TW200914849A - Method and device of performance measure control platform for heat chip with multiple heating sources - Google Patents

Abstract

A method and device of performance measure control platform for heat chip with multiple heating sources are disclosed. This invention is to aim to study the heat dissipation problem of an electronic element package. The platform is able to precisely provide heating power to a heat chip and perform temperature measurement, and the platform is utilized in exploiting thermal conduction effect of a chip package body. An automatic experiment and a measure system are developed by using the heat chip, and the conditions of internal rising temperature while the real package body is working may be simulated. This platform includes two parts: a temperature measure system and a heating control system, wherein the internal temperature of the heat chip is able to be measured and recorded by the temperature measure system. The heating control system is used for providing various heating modes for the internal heater inside the heat chip while operating in coordination with experiments.

Description

200914849 IX. Description of the Invention: [Technical Field] The present invention is a method and apparatus for a thermal wafer energy measurement control platform with multiple heat sources. The main purpose of the present invention is to investigate the heat dissipation of an electronic component package. A platform that can supply thermal power and temperature measurement of thermal wafers, and use this platform to explore the heat transfer effect of the chip package. Develop a set of automated experiments and measurement systems using thermal chips to simulate real package work. When the internal temperature rises, the platform includes two parts: temperature and degree measurement system and heating control system. The temperature measurement system can measure the temperature value inside the heat-recorded wafer; the heating control system is used to cooperate with the experiment. Provides various heating modes for the heater inside the hot B cymbal. [Prior Art] The traditional thermal wafer energy measurement control platform still has the following shortcomings due to the current measurement platform: 1. The traditional thermal wafer energy measurement platform has only a single heat source. 2. The traditional thermal chip energy measurement platform can only measure temperature at single point. 3. The traditional thermal chip energy measurement platform cannot control the power. 200914849 [Summary of the Invention] The performance measurement platform adds three kinds of functions, multi-point heating and multi-point dishes. ": The power is reduced, and the three shortcomings of the traditional thermal chip energy measurement platform are overcome." The invention has various advantages: 1. The invention has a multi-point heating function, and the _PWM crane circuit is composed of two transistor elements combined with the surface circuit.

2. The invention has multi-point temperature measurement, and the multi-point temperature measurement function is realized because the thermistor is connected. 3. The present invention has a control power level, and the PWM (wave width modulation) and parallel transmission are used as the main components of the controller, so that it has the function of controlling the power level, in accordance with the functions required by the microcontroller. 〇6 200914849 [Embodiment] A device for heating a thermal energy measurement control platform with multiple heat sources (refer to the first figure) includes a heating power control mechanism (10), a thermistor mechanism (20), etc., wherein heating The power control mechanism (see the second figure) is a combination of the signal processor (1〇7), the computer (106), the thermal chip (105), the transistor (101), and the power supply (1〇4). The signal operation device (107) is located on the left side of the platform main body and has a rectangular shape, and the voltage difference generated by the temperature change of the sensing portion in the (105) portion of the thermal wafer is transmitted to the signal through the transmission line. The picker (107) records in the transfer to the computer (106), converts the voltage difference into a temperature difference, and achieves the function of data manipulation. The computer (106) is located on the left side of the platform mechanism, and is connected by a cable. Heating the power control mechanism (10) and the signal extractor (107) to control the heating control and signal recording of the heating power control mechanism. The thermal wafer (105) is located at the lower right of the platform body to Cable connection to the heating power control mechanism 10), the shape is square, the heating power control mechanism (1〇) inputs power to heat the hot wafer (1〇5), and then the signal extractor (1〇7), the measurement data is passed through the cable Passed back to the computer, the transistor (101) is located above the heating power control mechanism (1〇), and has a shape of a rectangular opening for controlling the amount of power flowing into the thermal chip (1〇5), the power controller (1〇4), located above the computer (106) for supplying the heating power control mechanism power supply, the heating power control mechanism (10) is opened by using a bandwidth modulation (PWM) control transistor (1〇2) Time, in order to determine the average current flowing into the heater in the wafer, so that it has multi-point heating and multi-point temperature measurement, and can control the power separately, the heating power controller must provide external power supply, respectively for the driving circuit And the controller power supply; the thermistor mechanism (refer to the third figure) is made up of the thermocouple element (10) D and the data reader (202) = group, the thermocouple element (201) bit thermistor mechanism ( 20) above, the shape is long, when it is sensed When the temperature of the temperature of the heating zone of the wafer (105) changes, a current is generated between the circuits, and the current is changed. The data reader (2〇2) is located under the thermocouple element (2〇1) and has a long shape. The square type, combined with the thermocouple, transmits the signal of the thermocouple to the computer (106), and measures the temperature value by using the data measuring software; and the heating power control mechanism (1〇) controls the thermal chip through the combination of the above mechanisms (1〇5) Internal heating zone power supply, the heating power control mechanism uses a wavelength modulation (PWM) control transistor (1〇2) to open the time, and the computer (1〇6) controls the flow into the thermal chip (1) 〇5) The average current of the inner heater is 200914849. It has multi-point heating and multi-point temperature measurement, and can control the power separately. The internal PWM and parallel transmission are used. After the data reading card is completed with the computer (10)), the two-way communication is sent to Wei, the pwM mainly controls the time when the transistor (10) switch is turned on to determine the average current of the heating (four) part, and the parallel transmission is mainly used to provide the micro control. Benefit and computer (1〇6) The data transmission between the experimental operators is controlled by the individual brain (106) to control the PWM wavelength width, and the signal extractor (1〇7) is used to extract the temperature of the internal sensing region of the thermal wafer ((10)). The change produces a voltage difference, which is transmitted to the signal acquisition port via the transmission line, and is transmitted to the computer (the internal record is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The data reader (10) 2), when the current flow transmits the signal to the computer (106), and then the test software converts the voltage difference into a temperature difference to achieve the function of data capture. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a combination of the present invention. The second figure is a heating power control configuration diagram of the present invention. The third diagram is a diagram of the thermistor mechanism of the present invention. [Main component symbol description] (10) Heating power controller (101) Transistor one (102) Transistor two (103) Microcontroller (104) Power supply ( 105) Thermal Wafer (106) Computer (107) Signal Extractor 200914849 (20) Thermistor Mechanism (201) Thermocouple Element (202) Data Reader

Claims (1)

200914849 X. The scope of application for patents: 1.- The performance of the thermal chip with multiple heat generation 4 test control (4) method, 1 Step 1: Turn on the computer; Steps are as follows, Step 2: Turn on the heating power controller; Step 3: Turn on the signal Step 4: Turn on the power supply; Step 5: Connect the pre-measured thermal chip to the power controller and signal with the cable. Step 6: Record the recording body, and heat the brain to control the wafer. Zone power supply, and can control the wafer on the step VII. Via the power supply H, provide the "smart chip" on the shouting ^ Step 8: When the heating zone on the crystal = heating through the power supply, the sensing area of the wafer two is affected by the text The source generates a change in current, which is transmitted to the signal operation mechanism via the cable, and then the card is taken, the cable is transmitted, and the current is recorded on the computer. Step 9: After the data is recorded by the computer, the wafer can be calculated. The heating wattage of each zone can be used to heat different power sources in multiple zones, so the results of real chip can be simulated. 'Power Control 2. - A device with a multi-heat source heating thermal energy measurement control platform includes a twisting mechanism, a thermistor mechanism, etc., wherein the heating power control mechanism is composed of a signal extractor, a computer, and a heat The chip supplier is combined, shot, the alkalinity test material = rectangular shape, Nain thermal chip (four) silk zone temperature change charm, into the signal picker, transferred to the computer to record, the voltage The difference is converted into the temperature difference, and the ϊ ϊ 翻 翻 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The film/located at the lower right side of the main body of the platform, the heating power supply controller is connected by a cable, and the power is input by the heating power control mechanism to heat the hot chip, and then the signal is extracted by H 3 According to the transmission line back to the computer, the transistor is located in the shape of the heating power control mechanism dead square, which is used to control the power flow of the current into the thermal chip, and the power supply control is located at the top of the computer. The heating The power supply turns the power supply, the 200914849 variable (PWM) controls the opening time of the transistor to determine the inflow' to enable multi-point heating and multi-point temperature measurement, and the source controller must provide external power for driving heat respectively. The varistor mechanism is composed of a thermocouple element and a data reader. The thermocouple is located above the sensing mechanism and has a long strip shape. When the temperature of the heating zone of the wafer is sensed, the loop There will be current generation, change of sensory flow, the domain sugar is located under the thermocouple, the shape is rectangular, combined with the thermocouple, the signal of the thermocouple is transmitted to the computer, and the temperature is measured by the data measurement software. value; The heating power control mechanism controls the power level by using the average current magnitude of the heater in the wave width adjustment chip, the heating circuit and the controller power supply; and the combination of the above mechanisms, the heating power control mechanism controls the internal heating zone power of the chip. The heating power controller uses the wave width modulation (PWM) to control the opening time of the transistor, and the computer controls the average current of the hot crystal heater to have a multi-point heating degree; 1彳' And can control the size of God separately, and the two kinds of stones are transmitted in parallel with the money. The tree is used as the reference of the Wei-controlled view. The reading card is completed and the two-way PWM between the electric and the electric is controlled. In order to determine the average current flowing into the interior of the heating 2, the parallel transmission is mainly used to provide a poor transmission between the microcontroller and the personal computer to provide an experimental operator to control the duty width by the personal computer, the signal receiver, __(10) Fine t-shirt touch, _____ take the 'face to send __ record, the voltage difference is fresh into a temperature difference, and Da Cong according to the function of the couch's the thermistor, with the data reader, Current flows to the electrical signal transmitted to the known 'by the measurement software then converts the voltage difference to the temperature difference, in order to achieve the fetched data function.