CN103158061A - 固定硅片用载片圈 - Google Patents
固定硅片用载片圈 Download PDFInfo
- Publication number
- CN103158061A CN103158061A CN2011104185304A CN201110418530A CN103158061A CN 103158061 A CN103158061 A CN 103158061A CN 2011104185304 A CN2011104185304 A CN 2011104185304A CN 201110418530 A CN201110418530 A CN 201110418530A CN 103158061 A CN103158061 A CN 103158061A
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- mounting ring
- slide glass
- glass circle
- wafer mounting
- silicon chip
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Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011104185304A CN103158061A (zh) | 2011-12-14 | 2011-12-14 | 固定硅片用载片圈 |
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CN2011104185304A CN103158061A (zh) | 2011-12-14 | 2011-12-14 | 固定硅片用载片圈 |
Publications (1)
Publication Number | Publication Date |
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CN103158061A true CN103158061A (zh) | 2013-06-19 |
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CN2011104185304A Pending CN103158061A (zh) | 2011-12-14 | 2011-12-14 | 固定硅片用载片圈 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1332060A (zh) * | 2000-07-10 | 2002-01-23 | 住友电木株式会社 | 被研磨物保持材料及其制造方法 |
JP2003231054A (ja) * | 2002-02-08 | 2003-08-19 | Toyo Plastic Seiko Co Ltd | 被研磨物保持キャリア材用基材 |
US20060178089A1 (en) * | 2003-03-20 | 2006-08-10 | Shin-Etsu Handotai Co., Ltd. | Wafer-retaining carrier, double-side grinding device using the same, and double-side grinding method for wafer |
CN101489722A (zh) * | 2006-07-18 | 2009-07-22 | 信越半导体股份有限公司 | 双面研磨装置用载具、及使用此载具的双面研磨装置和双面研磨方法 |
JP4605564B1 (ja) * | 2009-09-28 | 2011-01-05 | 株式会社白崎製作所 | 脆性薄板研磨装置用ホルダ、およびその製造方法 |
CN101987430A (zh) * | 2009-07-29 | 2011-03-23 | 瑞晶电子股份有限公司 | 用于化学机械研磨的固定环 |
CN102263024A (zh) * | 2011-07-18 | 2011-11-30 | 北京通美晶体技术有限公司 | 一种单面抛光晶片的背面防腐蚀方法 |
-
2011
- 2011-12-14 CN CN2011104185304A patent/CN103158061A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1332060A (zh) * | 2000-07-10 | 2002-01-23 | 住友电木株式会社 | 被研磨物保持材料及其制造方法 |
JP2003231054A (ja) * | 2002-02-08 | 2003-08-19 | Toyo Plastic Seiko Co Ltd | 被研磨物保持キャリア材用基材 |
US20060178089A1 (en) * | 2003-03-20 | 2006-08-10 | Shin-Etsu Handotai Co., Ltd. | Wafer-retaining carrier, double-side grinding device using the same, and double-side grinding method for wafer |
CN101489722A (zh) * | 2006-07-18 | 2009-07-22 | 信越半导体股份有限公司 | 双面研磨装置用载具、及使用此载具的双面研磨装置和双面研磨方法 |
CN101987430A (zh) * | 2009-07-29 | 2011-03-23 | 瑞晶电子股份有限公司 | 用于化学机械研磨的固定环 |
JP4605564B1 (ja) * | 2009-09-28 | 2011-01-05 | 株式会社白崎製作所 | 脆性薄板研磨装置用ホルダ、およびその製造方法 |
CN102263024A (zh) * | 2011-07-18 | 2011-11-30 | 北京通美晶体技术有限公司 | 一种单面抛光晶片的背面防腐蚀方法 |
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C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Applicant after: YOUYAN NEW MATERIAL CO., LTD. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Applicant before: GRINM Semiconductor Materials Co., Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: GRINM SEMICONDUCTOR MATERIALS CO., LTD. TO: GRINM ADVANCED MATERIALS CO.,LTD. |
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Owner name: GRINM SEMICONDUCTOR MATERIALS CO., LTD. Free format text: FORMER OWNER: GRINM ADVANCED MATERIALS CO., LTD. Effective date: 20150617 |
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Effective date of registration: 20150617 Address after: 101300 Beijing city Shunyi District Shuanghe Linhe Industrial Development Zone on the south side of the road Applicant after: You Yan Semi Materials Co., Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Applicant before: YOUYAN NEW MATERIAL CO., LTD. |
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Application publication date: 20130619 |