CN103157975A - Small component assembly system and assembly method thereof - Google Patents
Small component assembly system and assembly method thereof Download PDFInfo
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- CN103157975A CN103157975A CN2013100737121A CN201310073712A CN103157975A CN 103157975 A CN103157975 A CN 103157975A CN 2013100737121 A CN2013100737121 A CN 2013100737121A CN 201310073712 A CN201310073712 A CN 201310073712A CN 103157975 A CN103157975 A CN 103157975A
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- secondary absorption
- thin
- head
- adjusting device
- wall part
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000001179 sorption measurement Methods 0.000 claims abstract description 31
- 238000010521 absorption reaction Methods 0.000 claims description 57
- 239000003292 glue Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 238000007711 solidification Methods 0.000 abstract description 4
- 230000008023 solidification Effects 0.000 abstract description 4
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 239000012528 membrane Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 229920000715 Mucilage Polymers 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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Abstract
The invention discloses a small component assembly system and an assembly method of the small component. The small component assembly system and the assembly method of the small component are used for gluing thin-walled pieces and to-be-machined components. The small component assembly system comprises an assembly platform, a secondary adsorption system, a first adjusting device, a microscope system, and a compressing system. The assembly platform is used for loading the to-be-machined components, the secondary adsorption system comprises a primary adsorption head and a secondary adsorption head, the primary adsorption head and the secondary adsorption head are connected in a detachable mode, a compressive surface is defined on the secondary adsorption head, an adsorption hole used for adsorbing the thin-walled pieces is formed at the lower end of the secondary adsorption head, the first adjusting device is connected with the secondary adsorption system and controls the secondary adsorption system to move, the microscope system is located on the upper position of the assembly platform, the compressive system comprises a second adjusting device and a compressing piece, the secondary adjusting device is connected with the compressing piece and controls the compressing piece to move, and a seal surface which can act on the compressive surface is arranged on the compressing piece. The small component assembly system has the advantages of being capable of greatly improving clamping efficiency and clamping quality of the thin-walled pieces, high in assembly accuracy, and free of displacement change of the thin-walled pieces in the process of solidification.
Description
Technical field
The present invention relates to a kind of in order to assembly system and assembly method thereof with thin-wall part and device to be processed gummed.
Background technology
The microminaturization technology is one of important dual-use technology geared to the 21st century, the impact of its development on the development own profound of the correlation techniques such as civilian and national defence.Along with the development of science and technology, more and more higher to the requirement of the aspects such as function, performance and reliability of microminiature device, also day by day urgent to the demand of accurate micro part and product.The physical dimension of micro part is generally in the scope of sub-micron to tens millimeter, its process technology (technique as little in silicon, LIGA technique and precise machine machining etc.) has reached certain development level, but corresponding assembly technology development is still slower, most microminiature parts are still taked manual assembly method, not only the cycle is long but also cost is high, makes it be subject to larger restriction aspect batch production and product percent of pass.
Along with miniaturization and the part of device are more microminiaturized, hand assembled will be greatly limited.By means of little mounting technology, can assemble to realize higher positioning accuracy and fine operation by flexible, flexible operation, the miniature manipulator that can adapt to various operating features, realize high-accuracy, the little assembling of high accuracy that staff is difficult to realize.The little assembling of automation not only can raise the efficiency, assemble, reduces costs in batches, can also significantly reduce operating personnel's labour intensity.
microminaturization structural member or device, such as the core component in the devices such as micro-acceleration gauge, processing and assembly precision require all very high, especially the thin-wall construction spare in small, its assembling is the key issue that miniaturization needs to be resolved hurrily, Miniature thin-wall structural member machining accuracy and being of high quality, structural member clamping job requirements is meticulous, require very high to operator personnel technical ability, not only operating process is complicated, efficient is low, and be difficult to reach the performance of matching requirements, therefore be necessary very much to improve quality and the efficient of assembling by automatic technology and special assembly method, solve simultaneously the erection stress problem of inevitably introducing in the staff assembling, importantly often cause the fault of whole device or system due to rigging error, lose huge.
Thin-wall construction spare adopts cementing mode, require the precision very high (often below 5 microns) of some mucilage binding timing, need compressing structure spare after assembling, make the abundant combination of structural member and bonding plane, solidify certain hour and make gelling solid, in solidification process, structural member and other parts can not have relative displacement.Artisan craftsmanship realizes that difficulty is very large at present.
Summary of the invention
In view of this, the invention provides a kind of micro devices assembly system and assembly method thereof, by this device, can greatly improve thin-wall part clamping efficient and clamping quality, in the high and solidification process of assembly precision, the thin-wall part non-displacement changes.
To achieve these goals, the technical scheme that provides of the application is as follows:
A kind of micro devices assembly system in order to thin-wall part and device to be processed are glued together, comprising:
Mounting plate is in order to carry device to be processed;
The secondary absorption system, comprise one-level adsorption head and secondary absorption head, described one-level adsorption head and secondary absorption head removably connect, and on described secondary absorption head, definition has compressive plane, and the lower end of described secondary absorption head is provided with to adsorb the sucker of described thin-wall part;
The first adjusting device is connected in described secondary absorption system to control its motion;
Microscopic system is positioned at the top of described mounting plate;
Pressing system comprises the second adjusting device and compressing tablet, and described the second adjusting device is connected in described compressing tablet and controls its motion, and described compressing tablet has the seal face that can act on described compressive plane.
As a further improvement on the present invention, described mounting plate comprises the 3rd adjusting device, and the 3rd adjusting device is in order to control described device to be processed in horizontal in-plane moving.
As a further improvement on the present invention, described one-level adsorption head lower end is provided with groove, and described secondary absorption head coordinates described groove to be provided with projection, connects by the gas absorption mode between described one-level adsorption head and secondary absorption head.
As a further improvement on the present invention, described secondary absorption system also comprises the power sensor, and this power sensor is in order to detect the pressure between described thin-wall part and device to be processed.
As a further improvement on the present invention, described secondary absorption head comprises main part and the boss that protrudes out from the side of described main part, and described compressive plane is the end face of described boss, and described sucker is positioned at the bottom of described boss.
Correspondingly, the invention also discloses a kind of assembly method of micro devices assembly system, comprise step:
A) one-level adsorption head and secondary absorption head connect to form an absorption hand;
B) sucker of secondary absorption head is communicated with gas circuit and forms negative pressure and pick up thin-wall part, and microscopic system is identified and detected simultaneously, guarantees the precision of picking up;
C) the 3rd adjusting device control device to be processed that end face scribbles glue move to thin-wall part under, the image that obtains by microscopic system judges the position deviation between thin-wall part and device to be processed, and this deviation is fed back to the first adjusting device adjusts;
D) the secondary absorption system moves down, and makes thin-wall part and device to be processed fit, and when the power sensor detected the pressure of setting, the secondary absorption system stopped moving down;
E) the second adjusting device is controlled the compressing tablet motion, makes the seal face of compressing tablet act on the compressive plane of described secondary absorption head;
F) the one-level adsorption head moves upward, and breaks away from the secondary absorption head;
G) glue between thin-wall part and device to be processed is carried out sintering.
Compared with prior art, micro devices assembly system of the present invention can improve thin-wall part clamping efficient and clamping quality greatly, and in the high and solidification process of assembly precision, the thin-wall part non-displacement changes.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Figure 1 shows that the structural representation of micro devices assembly system in the specific embodiment of the invention;
Figure 2 shows that the partial enlarged drawing of Fig. 1;
Figure 3 shows that the structural representation of secondary absorption system;
Figure 4 shows that the structural representation when one-level adsorption head and secondary absorption head decompose;
Figure 5 shows that another angle schematic diagram of Fig. 4;
Figure 6 shows that the structural representation when compressing tablet acts on boss.
The specific embodiment
In order to make those skilled in the art person understand better technical scheme in the application, below in conjunction with the accompanying drawing in the embodiment of the present application, technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only the application's part embodiment, rather than whole embodiment.Based on the embodiment in the application, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all should belong to the scope of the application's protection.
Fig. 1 is to shown in Figure 6 for ginseng, and the micro devices assembly system comprises secondary absorption system 1, and secondary absorption system 1 comprises one-level adsorption head 1-4 and a secondary absorption 1-3.The lower end of one-level adsorption head 1-4 is provided with groove 1-9; A secondary absorption 1-3 comprises the boss 1-5 that the side of main part 1-10 and autonomous body 1-10 protrudes out, main part 1-10 fit 1-9 is provided with protruding 1-7, the top of projection 1-7 is provided with hole 1-6 on suction nozzle, the end face of boss 1-5 is defined as compressive plane 1-11, the bottom of boss 1-5 is provided with sucker 1-8, and on sucker 1-8 and suction nozzle, hole 1-6 is connected.Removably connect by groove 1-9 and the protruding 1-7 that matches between an one-level adsorption head 1-4 and secondary absorption 1-3, in the time of can guaranteeing work, the two-stage suction nozzle is good fit, realizes stable operation.
Secondary absorption system 1 also comprises power sensor 1-13, and this power sensor 1-13 is in order to detect the pressure between thin-wall part 5 and device to be processed 6.The shell of power sensor 1-13 also is provided with containment vessel 1-2.
Secondary absorption system 1 also comprises air pipe interface 1-12, and the one end can be communicated in gas circuit, and the other end is communicated in hole 1-6 on suction nozzle.
The micro devices assembly system also comprises the first adjusting device 1-1, and the first adjusting device 1-1 is the fine adjustment micropositioner, and it is connected in secondary absorption system 1, controls the motion of secondary absorption system 1 in order to precision.
The micro devices assembly system also comprises mounting plate 4, and mounting plate 4 is in order to carry device 6 to be processed, and mounting plate 4 comprises the 3rd adjusting device 4-1, and the 3rd adjusting device is in order to control device 6 to be processed in horizontal in-plane moving.Mounting plate 4 is XY two degrees of freedom high accuracy micropositioner.
The micro devices assembly system also comprises microscopic system 2, and microscopic system 2 is positioned at the top of mounting plate 4, and in order to identification with detect the secondary absorption system to the picking up or discharge precision of thin-wall part, microscopic system 2 is connected with the control device (not shown).Control device can comprise microprocessor (MCU), this MCU can comprise CPU (Central Processing Unit, CPU), read-only memory module (read-only memory, ROM), random memory module (random access memory, RAM), time block, digital-to-analogue conversion module (A/D converter) and plural I/O port.Certainly, control device also can adopt the integrated circuit of other form, as: application-specific IC (Application Specific Integrated Circuit, ASIC) or on-the-spot programmable gate array (Field Programmable Gate Array, FPGA) etc.Preferably, control device is computer system.
The micro devices assembly system also comprises pressing system 3, pressing system 3 comprises the second adjusting device 3-2 and compressing tablet 3-1, the second adjusting device 3-2 is connected in compressing tablet 3-1 and controls its motion, and compressing tablet 3-1 has the seal face that can act on compressive plane 1-11, and this seal face refers to the bottom surface of compressing tablet.The second adjusting device 3-2 is the Three Degree Of Freedom pressing system.
The course of work of system is as follows:
A) one-level adsorption head 1-4 sucks in groove 1-9 by the protruding 1-7 of suction type with a secondary absorption 1-3, sucks rear state as shown in Figure 3, and this moment, one-level adsorption head 1-4 and a secondary absorption 1-3 connected to form an absorption hand;
B) the sucker 1-8 of a secondary absorption 1-3 is communicated with gas circuit and forms negative pressure and pick up thin-wall part 5, and microscopic system 2 is identified and detected simultaneously, guarantees the precision of picking up;
C) after thin-wall part 5 picks up successfully, the 3rd adjusting device 4-1 control device to be processed 6 that end face scribbles glue move to thin-wall part 5 under, the image judgement thin-wall part 5 that obtains by microscopic system 2 and the position deviation between device to be processed 6, and this deviation is fed back to the first adjusting device 1-1 adjust;
D) the secondary absorption system moves down, and makes thin-wall part 5 and device 6 to be processed fit, and when power sensor 1-13 detected the pressure of setting, the secondary absorption system stopped moving down;
E) the second adjusting device 3-2 controls compressing tablet 3-1 motion, makes the seal face of compressing tablet 3-1 act on the compressive plane of secondary absorption head;
F) the one-level adsorption head moves upward, and breaks away from the secondary absorption head;
G) glue between thin-wall part and device to be processed is carried out sintering.
At present manually-operated except efficient and precision relatively poor, mainly be to have had on device 6 to be processed the liquid glued membrane of one deck, and the size of thin-wall part own is little, can't wait compressing tablet 3-1 with tweezers clamping all the time always and remove to compress thin-wall part (without the operating space), therefore thin-wall part freely can only be placed on above device 6 to be processed at present, but thin-wall part can slide on glued membrane, cause assembling to lose efficacy, after each the pressure all will with the tweezers tip go among a small circle stir thin-wall part adjustment, but large deviation can't be adjusted sometimes.Therefore the present invention is by the mode of secondary suction nozzle, at first solved the problem that can't operate all the time thin-wall part, whole process all has negative pressure to carry out adsorption operations to thin-wall part, guaranteed that thin-wall part does not slide on glued membrane, secondly by the absorption hand, thin-wall part is carried out pre-pressing (strong sensor carries out the accurate judgement of power), then by compressing tablet 3-1 handing-over, during curing, the secondary suction nozzle enters high-temperature service with thin-wall part, whole process has guaranteed the stability of thin-wall part, has guaranteed the precision of assembling.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and in the situation that do not deviate from spirit of the present invention or essential characteristic, can realize the present invention with other concrete form.Therefore, no matter from which point, all should regard embodiment as exemplary, and be nonrestrictive, scope of the present invention is limited by claims rather than above-mentioned explanation, therefore is intended to include in the present invention dropping on the implication that is equal to important document of claim and all changes in scope.Any Reference numeral in claim should be considered as limit related claim.
In addition, be to be understood that, although this specification is described according to embodiment, but be not that each embodiment only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should make specification as a whole, and the technical scheme in each embodiment also can through appropriate combination, form other embodiments that it will be appreciated by those skilled in the art that.
Claims (6)
1. a micro devices assembly system, in order to thin-wall part and device to be processed gummed, is characterized in that, comprising:
Mounting plate is in order to carry device to be processed;
The secondary absorption system, comprise one-level adsorption head and secondary absorption head, described one-level adsorption head and secondary absorption head removably connect, and on described secondary absorption head, definition has compressive plane, and the lower end of described secondary absorption head is provided with to adsorb the sucker of described thin-wall part;
The first adjusting device is connected in described secondary absorption system to control its motion;
Microscopic system is positioned at the top of described mounting plate;
Pressing system comprises the second adjusting device and compressing tablet, and described the second adjusting device is connected in described compressing tablet and controls its motion, and described compressing tablet has the seal face that can act on described compressive plane.
2. micro devices assembly system according to claim 1, is characterized in that, described mounting plate comprises the 3rd adjusting device, and the 3rd adjusting device is in order to control described device to be processed in horizontal in-plane moving.
3. micro devices assembly system according to claim 1, it is characterized in that, described one-level adsorption head lower end is provided with groove, and described secondary absorption head coordinates described groove to be provided with projection, connects by the gas absorption mode between described one-level adsorption head and secondary absorption head.
4. micro devices assembly system according to claim 1, is characterized in that, described secondary absorption system also comprises the power sensor, and this power sensor is in order to detect the pressure between described thin-wall part and device to be processed.
5. micro devices assembly system according to claim 1, it is characterized in that, described secondary absorption head comprises main part and the boss that protrudes out from the side of described main part, and described compressive plane is the end face of described boss, and described sucker is positioned at the bottom of described boss.
6. weigh 1 assembly method to power 5 arbitrary described micro devices assembly systems, it is characterized in that, comprise step:
A) one-level adsorption head and secondary absorption head connect to form an absorption hand;
B) sucker of secondary absorption head is communicated with gas circuit and forms negative pressure and pick up thin-wall part, and microscopic system is identified and detected simultaneously, guarantees the precision of picking up;
C) the 3rd adjusting device control device to be processed that end face scribbles glue move to thin-wall part under, the image that obtains by microscopic system judges the position deviation between thin-wall part and device to be processed, and this deviation is fed back to the first adjusting device adjusts;
D) the secondary absorption system moves down, and makes thin-wall part and device to be processed fit, and when the power sensor detected the pressure of setting, the secondary absorption system stopped moving down;
E) the second adjusting device is controlled the compressing tablet motion, makes the seal face of compressing tablet act on the compressive plane of described secondary absorption head;
F) the one-level adsorption head moves upward, and breaks away from the secondary absorption head;
G) glue between thin-wall part and device to be processed is carried out sintering.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310073712.1A CN103157975B (en) | 2013-03-08 | 2013-03-08 | Micro devices assembly system and assembly method thereof |
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| CN201310073712.1A CN103157975B (en) | 2013-03-08 | 2013-03-08 | Micro devices assembly system and assembly method thereof |
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| CN103157975A true CN103157975A (en) | 2013-06-19 |
| CN103157975B CN103157975B (en) | 2015-10-28 |
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| CN105458646A (en) * | 2014-09-30 | 2016-04-06 | 佳能株式会社 | Automated assembly apparatus, automated assembly system and automated assembly method |
| CN109595239A (en) * | 2019-01-17 | 2019-04-09 | 中国工程物理研究院激光聚变研究中心 | The automatic micro assemby equipment of the micro- part of complicated multi-configuration of multi-sensor fusion |
| CN111195872A (en) * | 2020-03-12 | 2020-05-26 | 重庆大学 | Vacuum adsorption gripper system with micro-assembly force sensor |
| CN109595239B (en) * | 2019-01-17 | 2024-04-26 | 中国工程物理研究院激光聚变研究中心 | Multi-sensor integrated complex multi-configuration micro-part automatic micro-assembly equipment |
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| CN109595239B (en) * | 2019-01-17 | 2024-04-26 | 中国工程物理研究院激光聚变研究中心 | Multi-sensor integrated complex multi-configuration micro-part automatic micro-assembly equipment |
| CN111195872A (en) * | 2020-03-12 | 2020-05-26 | 重庆大学 | Vacuum adsorption gripper system with micro-assembly force sensor |
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| CN103157975B (en) | 2015-10-28 |
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