention that conductor is carried out eddy current test, detect degree of accuracy for improving, configurable mechanical scanner, eddy current probe are fixed on the mechanical scanner, host computer is equipped with the motion control card of mechanical scanner, by host computer mechanical scanner is carried out motion control.
Host computer can select for use labview software to carry out collection, demonstration and the aftertreatment of vortex induction signal.Eddy current probe is placed the top of measured conductor, sweep velocity and the excitation frequency of mechanical scanner are set in the labview program, after starting scanning monitor, can make eddy current probe scan measured conductor as requested, the direct-flow output signal variation tendency of the phase-sensitive detection circuit of gathering by data acquisition card obtains the defect information of tested metal material
As Fig. 8, shown in Figure 9, in eddy current testing device of the present invention, first high-speed analog switch can be selected the ADG1414 chip for use, and second high-speed analog switch can be selected the CD4052BCM chip for use.Below be that example further specifies the present invention with linear array formula eddy current probe.
In the present embodiment, linear array formula eddy current probe is made up of 8 on all four Orthogonal Composite probes of structure altogether, so this eddy current probe has eight drive coils and 16 inductive coils.As shown in Figure 5, identical and their center cross-sectional of the modes of emplacement of one of them inductive coil of all Orthogonal Composite probe is parallel to each other, and identical and their center cross-sectional of the modes of emplacement of another inductive coil of all Orthogonal Composite probes overlaps.
Single-chip microcomputer encourages each drive coil in the eddy current probe successively by controlling first high-speed analog switch, gathers the signal of each inductive coil in the eddy current probe successively by controlling second high-speed analog switch.In the eddy current probe, a termination first high-speed analog switch of each drive coil, other end ground connection; The two ends of each inductive coil connect second high-speed analog switch.Therefore, when using eddy current probe to detect, available a slice ADG1414 chip encourages 8 drive coils in the eddy current probe successively, gathers the vortex induction signal of 16 inductive coils successively with 4 CD4052BCM chips.Wherein, first CD4052BCM chip connects the 1st to the 4th inductive coil, second CD4052BCM chip connects the 5th to the 8th inductive coil, and the 3rd CD4052BCM chip connects the 9th to the 12nd inductive coil, and the 4th CD4052BCM chip connects the 13rd to the 16th inductive coil.Referring to Fig. 5, the 1st to the 8th inductive coil is respectively an inductive coil of first to the 8th Orthogonal Composite probe accordingly, and the center cross-sectional of the 1st to the 8th inductive coil is parallel to each other; The the 9th to the 16th inductive coil also is respectively another inductive coil of first to the 8th Orthogonal Composite probe accordingly, and the center cross-sectional of the 9th to the 17th inductive coil overlaps.Carry out specific description below in conjunction with Fig. 8 and Fig. 9.
Referring to Fig. 8, the 1st pin of ADG1414 chip, the 3rd pin, the 23rd pin, the 24th pin connect with the relevant control mouth of single-chip microcomputer respectively.The 2nd pin of ADG1414 chip connects positive 5v power supply, the 21st pin connects negative 5v power supply, the 4th pin connects digitally, and the 5th pin, the 7th pin, the 9th pin, the 11st pin, the 14th pin, the 16th pin, the 18th pin, the 20th pin that the 22nd pin is connected to positive 5v power supply ADG1414 chip by resistance R 1 connect and connect signal generating circuit respectively to obtain pumping signal; The 6th pin of ADG1414 chip, the 8th pin, the 10th pin, the 12nd pin, the 13rd pin, the 15th pin, the 17th pin, the 19th pin connect an end of the 1st to the 8th drive coil respectively.The equal ground connection of the other end of the 1st to the 8th drive coil.Referring to Fig. 9, the 6th pin of each CD4052BCM chip, the 10th pin, the 9th pin connect with the relevant control mouth of single-chip microcomputer respectively.The 8th pin of each CD4052BCM chip connects digitally, and the 16th pin connects+the 5V power supply, and the 7th pin connects-the 5V power supply.The 12nd pin of each CD4052BCM chip, the 14th pin, the 15th pin, the 11st pin are connected to an end of four corresponding inductive coils respectively successively, the other end of four inductive coils then is connected with the 1st pin, the 5th pin, the 2nd pin, the 4th pin of same CD4052BCM chip respectively, and the 3rd pin, the 13rd pin of CD4052BCM connect filtering and input amplifier.
When utilizing eddy current probe of the present invention that sheet metal is detected, the magnetic field that each drive coil of logical sinusoidal excitation signal produces is in space diverse location, direction and different sizes, and all changes in time.The space magnetic field of drive coil top is in magnetic line of force expansion and shrink distribution constantly as shown in Figure 1 and Figure 2.Among Fig. 1,1 is tested sheet metal, and 2 is drive coil, and 3 is the area of space of the certain volume directly over the drive coil, the distribution in the 4 magnetic field a certain moment in area of space 3 that produce for drive coil.In magnetic line of force expansion constantly, the space magnetic field distribution situation when drive coil 2 tops are overlooked as shown in Figure 3, magnetic field is symmetrically distributed centered by the center of circle of drive coil 2.No matter this symmetry is still all set up in the contraction magnetic line of force moment (any moment) when the magnetic line of force is expanded.When using eddy current probe of the present invention to detect, field distribution and the field distribution among Fig. 1, Fig. 2 that drive coil produces are similar.If the geometric center of two inductive coils 5 and 6 is overlapped, two inductive coils 5,6 center cross-sectional are all passed through the geometric center of drive coil 2 and drive coil 2, two inductive coils 5,6 center cross-sectional is vertical in twos, then because of the symmetry of magnetic field to the center of circle, all be almost equal to zero making vertically by two inductive coils 5,6 the clean magnetic line of force.When carrying out eddy current test, thereby the existence of defective causes the change of eddy current and causes that magnetic flux changes in the inductive coil, because the symmetry of field distribution, when zero defect, magnetic flux is very little in the inductive coil, be almost equal to zero, when therefore scanning defective, very little change of flux also will be detected delicately.
To sum up, in eddy current testing device of the present invention, the excitation of eddy current probe signal and collection are controlled with analog switch by single-chip microcomputer.The orthogonal perturbation formula of drive coil and inductive coil structure has greatly improved detection sensitivity, the modes of emplacement of the Orthogonal Composite of two inductive coils can realize that two dimensional surface is vertical simultaneously, the defects detection of horizontal both direction same precision, the defects detection information of two vertical orientations of Cai Jiing simultaneously, be aided with the present information treatment technology, can make more more rational deductions to defect shape in the conductor and distribution, the application of analog switch chip greatly reduces the testing circuit hardware cost, the application of array technique has greatly improved detection efficiency, makes the quick defective EDDY CURRENT of large-area metal become possibility.
Claims (9)
1. one kind is used for carrying out the eddy current probe that metal defect detects, it is characterized in that: comprise an above Orthogonal Composite probe, each Orthogonal Composite probe comprises a drive coil and two inductive coils, the geometric center of described two inductive coils overlaps, the center cross-sectional of described two inductive coils is all passed through the geometric center of drive coil, and the center cross-sectional of drive coil and two inductive coils is vertical in twos.
2. according to claim 1 be used to carrying out the eddy current probe that metal defect detects, it is characterized in that: described Orthogonal Composite probe is more than two, the center cross-sectional of the drive coil of all Orthogonal Composite probes is on same plane, and the geometric center of all drive coils is on same straight line.
3. eddy current testing device that contains the eddy current probe of claim 1 or 2, it is characterized in that: comprise controller, signal generating circuit, filtering and amplifying circuit, phase-sensitive detection circuit, data acquisition card, host computer, first high-speed analog switch, second high-speed analog switch and described eddy current probe, controller respectively with signal generating circuit, filtering and amplifying circuit, first high-speed analog switch, second high-speed analog switch connects, the output terminal of filtering and amplifying circuit is connected with the input end of phase-sensitive detection circuit, the output terminal of phase-sensitive detection circuit and signals collecting card connection, data acquisition card is connected with host computer, signal generating circuit is connected with first high-speed analog switch, and filtering and amplifying circuit are connected with second high-speed analog switch; Each drive coil in the described eddy current probe is connected with first high-speed analog switch, and each inductive coil in the eddy current probe is connected with second high-speed analog switch.
4. eddy current testing device according to claim 3, it is characterized in that: described signal generating circuit is sinusoidal signal generation circuit.
5. according to claim 3 or 4 described eddy current testing devices, it is characterized in that: comprise that also mechanical scanner, eddy current probe are fixed on the described mechanical scanner.
6. according to claim 3 or 4 described eddy current testing devices, it is characterized in that: described controller is single-chip microcomputer.
7. according to claim 3 or 4 described eddy current testing devices, it is characterized in that: the output current of described first high-speed analog switch is more than 100 milliamperes.
8. eddy current testing device according to claim 6, it is characterized in that: also comprise mechanical scanner, described eddy current probe is fixed on the described mechanical scanner.
9. eddy current testing device according to claim 8, it is characterized in that: the output current of described first high-speed analog switch is more than 100 milliamperes.
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| CN104407043A (en) * | 2014-12-03 | 2015-03-11 | 江苏大学 | On-line defect detection device for steel cords based on electromagnetic induction and detection method thereof |
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| JP5213692B2 (en) * | 2008-12-24 | 2013-06-19 | マークテック株式会社 | Eddy current flaw detection method and eddy current flaw detector |
| EP2434279B1 (en) * | 2009-05-22 | 2016-11-02 | Nippon Steel & Sumitomo Metal Corporation | Rotating eddy current test probe |
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| CN104407043B (en) * | 2014-12-03 | 2017-08-01 | 江苏大学 | Steel cord on-line detection device of defects and its detection method based on electromagnetic induction |
| CN106442704A (en) * | 2016-09-29 | 2017-02-22 | 哈尔滨理工大学 | System and method for fast measuring iron content in magnetite concentrate |
| CN110291389A (en) * | 2017-02-10 | 2019-09-27 | 法玛通公司 | Pipe inspection unit and corresponding method with eddy current probe |
| CN110291389B (en) * | 2017-02-10 | 2023-06-30 | 法玛通公司 | Pipeline inspection unit with eddy current probe and corresponding method |
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| CN107167516B (en) * | 2017-05-24 | 2023-09-26 | 昆明理工大学 | Double differential pulse eddy current probe unit, array probe and detection device |
| CN110794030A (en) * | 2019-10-18 | 2020-02-14 | 中车青岛四方机车车辆股份有限公司 | Non-directional welding seam eddy current detection probe and detection device |
| CN111307930A (en) * | 2020-03-31 | 2020-06-19 | 广东省特种设备检测研究院顺德检测院 | Alternating-current electromagnetic field detection probe for detecting defects of still kettle and detection system thereof |
| CN111458400A (en) * | 2020-04-09 | 2020-07-28 | 中北大学 | Metal material defect detection system based on electromagnetic induction |
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