CN103167738B - Metal image manufacturing method and metal image semi-finished plate - Google Patents
Metal image manufacturing method and metal image semi-finished plate Download PDFInfo
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- CN103167738B CN103167738B CN201110420973.7A CN201110420973A CN103167738B CN 103167738 B CN103167738 B CN 103167738B CN 201110420973 A CN201110420973 A CN 201110420973A CN 103167738 B CN103167738 B CN 103167738B
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Abstract
The invention provides a metal image manufacturing method and a metal image semi-finished plate. The metal image manufacturing method includes the following steps. Firstly, a soleplate is obtained and comprises a base plate and a metal layer covered on the base plate. The base plate is made of meltable materials. Secondly, a required metal image is formed on the metal layer and the metal image semi-finished plate can be obtained. Thirdly, a melting method is used for removing the base plate from the soleplate so that a metal image product separated from the base plate is obtained. The metal image manufacturing method is simple in technology procedures, high in efficiency, wide in machining size and thickness range, high in precision and capable of well ensuring stability of the size of a metal image.
Description
Technical field
The invention belongs to printed circuit board (PCB) and make field, the manufacture method being specifically related to a kind of metallic pattern and metallic pattern half production board adopting the method to make.
Background technology
At present, along with the de-velopment and innovation of electronic product, make the demand of various special circuit plate also in continuous increase, copper clad patterns is one wherein.So-called copper clad patterns, refer to there is no carrier and the Copper Foil with certain figure (comprising circuit), be that one only forms figure by copper conductor and do not have the special printed circuit board that baseplate material (insulating barrier) supports, be different from the copper clad patterns of flood in existing PCB technology.Because it does not have base plate, can reduce the signal loss that causes or distortion because baseboard material impact in transmitting procedure to greatest extent, the copper clad patterns produced in addition can also easier be attached on any carrier for circuit turn-on or decoration.
Application number be 200910166037.0 Chinese patent disclose " a kind of implementation method printing thick Copper Foil in pcb board ", Copper Foil on pcb board is divided into thick Copper Foil and common Copper Foil according to the size of current of circuit by the method, inserts in pcb board after thick Copper Foil wherein being adopted the mode machine-shaping of mechanical stamping, spark cutting or laser cutting again.Be shaped although this copper clad patterns does not ride in PCB substrate, wherein known mechanical stamping, spark cutting method limited precision, be difficult to the processing of fine pattern; And laser cutting mode cost is high, efficiency is low, the copper clad patterns cut out can be oxidized by high temperature because of sidewall, thus affects electrical property and the reliability of product.
Equally, field is made at printed circuit board, application number is disclose one " circuit mending paster structure and manufacture method, circuit board and method for repairing and mending " in the Chinese patent of 201010242174.0, the making of the circuit paster of its damaged location on fix-up circuit plate, the method mainly, first on steel plate, electroplate required copper clad patterns, then separate this copper clad patterns by hand.The manufacture method of this circuit mending paster structure is owing to adopting peel manually from the mode of the copper clad patterns on steel plate, be easy to the copper clad patterns that fractures, simultaneously also can cause stretching to a certain degree to the good Copper Foil of ductility, also can not process meticulousr figure, the copper clad patterns thickness range that can make is also very little; Meanwhile, owing to affecting by electroplating process, the thickness evenness of copper clad patterns is poor, to the processing of thicker copper clad patterns length consuming time or can not process at all.Visible, the copper clad patterns of the circuit paster of this damaged location on fix-up circuit plate, fineness and the finished size stability of its graphics processing are all subject to certain restrictions, and product type also compares limitation, can not require high copper clad patterns by accurate to dimension.
In summary, for the making of copper clad patterns, still lack desirable manufacture method at present, be more difficult to produce the copper clad patterns that dimensional accuracy is high, thickness is large expeditiously.
Summary of the invention
Technical problem to be solved by this invention is for above shortcomings in prior art, a kind of manufacture method and metallic pattern half-finished product plate of metallic pattern are provided, this manufacture method efficiency is high, and the thickness range of the metallic pattern adopting the method to make is large, precision is high.
The technical scheme that solution the technology of the present invention problem adopts is the manufacture method of this metallic pattern, comprises the steps:
1) obtain soleplate, described soleplate comprises base plate and covers metal level on described base plate, and described base plate adopts and can melt material and make;
2) on described metal level, form required metallic pattern, obtain metallic pattern half-finished product plate;
3) adopt the described base plate melted in method removing soleplate, namely obtain the metallic pattern finished product be separated with described base plate.
Preferably, the described material that melts is have the macromolecular material decomposing and depart from character;
In described step 3) in, the described base plate that described employing is melted in method removing soleplate specifically comprises:
Adopt plasma etching method to bombard base plate, or adopt alkaline solution to soak base plate, or adopt laser ablation methods to carry out ablation to base plate, thus make base plate split into Small molecular and depart from metallic pattern.
Preferably, the described material that melts is epoxy resin or polyimide resin.
Preferably, the etching media adopted in described plasma etching method is the mist of oxygen and carbon tetrafluoride;
Described base plate adopts epoxy resin or polyimide resin to make, and described alkaline solution is the mixed solution of NaOH and potassium hydroxide;
Laser in described laser ablation methods adopts CO
2infrared laser or UV laser.
Preferably, described base plate adopts plasma etching method to bombard base plate, or when adopting laser ablation methods to carry out ablation to base plate, described base plate adopts mylar or polyolefin resin to make.
Preferably, described soleplate adopts single-face flexibility copper-clad board or does not contain the one side rigidity copper-clad plate of glass fibre; Or adopt sputtering or chemical deposition on base plate, form metal level and make; Or by metal level is departed from bonding agent that the macromolecular material of character makes and is bonded on base plate makes by having to decompose, described step 3) comprise employing further and melt method except no-bonder.
The present invention also provides a kind of metallic pattern half-finished product plate, comprises base plate and covers the metal level on described base plate, wherein:
Described metal level is metallic pattern needed for Graphic transitions acquisition;
Described base plate is made for melting material, for when adopting the method that melts to remove the base plate of described metallic pattern half-finished product plate, obtains the metallic pattern finished product be separated with described base plate.
Preferably, the described material that melts is have the macromolecular material decomposing and depart from character, and the thickness of described metal level is greater than 3Oz;
Wherein a kind of possibility is, has bonding agent between described metal level and described base plate, and described metal level is bonded on described base plate by described binding agent, and described bonding agent adopts the macromolecular material with decomposition disengaging character to make.
Wherein, have described in and decompose that to depart from the macromolecular material of character be epoxy resin or polyimide resin or mylar or polyolefin resin.
The invention has the beneficial effects as follows: the manufacture method of this metallic pattern, its technological process is simple, efficiency is high, and processing dimension thickness range is large, precision is high, and can ensure the dimensional stability of metallic pattern well.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of copper clad patterns in the embodiment of the present invention 1;
Fig. 2 is the flow chart of the manufacture method of copper clad patterns in the embodiment of the present invention 2;
Fig. 3 is the process chart making soleplate 4 in the embodiment of the present invention 1;
Fig. 4 is the process chart making soleplate 4 in the embodiment of the present invention 2;
Fig. 5 is the process chart of graph transfer method in the embodiment of the present invention 1;
Fig. 6 is the schematic diagram that in the embodiment of the present invention 1, copper clad patterns is formed.
In figure: 1-copper foil layer; 2-base plate; 3-binding agent; 4-soleplate; 5-half-finished product plate; 6-plasma gas stream; 7-finished product; 8-dry film against corrosion.
Embodiment
For making those skilled in the art understand technical scheme of the present invention better, below in conjunction with the drawings and specific embodiments, the manufacture method of metallic pattern of the present invention and metallic pattern half-finished product plate are described in further detail.
A manufacture method for metallic pattern, comprises the steps:
1) obtain soleplate, described soleplate comprises base plate and covers metal level on described base plate, and described base plate adopts and can melt material and make;
2) on described metal level, form required metallic pattern, obtain metallic pattern half-finished product plate;
3) adopt the described base plate melted in method removing soleplate, namely obtain the metallic pattern finished product be separated with described base plate.
Wherein, described metal level comprises various metals paper tinsel or Alloy Foil film pattern, such as: aluminium (Al) paper tinsel, zinc (Zn) paper tinsel, iron (Fe) paper tinsel or alloy foil film or nichrome paper tinsel film, zinc-plated paper tinsel film, clutch gold film etc.In the following embodiments, described metal level is for copper foil layer.
Embodiment 1:
Be the process chart of the manufacture method of metallic pattern in the embodiment of the present invention 1 shown in Fig. 1, the pattern of copper clad patterns made in this embodiment is an annulus, but this manufacture method is applicable to the copper clad patterns making arbitrary shape.
This technological process starts from step S01.In step S01, basis of formation plate 4.
In the present embodiment, the mode basis of formation plate 4 copper foil layer 1 and base plate 2 bondd by binding agent 3 is adopted.Wherein, described base plate 2 adopts epoxy resin material to make, and binding agent 3 adopts epoxy resin material to make, and namely base plate 2 and binding agent 3 all adopt epoxy resin to make.
Copper foil layer 1 and base plate 2 are being bondd by binding agent and in the bonding process of basis of formation plate 4, can suitably apply certain pressure and temperature to copper foil layer 1 and base plate 2, is boning more firm to make copper foil layer 1 and base plate 2.As shown in Figure 3, in this soleplate 4, upper strata is copper foil layer 1, and lower floor is base plate 2, copper foil layer 1 and base plate 2 to be bondd formation entirety by the very thin layer binder 3 in centre.
Wherein, the thickness of the copper foil layer 1 in soleplate 4 is greater than 3Oz (1Oz=35 μm), thus finally can form the copper clad patterns that thickness is greater than 3Oz; The base plate 2 be made up of epoxy resin and bonding agent 3 have can to divide by plasma gas stream bombardment becomes Small molecular and the characteristic that departs from copper clad patterns; And the very thin thickness of bonding agent 3, only play the effect of bond copper layers of foil 1 and base plate 2.
The material making copper foil layer 1 adopts copper foil material conventional in printed circuit board industry, and thickness can be selected according to the needs of this copper clad patterns product.The binding agent that the base plate made due to copper foil material, epoxy resin and epoxy resin are made is the common used material in printed circuit board industry, therefore selects more convenient.In this step, for the requirement of soleplate 4, namely the bonding steadiness between copper foil layer 1 and epoxy resin base plate 2 requires the steadiness requirement lower than Copper Foil and epoxy resin base plate in the rigidity copper-clad plate used in printed circuit board industry, soleplate 4 made in this step only needs copper foil layer 1 and base plate 2 to be closely linked, and does not do requirement to the peel strength of copper foil layer 1 and base plate 2 and heat resistance.
In step S02, copper foil layer 1 is formed required copper clad patterns, obtains half-finished product plate 5.Wherein, described copper clad patterns be formed by graph transfer method.Described graph transfer method comprises: on copper foil layer 1, paste dry film against corrosion → expose → develop → etch → take off the steps such as film.In the process forming copper clad patterns, because the method for Graphic transitions is identical with the method making Graphic transitions in traditional single-clad board, technology is comparatively ripe, therefore no longer describes in detail here.Further, this graph transfer method is not only applicable to the making of fine copper paper tinsel figure, is equally applicable to the processing of the larger copper clad patterns of thickness.
Figure 5 shows that the schematic diagram of graph transfer method in step S02, it specifically comprises the steps:
In step S021: paste dry film against corrosion.Paste dry film 8 against corrosion on copper foil layer 1 surface, this dry film against corrosion is common used material in printed circuit board industry, after step S021, covers one deck dry film 8 against corrosion at the surface integral of soleplate 4.
In step S022: exposure.Exposure mainly makes the dry film against corrosion 8 being irradiated by light part that curing reaction occurs, dry film against corrosion is formed required copper clad patterns, in the present embodiment, circular loop pattern is provided with in the mask plate that exposure process utilizes, after step S022, in dry film 8 against corrosion, namely curing reaction forms a circular loop pattern, as shown in Fig. 5 bend part.
In step S023: development.Development mainly removes unwanted dry film against corrosion 8, namely removes and is not irradiated by light part and the dry film against corrosion 8 of curing reaction does not occur.After step S023, dry film 8 against corrosion other parts except circular loop pattern are removed totally, and soleplate 4 is formed the circular loop pattern of solidifying on copper foil layer 1.
In step S024: etching.Etching mainly removes other Copper Foil parts that copper foil layer 1 does not have circular loop pattern to protect, and only leaves the Copper Foil of circular loop pattern part.After step S 024, on base plate 2 except the Copper Foil of the circular loop pattern under dry film against corrosion 8 covering protections of circular loop pattern is retained, other parts in copper foil layer 1 are all eliminated by etching.No matter the thickness difference of copper foil layer 1 is much, all only need through once etching the making that can complete copper clad patterns on base plate 2.In the present embodiment, copper foil layer 1 with the etching solution system generation chemical reaction containing sulfuric acid/hydrogen peroxide or hydrochloric acid/hydrogen peroxide or hydrochloric acid/clorox or nitric acid or ammoniacal liquor/copper chloride, thus can form copper clad patterns.
In step S 025: take off film.Take off film mainly to remove in step of exposure and cover copper foil layer after curing reaction; be not removed in development step and the dry film against corrosion 8 of the circular loop pattern be not removed for the protection of the Copper Foil of required copper clad patterns pattern part in an etching step, thus obtain half-finished product plate 5.
As shown in the above, during the graph transfer method adopted in the present embodiment makes with printed circuit board in prior art, graph transfer method is identical, because in printed circuit board making in prior art, graph transfer method is very ripe, therefore utilize this graph transfer method can ensure the machining accuracy of copper clad patterns well, the making that size is less than the meticulous copper clad patterns of 100 μm can be met.
In step 03: the base plate 2 in removing half-finished product plate 5, final formation finished product 7, i.e. copper clad patterns.In the present embodiment, the method that melts adopts plasma etching method to remove the base plate 2 in half-finished product plate 5, the epoxy resin base plate in half-finished product plate 5 is acted on by plasma gas stream, rupture to make the macromolecular chain in epoxy resin base plate, resolve into Small molecular, reach the object of the base plate in removing half-finished product plate 5, form copper clad patterns finished product.
Fig. 6 adopts plasma etching method to form the schematic diagram of copper clad patterns in step S03.In the present embodiment, what adopt is the plasma etching method utilizing plasma process to remove epoxy resin base plate, namely plasma machine is utilized, by high energy effect by some gas plasma gas that plasma is formed in seal cavity, and under electric field action, make plasma gas displacement and form plasma gas stream 6 (i.e. etching media), and make plasma gas stream form impact to the macromolecular chain in base plate 2 in half-finished product plate 5 and bonding agent 3, cause scission of link, macromolecule is made to resolve into Small molecular, thus reach removal base plate 2 and bonding agent 3, base plate 2 is finally made to be separated with the copper clad patterns on it, form independent copper clad patterns finished product.
In the present embodiment, in plasma etching method, a certain proportion of oxygen (O is adopted
2) and carbon tetrafluoride (CF
4) mist as etching media, make this mist after plasma machine, form plasma gas stream 6, utilize plasma gas stream 6 to decompose and the base plate 2 removed in soleplate 4 and binding agent 3.
Here it should be understood that, the plasma gas stream utilizing plasma to be formed can act on the polymeric membrane that organic system used is formed, but in concrete use procedure, because organic substance difference article on plasma demand is different, plasma processing time also there are differences.Such as nearly all epoxy-resin systems all can by O
2with CF
4the plasma gas Traffic Decomposition that mist is formed, decomposition rate is approximately 2 μm/min.In actual applications, the selection of plasma gas is different according to different macromolecular material types difference, but, use O
2with CF
4the plasma gas stream that mist is formed can react with the material of most resinous type and by it removing.In the embodiment adopting plasma etching method, base plate, except use epoxide resin material, can also adopt the materials such as polyimide resin, mylar or polyolefin resin to make.
The plasma etching method adopted in step S03, can not cause any damage or destruction to established copper clad patterns, can ensure the dimensional stability of copper clad patterns well; Meanwhile, according to the size of plasma machine equipment cavity, multiple half-finished product plates 5 can be processed simultaneously, improve the efficiency of batch production.
Embodiment 2:
The difference of the present embodiment and embodiment 1 is, in step S01, sputtering or chemical deposition mode is adopted to form copper foil layer 1 on a base plate 2, namely the base plate 2 adopting sputtering or chemical deposition mode to make at epoxy resin forms the very thin Copper Foil of one deck, the copper foil layer 1 obtaining desired thickness is thickeied again through plating, thus basis of formation plate 4.
As shown in Figure 4, adopt and form copper foil layer 1 on the surface of base plate 2 by the mode of sputtering, then thickeied to required copper thickness by plating mode, thus basis of formation plate 4; Or form copper foil layer 1 by the mode of chemical deposition, then thickeied to required copper thickness by plating mode, thus basis of formation plate 4.Sputtering or chemical deposition mode are the normal technology modes adopted in existing printed circuit board industry, repeat no more here.
Other steps in the present embodiment and treatment process are all identical with embodiment 1, repeat no more here.
Embodiment 3:
In the present embodiment, soleplate 4 directly adopts not containing the one side rigidity copper-clad plate (namely not containing the single-clad board substrate of glass fibre) of glass fibre.
In the present embodiment, when soleplate 4 adopts the one side rigidity copper-clad plate of a large amount of use in printed circuit board industry, because the glass fibre reaction speed in plasma etch processes wherein comprised is very slow, efficiency is extremely low, therefore for ensureing the effect of subsequent step, in the dielectric layer of the base plate in the one side rigidity copper-clad plate adopted in the present embodiment, not there is passive glass fibre, therefore, in step S03, plasma gas stream 6 can remove the epoxy resin medium layer in the dielectric layer of base plate easily.
In the present embodiment other step and treatment process all identical with embodiment 1, repeat no more here.
Embodiment 4:
In the present embodiment, soleplate 4 directly adopts common single-face flexibility copper-clad board (or claiming soft board), described single-face flexibility copper-clad board with polyimide or epoxy resin material for dielectric layer, this single-face flexibility copper-clad board, owing to using in a large number in printed circuit board industry, therefore obtains easily.
In step S03, plasma gas stream 6 can remove polyimide in single-face flexibility copper-clad board dielectric layer or epoxy resin material easily.
In the present embodiment other step and treatment process all identical with embodiment 1, repeat no more here.
Embodiment 5:
In the present embodiment, soleplate 4 adopts common single-face flexibility copper-clad board.The difference of the present embodiment and embodiment 4 is, the method that melts of the removal base plate adopted in step S03 from embodiment 1 to melt method different.Concrete, in step 03, adopt alkaline solution to soak half-finished product plate 5, dissolve removing base plate 2, finally form copper clad patterns.
In the present embodiment, the alkaline solution neutral and alkali solvent of the employing mixed solution etc. that is the NaOH described in the patent of invention of CN1953643A (application number 200510021881.6) and potassium hydroxide as publication number.Wherein the organic material of flexibility coat copper plate bottom parts is epoxy resin or polyimide-type materials, and its general formula is as follows:
Issue raw hydrolysis in the effect of dense hot highly basic KOH, its reaction mechanism is:
At room temperature, it is very slow that reaction is carried out, and be irreversible.And the temperature improving reaction system can improve reaction rate greatly.
In the present embodiment, be soaked in by half-finished product plate 5 in this solution, 100-120 DEG C of condition, this solution can swelling dissolving polyimide material, reaches the object removing bottom parts.It should be noted that this processing procedure is consuming time longer, and need to react under 100-120 DEG C of condition, the basic solvent corrosivity that need use is strong.
In the present embodiment other step and treatment process all identical with embodiment 4, repeat no more here.
Embodiment 6:
In the present embodiment, soleplate 4 adopts common single-face flexibility copper-clad board.The difference of the present embodiment and embodiment 1 is, the removal base plate adopted in step S03 to melt method different.Concrete, in step S03, adopt CO
2the method of infrared laser or UV laser ablation removes base plate 2, finally forms copper clad patterns.
In the present embodiment, CO
2the principle of infrared laser or UV laser ablation methods be utilize high-octane laser irradiate bottom parts and react with organic material (mainly high-energy makes macromolecule bond fission, oxidation organic molecule, formed H
2o or CO
2deng), the organic material of bottom parts is gasified rapidly, departs from copper clad patterns.
In the embodiment adopting laser ablation method, base plate, except use epoxide resin material, can also adopt the materials such as polyimide resin, mylar or polyolefin resin to form.In the present embodiment other step and treatment process all identical with embodiment 4, repeat no more here.
In the various embodiments described above, in step S01, copper foil layer in soleplate can according to product demand, select various thickness or type (as electrolytic copper foil, rolled copper foil etc.) form all kinds of figure, the type of whole process to Copper Foil does not limit, and does not also limit the upper thickness limit of Copper Foil, as long as follow-up etching step can meet the formation of this thickness copper clad patterns, the copper clad patterns of known 10Oz also can process more easily.
Above-mentioned copper clad patterns manufacture method, on base plate, copper clad patterns is formed owing to utilizing ripe printed circuit board figure transfer method, recycling plasma etching method etc. melts method removing base plate, therefore the problem that in small size copper clad patterns, line pattern fractures can not only effectively be avoided, and processing fineness is only by Graphic transitions Accuracy, good stability of the dimension, can process fine degree and require higher various copper clad patterns; And made copper clad patterns product thickness is determined by copper thickness, the copper clad patterns of various thickness more conveniently can be made.
Certainly, except can adopting the method that the melts removing base plate in above-described embodiment, other methods that can melt base plate also can be adopted to make copper clad patterns.
Here it should be understood that, above-described embodiment is only to make the copper clad patterns of a circular loop pattern, but this copper clad patterns manufacture method is applicable to make the copper clad patterns of arbitrary shape, be particularly useful for the copper clad patterns making of Copper Foil fine pattern (i.e. minimum dimension be less than 100 μm figure) or thick Copper Foil (thickness is greater than the Copper Foil of 3Oz).
The more important thing is, copper clad patterns manufacture method of the present invention, be not limited in embodiment 1-embodiment 6 and the processing not having the copper clad patterns of carrier is formed to Copper Foil, the processing of other metal forming figures can be applied to simultaneously, comprise various metals paper tinsel or Alloy Foil film pattern, such as: aluminium (Al) paper tinsel, zinc (Zn) paper tinsel, iron (Fe) paper tinsel or alloy foil film or nichrome paper tinsel film, zinc-plated paper tinsel film, clutch gold film etc., in actual applications, first metallic pattern can be formed according to graph transfer method in step S02 in the manufacture method of this copper clad patterns, and then react with a kind of etching solution system the base plate itself adhered to remove this metallic pattern, wherein, used dry film against corrosion, character and the standard of the metal forming that development and etching solution system (comprising the selection of etching solution type and the operation of etching step) should use with reference to reality or Alloy Foil film adjust accordingly.To these metallic patterns, machinable dimensional thickness scope is large, and precision is high.
In sum, the manufacture method of metallic pattern of the present invention, its technological process is simple, efficiency is high, and processing dimension thickness range is large, precision is high, and can ensure the dimensional stability of metallic pattern well.
Be understandable that, the illustrative embodiments that above execution mode is only used to principle of the present invention is described and adopts, but the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a manufacture method for metallic pattern, is characterized in that comprising the steps:
1) obtain soleplate, described soleplate comprises base plate and covers metal level on described base plate, and described base plate adopts and can melt material and make;
2) on described metal level, form required metallic pattern, obtain metallic pattern half-finished product plate;
3) adopt the described base plate melted in method removing soleplate, obtain the metallic pattern finished product be separated with described base plate.
2. the manufacture method of metallic pattern according to claim 1, is characterized in that, the described material that melts is have the macromolecular material decomposing and depart from character;
In described step 3) in, the described base plate that described employing is melted in method removing soleplate specifically comprises:
Adopt plasma etching method to bombard base plate, or adopt alkaline solution to soak base plate, or adopt laser ablation methods to carry out ablation to base plate, thus make base plate split into Small molecular and depart from metallic pattern.
3. the manufacture method of metallic pattern according to claim 2, is characterized in that, the described material that melts is epoxy resin or polyimide resin.
4. the manufacture method of metallic pattern according to claim 3, is characterized in that,
The etching media adopted in described plasma etching method is the mist of oxygen and carbon tetrafluoride;
Described base plate adopts epoxy resin or polyimide resin to make, and described alkaline solution is the mixed solution of NaOH and potassium hydroxide;
Laser in described laser ablation methods adopts CO
2infrared laser or UV laser.
5. the manufacture method of metallic pattern according to claim 2, it is characterized in that, described base plate adopts plasma etching method to bombard base plate, or when adopting laser ablation methods to carry out ablation to base plate, described base plate adopts mylar or polyolefin resin to make.
6. according to the manufacture method of the metallic pattern one of claim 1-5 Suo Shu, it is characterized in that, described soleplate adopts single-face flexibility copper-clad board or does not contain the one side rigidity copper-clad plate of glass fibre;
Or adopt sputtering or chemical deposition on base plate, form metal level and make;
Or by metal level is departed from bonding agent that the macromolecular material of character makes and is bonded on base plate makes by having to decompose, described step 3) comprise employing further and melt method and remove described bonding agent.
7. a metallic pattern half-finished product plate, is characterized in that, comprises base plate and covers the metal level on described base plate, wherein:
Described metal level is metallic pattern needed for Graphic transitions acquisition;
Described base plate is made by melting material, for when adopting the method that melts to remove the base plate of described metallic pattern half-finished product plate, obtains the metallic pattern finished product be separated with described base plate.
8. metallic pattern half-finished product plate according to claim 7, is characterized in that, the described material that melts is have the macromolecular material decomposing and depart from character, and the thickness of described metal level is greater than 3Oz.
9. metallic pattern half-finished product plate according to claim 7, it is characterized in that, have bonding agent between described metal level and described base plate, described metal level is bonded on described base plate by described bonding agent, and described bonding agent adopts the macromolecular material with decomposition disengaging character to make.
10. metallic pattern half-finished product plate according to claim 9, is characterized in that, described in have and decompose that to depart from the macromolecular material of character be epoxy resin, polyimide resin, mylar or polyolefin resin.
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| CN104837300B (en) * | 2015-05-19 | 2018-08-31 | 上海安费诺永亿通讯电子有限公司 | A kind of NFC or wireless charging technology thickness metallic circuit and preparation method thereof |
| CN106612591A (en) * | 2015-10-21 | 2017-05-03 | 上海和辉光电有限公司 | Method for making flexible printed circuit board |
| CN106413290B (en) * | 2016-04-15 | 2018-09-21 | 江阴科利达电子有限公司 | A kind of production technology of high-precision long-life type circuit board |
| CN108199107B (en) * | 2018-01-03 | 2020-02-18 | 殷衡 | Method for recycling ternary battery positive electrode material by plasma technology |
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| CN101120621A (en) * | 2005-02-08 | 2008-02-06 | 富士胶片株式会社 | Method of forming metallic pattern, metallic pattern and printed wiring board using it and tft wiring circuit |
| CN1805658A (en) * | 2006-01-16 | 2006-07-19 | 深圳市深南电路有限公司 | Thick copper foil fine-wire circuit manufacturing method |
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| CN103167738A (en) | 2013-06-19 |
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Effective date of registration: 20220627 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. |