CN103157975B - Micro devices assembly system and assembly method thereof - Google Patents
Micro devices assembly system and assembly method thereof Download PDFInfo
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- CN103157975B CN103157975B CN201310073712.1A CN201310073712A CN103157975B CN 103157975 B CN103157975 B CN 103157975B CN 201310073712 A CN201310073712 A CN 201310073712A CN 103157975 B CN103157975 B CN 103157975B
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Abstract
The invention discloses a kind of micro devices assembly system, in order to by thin-wall part and device to be processed gummed, comprising: mounting plate, in order to carry device to be processed; Secondary absorption system, comprise primary adsorption head and secondary absorption head, described primary adsorption head and secondary absorption head removably connect, and on described secondary absorption head, definition has compressive plane, and the lower end of described secondary absorption head is provided with the sucker of adsorbing described thin-wall part; First adjusting device, is connected to described secondary absorption system to control its motion; Microscopic system, is positioned at the top of described mounting plate; Pressing system, comprises the second adjusting device and compressing tablet, and the second described adjusting device is connected to described compressing tablet and controls its motion, and described compressing tablet has the seal face that can act on described compressive plane.Micro devices assembly system of the present invention, can substantially increase thin-wall part clamping efficiency and clamping quality, assembly precision high and in solidification process thin-wall part non-displacement change.
Description
Technical field
The present invention relates to a kind of in order to by thin-wall part and device to be processed gummed assembly system and assembly method.
Background technology
Microminaturization technology is one of important dual-use technology geared to the 21st century, and its development is on the impact of the development own profound of the correlation techniques such as civilian and national defence.Along with the development of science and technology, more and more higher to the requirement of the function of microminiature device, the aspect such as performance and reliability, also day by day urgent to the demand of accurate micro part and product.The physical dimension of micro part is generally in the scope of sub-micron to tens millimeters, its process technology (technique as micro-in silicon, LIGA technique and precise machine machining etc.) has reached certain development level, but corresponding assembly technology development is still slower, most microminiature parts still take manual assembly method, not only the cycle is long but also cost is high, makes it to be subject to larger restriction in batch production and product percent of pass.
Along with the miniaturization of device and part more microminiaturized, hand assembled will be greatly limited.By means of micro assemby technology, realize higher positioning precision and fine operation by flexible, flexible operation, the miniature manipulator assembling that can adapt to various operating feature, realize high-accuracy, high accuracy micro assemby that staff is difficult to realize.Automation micro assemby not only can be raised the efficiency, batch assembles, reduces costs, and significantly can also reduce the labour intensity of operating personnel.
Microminaturization structural member or device, such as, core component in the devices such as micro-acceleration gauge, processing and assembly precision require all very high, especially the thin-walled workpiece in small piece, its assembling is key issue miniaturized urgently to be resolved hurrily, Miniature thin-wall structural member machining accuracy and being of high quality, structural member clamping job requirements is meticulous, very high to operator personnel skill set requirements, not only operating process is complicated, efficiency is low, and be difficult to the performance reaching matching requirements, therefore the quality and the efficiency that improve assembling by automatic technology and special assembly method is necessary very much, solve the erection stress problem inevitably introduced in staff assembling simultaneously, importantly often because rigging error causes the fault of whole device or system, lose huge.
Thin-walled workpiece adopts cementing mode, require the precision very high (often below 5 microns) of some mucilage binding timing, need compressing structure part after assembling, structural member and bonding plane are fully combined, solidification certain hour makes gelling solid, and in solidification process, structural member and other parts can not have relative displacement.It is very large that current artisan craftsmanship realizes difficulty.
Summary of the invention
In view of this, the invention provides a kind of micro devices assembly system and assembly method thereof, by this device, thin-wall part clamping efficiency and clamping quality can be substantially increased, assembly precision high and in solidification process thin-wall part non-displacement change.
To achieve these goals, the technical scheme that provides of the application is as follows:
A kind of micro devices assembly system, in order to thin-wall part and device to be processed to be glued together, comprising:
Mounting plate, in order to carry device to be processed;
Secondary absorption system, comprise primary adsorption head and secondary absorption head, described primary adsorption head and secondary absorption head removably connect, and on described secondary absorption head, definition has compressive plane, and the lower end of described secondary absorption head is provided with the sucker of adsorbing described thin-wall part;
First adjusting device, is connected to described secondary absorption system to control its motion;
Microscopic system, is positioned at the top of described mounting plate;
Pressing system, comprises the second adjusting device and compressing tablet, and the second described adjusting device is connected to described compressing tablet and controls its motion, and described compressing tablet has the seal face that can act on described compressive plane.
As a further improvement on the present invention, described mounting plate comprises the 3rd adjusting device, and the 3rd adjusting device is in order to control described device to be processed in horizontal in-plane moving.
As a further improvement on the present invention, described primary adsorption head lower end is provided with groove, and described secondary absorption head coordinates described groove to be provided with projection, is connected between described primary adsorption head and secondary absorption head by gas absorption mode.
As a further improvement on the present invention, described secondary absorption system also comprises force snesor, and this force snesor is in order to detect the pressure between described thin-wall part and device to be processed.
As a further improvement on the present invention, the boss that described secondary absorption head comprises main part and protrudes out from the side of described main part, described compressive plane is the end face of described boss, and described sucker is positioned at the bottom of described boss.
Correspondingly, the invention also discloses a kind of assembly method of micro devices assembly system, comprise step:
A) primary adsorption head and secondary absorption head connect to form an absorption hand;
B) sucker of secondary absorption head is communicated with gas circuit and forms negative pressure and pick up thin-wall part, and microscopic system carries out identifying and detecting simultaneously, ensures the precision of pickup;
C) the 3rd adjusting device controls the device to be processed that end face scribbles glue and moves to immediately below thin-wall part, and the image obtained by microscopic system judges the position deviation between thin-wall part and device to be processed, and this deviation is fed back to the first adjusting device adjusts;
D) secondary absorption system moves down, and thin-wall part and device to be processed are fitted, and when force snesor detects the pressure of setting, secondary absorption system stops moving down;
E) the second adjusting device controls compressing tablet motion, makes the seal face of compressing tablet act on the compressive plane of described secondary absorption head;
F) primary adsorption head moves upward, and departs from secondary absorption head;
G) glue between thin-wall part and device to be processed is sintered.
Compared with prior art, micro devices assembly system of the present invention, can substantially increase thin-wall part clamping efficiency and clamping quality, assembly precision high and in solidification process thin-wall part non-displacement change.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Figure 1 shows that the structural representation of micro devices assembly system in the specific embodiment of the invention;
Figure 2 shows that the partial enlarged drawing of Fig. 1;
Figure 3 shows that the structural representation of secondary absorption system;
Figure 4 shows that structural representation when primary adsorption head and secondary absorption head decompose;
Figure 5 shows that another angle schematic diagram of Fig. 4;
Figure 6 shows that structural representation when compressing tablet acts on boss.
Detailed description of the invention
Technical scheme in the application is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present application, technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all should belong to the scope of the application's protection.
Shown in ginseng Fig. 1 to Fig. 6, micro devices assembly system comprises secondary absorption system 1, and secondary absorption system 1 comprises primary adsorption head 1-4 and secondary absorption head 1-3.The lower end of primary adsorption head 1-4 is provided with groove 1-9; The boss 1-5 that the side that secondary absorption head 1-3 comprises main part 1-10 and main body 1-10 protrudes out, main part 1-10 fit 1-9 is provided with protruding 1-7, the top of protruding 1-7 is provided with hole 1-6 on suction nozzle, the end face of boss 1-5 is defined as compressive plane 1-11, the bottom of boss 1-5 is provided with sucker 1-8, and sucker 1-8 is connected with hole 1-6 on suction nozzle.Removably connected by the groove 1-9 that matches and protruding 1-7 between primary adsorption head 1-4 and secondary absorption head 1-3, when can ensure work, two-stage suction nozzle is good fit, realizes stable operation.
Secondary absorption system 1 also comprises force snesor 1-13, and this force snesor 1-13 is in order to detect the pressure between thin-wall part 5 and device to be processed 6.The shell of force snesor 1-13 is also provided with containment vessel 1-2.
Secondary absorption system 1 also comprises air pipe interface 1-12, and its one end can be communicated in gas circuit, and the other end is communicated in hole 1-6 on suction nozzle.
Micro devices assembly system also comprises the first adjusting device 1-1, and the first adjusting device 1-1 is fine adjustment micropositioner, and it is connected to secondary absorption system 1, in order to the motion of precise hard_drawn tuhes secondary absorption system 1.
Micro devices assembly system also comprises mounting plate 4, and mounting plate 4 is in order to carry device 6 to be processed, and mounting plate 4 comprises the 3rd adjusting device 4-1, and the 3rd adjusting device is in order to control device 6 to be processed in horizontal in-plane moving.Mounting plate 4 is XY Two-degree-of-freedohigh-precision high-precision micropositioner.
Micro devices assembly system also comprises microscopic system 2, and microscopic system 2 is positioned at the top of mounting plate 4, and in order to identify and to detect secondary absorption system to the pickup of thin-wall part or release precision, microscopic system 2 is connected with control device (not shown).Control device can comprise microprocessor (MCU), this MCU can comprise CPU (Central Processing Unit, CPU), read-only memory module (read-only memory, ROM), random memory module (random access memory, RAM), time block, digital-to-analogue conversion module (A/D converter) and plural I/O port.Certainly, control device also can adopt the integrated circuit of other form, as: application-specific IC (ApplicationSpecific Integrated Circuit, ASIC) or field programmable gate arrays (FieldProgrammable Gate Array, FPGA) etc.Preferably, control device is computer system.
Micro devices assembly system also comprises pressing system 3, pressing system 3 comprises the second adjusting device 3-2 and compressing tablet 3-1, second adjusting device 3-2 is connected to compressing tablet 3-1 and controls its motion, and compressing tablet 3-1 has the seal face that can act on compressive plane 1-11, and this seal face refers to the bottom surface of compressing tablet.Second adjusting device 3-2 is Three Degree Of Freedom pressing system.
The course of work of system is as follows:
A) the protruding 1-7 of secondary absorption head 1-3 sucks in groove 1-9 by suction type by primary adsorption head 1-4, and after sucking, state as shown in Figure 3, and now primary adsorption head 1-4 and secondary absorption head 1-3 connects to form an absorption hand;
B) the sucker 1-8 of secondary absorption head 1-3 is communicated with gas circuit and forms negative pressure and pick up thin-wall part 5, and microscopic system 2 carries out identifying and detecting simultaneously, ensures the precision of pickup;
C) thin-wall part 5 picks up successfully, the device to be processed 6 that 3rd adjusting device 4-1 control end face scribbles glue moves to immediately below thin-wall part 5, the image obtained by microscopic system 2 judges the position deviation between thin-wall part 5 and device to be processed 6, and this deviation is fed back to the first adjusting device 1-1 adjusts;
D) secondary absorption system moves down, and thin-wall part 5 and device 6 to be processed are fitted, and when force snesor 1-13 detects the pressure of setting, secondary absorption system stops moving down;
E) the second adjusting device 3-2 controls compressing tablet 3-1 motion, makes the seal face of compressing tablet 3-1 act on the compressive plane of secondary absorption head;
F) primary adsorption head moves upward, and departs from secondary absorption head;
G) glue between thin-wall part and device to be processed is sintered.
Current manual operation except efficiency and precision poor except, mainly be device 6 to be processed there has been the liquid glued membrane of one deck, and the size of thin-wall part own is little, all the time cannot hold with tweezers always wait for that compressing tablet 3-1 goes to compress thin-wall part (without operating space), therefore thin-wall part freely can only be placed at present above device 6 to be processed, but thin-wall part can slide on glued membrane, assembling is caused to lose efficacy, after each pressure is complete all with tweezers tip go among a small circle stir thin-wall part adjustment, but sometimes large deviation cannot adjust.Therefore the present invention is by the mode of secondary suction nozzle, first the problem that cannot operate thin-wall part is all the time solved, whole process all has negative pressure to carry out adsorption operations to thin-wall part, ensure that thin-wall part does not slide on glued membrane, secondly carry out pre-pressing (force sensor carries out the accurate judgement of power) by absorption hand to thin-wall part, then joined by compressing tablet 3-1, during solidification, secondary suction nozzle enters high-temperature service with thin-wall part, whole process ensure that the stability of thin-wall part, ensure that the precision of assembling.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should by description integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.
Claims (4)
1. a micro devices assembly system, in order to thin-wall part and device to be processed to be glued together, is characterized in that, comprising:
Mounting plate, in order to carry device to be processed;
Secondary absorption system, comprise primary adsorption head and secondary absorption head, described primary adsorption head and secondary absorption head removably connect, and on described secondary absorption head, definition has compressive plane, and the lower end of described secondary absorption head is provided with the sucker of adsorbing described thin-wall part;
First adjusting device, is connected to described secondary absorption system to control its motion;
Microscopic system, is positioned at the top of described mounting plate;
Pressing system, comprises the second adjusting device and compressing tablet, and the second described adjusting device is connected to described compressing tablet and controls its motion, and described compressing tablet has the seal face that can act on described compressive plane;
Described primary adsorption head lower end is provided with groove, and described secondary absorption head coordinates described groove to be provided with projection, is connected between described primary adsorption head and secondary absorption head by gas absorption mode;
The boss that described secondary absorption head comprises main part and protrudes out from the side of described main part, described compressive plane is the end face of described boss, and described sucker is positioned at the bottom of described boss.
2. micro devices assembly system according to claim 1, is characterized in that, described mounting plate comprises the 3rd adjusting device, and the 3rd adjusting device is in order to control described device to be processed in horizontal in-plane moving.
3. micro devices assembly system according to claim 1, is characterized in that, described secondary absorption system also comprises force snesor, and this force snesor is in order to detect the pressure between described thin-wall part and device to be processed.
4. the assembly method of the micro devices assembly system according to any one of claim 1 to claim 3, is characterized in that, comprise step:
A) primary adsorption head and secondary absorption head connect to form an absorption hand;
B) sucker of secondary absorption head is communicated with gas circuit and forms negative pressure and pick up thin-wall part, and microscopic system carries out identifying and detecting simultaneously, ensures the precision of pickup;
C) the 3rd adjusting device controls the device to be processed that end face scribbles glue and moves to immediately below thin-wall part, the image obtained by microscopic system judges the position deviation between thin-wall part and device to be processed, and this deviation is fed back to the first adjusting device adjusts;
D) secondary absorption system moves down, and thin-wall part and device to be processed are fitted, and when force snesor detects the pressure of setting, secondary absorption system stops moving down;
E) the second adjusting device controls compressing tablet motion, makes the seal face of compressing tablet act on the compressive plane of described secondary absorption head;
F) primary adsorption head moves upward, and departs from secondary absorption head;
G) glue between thin-wall part and device to be processed is sintered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201310073712.1A CN103157975B (en) | 2013-03-08 | 2013-03-08 | Micro devices assembly system and assembly method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310073712.1A CN103157975B (en) | 2013-03-08 | 2013-03-08 | Micro devices assembly system and assembly method thereof |
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| CN103157975A CN103157975A (en) | 2013-06-19 |
| CN103157975B true CN103157975B (en) | 2015-10-28 |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI595958B (en) * | 2014-09-30 | 2017-08-21 | 佳能股份有限公司 | Automated assembly apparatus, automated assembly system and automated assembly method |
| CN109595239A (en) * | 2019-01-17 | 2019-04-09 | 中国工程物理研究院激光聚变研究中心 | The automatic micro assemby equipment of the micro- part of complicated multi-configuration of multi-sensor fusion |
| CN111195872B (en) * | 2020-03-12 | 2021-05-28 | 重庆大学 | Vacuum adsorption gripper system with micro-assembly force sensor |
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| EP1095669A1 (en) * | 1999-10-30 | 2001-05-02 | Arzneimittel GmbH Apotheker Vetter & Co. Ravensburg | Apparatus for placing needle protection sheaths onto medical syringes |
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2013
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| EP1095669A1 (en) * | 1999-10-30 | 2001-05-02 | Arzneimittel GmbH Apotheker Vetter & Co. Ravensburg | Apparatus for placing needle protection sheaths onto medical syringes |
| CN2889598Y (en) * | 2006-05-18 | 2007-04-18 | 上海小糸车灯有限公司 | Device for mounting ventilation lid using vehicle lamp air-tight experiment machine |
| CN1923466A (en) * | 2006-10-13 | 2007-03-07 | 北京理工大学 | Macrography/microcosmic association 12 freedom degree micro assembly system |
| CN102744590A (en) * | 2012-07-25 | 2012-10-24 | 中国科学院自动化研究所 | Assembling adhesive-dispensing device applied to micron order microtube and micropore |
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