CN103175704B - Electronic device test system - Google Patents

Electronic device test system Download PDF

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Publication number
CN103175704B
CN103175704B CN201110429467.4A CN201110429467A CN103175704B CN 103175704 B CN103175704 B CN 103175704B CN 201110429467 A CN201110429467 A CN 201110429467A CN 103175704 B CN103175704 B CN 103175704B
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CN
China
Prior art keywords
plug
card
test
slot
temperature
Prior art date
Application number
CN201110429467.4A
Other languages
Chinese (zh)
Other versions
CN103175704A (en
Inventor
杨仁庚
Original Assignee
爱珂勒电子元器件(珠海)有限公司
Filing date
Publication date
Application filed by 爱珂勒电子元器件(珠海)有限公司 filed Critical 爱珂勒电子元器件(珠海)有限公司
Priority to CN201110429467.4A priority Critical patent/CN103175704B/en
Priority claimed from TW100148525A external-priority patent/TWI483104B/en
Publication of CN103175704A publication Critical patent/CN103175704A/en
Application granted granted Critical
Publication of CN103175704B publication Critical patent/CN103175704B/en

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Abstract

A kind of electronic device test system, including a tested board, one temperature sensing module, one measuring instruments and a test computer, described tested board includes a mainboard and a power supply unit, it is plugged in the plug-in card on described slot equipped with a slot and one on described mainboard, equipped with multiple fictitious loads on described plug-in card, described power supply unit includes at least one power line being connected with described slot, described temperature sensing module is for sensing the temperature of fictitious load on described plug-in card, described measuring instruments measures the electric current of described power line or output and exports the electric current measured or output to described test computer, the temperature information output extremely described test computer that described temperature sensing module will measure, described test computer shows and processes the information received.Present invention further teaches a kind of method of testing based on above-mentioned electronic device test system.Described electronic device test system and method can accurate test tested board febrile states under different capacity.

Description

Electronic device test system

Technical field

The present invention relates to a kind of electronic device test system.

Background technology

When testing the cooling system of electronic installation (such as computer), the most first a plug-in card is plugged in the slot of computer main board On, equipped with multiple fictitious loads and equipped with a temperature-sensitive sticker on this plug-in card, described fictitious load can analogue computer work time each The heat condition of components and parts.After mainboard energising, plug-in card and fictitious load thereon are started working, described temperature-sensitive sticker sensing mould Intending the temperature of load, tester can determine whether that whether the temperature value measured is beyond the temperature upper limit preset.But, the power of plug-in card is not Meanwhile, on plug-in card, the caloric value of fictitious load is the most different, thus i.e. detects simulation in the case of the power not detecting plug-in card The heat condition of load, test result is inaccurate.

Summary of the invention

In view of the foregoing, it is necessary to a kind of accurate electronic device test system of test result is provided.

A kind of electronic device test system, including a tested board and a temperature sensing module, described tested board includes One mainboard and a power supply unit, described mainboard is plugged in the plug-in card on described slot, described plug-in card equipped with a slot and one On equipped with multiple fictitious loads, described power supply unit includes at least one power line being connected with the power interface of described slot, Described temperature sensing module is for sensing the temperature of fictitious load on described plug-in card, and described electronic device test system also includes one Measuring instruments and a test computer, described measuring instruments is connected electric current or the output measuring described power line with described power line The electric current measured or output are also exported to described test computer, described temperature sensing module and described test computer by power Be connected with the temperature information output that will measure to described test computer, described test computer show and process described measuring instruments and The information of temperature sensing module output.

Compared to prior art, above-mentioned electronic device test system utilizes measuring instruments to measure the input work of described slot Rate, utilizes temperature-sensitive sticker to measure the temperature of fictitious load, and judge the power measured and temperature whether in default scope, So can detect the fictitious load of the tested board febrile state under different input powers, test result is more accurate.

Accompanying drawing explanation

Fig. 1 is the composition diagram of a better embodiment of electronic device test system of the present invention.

Fig. 2 is the particular make-up figure of tested board in Fig. 1.

Fig. 3 is the flow chart of a better embodiment of electronic device test method of the present invention.

Main element symbol description

Tested board 10 Mainboard 12 Slot 121 Plug-in card 123 Power supply unit 14 Measuring instruments 20 Test computer 30 Temperature sensing module 40

Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.

Detailed description of the invention

Referring to Fig. 1, the better embodiment of electronic device test system of the present invention includes tested board 10, one and an institute State measuring instruments 20, test computer 30 and a temperature sensing mould being connected with described tested board 10 that tested board 10 is connected Group 40.In one embodiment, described tested board 10 is a computer equipment.Described measuring instruments 20 can be used for measuring tested machine The information such as the electric current of platform 10 or power, described temperature sensing module 40 is for measuring the temperature information of tested board 10.Described survey Amount instrument 20 and described temperature sensing module 40 are all connected with described test computer 30 with the information output extremely described survey that will measure Examination computer 30, described test computer 30 is for analyzing and showing the information measured.

Referring to Fig. 2, described tested board 10 includes mainboard 12 and the power supply unit being connected with described mainboard 12 14.It is plugged in the plug-in card 123 on described slot 121 equipped with a slot 121 and on described mainboard 12.In one embodiment, Described slot 121 is a PCI (Peripheral Component Interconnect, peripheral element extension interface) or PCI-E (PCI-Express) slot, PCI or PCI-E slot all includes four voltage interface.Four power supplys of described power supply unit 14 Line is connected with four voltage interface of described slot 121 respectively, and described four power lines export 3.3V, 5V ,+12V ,-12V respectively Voltage to the voltage interface of described slot 121.Equipped with multiple fictitious loads on described plug-in card 123, in order to each unit of analogue computer The heat condition of device.Described temperature sensing module 40 includes one or more temperature-sensitive sticker, and described temperature-sensitive sticker is installed On described plug-in card 123, can be used for measuring the integrated temperature of each fictitious load when described plug-in card 123 works or measuring each one by one The temperature of fictitious load.In one embodiment, the fictitious load on described plug-in card 123 is heating resistor.

In one embodiment, described measuring instruments 20 is an ammeter, and described ammeter can measure described four respectively The electric current measured also is sent to described test computer 30 by the electric current of power line, owing to the voltage of each power line is certain, and described survey Examination computer 30 can calculate the output of each power line, then the output by each power line according to formula Power=voltage × electric current Power is added the general power that can draw described power supply unit 14 output extremely described slot 121, and this general power is slot 121 Input power or the input power of plug-in card 123.In another embodiment, described measuring instruments 20 is an energy meter, can be straight Connecing the power measuring each power line the power output extremely described test computer 30 that will measure, described test computer 30 calculates respectively The power sum of power line can draw the general power of described power supply unit 14 output extremely described slot 121.

Refer to Fig. 3, a kind of method of testing based on above-mentioned electronic device test system, comprise the following steps.

S01: described plug-in card 123 is plugged in the slot 121 of described mainboard 12.

S02: being installed on described plug-in card 123 by described temperature sensing module 40, described temperature sensing module 40 includes one Individual or multiple temperature-sensitive stickers, in this step, can be installed on the fictitious load of described plug-in card 123 by a temperature-sensitive sticker Between gap, to read the integrated temperature during work of each fictitious load;Or multiple temperature-sensitive stickers are mounted on described mould one by one Intend in load, in order to read the temperature of each fictitious load.

S03: open the power supply unit 14 of described tested board 10, described tested board 10 is i.e. initially powered up work.

Four power lines of S04: described power supply unit 14 export four road voltages (such as 3.3V, 5V ,+12V ,-12V) to institute State the corresponding voltage interface of slot 121.

S05: utilize described measuring instruments 20 to measure electric current or the output work of the power line that each and described slot 121 is connected Rate, and utilize described temperature sensing module 40 to measure the temperature information of fictitious load of described plug-in card 123.

The electric current measured or output are exported to described test computer 30 by S06: described measuring instruments 20, and described temperature The temperature information output extremely described test computer 30 that degree sensing module 40 will measure.

S07: described test computer 30 calculates the input power of described slot 121, in this step, described test computer 30 Can first calculate the output of each power line, then the output addition of each power line can be drawn the defeated of described slot 121 Enter power, due between described slot 121 and described plug-in card 123 without other electric energy loss, thus the input work of described slot 121 Rate is equal with the input power of described plug-in card 123.

S08: described test computer 30 shows input power and the temperature information of described plug-in card 123.

S09: described test computer 30 judge the input power of described plug-in card 123 and temperature whether in default scope, Such as, when the input power of described plug-in card 123 is 18 watt-hours, and the maximum temperature that described temperature sensing module 40 measures should be less than 65 Degree;When the input power of described plug-in card 123 is 25 watt-hours, and the maximum temperature that described temperature sensing module 40 measures should be less than 70 Degree.

S10: if the input power of described plug-in card 123 and temperature are all in default scope, described test computer 30 shows Show the information (such as display Pass) of test passes.

S11: if the input power of described plug-in card 123 and temperature information one of them or the most not in default scope, Described test computer 30 shows the information (such as display Failure) of test failure.

Claims (2)

1. an electronic device test system, including a tested board and a temperature sensing module, described tested board includes one Mainboard and a power supply unit, described mainboard is plugged in the plug-in card on described slot equipped with a slot and one, and described slot is PCI or PCI-E slot, including four power interfaces, equipped with multiple fictitious loads on described plug-in card, described power supply unit includes Four power lines that power interface with described slot is connected respectively, power line exports the pre-of 3.3V, 5V ,+12V and-12V respectively If voltage is to the corresponding power interface of described slot, described temperature sensing module is for sensing the temperature of fictitious load on described plug-in card Degree, it is characterised in that: described electronic device test system also include a measuring instruments and one test computer, described measuring instruments with Described power line is connected to measure electric current or the output of described power line, and described test computer is for according to described default electricity Pressure and described electric current obtain the input power of plug-in card or obtain the input power of plug-in card according to described output, described temperature sense Survey module and be connected with described test computer with the temperature information output extremely described test computer that will measure, described test computer according to The scope of the maximum temperature of the load that the input power of plug-in card is corresponding judges that whether the temperature sensed is at the plug-in card obtained The load corresponding to input power maximum temperature in the range of.
2. electronic device test system as claimed in claim 1, it is characterised in that: described measuring instruments is a galvanometer or merit Rate meter.
CN201110429467.4A 2011-12-20 Electronic device test system CN103175704B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110429467.4A CN103175704B (en) 2011-12-20 Electronic device test system

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201110429467.4A CN103175704B (en) 2011-12-20 Electronic device test system
TW100148525A TWI483104B (en) 2011-12-20 2011-12-26 Electronic device testing system and method
US13/572,774 US8598900B2 (en) 2011-12-20 2012-08-13 System and method for testing electronic device

Publications (2)

Publication Number Publication Date
CN103175704A CN103175704A (en) 2013-06-26
CN103175704B true CN103175704B (en) 2016-12-14

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246969B1 (en) * 1998-09-08 2001-06-12 International Business Machines Corporation Method and apparatus for testing computer cooling systems
CN1466044A (en) * 2002-07-05 2004-01-07 广达电脑股份有限公司 Dynamic temp.-control method for computer system
CN1794136A (en) * 2005-11-18 2006-06-28 张宏志 Monitoring system of power source supplier possossing USB transmission
CN1885274A (en) * 2005-06-24 2006-12-27 鸿富锦精密工业(深圳)有限公司 CPU power estimating method
CN201107387Y (en) * 2007-11-28 2008-08-27 浪潮电子信息产业股份有限公司 Apparatus for rapidly testing and aging of computer panel card
TW200914849A (en) * 2007-09-27 2009-04-01 Tsint Method and device of performance measure control platform for heat chip with multiple heating sources
CN201229567Y (en) * 2008-07-08 2009-04-29 英业达股份有限公司 Test module and test system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246969B1 (en) * 1998-09-08 2001-06-12 International Business Machines Corporation Method and apparatus for testing computer cooling systems
CN1466044A (en) * 2002-07-05 2004-01-07 广达电脑股份有限公司 Dynamic temp.-control method for computer system
CN1885274A (en) * 2005-06-24 2006-12-27 鸿富锦精密工业(深圳)有限公司 CPU power estimating method
CN1794136A (en) * 2005-11-18 2006-06-28 张宏志 Monitoring system of power source supplier possossing USB transmission
TW200914849A (en) * 2007-09-27 2009-04-01 Tsint Method and device of performance measure control platform for heat chip with multiple heating sources
CN201107387Y (en) * 2007-11-28 2008-08-27 浪潮电子信息产业股份有限公司 Apparatus for rapidly testing and aging of computer panel card
CN201229567Y (en) * 2008-07-08 2009-04-29 英业达股份有限公司 Test module and test system

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Effective date of registration: 20150928

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Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD.

Address before: 430205 Hubei city of Wuhan province Optics Valley East Lake New Technology Development Zone Road No. two Foxconn Technology Park

Applicant before: Hongfujin Precision Industry (Wuhan) Co., Ltd.

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Effective date of registration: 20151208

Address after: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111

Applicant after: Shanghai Lirui Network Technology Co., Ltd.

Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor

Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD.

CB03 Change of inventor or designer information

Inventor after: Yang Rengeng

Inventor before: Xu Xia

Inventor before: Yi Wenming

Inventor before: Liu Yulin

TA01 Transfer of patent application right

Effective date of registration: 20160928

Address after: 519040 Guangdong province Zhuhai Sanzao calm bay eight road No. 8 Building B

Applicant after: Electronic components (Zhuhai) Co., Ltd.

Address before: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111

Applicant before: Shanghai Lirui Network Technology Co., Ltd.

CI01 Correction of invention patent gazette

Correction item: Applicant|Address

Correct: Electronic components (Zhuhai) Co., Ltd.|519040 Guangdong province Zhuhai Sanzao calm bay eight road No. 8 Building B

False: Electronic components (Zhuhai) Co., Ltd.|519040 Guangdong province Zhuhai Sanzao calm bay eight road No. 8 Building B

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Volume: 32

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Granted publication date: 20161214

Termination date: 20171220