CN103134363A - Structure and manufacturing method of heat pipe - Google Patents
Structure and manufacturing method of heat pipe Download PDFInfo
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- CN103134363A CN103134363A CN2011103741454A CN201110374145A CN103134363A CN 103134363 A CN103134363 A CN 103134363A CN 2011103741454 A CN2011103741454 A CN 2011103741454A CN 201110374145 A CN201110374145 A CN 201110374145A CN 103134363 A CN103134363 A CN 103134363A
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- heat pipe
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- hollow tube
- pipe structure
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Abstract
The invention discloses a structure and a manufacturing method of a heat pipe. The structure of the heat pipe comprises a body, wherein the body is provided with a cavity, the cavity is provided with at least one capillary area and at least one flow passage area, the capillary area is adjacent to the flow passage area, the capillary area and the flow passage area respectively extend in the axial direction and are arranged in the cavity, the capillary area is arranged on the inner wall surface of the cavity, and the occupied area of the capillary area is smaller than one half of the circumference of the inner wall surface of the cavity. The structure of the heat pipe can avoid the situation that a capillary structure inside the heat pipe is damaged in the manufacturing process, and therefore the rate of finished products in the manufacturing process is improved by a large margin.
Description
Technical field
A kind of heat pipe structure and manufacture method thereof, espespecially a kind of processing procedure yield rate that promotes avoids the inside heat pipe capillary structure to be added heat pipe structure and the manufacture method thereof of destroying man-hour.
Background technology
Press, the industry development, cooling or removing of heat is always the large obstacle that electronic industry develops.Along with raising and the multi-functional application of dynamical requirement, degree of integration, also face big challenge for the requirement of dispelling the heat, therefore just become the major subjects of electronics industry for the research and development of heat transfer efficient.
Fin (Heat Sink) is used in heat dissipation that electronic component or system are produced usually among atmosphere; And under the lower situation of thermal resistance, show that this fin has higher radiating efficiency.In general, thermal resistance is made of the diffusion thermal resistance of fin inside and the thermal-convection resistance between this fin surface and atmospheric environment; On using, the material of high conductance such as copper, aluminium etc. often are used to make fin to reduce the diffusion thermal resistance; Yet thermal-convection resistance has limited the usefulness of fin, makes it can't reach the heat radiation requirement of electronic component of new generation.
Accordingly, existing market all is conceived to more efficient cooling mechanism, and proposition has thin type heat pipe/flat plate heat tube (Heat pipe) and the soaking plate (Vapor chamber) of high heat conduction efficiency successively, and it can be made matched combined with radiator, with effective solution heat dissipation problem of present stage.
Press, present thin heat pipe structure, it inserts metal dust by the hollow space in thin type heat pipe, and form the capillary structure of a sintered form in the inwall of this thin type heat pipe by the mode of sintering, or insert its hollow space as capillary structure with wire netting, this thin type heat pipe vacuumized and fill working fluid and seal at last thereafter again or be formed with ring-type and axially extended groove on the inwall of thin type heat pipe; Due to known thin type heat pipe when processing is pressurizeed, the capillary structure (being metal dust or wire netting or the annular ditch groove of sintering) of this thin type heat pipe inside is vulnerable to squeeze and destroy and is come off or pushed distortion by the inwall of this thin type heat pipe, cause the heat biography usefulness of this thin type heat pipe significantly to reduce, severe patient even lost efficacy, and was a large emphasis therefore how to improve capillary structure in making not to be damaged when pressurizeing.
Summary of the invention
For this reason, for solving the shortcoming of above-mentioned known technology, the invention provides a kind of heat pipe structure that promotes the processing procedure yield rate.
Secondary objective of the present invention provides a kind of manufacture method that promotes the heat pipe structure of processing procedure yield rate.
In order to achieve the above object, the invention provides a kind of heat pipe structure, comprise: a body;
Described body has a chamber, this chamber has at least one capillary district and at least one flow path area, neighbour this flow path area in described capillary district also extends axially respectively to be located in this chamber, described capillary district is arranged at the internal face of this chamber, and the shared scope in this capillary district is less than half of the internal face circumference of this chamber.
In order to achieve the above object, the invention provides a kind of manufacture method of heat pipe structure, comprise the following step:
One hollow tube is provided;
In a plurality of grooves of this hollow tube inwall moulding;
This hollow tube is flattened;
This hollow tube is carried out tube sealing and vacuumizes the operation of inserting working fluid.
Can promote the yield rate of heat pipe processing procedure by heat pipe structure of the present invention and manufacture method thereof, prevent that heat pipe from destroying inner capillary structure and producing defective finished product in the processing procedure process; Therefore the present invention has following advantages:
1. improving product yield rate;
2. simple in structure.
Description of drawings
Fig. 1 is the first embodiment stereogram of heat pipe structure of the present invention;
Fig. 2 A is first embodiment A-A cutaway view of heat pipe structure of the present invention;
Fig. 2 B is first Embodiment B-B cutaway view of heat pipe structure of the present invention;
Fig. 3 is the second embodiment cutaway view of heat pipe structure of the present invention;
Fig. 4 is the 3rd embodiment cutaway view of heat pipe structure of the present invention;
Fig. 5 is the 4th embodiment cutaway view of heat pipe structure of the present invention;
Fig. 6 is the 5th embodiment cutaway view of heat pipe structure of the present invention;
Fig. 7 is the manufacture method first embodiment flow chart of heat pipe structure of the present invention;
Fig. 8 is the manufacture method second embodiment flow chart of heat pipe structure of the present invention.
[main element symbol description]
Capillary district 111
The first capillary structure 1112
The second capillary structure 1113
The second runner 1122
The first side 113
The second side 114
The 3rd side 115
The 4th side 116
The specific embodiment
Characteristic on above-mentioned purpose of the present invention and structure thereof and function will be explained according to appended graphic preferred embodiment.
See also Fig. 1, Fig. 2 A, Fig. 2 B, be the first embodiment solid and the A-A cutaway view of heat pipe structure of the present invention, as shown in the figure, heat pipe structure of the present invention comprises: a body 1;
Described body 1 has a chamber 11, this chamber 11 has at least one capillary district 111 and at least one flow path area 112, neighbour this flow path area 112 in described capillary district 111 also extends axially respectively to be located in this chamber 11, described capillary district 111 is arranged at the internal face of this chamber 11, the shared scope in this capillary district 111 is less than half of the internal face circumference of this chamber 11, and described capillary district 111 has a plurality of grooves 1111.
described chamber 11 also has one first side 113 and one second side 114 and one the 3rd side 115 and one the 4th side 116, described first, two sides 113, 114 is mutually corresponding, the described the 3rd, four sides 115, 116 is mutually corresponding, and this first, two sides 113, 114 and the 3rd, four sides 115, 116 interconnect, described capillary district 111 is located at this first side 113, and this flow path area 112 has a first flow 1121 and one second runner 1122, this first flow 1121 is located at the 3rd side 115 and this capillary district 111 intersections, this second runner 1122 is located at the 4th side 116 and this capillary district 111 intersections.
See also Fig. 3, the second embodiment cutaway view for heat pipe structure of the present invention, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together for the wall thickness of the first side 114 of described body 1 this second and third, four sides 114,115,116 are thick.
see also Fig. 4, the 3rd embodiment cutaway view for heat pipe structure of the present invention, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together and also have one first side 113 and one second side 114 and one the 3rd side 115 and one the 4th side 116, described first for described chamber 11, two sides 113, 114 is mutually corresponding, and the described the 3rd, four sides 115, 116 is mutually corresponding, and this first, two sides 113, 114 and the 3rd, four sides 115, 116 interconnect, described capillary district 111 also has one first capillary structure 1112 and one second capillary structure 1113, described the first capillary structure 1112 is located at this first side 113, described the second capillary structure 1113 is located at this second side 114, and this flow path area 112 has a first flow 1121 and one second runner 1122, and this first flow 1121 is located at the 3rd side 115 and this first, two capillary structures 1112, 1113 intersections, this second runner 1122 are located at the 4th side 116 and this first, two capillary structures 1112, 1113 intersections.
Described first and second capillary structure 1112,1113 is by 1111 configurations of a plurality of grooves.
See also Fig. 5, the 4th embodiment cutaway view for heat pipe structure of the present invention, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together for first and second side 113 of described body 1,114 wall thickness this third and fourth side 115,116 be thick.
See also Fig. 6, the 5th embodiment cutaway view for heat pipe structure of the present invention, as shown in the figure, the present embodiment is identical with aforementioned the first embodiment part-structure, therefore will repeat no more at this, only the present embodiment and aforementioned the first embodiment do not exist together and extend axially and be located in this chamber 11 for body 1 also has a supporting construction 2, this supporting construction 2 and these capillary district's 111 corresponding settings, this flow path area 112 also has a first flow 1121 and one second runner 1122, and described first and second runner 1121,1122 is divided into this supporting construction 2 and these 111 both sides, capillary district.
This capillary district 111 has a plurality of grooves 1111, and described supporting construction 2 is that agglomerated powder opisthosoma and grid body and corpus fibrosum are wherein arbitrary.
See also Fig. 7, be the manufacture method first embodiment flow chart of heat pipe structure of the present invention, and consult in the lump Fig. 1-Fig. 6, as shown in the figure, the present embodiment comprises the following step:
S1 a: hollow tube is provided;
One hollow tube (being body 1) is provided, and this hollow tube is that the better material of thermal conductive property such as copper material and aluminium material and stainless steel are wherein arbitrary, and the present embodiment is not limited but do not regard it as with copper material embodiment as an illustration.
S2: in a plurality of grooves of this hollow tube inner wall forming;
Mode in this hollow tube (being body 1) internal face by machining a plurality of grooves that are shaped, described machining can be the mill pin and processes and mill pin processing and the processing of plane pin and pull and process wherein arbitrary, the present embodiment first carries out preparatory processing to this hollow tube internal face with the processing of mill pin, again with pull be machined in this hollow tube internal face shaping a plurality of grooves thereafter, the position of a plurality of grooves 1111 is set in this body 1 wish, and its pipe thickness does not arrange the part pipe thickness of groove 1111 greater than other.
S3: this hollow tube is flattened;
Hollow tube (being body 1) is flattened, this hollow tube is flattened can be wherein arbitrary by punch process and rotary rolling mill, the present embodiment with punch process as an illustration but do not regard it as and be limited, the present embodiment is selected the oil pressure processing of punch process, for the hollow tube pressurization that progressively presses, this hollow tube is pressed into flat.
S4: this hollow tube is carried out tube sealing and vacuumizes the operation of inserting working fluid.
The aforementioned hollow tube (being body 1) that flattens operation of completing is vacuumized and inserts working fluid and tube sealing operation.
See also Fig. 8, be the manufacture method second embodiment flow chart of heat pipe structure of the present invention, as shown in the figure, the present embodiment comprises the following step:
S1 a: hollow tube is provided;
One hollow tube (being body 1) is provided, and this hollow tube is that the better material of thermal conductive property such as copper material and aluminium material and stainless steel are wherein arbitrary, and the present embodiment is not limited but do not regard it as with copper material embodiment as an illustration.
S2: in a plurality of grooves of this hollow tube inner wall forming;
Mode by machining in this hollow tube (being body 1) a plurality of grooves 1111 that are shaped, described machining can be mill pin processing, it is wherein arbitrary to mill pin processing and the processing of plane pin and pull processing, and its pipe thickness of position that a plurality of grooves 1111 are set in this body 1 wish does not arrange the position pipe thickness of groove 1111 greater than other.
S4: this hollow tube is carried out tube sealing and vacuumizes the operation of inserting working fluid;
The aforementioned hollow tube (being body 1) that flattens operation of completing is vacuumized and inserts working fluid and tube sealing operation.
S3: this hollow tube is flattened.
Hollow tube (being body 1) is flattened, this hollow tube is flattened can be wherein arbitrary by punch process and rotary rolling mill, the present embodiment with punch process as an illustration but do not regard it as and be limited, the present embodiment is selected the oil pressure processing of punch process, for the hollow tube pressurization that progressively presses, this hollow tube is pressed into flat.
Claims (15)
1. a heat pipe structure, is characterized in that, comprises:
One body, has a chamber, this chamber has at least one capillary district and at least one flow path area, neighbour this flow path area in described capillary district also extends axially respectively to be located in this chamber, described capillary district is arranged at the internal face of this chamber, and the shared scope in this capillary district is less than half of the internal face circumference of this chamber.
2. heat pipe structure as claimed in claim 1, it is characterized in that, described capillary district also has one first capillary structure and one second capillary structure, and the mutual correspondence of this first and second capillary structure is arranged in this chamber, and described first and second capillary structure is by a plurality of groove institute configuration.
3. heat pipe structure as claimed in claim 1, is characterized in that, described capillary district has a plurality of grooves.
4. heat pipe structure as claimed in claim 2, it is characterized in that, described chamber also has one first side and one second side and one the 3rd side and one the 4th side, described first, two sides are mutually corresponding, the described the 3rd, four sides are mutually corresponding, and this first, two sides and the 3rd, four sides interconnect, described the first capillary structure is located at this first side, described the second capillary structure is located at this second side, and this flow path area has a first flow and one second runner, this first flow is located at the 3rd side and this first, two capillary structure intersections, this second runner is located at the 4th side and this first, two capillary structure intersections.
5. heat pipe structure as claimed in claim 4, is characterized in that, the wall thickness of first and second side of described body this third and fourth side is thick.
6. heat pipe structure as claimed in claim 1, it is characterized in that, described chamber also has one first side and one second side and one the 3rd side and one the 4th side, described first and second side is mutually corresponding, described third and fourth side is mutually corresponding, and this first and second side and this third and fourth side interconnect, described capillary district is located at this first side, and this flow path area has a first flow and one second runner, this first flow is located at the 3rd side and this capillary district intersection, and this second runner is located at the 4th side and this capillary district intersection.
7. heat pipe structure as claimed in claim 6, is characterized in that, the wall thickness of the first side of described wherein said body this second and third, four sides are thick.
8. heat pipe structure as claimed in claim 1, it is characterized in that, also having a supporting construction extends axially and is located in this chamber, this supporting construction and this corresponding setting in capillary district, this flow path area also has a first flow and one second runner, and described first and second runner is divided into this supporting construction and this both sides, capillary district.
9. heat pipe structure as claimed in claim 8, is characterized in that, described capillary district has a plurality of grooves, and described supporting construction is that agglomerated powder opisthosoma and grid body and corpus fibrosum are wherein arbitrary.
10. the manufacture method of a heat pipe structure, is characterized in that, comprises the following step:
One hollow tube is provided;
In a plurality of grooves of this hollow tube inner wall forming;
This hollow tube is flattened;
This hollow tube is carried out tube sealing and vacuumizes the operation of inserting working fluid.
11. the manufacture method of heat pipe structure as claimed in claim 10, it is characterized in that, a plurality of grooves of this hollow tube inner wall forming that are set forth in are completed by machining, and described machining is processed for the mill pin and milled pin processing and the processing of plane pin and pull and process wherein arbitrary.
12. the manufacture method of heat pipe structure as claimed in claim 10 is characterized in that, described that this hollow tube is flattened this step is wherein arbitrary by punch process and rotary rolling mill.
13. the manufacture method of a heat pipe structure is characterized in that, comprises the following step:
One hollow tube is provided;
In a plurality of grooves of this hollow tube inner wall forming;
This hollow tube is carried out tube sealing and vacuumizes the operation of inserting working fluid;
This hollow tube is flattened.
14. the manufacture method of heat pipe structure as claimed in claim 13, it is characterized in that, a plurality of grooves of this hollow tube inner wall forming that are set forth in are completed by machining, and described machining is processed for the mill pin and milled pin processing and the processing of plane pin and pull and process wherein arbitrary.
15. the manufacture method of heat pipe structure as claimed in claim 13 is characterized in that, described that this hollow tube is flattened this step is wherein arbitrary by punch process and rotary rolling mill.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103741454A CN103134363A (en) | 2011-11-22 | 2011-11-22 | Structure and manufacturing method of heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103741454A CN103134363A (en) | 2011-11-22 | 2011-11-22 | Structure and manufacturing method of heat pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103134363A true CN103134363A (en) | 2013-06-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103741454A Pending CN103134363A (en) | 2011-11-22 | 2011-11-22 | Structure and manufacturing method of heat pipe |
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| Country | Link |
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| CN (1) | CN103134363A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107835926A (en) * | 2015-06-19 | 2018-03-23 | 株式会社Innotm | Thin type heat pipe and its manufacture method |
| CN109974495A (en) * | 2013-07-08 | 2019-07-05 | 奇鋐科技股份有限公司 | Equalizing plate structure manufacturing method |
| CN112846643A (en) * | 2020-12-08 | 2021-05-28 | 北京星航机电装备有限公司 | Forming method and forming device for titanium alloy thin-wall hollow structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2421606Y (en) * | 2000-05-16 | 2001-02-28 | 李嘉豪 | Plate-heat pipe with capillary supporting structure |
| CN1892164A (en) * | 2005-06-27 | 2007-01-10 | 中村制作所株式会社 | Plate type heat exchanger and method of manufacturing the same |
| CN101537441A (en) * | 2008-02-21 | 2009-09-23 | 郑文春 | Microgrooves as wick structures in heat pipes and method for fabricating the same |
| CN202562344U (en) * | 2011-11-22 | 2012-11-28 | 奇鋐科技股份有限公司 | Heat pipe structure |
-
2011
- 2011-11-22 CN CN2011103741454A patent/CN103134363A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2421606Y (en) * | 2000-05-16 | 2001-02-28 | 李嘉豪 | Plate-heat pipe with capillary supporting structure |
| CN1892164A (en) * | 2005-06-27 | 2007-01-10 | 中村制作所株式会社 | Plate type heat exchanger and method of manufacturing the same |
| CN101537441A (en) * | 2008-02-21 | 2009-09-23 | 郑文春 | Microgrooves as wick structures in heat pipes and method for fabricating the same |
| CN202562344U (en) * | 2011-11-22 | 2012-11-28 | 奇鋐科技股份有限公司 | Heat pipe structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109974495A (en) * | 2013-07-08 | 2019-07-05 | 奇鋐科技股份有限公司 | Equalizing plate structure manufacturing method |
| CN109974494A (en) * | 2013-07-08 | 2019-07-05 | 奇鋐科技股份有限公司 | Equalizing plate structure manufacturing method |
| CN107835926A (en) * | 2015-06-19 | 2018-03-23 | 株式会社Innotm | Thin type heat pipe and its manufacture method |
| CN112846643A (en) * | 2020-12-08 | 2021-05-28 | 北京星航机电装备有限公司 | Forming method and forming device for titanium alloy thin-wall hollow structure |
| CN112846643B (en) * | 2020-12-08 | 2022-06-21 | 北京星航机电装备有限公司 | Forming method and forming device for titanium alloy thin-wall hollow structure |
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Addressee: Beijing wiscom Puhua Intellectual Property Agency Ltd. Ba Xiaoyan Ba Xiaoyan Document name: Written decision of reexamination |
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Application publication date: 20130605 |
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