CN103167784A - Heat sink - Google Patents
Heat sink Download PDFInfo
- Publication number
- CN103167784A CN103167784A CN201210032531XA CN201210032531A CN103167784A CN 103167784 A CN103167784 A CN 103167784A CN 201210032531X A CN201210032531X A CN 201210032531XA CN 201210032531 A CN201210032531 A CN 201210032531A CN 103167784 A CN103167784 A CN 103167784A
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- China
- Prior art keywords
- cold
- producing medium
- path
- pipe
- moves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/04—Tubular elements of cross-section which is non-circular polygonal, e.g. rectangular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A heat sink including: a pipe for refrigerant movement including a first path, a third path having a cross-sectional area smaller than that of the first path in a thickness direction, and a second path connecting between the first and third paths and having a cross-sectional area in the thickness direction reduced from the first path toward the third path; and a case enclosing the pipe for refrigerant movement.
Description
The cross reference of related application
The application requires take submission on December 12nd, 2011, a korean patent application No.10-2011-0133190 that is called " Heat Sink (radiator) " as priority, and the full content of this application is incorporated into the application as a reference at this.
Technical field
The present invention relates to a kind of radiator.
Background technology
Recently, along with miniaturization/integrated development, due to increase and inefficient increase that the energy uses, heat dissipation problem occurs in power module.
Because this heat dissipation problem exerts an influence to life-span and the simple temperature problem of element, so proposed to solve the several different methods of heat dissipation problem.
But, because raise the efficiency and will cause the increase of production cost by the structure of complexity, need to design simple and high efficiency radiator structure.
In addition, the basic purpose for the radiator that improves radiating efficiency is to reduce the temperature of power module.In the case, to improve heat dispersion will be more effective for the temperature by reducing the local heater that arranges rather than the bulk temperature that reduces power module.
Simultaneously, open in Korean Patent No.0598516 according to the radiator of prior art.
As disclosed in above-mentioned patent documentation, be that thin board type post (thin fin type pillars) or the pin formula post (pin type pillars) with predetermined diameter arranged with predetermined interval according to the structure of the radiator manufacturing of prior art.
But, have the structure of the bulk temperature that reduces power module in the radiator according to prior art as above, thereby be difficult to effectively reduce the temperature of the local heater that arranges.
Summary of the invention
The present invention is devoted to provide a kind of radiator, and this radiator can improve the heat dispersion of each local heater that arranges.
According to the preferred embodiment of the present invention, a kind of radiator is provided, this radiator comprises: be used for the pipe that cold-producing medium moves, pipe that cold-producing medium moves be should be used for and the first path, the second path and Third Road footpath comprised, described Third Road footpath through-thickness has the cross section less than the cross section in described the first path, described the second Path Connection between described the first path and described Third Road footpath and through-thickness have from described the first path the cross section that reduces towards described Third Road footpath, and housing, the described pipe that moves for cold-producing medium of this packaging shell.
The number in described the first path, described the second path and described Third Road footpath is respectively a plurality of.
Described the first path and described Third Road footpath can alternately be arranged.
The number of the described pipe that moves for cold-producing medium can be for a plurality of, and described a plurality of pipe that moves for cold-producing medium can be arranged by through-thickness.
The width of the cross section through-thickness of the described pipe that moves for cold-producing medium and the described pipe that moves for cold-producing medium can change pro rata.
The height of the cross section through-thickness of the described pipe that moves for cold-producing medium and the described pipe that moves for cold-producing medium can change pro rata.
The second path of the described pipe that moves for cold-producing medium all can contact with the inner surface of described housing with another surface with a surface in Third Road footpath, and semiconductor chip can be connected on described housing, and the zone that contacts with described Third Road footpath that is connected to described housing.
A surface in the second path of the described pipe that moves for cold-producing medium and Third Road footpath and at least one surface on another surface contact with the inner surface of described housing, and the inner surface of other surfaces and described housing separately, and semiconductor chip can be connected on described housing, and the zone that contacts with described Third Road footpath that is connected to described housing.
Described housing two far-ends along its length are respectively arranged with refrigerant inlet and refrigerant outlet, by described refrigerant inlet, cold-producing medium is introduced into the described pipe that moves for cold-producing medium, by described refrigerant outlet, described cold-producing medium is discharged from the described pipe that moves for cold-producing medium.
Described radiator also comprises pin, and this pin is formed in described Third Road footpath.
The number of described pin can be for a plurality of, and described pin can be for tabular, and described pin can form the direction that a surface making described pin and another surface are parallel to flow of refrigerant.
according to another preferred embodiment of the present invention, a kind of radiator is provided, this radiator comprises: be used for the pipe that cold-producing medium moves, should comprise the first path for the pipe that cold-producing medium moves, the second path and Third Road footpath, described Third Road footpath through-thickness has the cross section less than the cross section in described the first path, described the second Path Connection between described the first path and described Third Road footpath and through-thickness have from described the first path the cross section that reduces towards described Third Road footpath, and housing, the described pipe that moves for cold-producing medium of this packaging shell, wherein, the width of the cross section through-thickness of the described pipe that moves for cold-producing medium and the described pipe that moves for cold-producing medium and changing highly pro rata.
Described radiator also comprises the pin that is formed in described Third Road footpath.
The number of described pin can be for a plurality of, and described pin can be for tabular, and described pin can form the direction that a surface making described pin and another surface are parallel to flow of refrigerant.
Description of drawings
Fig. 1 is the perspective view that shows the structure of radiator according to the first preferred embodiment of the present invention;
Fig. 2 is that demonstration is according to the perspective view of the structure of the radiator of the second preferred implementation of the present invention;
Fig. 3 is that demonstration is according to the perspective view of the structure of the radiator of the 3rd preferred implementation of the present invention;
Fig. 4 is the plane graph that shows the structure of radiator according to the first preferred embodiment of the present invention;
Fig. 5 is that demonstration is according to the end view of the structure of the radiator of the second preferred implementation of the present invention;
Fig. 6 is the view that in the radiator that is presented at according to the first preferred embodiment of the present invention, flow of refrigerant changes;
Fig. 7 is presented at the view that changes according to flow of refrigerant in the radiator of the second preferred implementation of the present invention; And
Fig. 8 is that demonstration is according to the perspective view of the structure of the radiator of the 4th preferred implementation of the present invention.
Embodiment
By following description, various feature and advantage of the present invention will be apparent with reference to accompanying drawing.
Term in the specification and claims and word should not be construed as limited to the definition in typical implication or dictionary, and should rule-basedly be interpreted as having implication and the concept relevant to technical scope of the present invention, according to described rule, the concept that the inventor can define term suitably to describe the most rightly the enforcement best approach of the present invention known to him or she.
By preferred embodiment and below in conjunction with the detailed description of accompanying drawing, above and other purpose of the present invention, feature and advantage will more clearly be understood.In specification, added Reference numeral to parts in institute's drawings attached, even it should be noted that these parts are presented in different accompanying drawings, identical Reference numeral also represents identical parts.In addition, when the detailed description that can determine known technology related to the present invention can make purport of the present invention fuzzy, this concrete description will be omitted.In specification, term " first ", " second " etc. are used for an element and another element region separately, but these elements and can't help above-mentioned term and limit.
Below, will describe the preferred embodiment of the present invention in detail by reference to the accompanying drawings.
Fig. 1 is the perspective view that shows the structure of radiator according to the first preferred embodiment of the present invention;
Fig. 2 is that demonstration is according to the perspective view of the structure of the radiator of the second preferred implementation of the present invention; And
Fig. 3 is that demonstration is according to the perspective view of the structure of the radiator of the 3rd preferred implementation of the present invention.
Referring to figs. 1 to Fig. 3, according to the radiator 100,200 and 300 of the first to the 3rd preferred implementation of the present invention be set to respectively comprise the pipe 110 that moves for cold-producing medium, 210 and 310 and encapsulation be used for the pipe 110 that cold-producing medium moves, 210 and 310 housing 120,220 and 320.
Has following common shape according to the radiator 100 of the first to the 3rd preferred implementation of the present invention, 200 and 300 the pipe 110,210 and 310 that moves for cold-producing medium.
Namely, as shown in Fig. 1 to Fig. 3, the above-mentioned pipe 110,210 and 310 that moves for cold-producing medium according to each preferred implementation of the present invention comprises respectively the first path 110a, 210a and 310a, the second path 110b, 210b and 310b and Third Road footpath 110c, 210c and 310c.
Herein, the cross section of Third Road footpath 110c, 210c and 310c through-thickness can be respectively less than the cross section of the first path 110a, 210a and 310a, and the second path 110b, 210b and 310b can be respectively interconnect with the first path 110a, 210a and 310a and Third Road footpath 110c, 210c and 310c, and the cross section of through-thickness reduces towards Third Road footpath 110c, 210c and 310c from the first path 110a, 210a and 310a.
Herein, the cross section of through-thickness refers to along being used for the pipe 110 that cold-producing medium moves, 210 and 310 cross section perpendicular to the intercepting of the surface of cold-producing medium moving direction.
Below, in this manual, thickness direction refers to as mentioned above the direction perpendicular to the cold-producing medium moving direction, and length direction refers to the direction parallel with the cold-producing medium moving direction.
And, in each preferred implementation of the present invention, be used for pipe 110 that cold-producing medium moves, 210 and 310 the first path 110a, 210a and 310a, the second path 110b, 210b and 310b and Third Road footpath 110c, 210c and 310c and can arrange respectively many, and the first path 110a, 210a and 310a and Third Road footpath 110c, 210c and 310c can replace layout as shown in Fig. 1 to Fig. 3, but specifically are not defined in this.
As mentioned above, the first path 110a, 210a and 310a and Third Road footpath 110c, 210c and 310c alternately arrange, reduce partly the pipe 110 that moves for cold-producing medium, 210 and 310 cross section with through-thickness, thereby can increase partly cold-producing medium in the pipe 110 that moves for cold-producing medium, 210 and 310 speed that flow.
Usually, pipe 110 that cold-producing medium moves, 210 and 310 flow (namely in the situation that be used for the pipe 110 that cold-producing medium moves, the amount of 210 and 310 cold-producing mediums that flow) are identical each other being used for, when cold-producing medium is flowed through the area (being cross section) that passes through when reducing, the flow direction of the cold-producing medium by appropriate section of flowing through changes and flowing velocity increases, and this demonstrates in Fig. 6 and Fig. 7.
As shown in Fig. 6 and Fig. 7, when the amount of the cold-producing medium that flows into the first path 110a, 210a and 310a was identical with the amount of cold-producing medium of Third Road footpath 110c, 210c and 310c of flowing into, cross section was faster less than the speed of speed ratio the first path 110a, the 210a of Third Road footpath 110c, the 210c of the first path 110a, 210a and 310a and the cold-producing medium in 310c and the cold-producing medium in 310a.
As implied above, the flowing velocity of cold-producing medium increases, thereby can improve heat transference efficiency in corresponding part.
And, in each preferred implementation of the present invention, the pipe 110,210 and 310 that moves for cold-producing medium can arrange respectively a plurality of, and as shown in Fig. 1 to Fig. 3, these are used for a plurality of pipes 110 that cold-producing medium moves, 210 and 310 layouts that can through-thickness be parallel to each other, and still specifically are not defined in this.
Has above-mentioned common shape according to the radiator 100,200 and 300 of each preferred implementation of the present invention.Below, with the difference of describing in each preferred implementation of the present invention.
At first, with reference to figure 1, at the pipe 110 that cold-producing medium moves that is used for of according to the first preferred embodiment of the present invention radiator 100, Third Road footpath 110c through-thickness has the cross section less than the cross section of the first path 110a.In this case, Third Road footpath 110c can have the height identical with the height of the first path 110a by through-thickness, and through-thickness has the width less than the width of the first path 110a.
In other words, the height that is used for pipe 110 through-thickness that cold-producing medium moves does not change, and changes but its width is local, for example shown in Fig. 4.
In the first preferred implementation of the present invention, the cross section that is used for pipe 110 through-thickness that cold-producing medium moves can change pro rata with the width that is used for pipe 110 through-thickness that cold-producing medium moves.
As shown in Figure 1, in the first preferred implementation of the present invention, the first path 110a that is used for the pipe 110 that cold-producing medium moves all can contact with the inner surface of housing 120 with another surface to the surface of Third Road footpath 110c.Then, when being connected on housing 120 for the semiconductor chip (not shown) of heater, what semiconductor chip can be connected to housing 120 has with through-thickness the zone that the Third Road footpath 110c of the cross section that reduces contacts, but specifically is not defined in this.
Secondly, with reference to figure 2, at the pipe 210 that cold-producing medium moves that is used for according to the radiator 200 of the second preferred implementation of the present invention, Third Road footpath 210c through-thickness has the cross section less than the cross section of the first path 210a.In this case, different from the first preferred implementation of the present invention as above, Third Road footpath 210c can have the width identical with the width of the first path 210a by through-thickness, and through-thickness has the height that the height part than the first path 210a reduces.
In other words, the width that is used for pipe 210 through-thickness that cold-producing medium moves does not change, but its local change highly.
In the second preferred implementation of the present invention as above, the cross section that is used for pipe 210 through-thickness that cold-producing medium moves can change pro rata with the height that is used for pipe 210 through-thickness that cold-producing medium moves.
In the second preferred implementation of the present invention, as shown in Figure 2, a surface that is used for the first path 210a of the pipe 210 that cold-producing medium moves all can contact with the inner surface of housing 220 with another surface, and for example shown in Fig. 5, surface of the second path 210b and Third Road footpath 210c can contact with the inner surface of housing 220 with at least one surface in another surface, and other surfaces can with the inner surface of housing 220 separately.
Reason is that the semiconductor chip (not shown) is connected on housing 220 in follow-up technique, in this case, being used for a surface of the pipe 210 that cold-producing medium moves and at least one surface on another surface need to contact with the inner surface of housing 220 in the part that the semiconductor chip (not shown) is connected on housing 220, effectively to distribute the heat that is produced by semiconductor chip.
Then, what the semiconductor chip (not shown) can be connected to housing 220 has with through-thickness the zone that the Third Road footpath 210c of the cross section that reduces contacts, but specifically is not defined in this.
Again, with reference to figure 3, at the pipe 310 that cold-producing medium moves that is used for according to the radiator 300 of the 3rd preferred implementation of the present invention, Third Road footpath 310c through-thickness has the cross section less than the cross section of the first path 310a.In this case, different from the first and second preferred implementations of the present invention as above, Third Road footpath 310c can have than the width of the first path 310a and highly little width and height by through-thickness.
In other words, be used for width and highly all local changes of pipe 310 through-thickness that cold-producing medium moves.
In the 3rd preferred implementation of the present invention as above, be used for pipe 310 through-thickness that cold-producing medium moves cross section can with the width and the change highly pro rata that are used for pipe 310 through-thickness that cold-producing medium moves.
Fig. 8 has shown the structure according to the radiator of the 4th preferred implementation of the present invention.
With reference to figure 8, comprise according to the radiator 400 of the 4th preferred implementation of the present invention pipe 410, housing 420 and a plurality of pin 430 that moves for cold-producing medium.
Although shown in Fig. 8 that the Third Road footpath 410c through-thickness that is used for pipe 410 that cold-producing medium moves has than the width of the first path 410a and the highly local width that reduces and highly, similar with the structure that is used for the pipe 310 that cold-producing medium moves of the radiator 300 according to the 3rd preferred implementation of the present invention as above, but this is only an embodiment.In other words, the pipe 410 that moves for cold-producing medium can have identical structure and above-described structure with the pipe 110 and 210 that moves for cold-producing medium according to the first and second preferred implementations of the present invention as above, but specifically is not defined in this.
In this embodiment, a plurality of pins 430 can be formed on the Third Road footpath 410c of the pipe 410 that moves for cold-producing medium.Herein, pin 430 can have as shown in Figure 8 tabular, but specifically is not defined in this.
In addition, for example, have a surface and another surface and have tabular pin 430 and can be formed in Third Road footpath 410c, so that the direction that a surface of pin 430 and another surface are parallel to flow of refrigerant, but specifically be not defined in this.
As mentioned above, in this embodiment, pin is additionally formed at through-thickness to have in the Third Road footpath of relatively little cross section, make area of heat transfer increase when the speed of cold-producing medium increases, thereby can obtain such as the higher heat transference efficiency of the radiator according to the first to the 3rd preferred implementation of the present invention of the above.
As implied above, according to the preferred embodiment of the present invention, the cross section that is used for the pipe through-thickness that cold-producing medium moves reduces partly, with the flowing velocity of the cold-producing medium that increases respective regions, thereby can improve the heat transference efficiency of respective regions.
In addition, according to the preferred embodiment of the present invention, heater is connected to the part that the zone with having the cross section that reduces of housing contacts, thereby can effectively will pass to cold-producing medium from the heat that heater produces.
Although disclose for purpose of explanation embodiments of the present invention, but these execution modes be used for specific explanations the present invention and thereby radiator according to the present invention be not limited thereto, it will be understood by those skilled in the art that, in the situation that do not depart from the scope of the present invention and spirit, can make various modifications, interpolation and replacement.
Therefore, arbitrarily and all modification, interpolation and replacements should also be interpreted as and drop in the scope of the invention, concrete scope of the present invention is open in subsidiary claim.
Claims (20)
1. radiator, this radiator comprises:
Be used for the pipe that cold-producing medium moves, pipe that cold-producing medium moves be should be used for and the first path, the second path and Third Road footpath comprised, described Third Road footpath through-thickness has the cross section less than the cross section in described the first path, described the second Path Connection between described the first path and described Third Road footpath and through-thickness have from described the first path the cross section that reduces towards described Third Road footpath, and
Housing, the described pipe that moves for cold-producing medium of this packaging shell.
2. radiator according to claim 1, wherein, the number in described the first path, described the second path and described Third Road footpath is respectively a plurality of.
3. radiator according to claim 2, wherein, described the first path and described Third Road footpath are alternately arranged.
4. radiator according to claim 1, wherein, the number of the described pipe that moves for cold-producing medium is a plurality of.
5. radiator according to claim 4, wherein, described a plurality of pipe through-thickness that move for cold-producing medium are arranged.
6. radiator according to claim 1, wherein, the width of the cross section through-thickness of the described pipe that moves for cold-producing medium and the described pipe that moves for cold-producing medium changes pro rata.
7. radiator according to claim 1, wherein, the height of the cross section through-thickness of the described pipe that moves for cold-producing medium and the described pipe that moves for cold-producing medium changes pro rata.
8. radiator according to claim 1, wherein, described second path of the described pipe that moves for cold-producing medium all contacts with the inner surface of described housing with another surface with a surface in described Third Road footpath.
9. radiator according to claim 8, wherein, semiconductor chip is connected on described housing, and the zone that contacts with described Third Road footpath that is connected to described housing.
10. radiator according to claim 1, wherein, a surface in described second path of the described pipe that moves for cold-producing medium and described Third Road footpath and at least one surface on another surface contacts with the inner surface of described housing, and the inner surface of other surperficial and described housings separately.
11. radiator according to claim 10, wherein, semiconductor chip is connected on described housing, and the zone that contacts with described Third Road footpath that is connected to described housing.
12. radiator according to claim 1, wherein, described housing two far-ends along its length are respectively arranged with refrigerant inlet and refrigerant outlet, by described refrigerant inlet, cold-producing medium is introduced into the described pipe that moves for cold-producing medium, by described refrigerant outlet, described cold-producing medium is discharged from the described pipe that moves for cold-producing medium.
13. radiator according to claim 1, wherein, described radiator also comprises pin, and this pin is formed in described Third Road footpath.
14. radiator according to claim 13, wherein, the number of described pin is a plurality of.
15. radiator according to claim 13, wherein, described pin is tabular.
16. radiator according to claim 15, wherein, described pin-shaped becomes the direction that surface making described pin and another surface are parallel to flow of refrigerant.
17. a radiator, this radiator comprises:
Be used for the pipe that cold-producing medium moves, pipe that cold-producing medium moves be should be used for and the first path, the second path and Third Road footpath comprised, described Third Road footpath through-thickness has the cross section less than the cross section in described the first path, described the second Path Connection between described the first path and described Third Road footpath and through-thickness have from described the first path the cross section that reduces towards described Third Road footpath, and
Housing, the described pipe that moves for cold-producing medium of this packaging shell,
Wherein, the width of the cross section through-thickness of the described pipe that moves for cold-producing medium and the described pipe that moves for cold-producing medium and changing highly pro rata.
18. radiator according to claim 17, wherein, described radiator also comprises the pin that is formed in described Third Road footpath.
19. radiator according to claim 18, wherein, the number of described pin is a plurality of.
20. radiator according to claim 18, wherein, described pin is tabular, and
Described pin-shaped becomes the direction that surface making described pin and another surface are parallel to flow of refrigerant.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110133190A KR101367071B1 (en) | 2011-12-12 | 2011-12-12 | Heat sink |
| KR10-2011-0133190 | 2011-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103167784A true CN103167784A (en) | 2013-06-19 |
Family
ID=45655646
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210032531XA Pending CN103167784A (en) | 2011-12-12 | 2012-02-14 | Heat sink |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130146259A1 (en) |
| EP (1) | EP2605277A3 (en) |
| KR (1) | KR101367071B1 (en) |
| CN (1) | CN103167784A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108351175A (en) * | 2015-07-10 | 2018-07-31 | 汇流技术控股有限公司 | Heat exchanger |
| CN113701544A (en) * | 2020-05-22 | 2021-11-26 | 北京机械设备研究所 | Flat pipe radiator and processing method of flat pipe of radiator |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI494051B (en) * | 2012-11-19 | 2015-07-21 | Acer Inc | Fluid heat exchange apparatus |
| CN109964548B (en) | 2016-11-17 | 2021-08-27 | Lg伊诺特有限公司 | DC-DC converter |
| WO2018093195A1 (en) * | 2016-11-17 | 2018-05-24 | 엘지이노텍 주식회사 | Dc-dc converter |
| JP7358152B2 (en) * | 2019-09-24 | 2023-10-10 | 住友精密工業株式会社 | Heat exchanger |
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| JP2007025097A (en) * | 2005-07-14 | 2007-02-01 | Japan Servo Co Ltd | Cooling device and cooling system |
| KR20100032020A (en) * | 2008-09-17 | 2010-03-25 | 배명호 | Cpu cooler |
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- 2012-02-14 CN CN201210032531XA patent/CN103167784A/en active Pending
- 2012-02-22 US US13/402,525 patent/US20130146259A1/en not_active Abandoned
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| JPH08125367A (en) * | 1994-10-21 | 1996-05-17 | Mitsubishi Materials Corp | Device for cooling electronic part |
| WO1999014807A1 (en) * | 1997-09-17 | 1999-03-25 | Advanced Energy's Voorhees Operations | Cooling module for electronic components |
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| US20050168990A1 (en) * | 2004-01-13 | 2005-08-04 | Seiko Epson Corporation | Light source apparatus and projection display apparatus |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108351175A (en) * | 2015-07-10 | 2018-07-31 | 汇流技术控股有限公司 | Heat exchanger |
| CN113701544A (en) * | 2020-05-22 | 2021-11-26 | 北京机械设备研究所 | Flat pipe radiator and processing method of flat pipe of radiator |
| CN113701544B (en) * | 2020-05-22 | 2024-01-26 | 北京机械设备研究所 | Flat tube radiator and processing method of flat tube of radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130066394A (en) | 2013-06-20 |
| EP2605277A3 (en) | 2013-12-25 |
| EP2605277A2 (en) | 2013-06-19 |
| KR101367071B1 (en) | 2014-02-25 |
| US20130146259A1 (en) | 2013-06-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130619 |