CN203249896U - Eddy current detecting device for detecting metal defects and eddy current probe of eddy current device - Google Patents
Eddy current detecting device for detecting metal defects and eddy current probe of eddy current device Download PDFInfo
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- CN203249896U CN203249896U CN201320194085.2U CN201320194085U CN203249896U CN 203249896 U CN203249896 U CN 203249896U CN 201320194085 U CN201320194085 U CN 201320194085U CN 203249896 U CN203249896 U CN 203249896U
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- eddy current
- analog switch
- probe
- speed analog
- current probe
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Abstract
The utility model discloses an eddy current detecting device for detecting metal defects and the eddy current probe of the eddy current device. The eddy current probe comprises one or more orthogonally-combined probes, wherein each orthogonally-combined probe comprises an exciting coil and two induction coils; the geometric centers of the two induction coils are superposed; the center cross sections of the two induction coils pass through the geometric center of the exciting coil and are mutually perpendicular to the exciting coil. If the orthogonally-combined probes are more than two, the center cross sections of the induction coils of all the orthogonally-combined probes are on the same plane and the geometric centers of all the exciting coils are on the same line. The eddy current detecting device comprises a controller, a signal generating circuit, a filtering and amplifying circuit, a phase-sensitive detecting circuit, a signal acquisition card, a host computer, a first high-speed analog switch, a second high-speed analog switch and the eddy current probe. The eddy current detecting device has the advantages of higher detection sensitivity and higher detection speed.
Description
Technical field
The utility model relates to a kind of metal material defective Non-Destructive Testing sensor construction and corresponding testing circuit.
Background technology
The defects detection of metal material is significant according to electromagnetic induction principle at military industry field, the coil that is loaded with alternating current can induce eddy current near in its metal material, the eddy current of induction can affect magnetic test coil original Distribution of Magnetic Field on every side conversely, eddy current has carried the thickness of metal material thereby the measurement impedance that causes inductive coil changes, the information such as defective, conductivity, change and to know the relevant physical parameter of metal material by inference by measuring the coil impedance that causes because of eddy current, as whether there being defective etc.
Conventional EDDY CURRENT, inductive coil have original induced voltage signal output in testing process, for enlarging the input dynamic range, improve detection sensitivity, generally adopt the differential probe structure.When metal was carried out defects detection, two coils of differential probe need place identical electromagnetic environment, and the initial voltage signal that just can make eddy current probe is zero, and this is in reality detects, and difficulty realizes sometimes.General larger drive coil and two the identical little inductive coils of structure of adopting of perturbation detection technique form.Two parallel placements of inductive coil, all perpendicular to drive coil, two inductive coil positions are fully reciprocity.This perturbed structure can make the eddy current sensor that is positioned on the derby below metal when not having defective, two little inductive coil differential output signals are almost equal to zero, the advantage of this detection architecture is defective very responsive, can detect atomic little defective.In the eddy current test, generally can only can obviously cut off the flow through direction in path of inductive loop at one and carry out effective detection of defective, the general single probe that adopts detects simultaneously, and these are all restricting the detection efficiency of eddy detection system to a certain extent.
The utility model content
The purpose of this utility model provides a kind of eddy current testing device and eddy current probe thereof be used to carrying out the metal defect detection, to overcome all or part of defective of prior art.
For achieving the above object, technical solution adopted in the utility model is:
The utility model comprises an above Orthogonal Composite probe for the eddy current probe that carries out the metal defect detection, each Orthogonal Composite probe comprises a drive coil and two inductive coils, the geometric center of described two inductive coils overlaps, the center cross-sectional of described two inductive coils is all passed through the geometric center of drive coil, and the center cross-sectional of drive coil and two inductive coils is vertical in twos.
Further, Orthogonal Composite probe described in the utility model is more than two, and the center cross-sectional of the drive coil of all Orthogonal Composite probes is on same plane, and the geometric center of all drive coils is on same straight line.
The eddy current testing device that the utility model contains above-mentioned eddy current probe comprises controller, signal generating circuit, filtering and amplifying circuit, phase-sensitive detection circuit, data acquisition card, host computer, the first high-speed analog switch, the second high-speed analog switch and described eddy current probe, controller respectively with signal generating circuit, filtering and amplifying circuit, the first high-speed analog switch, the second high-speed analog switch connects, the output terminal of filtering and amplifying circuit is connected with the input end of phase-sensitive detection circuit, the output terminal of phase-sensitive detection circuit is connected with data acquisition card, data acquisition card is connected with host computer, signal generating circuit is connected with the first high-speed analog switch, and filtering and amplifying circuit are connected with the second high-speed analog switch; Each drive coil in the described eddy current probe is connected with the first high-speed analog switch, and each inductive coil in the eddy current probe is connected with the second high-speed analog switch.
Further, signal generating circuit described in the utility model is sinusoidal signal generation circuit.
Further, the utility model eddy current testing device also comprises mechanical scanner, and eddy current probe is fixed on the described mechanical scanner.
Further, controller described in the utility model is single-chip microcomputer.
Further, the output current of the first high-speed analog switch described in the utility model is more than 100 milliamperes.
Compared with prior art, the utility model has the advantages that:
(1) absolute type can be measured atomic little cracks of metal surface based on the sonde configuration of perturbation principle.
(2) two quadrature inductive coils can be realized the in length and breadth defects detection of both direction same precision of two dimensional surface.
(3) array probe has improved defects detection efficient greatly, to each probe timesharing excitation, has reduced the interference between probe, has simplified follow-up hardware handles circuit.
(4) adopt the high-speed analog switch chip that can lead to large electric current, guaranteed intensity and system's accuracy of detection of exciting field.
(5) the utlity model has higher detection sensitivity and detection speed.
Description of drawings
Fig. 1 is the drive coil top Distribution of Magnetic Field figure (magnetic line of force expansion constantly) of the utility model eddy current probe;
Fig. 2 is eddy current drive coil top Distribution of Magnetic Field figure (magnetic line of force shrinks constantly);
Fig. 3 is a certain moment Distribution of Magnetic Field vertical view in eddy current drive coil top;
Fig. 4 is a kind of structural representation that only contains the eddy current probe of single Orthogonal Composite probe of the present utility model;
Fig. 5 is a kind of structural representation that contains the eddy current probe of two above Orthogonal Composite probes of the present utility model;
Fig. 6 is that the working method of two kinds of eddy current probes compares schematic diagram, wherein, (a) contains single Orthogonal Composite probe, (b) contains a plurality of Orthogonal Composite probes;
Fig. 7 is the structured flowchart of a kind of eddy current testing device of the present utility model;
Fig. 8 is a kind of circuit diagram of the first high-speed analog switch of the present utility model;
Fig. 9 is a kind of circuit diagram of the second high-speed analog switch of the present utility model.
Embodiment
The structure of a kind of eddy current probe of the present utility model as shown in Figure 4.Wherein, 2 is drive coil, and 5,6 are respectively inductive coil.Eddy current probe shown in Figure 4 comprises an Orthogonal Composite probe, and this Orthogonal Composite probe comprises a drive coil 2, inductive coil 5 and inductive coil 6.Wherein, the geometric center of inductive coil 5 and inductive coil 6 overlaps, the geometric center that the center cross-sectional of inductive coil 5 and inductive coil 6 is all passed through drive coil 2, and drive coil 2, inductive coil 5 are vertical in twos with inductive coil 6 threes' center cross-sectional.Eddy current probe of the present utility model can place two inductive coils 5,6 inside (as shown in Figure 4) of drive coil 2, also can as shown in Figure 5 two inductive coils 5,6 be placed the outside of drive coil 2.Under the symmetric prerequisite of damage field not, drive coil 2 can adopt the column type coaxial coil, and inductive coil 5,6 can be square coil.When eddy current probe is popped one's head in side-by-side forming array probe by the identical Orthogonal Composite formula of a plurality of structures (as shown in Figure 5), the center cross-sectional of the drive coil 2 of all Orthogonal Composite probes is on same plane 7, and the geometric center of all drive coils 2 is on same straight line.When carrying out EDDY CURRENT, contain the scan mode of the eddy current probe of single Orthogonal Composite probe and the Array eddy－ current probe that contains a plurality of Orthogonal Composite probes respectively shown in Fig. 6 (a), Fig. 6 (b).Wherein, Array eddy－ current probe is the linear array that the on all four Orthogonal Composite probe of a plurality of structures forms, and adopts Array eddy－ current probe to detect a flaw and can greatly improve detection efficiency.
The structure of a kind of eddy current testing device of the present utility model as shown in Figure 7, it comprises controller, signal generating circuit, filtering and amplifying circuit, phase-sensitive detection circuit, data acquisition card, host computer, the first high-speed analog switch, the second high-speed analog switch and eddy current probe of the present utility model.Wherein, controller is connected with signal generating circuit, filtering and amplifying circuit, the first high-speed analog switch, the second high-speed analog switch respectively, the output terminal of filtering and amplifying circuit is connected with the input end of phase-sensitive detection circuit, the output terminal of phase-sensitive detection circuit is connected with data acquisition card, data acquisition card is connected with host computer, signal generating circuit is connected with the first high-speed analog switch, and filtering and amplifying circuit are connected with the second high-speed analog switch; Each drive coil 2 in the described eddy current probe is connected with the first high-speed analog switch, and each inductive coil in the eddy current probe is connected with the second high-speed analog switch.Wherein, signal generating circuit can use sinusoidal signal generation circuit, for example uses the dds(digital frequency synthesizer) chip.Controller can use single-chip microcomputer.
Under Single-chip Controlling, the dds(digital frequency synthesizer) chip produces the input port that sinusoidal excitation signal is sent to the first high-speed analog switch chip, sinusoidal excitation signal encourages the drive coil of each Orthogonal Composite probe in the array probe successively under Single-chip Controlling, the vortex induction signal of each inductive coil enters filtering successively by the second high-speed analog switch chip and amplifying circuit is processed in the Orthogonal Composite probe, then transfer the vortex induction signal to the analog DC signal corresponding with the inductive coil impedance by AC signal by phase-sensitive detection circuit, behind data acquisition card, be sent to host computer and show and process.
When using the utility model that conductor is carried out eddy current test, detect degree of accuracy for improving, configurable mechanical scanner, eddy current probe are fixed on the mechanical scanner, host computer is equipped with the motion control card of mechanical scanner, by host computer mechanical scanner is carried out motion control.
Host computer can select labview software to carry out collection, demonstration and the aftertreatment of vortex induction signal.Eddy current probe is placed the top of measured conductor, sweep velocity and the excitation frequency of mechanical scanner are set in the labview program, after starting scanning monitor, can make eddy current probe scan as requested measured conductor, the direct-flow output signal variation tendency of the phase-sensitive detection circuit that gathers by data acquisition card obtains the defect information of tested metal material
Such as Fig. 8, shown in Figure 9, in the utility model eddy current testing device, the first high-speed analog switch can be selected the ADG1414 chip, and the second high-speed analog switch can be selected the CD4052BCM chip.Below further specify the utility model as an example of the Linear Array Realtime eddy current probe example.
In the present embodiment, the Linear Array Realtime eddy current probe is comprised of 8 on all four Orthogonal Composite probes of structure altogether, so this eddy current probe has eight drive coils and 16 inductive coils.As shown in Figure 5, identical and their center cross-sectional of the modes of emplacement of one of them inductive coil of all Orthogonal Composite probe is parallel to each other, and identical and their center cross-sectional of the modes of emplacement of another inductive coil of all Orthogonal Composite probes overlaps.
Single-chip microcomputer encourages each drive coil in the eddy current probe successively by controlling the first high-speed analog switch, gathers successively the signal of each inductive coil in the eddy current probe by controlling the second high-speed analog switch.In the eddy current probe, a termination first high-speed analog switch of each drive coil, other end ground connection; The two ends of each inductive coil connect the second high-speed analog switch.Therefore, when using eddy current probe to detect, available a slice ADG1414 chip encourages 8 drive coils in the eddy current probe successively, gathers successively the vortex induction signal of 16 inductive coils with 4 CD4052BCM chips.Wherein, first CD4052BCM chip connects the 1st to the 4th inductive coil, second CD4052BCM chip connects the 5th to the 8th inductive coil, and the 3rd CD4052BCM chip connects the 9th to the 12nd inductive coil, and the 4th CD4052BCM chip connects the 13rd to the 16th inductive coil.Referring to Fig. 5, the 1st to the 8th inductive coil is respectively an inductive coil of the first to the 8th Orthogonal Composite probe accordingly, and the center cross-sectional of the 1st to the 8th inductive coil is parallel to each other; The the 9th to the 16th inductive coil also is respectively another inductive coil of the first to the 8th Orthogonal Composite probe accordingly, and the center cross-sectional of the 9th to the 17th inductive coil overlaps.Carry out specific description below in conjunction with Fig. 8 and Fig. 9.
Referring to Fig. 8, the 1st pin of ADG1414 chip, the 3rd pin, the 23rd pin, the 24th pin are connected with the relevant control mouth of single-chip microcomputer respectively.The 2nd pin of ADG1414 chip connects positive 5v power supply, the 21st pin connects negative 5v power supply, the 4th pin connects digitally, and the 5th pin, the 7th pin, the 9th pin, the 11st pin, the 14th pin, the 16th pin, the 18th pin, the 20th pin that the 22nd pin is connected to positive 5v power supply ADG1414 chip by resistance R 1 connect and connect respectively signal generating circuit to obtain pumping signal; The 6th pin of ADG1414 chip, the 8th pin, the 10th pin, the 12nd pin, the 13rd pin, the 15th pin, the 17th pin, the 19th pin connect respectively an end of the 1st to the 8th drive coil.The equal ground connection of the other end of the 1st to the 8th drive coil.Referring to Fig. 9, the 6th pin of each CD4052BCM chip, the 10th pin, the 9th pin are connected with the relevant control mouth of single-chip microcomputer respectively.The 8th pin of each CD4052BCM chip connects digitally, and the 16th pin connects+the 5V power supply, and the 7th pin connects-the 5V power supply.The 12nd pin of each CD4052BCM chip, the 14th pin, the 15th pin, the 11st pin are connected to respectively an end of four corresponding inductive coils successively, the other end of four inductive coils then is connected with the 1st pin, the 5th pin, the 2nd pin, the 4th pin of same CD4052BCM chip respectively, and the 3rd pin, the 13rd pin of CD4052BCM connect filtering and input amplifier.
When utilizing the utility model eddy current probe that sheet metal is detected, the magnetic field that each drive coil of logical sinusoidal excitation signal produces is in space diverse location, direction and different sizes, and all changes in time.The space magnetic field of drive coil top in the distribution constantly of magnetic line of force enlargement and contraction as shown in Figure 1 and Figure 2.Among Fig. 1,1 is tested sheet metal, and 2 is drive coil, and 3 is the area of space of the certain volume directly over the drive coil, the distribution in the 4 magnetic field a certain moment in area of space 3 that produce for drive coil.In magnetic line of force expansion constantly, the space magnetic field distribution situation when drive coil 2 tops are overlooked as shown in Figure 3, magnetic field is symmetrical centered by the center of circle of drive coil 2.No matter this symmetry is all set up when the magnetic line of force is expanded or in the contraction magnetic line of force moment (any moment).When using the utility model eddy current probe to detect, field distribution and the field distribution among Fig. 1, Fig. 2 that drive coil produces are similar.If the geometric center of two inductive coils 5 and 6 is overlapped, two inductive coils 5,6 center cross-sectional are all passed through the geometric center of drive coil 2 and drive coil 2, two inductive coils 5,6 center cross-sectional is vertical in twos, then because of the symmetry of magnetic field to the center of circle, all be almost equal to zero making vertically by two inductive coils 5,6 the clean magnetic line of force.When carrying out eddy current test, thereby the existence of defective causes the change of eddy current and causes that magnetic flux changes in the inductive coil, because the symmetry of field distribution, when zero defect, magnetic flux is very little in the inductive coil, be almost equal to zero, when therefore scanning defective, very little change of flux also will be detected delicately.
To sum up, in eddy current testing device of the present utility model, the excitation of eddy current probe signal and collection are controlled with analog switch by single-chip microcomputer.The orthogonal perturbation formula of drive coil and inductive coil structure has greatly improved detection sensitivity, the modes of emplacement of the Orthogonal Composite of two inductive coils can realize that two dimensional surface is vertical simultaneously, the defects detection of horizontal both direction same precision, the defects detection information of two vertical orientations that gather simultaneously, be aided with the present information treatment technology, can make more more reasonably deductions to defect shape in the conductor and distribution, the application of analog switch chip greatly reduces the testing circuit hardware cost, the application of array technique has greatly improved detection efficiency, makes the quick defective EDDY CURRENT of large-area metal become possibility.
Claims (9)
1. one kind is used for carrying out the eddy current probe that metal defect detects, it is characterized in that: comprise an above Orthogonal Composite probe, each Orthogonal Composite probe comprises a drive coil and two inductive coils, the geometric center of described two inductive coils overlaps, the center cross-sectional of described two inductive coils is all passed through the geometric center of drive coil, and the center cross-sectional of drive coil and two inductive coils is vertical in twos.
2. the eddy current probe be used to carrying out metal defect and detecting according to claim 1, it is characterized in that: described Orthogonal Composite probe is more than two, the center cross-sectional of the drive coil of all Orthogonal Composite probes is on same plane, and the geometric center of all drive coils is on same straight line.
3. eddy current testing device that contains the eddy current probe of claim 1 or 2, it is characterized in that: comprise controller, signal generating circuit, filtering and amplifying circuit, phase-sensitive detection circuit, data acquisition card, host computer, the first high-speed analog switch, the second high-speed analog switch and described eddy current probe, controller respectively with signal generating circuit, filtering and amplifying circuit, the first high-speed analog switch, the second high-speed analog switch connects, the output terminal of filtering and amplifying circuit is connected with the input end of phase-sensitive detection circuit, the output terminal of phase-sensitive detection circuit is connected with data acquisition card, data acquisition card is connected with host computer, signal generating circuit is connected with the first high-speed analog switch, and filtering and amplifying circuit are connected with the second high-speed analog switch; Each drive coil in the described eddy current probe is connected with the first high-speed analog switch, and each inductive coil in the eddy current probe is connected with the second high-speed analog switch.
4. eddy current testing device according to claim 3, it is characterized in that: described signal generating circuit is sinusoidal signal generation circuit.
5. it is characterized in that: comprise that also mechanical scanner, eddy current probe are fixed on the described mechanical scanner according to claim 3 or 4 described eddy current testing devices.
6. according to claim 3 or 4 described eddy current testing devices, it is characterized in that: described controller is single-chip microcomputer.
7. according to claim 3 or 4 described eddy current testing devices, it is characterized in that: the output current of described the first high-speed analog switch is more than 100 milliamperes.
8. eddy current testing device according to claim 6, it is characterized in that: also comprise mechanical scanner, described eddy current probe is fixed on the described mechanical scanner.
9. eddy current testing device according to claim 8, it is characterized in that: the output current of described the first high-speed analog switch is more than 100 milliamperes.
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| CN201320194085.2U CN203249896U (en) | 2013-04-17 | 2013-04-17 | Eddy current detecting device for detecting metal defects and eddy current probe of eddy current device |
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| CN201320194085.2U CN203249896U (en) | 2013-04-17 | 2013-04-17 | Eddy current detecting device for detecting metal defects and eddy current probe of eddy current device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196996B (en) * | 2013-04-17 | 2016-06-08 | 浙江大学 | A kind of eddy current testing device for carrying out metal defect detection and eddy current probe thereof |
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2013
- 2013-04-17 CN CN201320194085.2U patent/CN203249896U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103196996B (en) * | 2013-04-17 | 2016-06-08 | 浙江大学 | A kind of eddy current testing device for carrying out metal defect detection and eddy current probe thereof |
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Granted publication date: 20131023 |
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