CN103123255B - Three-dimensional measuring apparatus - Google Patents
Three-dimensional measuring apparatus Download PDFInfo
- Publication number
- CN103123255B CN103123255B CN201210172459.0A CN201210172459A CN103123255B CN 103123255 B CN103123255 B CN 103123255B CN 201210172459 A CN201210172459 A CN 201210172459A CN 103123255 B CN103123255 B CN 103123255B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- light pattern
- measured value
- altitude information
- obtains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/50—Depth or shape recovery
- G06T7/521—Depth or shape recovery from laser ranging, e.g. using interferometry; from the projection of structured light
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Abstract
Problem of the present invention is to provide a kind of three-dimensional measuring apparatus, when carrying out the three-dimensional measurement adopting phase-shift method, can realize more high-precision measurement.Base board checking device comprises: irradiation unit, and it irradiates the light pattern of striated to printed circuit board (PCB); To the camera that it is made a video recording; Control device, it carries out three-dimensional measurement according to the view data of having taken.The view data that control device obtains according to irradiating the 1st light pattern from the 1st irradiation unit obtains the 1st measured value, and the view data obtained according to irradiating the 2nd light pattern from the 2nd irradiation unit obtains the 2nd measured value.In addition, for the full illumination region of irradiation two light patterns, using the value of being specified by two measured values altitude information as this region, for only irradiating any one a part of irradiation area, the supplementary data calculated according to the altitude information by above-mentioned full illumination region, the striped number of times of the measured value of specifying this region to be correlated with, obtains the altitude information in this region.
Description
Technical field
The present invention relates to three-dimensional measuring apparatus.
Background technology
Generally, electron device is being installed on the occasion on printed circuit board (PCB), first printed solder paste in the electrode pattern being arranged at the regulation on printed circuit board (PCB).Then, according to the viscosity of this solder(ing) paste, electron device is temporarily fixed on printed circuit board (PCB).Then, by above-mentioned printed circuit board (PCB) guiding reflow soldering, via the reflow step of regulation, weld.Recently, in the previous stage of guiding reflow soldering, necessarily require the printing state checking solder(ing) paste, can three-dimensional measuring apparatus be adopted when above-mentioned inspection.
In recent years, people propose the three-dimensional measuring apparatus having the what is called of multiple employing light contactless, such as, propose there is the technology relating to the three-dimensional measuring apparatus adopting phase-shift method.
In the three-dimensional measuring apparatus adopting this phase-shift method, by the irradiation means be made up of with the filter bank with sinusoidal wave shape pattern light source, the light pattern of the light intensity distributions with sinusoidal wave shape (striated) is irradiated to measured object (in this occasion, being printed circuit board (PCB)).Then, the point on the observation of the image mechanism directly over being arranged at substrate is adopted.Image mechanism adopts the CCD camera etc. be made up of lens and image-forming component etc.In this occasion, the intensity I of the light of the measuring object point P on picture is represented by following formula:
I=e+f·cosφ
(wherein, e: direct current light noise (deviation composition), f: sinusoidal wave contrast (reflectivity), φ: the phase place had because of the jog of object)
At this, by mobile light pattern, according to such as 4 stages (φ+0, φ+pi/2, φ+π, φ+3 pi/2), phase place is changed, obtains and there is the intensity distributions I0 corresponding with them, the image of I1, I2, I3, obtain modulation voltage α according to following formula:
α=arctan{(I3-I1)/(I0-I2)}
Adopt this modulation voltage α, obtain the three-dimensional coordinate (X, Y, Z) of the some P on the measuring object of solder(ing) paste etc., thus, measure the 3D shape of measuring object, particularly height.
But actual measuring object has higher type, also has lower type.Such as, about solder(ing) paste, there is the type of film-form, also there is the type of the projection in circular cone shape.In addition, if correspond to the maximum height in these measuring objects, expand the spacing of the striped of the light pattern irradiated, then there is resolution low, the danger of measuring accuracy difference.On the other hand, although seek the raising of precision by making the spacing of striped narrow, there is the danger of measurable altitude range deficiency (striped number of times is other value).
So people also propose the light pattern different cycle (fringe spacing), that is, the light pattern combination of the light pattern that the cycle is short, cycle length, carries out the technology (such as, with reference to patent documentation 1) measured.Thus, the resolution of short transverse can not be reduced, expand measurable altitude range.
Prior art document
Patent documentation 1: Japanese Unexamined Patent Publication 2001-159510 publication
Summary of the invention
The problem that invention will solve
But, as above-mentioned prior art, light source is only arranged in the scheme at 1 position, due to the part of not irradiating the shade of light pattern can be produced at measured object (measuring object), therefore there is the danger of the measurement be applicable to cannot carrying out this part.
This situation relatively, even if when distinguishing the scheme of the different light pattern of exposure period from two light sources, due to the part of the light pattern only irradiating one-period can be produced, therefore about this part, have and in wide dynamic range as described above, the danger of high-resolution measurement cannot be carried out.
In addition, above-mentioned problem is not necessarily limited to the elevation carrection of the solder(ing) paste be printed on printed circuit board (PCB) etc., also comprises the field of other three-dimensional measuring apparatus.
The present invention be directed to such situation to propose, the object of the present invention is to provide a kind of three-dimensional measuring apparatus, it when carrying out the three-dimensional measurement adopting phase-shift method, can realize more high-precision measurement.
For solving the technical scheme of problem
Subitem ground is described each technical scheme being suitable for solving above-mentioned problem below.In addition, as required, after corresponding technical scheme, distinctive action effect is recorded.
Technical scheme 1 relates to a kind of three-dimensional measuring apparatus, and this three-dimensional measuring apparatus comprises:
Multiple irradiation means, it can irradiate multiple light pattern from positions different respectively to measured object, and the plurality of light pattern has the light intensity distributions of striated, and the cycle is different;
Image mechanism, it can be made a video recording to the above-mentioned measured object irradiating above-mentioned each light pattern; And
Image procossing mechanism, it carries out three-dimensional measurement according to the view data of being taken by above-mentioned image mechanism;
It is characterized in that, above-mentioned image procossing mechanism comprises:
Measured value obtains mechanism, it is according to multiple view data, three-dimensional measurement is carried out by phase-shift method, obtained as the relevant measured value of above-mentioned each light pattern by this measured value, above-mentioned multiple view data is relevant to: the above-mentioned each light pattern taken by above-mentioned image mechanism after irradiating above-mentioned each light pattern that phase place repeatedly changes respectively;
1st altitude information obtains mechanism, and it is for the full illumination region of above-mentioned multiple light pattern full illumination, the altitude information that the altitude information of being specified by the above-mentioned measured value of being correlated with by above-mentioned multiple light pattern is relevant as this full illumination region and obtaining;
Supplementary data obtains mechanism, and it is according to the altitude information in above-mentioned full illumination region, obtains the supplementary data that a part of irradiation area of a part of only irradiating in above-mentioned multiple light pattern is relevant; And
2nd altitude information obtains mechanism, it is according to above-mentioned supplementary data, the striped number of times of the above-mentioned measured value of specifying above-mentioned a part of irradiation area to be correlated with, obtains altitude information relevant as this part of irradiation area for the altitude information corresponding to the measured value of this striped number of times.
According to technique scheme 1, according to respectively from different positions to the different multiple light pattern of measured object exposure period and the multiple view data obtained, carried out three-dimensional measurement by phase-shift method, this measured value is obtained as the measured value of each light pattern.In addition, the altitude information that the measured value according to multiple light pattern is specified, as measured object altitude information and obtain.Thus, following two kinds of effects can be obtained, that is, as utilize the characteristic of the light pattern in long cycle, can measurable altitude range be increased; And as utilize the characteristic of the light pattern in short cycle, the high high-acruracy survey of resolution can be realized.Consequently, high-resolution measurement can be carried out in wider dynamic range, more high-precision measurement can be realized.
But, due to the measured value according to multiple light pattern, specify the altitude information of measured object, therefore for a part of irradiation area of a part of only irradiating in multiple light pattern, what produce data lacks part.
So, in the technical program, for the full illumination region of the multiple light pattern of full illumination, the altitude information that measured value by multiple light pattern is specified as this full illumination region altitude information and obtain, on the other hand, for a part of irradiation area of a part of only irradiating in multiple light pattern, altitude information according to above-mentioned full illumination region calculates supplementary data, then, the striped number of times of the measured value of above-mentioned a part of irradiation area is specified according to it, the altitude information corresponding with the measured value of this striped number of times is obtained as the altitude information of this part of irradiation area.
Thus, be much less the full illumination region for the multiple light pattern of full illumination, and for only irradiating a part of irradiation area of a part of multiple light pattern, also can obtain more high-precision altitude information.
In addition, if the shape comprised at a part of irradiation area is more smooth shape, then also consider that the supplementary data obtained carrying out linear supplementary grade is used as the altitude information of this part of irradiation area same as before, but, not only a part of irradiation area of the measuring object of solder(ing) paste etc. must be such shape, but also consider in such as having the concaveconvex shape comparatively risen and fallen, thus, same for this part of irradiation area, from obtaining more close to the aspect of actual value, best, adopt measured value (altitude information corresponding with the measured value of the striped number of times of regulation) same as before.
Technical scheme 2 relates to a kind of three-dimensional measuring apparatus, and this three-dimensional measuring apparatus comprises:
1st irradiation means, it can irradiate the 1st light pattern in the 1st cycle to measured object from the 1st position, the 1st light pattern in the 1st cycle has the light intensity distributions of striated;
2nd irradiation means, it can from being different from the 2nd position of above-mentioned 1st position to the 2nd light pattern in measured object the 2nd cycle of irradiation, and the 2nd light pattern in the 2nd cycle has the light intensity distributions of striated and is greater than above-mentioned 1st cycle;
Image mechanism, it can be made a video recording to the above-mentioned measured object irradiating above-mentioned light pattern; And
Image procossing mechanism, it carries out three-dimensional measurement according to the view data of being taken by above-mentioned image mechanism;
It is characterized in that, above-mentioned image procossing mechanism comprises:
1st measured value obtains mechanism, it carries out three-dimensional measurement according to multiple view data by phase-shift method, is obtained by this measured value as the 1st measured value, above-mentioned 1st light pattern that the plurality of view data repeatedly changes by irradiating phase place, takes with above-mentioned image mechanism and obtains;
2nd measured value obtains mechanism, it carries out three-dimensional measurement according to multiple view data by phase-shift method, is obtained by this measured value as the 2nd measured value, above-mentioned 2nd light pattern that the plurality of view data repeatedly changes by irradiating phase place, takes with above-mentioned image mechanism and obtains;
1st altitude information obtains mechanism, and its full illumination region all irradiated for above-mentioned 1st light pattern and above-mentioned 2nd light pattern, obtains the altitude information of being specified by above-mentioned 1st measured value and above-mentioned 2nd measured value as the altitude information in this full illumination region;
Supplementary data obtains mechanism, and it is according to the altitude information in above-mentioned full illumination region, obtains the supplementary data that a part of irradiation area of the only one of irradiating in above-mentioned 1st light pattern or above-mentioned 2nd light pattern is relevant; And
2nd altitude information obtains mechanism, it is according to above-mentioned supplementary data, above-mentioned 1st measured value of specifying above-mentioned a part of irradiation area to be correlated with or the striped number of times of the 2nd measured value, obtain altitude information relevant as this part of irradiation area for altitude information corresponding for the 1st measured value or the 2nd measured value to this striped number of times.
According to technique scheme 2, according to multiple view data, by phase-shift method, carry out three-dimensional measurement, obtained as the 1st measured value by this measured value, the plurality of view data is: the 1st light pattern in the 1st cycle phase place repeatedly changed is irradiated to measured object from the 1st position and obtains.And, according to multiple view data, by phase-shift method, carry out three-dimensional measurement, obtained as the 2nd measured value by this measured value, the plurality of view data is that the 2nd light pattern in the 2nd cycle phase place repeatedly changed is irradiated to measured object from the 2nd position and obtains.In addition, the altitude information of specifying according to the 1st measured value and the 2nd measured value is obtained as the altitude information of measured object.Thus, following two kinds of effects can be obtained, that is, as utilize the characteristic of the 2nd light pattern in long cycle, can measurable altitude range be increased; And as utilize the characteristic of the 1st light pattern in short cycle, the high high-acruracy survey of resolution can be realized.Consequently, high-resolution measurement can be carried out in wider dynamic range, more high-precision measurement can be realized.
But owing to specifying the altitude information of measured object according to the 1st measured value and the 2nd measured value, therefore for a part of irradiation area of the one of only irradiating in the 1st light pattern or the 2nd light pattern, what produce data lacks part.
So, in the technical program, for the full illumination region that two light patterns all irradiate, the altitude information of being specified by the 1st measured value and the 2nd measured value is obtained as the altitude information in this full illumination region, on the other hand, for a part of irradiation area of the one of only irradiating in the 1st light pattern or the 2nd light pattern, according to the altitude information of the measured value in above-mentioned full illumination region, calculate supplementary data, then, the 1st measured value of above-mentioned a part of irradiation area or the striped number of times of the 2nd measured value is specified according to it, altitude information relevant as this part of irradiation area for altitude information corresponding for the 1st measured value or the 2nd measured value to this striped number of times is obtained.
Thus, be much less the 2 full illumination regions all irradiated for the 1st light pattern and the 2nd light pattern, and for a part of irradiation area of the one of only irradiating in two light patterns, also can obtain more high-precision altitude information.
In addition, if the shape comprised at a part of irradiation area is more smooth shape, therefore also consider that the supplementary data obtained carrying out linear supplementary grade is used as the relevant altitude information of this part of irradiation area same as before, but, not only a part of irradiation area of the measuring object of solder(ing) paste etc. must be such shape, but also consider to be such as, there is the concaveconvex shape comparatively risen and fallen, thus, same for this part of irradiation area, from obtaining more close to the aspect of actual value, best, adopt measured value (altitude information corresponding with the 1st measured value of striped number of times of regulation or the 2nd measured value) same as before.
Technical scheme 3 relates to the three-dimensional measuring apparatus according to technique scheme 2, it is characterized in that, in the vertical view watched from the shooting direction (basic vertical direction) along above-mentioned image mechanism, above-mentioned 1st irradiation means and the 2nd irradiation means be arranged at clamping above-mentioned measured object and faced by position.
According to technique scheme 3, the danger of the part of all non-irradiated shade of any person in generation the 1st light pattern and the 2nd light pattern can be reduced, more positively can realize the action effect of technique scheme 2.
Technical scheme 4 relates to the three-dimensional measuring apparatus according to technique scheme 2, it is characterized in that, there is 2 groups of above-mentioned 1st irradiation means and the 2nd irradiation means respectively, from the vertical view that the shooting direction along above-mentioned image mechanism is watched, centered by above-mentioned measured object, above-mentioned 1st irradiation means and the 2nd irradiation means are alternately arranged according to 90 ° of intervals.
According to technique scheme 4, such as, as technique scheme 3, comprise the 1st irradiation means faced by 2 groups and the 2nd irradiation means, with centered by measured object according to compared with 90 ° of spaced schemes, the ratio of a part of irradiation area only irradiating the one in the 1st light pattern or the 2nd light pattern can be reduced with doing one's utmost.Consequently, the higher measurement of precision can be carried out.
Accompanying drawing explanation
Fig. 1 is the surface structure skeleton view representing base board checking device in a schematic way;
Fig. 2 is the block scheme of the circuit structure representing base board checking device;
Fig. 3 is the figure of the relation of the resolution or measured altitude information etc. representing each light pattern;
Fig. 4 is the side schematic view representing the state of from each lighting device, solder(ing) paste being irradiated to each light pattern;
Fig. 5 represents the solder(ing) paste of state and the floor map of its periphery that have irradiated each light pattern;
Fig. 6 demarcates to the altitude information in the full illumination region along the K-K line section in Fig. 5 the figure drawn;
Fig. 7 demarcates and the figure of drawing modification the supplementary data of a part of irradiation area along the K-K line section in Fig. 5;
The altitude information of a part of irradiation area that Fig. 8 specifies for the supplementary data according to Fig. 7 carries out demarcating and the figure drawn;
Fig. 9 demarcates to the altitude information along the K-K line section in Fig. 5 the figure drawn;
Figure 10 is the floor map arranging structure of the lighting device representing another embodiment;
Figure 11 is the floor map arranging structure of the lighting device representing an also embodiment.
Embodiment
With reference to the accompanying drawings, an embodiment is described.
Fig. 1 is the appearance assumption diagram of the base board checking device 1 representing the three-dimensional measuring apparatus with present embodiment in a schematic way.Shown in this figure, base board checking device 1 comprises loading stage 3, and it is for loading the printed circuit board (PCB) 2 as the measured object being printed with the solder(ing) paste (with reference to Fig. 4 etc.) forming measuring object; Two lighting devices (as the 1st lighting device 4A of the 1st irradiation means, with as the 2nd lighting device 4B of the 2nd lighting mechanism), it is for irradiating the light pattern of regulation to the surface of printed circuit board (PCB) 2 from oblique upper; As the camera 5 of image mechanism, it is for making a video recording to the above-mentioned illuminated part on printed circuit board (PCB) 2; Control device 6, it is for carrying out various controls in base board checking device 1, image procossing, calculation process.Control device 6 forms the image procossing mechanism of present embodiment.
Each lighting device 4A, 4B comprise known liquid crystal optics shutter, can irradiate the light pattern of the striated that phase place changes according to 1/4th spacing at every turn from oblique upper.In the present embodiment, the mode that light pattern irradiates along X-direction according to the mode parallel with an opposite side of rectangular-shaped printed circuit board (PCB) 2 sets.That is, the striped of light pattern and X-direction perpendicular, and to irradiate abreast with Y direction.
In addition, each lighting device 4A, 4B from along plane viewing (X-Y plane) of watching as the basic vertical direction (Z-direction) in the shooting direction of camera 5, be arranged at clamping printed circuit board 2 and faced by position.Here, the position arranging the 1st lighting device 4A is equivalent to the 1st position of present embodiment, and the position arranging the 2nd lighting device 4B is equivalent to the 2nd position.
Further, each lighting device 4A, 4B of present embodiment are formed according to the mode can irradiating the different light pattern of fringe spacing (cycle) respectively.More particularly, the 1st lighting device 4A is that the mode of the 1st light pattern of 600 μm is formed according to exposure period, and the 2nd lighting device 4B is that the mode of the 2nd light pattern of 800 μm is formed according to exposure period.In the present embodiment, 600 μm were equivalent to for the 1st cycle, and 800 μm corresponded to for the 2nd cycle.
Thus, by the 1st light pattern, as shown in Figure 3, such as be called "-300 (μm) ", "-200 (μm) ", "-100 (μm) " according to measuring object point ... mode, be positioned at the height of the scope of "-300 (μm) " ~ "+300 (μm) " according to the precision measure of " 100 (μm) " scale.In addition, "+300 (μm) " is equivalent to "-300 (μm) " of the striped number of times of more than 1.
On the other hand, by the 2nd light pattern, be called such as according to measuring object point, "-400 (μm) ", "-300 (μm) ", the mode of "-200 (μm) ", according to the precision of " 100 (μm) " scale, measures the height being positioned at the scope of "-400 (μm) " ~ "+400 (μm) ".In addition, "+400 (μm) " is equivalent to "-400 (μm) " in the striped number of times of more than 1.
Further, in each lighting device 4A, 4B, the light from not shown light source to be led a pair collector lens by optical fiber, forms directional light here.This directional light is via liquid crystal cell, and guiding is arranged at the projecting lens of the inside of thermostatically-controlled equipment.Then, the light pattern of 4 phase place changes is irradiated from projecting lens.Like this, each lighting device 4A, 4B adopt liquid crystal optics shutter, thus, in the occasion of the light pattern of making striated, obtain its illumination close to desirable sine wave, and thus, the Measurement Resolution of three-dimensional measurement improves.In addition, the electric control of the phase shift of light pattern can be carried out, the densification of control system can be sought.
Loading stage 3 arranges motor 15,16, and this motor 15,16 is drived control by control device 6, and thus, the printed circuit board (PCB) 2 be loaded on loading stage 3 slides along arbitrary direction (X-direction and Y direction).
Camera 5 is made up of lens, image-forming component etc.Image-forming component adopts ccd sensor.Obviously, image-forming component is not limited to this, also can adopt such as cmos sensor etc.
Below the circuit structure of control device 6 is described.As shown in Figure 2, control device 6 CPU that comprises the control of the entirety of carrying out base board checking device 1 and the input media 22 of ' input mechanism ' that is made up of I/O Interface 21, keyboard, mouse or touch panel; The display device 23 with ' indication mechanism ' of display frame of CRT or liquid crystal etc.; For storing the image data storage apparatus 24 of the view data of the shooting based on camera 5; For storing the operation result memory storage 25 of various operation result; Prestore the setting data memory storage 26 of various information.In addition, each device 22 ~ 26 is electrically connected with CPU and I/O Interface 21.
Below the contents processing of the three-dimensional measurement undertaken by control device 6 is described.Control device 6 is drive control motor 15,16 first, and printed circuit board (PCB) 2 is moved, and the visual field of camera 5 is aimed at the inspection area E of the regulation on printed circuit board (PCB) 2.In addition, inspection area E is of a size of 1 unit with the visual field of camera 5, splits 1 region in the region behind the surface of printed circuit board (PCB) 2 in advance.
Here, control device 6 drived control the 1st lighting device 4A, starts the irradiation of the 1st light pattern (cycle is 600 μm), and each spacing according to 1/4th moves the phase place of the 1st light pattern, switches control 4 kinds irradiation successively.In addition, control device 6 is during the illumination of phase shifts carrying out the 1st light pattern like this, and drived control camera 5, makes a video recording to inspection area E part for each irradiation, obtain the view data of 4 picture amounts.
Control device 6 is according to the view data of acquired 4 picture amounts, carry out various image procossing, according to the known phase-shift method also described in the introduction, carry out the elevation carrection of each coordinate (pixel), this measured value is stored as the 1st measured value.Present treatment forms the function of the 1st measured value acquisition mechanism of present embodiment.
Then, control device 6 drived control the 2nd lighting device 4B, starts the irradiation that its cycle is greater than the 2nd light pattern (cycle is 800 μm) of the 1st light pattern, and at every turn according to 1/4th spacing, the phase place of mobile 2nd light pattern, switches control 4 kinds irradiation successively.In addition, control device 6 is like this, and during carrying out the illumination of the phase shifts of the 2nd light pattern, drived control camera 5, for each irradiation, makes a video recording to inspection area E part, obtain the view data of 4 picture amounts.
Control device 6 is according to the view data of acquired 4 picture amounts, carry out various image procossing, as described above, according to the known phase-shift method also described in the introduction, carry out the elevation carrection of each coordinate (pixel), this measured value is stored as the 2nd measured value.Present treatment forms the function of the 2nd measured value acquisition mechanism of present embodiment.
Then, control device 6 is for full illumination region WA1, WA2 (reference Fig. 4, Fig. 5), the altitude information of specifying according to above-mentioned 1st measured value and the 2nd measured value is obtained as the altitude information of this full illumination region WA1, WA2, in this full illumination region WA1, WA2, the 1st light pattern in the E of inspection area and the 2nd light pattern all illuminated, and above-mentioned 1st measured value and the 2nd both measured values can be obtained.Present treatment forms the function of the 1st altitude information acquisition mechanism of present embodiment.Fig. 4 represents the side schematic view from each lighting device 4A, 4B, the solder(ing) paste H forming measuring object being irradiated to the state of each light pattern, and Fig. 5 represents to have irradiated the solder(ing) paste H of the state of each light pattern and the floor map of its periphery.
Clear as the correspondence table also cited by Fig. 3, at the measuring object point for regulation, the value obtained as the 1st measured value such as, the occasion of "+100 (μm) ", "+100 (μm) " that be candidate for striped number of times " 1 " of the altitude information of this measuring object point, "+700 (μm) " of striped number of times " 2 ", or "+1300 (μm) " that be striped number of times " 3 ".
Here, about same measuring object point, the value obtained as the 2nd measured value is be such as the occasion of "-100 (μm) ", is appointed as "+700 (μm) " by the altitude information of this measuring object point.
But, about a part of irradiation area WB1 only having irradiated (not the having irradiation the 2nd light pattern) of the 1st light pattern in above-mentioned inspection area E, with a part of irradiation area WB2 of (not having irradiation the 1st light pattern) only having irradiated the 2nd light pattern, what form data respectively lacks part (between the A-A ' in Fig. 6, between the B-B ' in Fig. 6).Fig. 6 carries out demarcating the figure drawn to the altitude information of full illumination region WA1, WA2 along the K-K line section in Fig. 5.
Then, according to the altitude information of above-mentioned full illumination region WA1, WA2, the supplementary data relating to above-mentioned a part of irradiation area WA1, WA2 is obtained.This process forms the function of the supplementary data acquisition mechanism of present embodiment.
In the present embodiment, linearly supplement (with reference to Fig. 7) according to the mode of the following data of overlooking in direction of illumination (left and right directions of Fig. 5) connecting the 1st light pattern or the 2nd light pattern respectively, these data are: altitude information A, A of contacting full illumination region WA1, the WA2 at the two ends of a part of irradiation area WB1 (data lack part) ', contact full illumination region WA1, the WA2 at the two ends of a part of irradiation area WB2 altitude information B, B '.Fig. 7 carries out demarcating the figure drawn to the supplementary data of a part of irradiation area WB1, WB2 along the K-K line section in Fig. 5.
Then, according to the above-mentioned supplementary data relating to a part of irradiation area WB1, specify the 1st measured value striped number of times that this part of irradiation area WB1 is relevant, altitude information relevant as this part of irradiation area WB1 for altitude information corresponding for the 1st measured value to this striped number of times is obtained (with reference to Fig. 8).Equally, according to the supplementary data of a part of irradiation area WB2, the striped number of times of the 2nd measured value of specifying this part of irradiation area WB2 to be correlated with, obtains altitude information corresponding for the 2nd measured value with this striped number of times as the altitude information of this part of irradiation area WB2 (with reference to Fig. 8).These process form the function of the 2nd altitude information acquisition mechanism of present embodiment.The altitude information that Fig. 8 is a part of irradiation area WB1, WB2 of specifying the supplementary data according to Fig. 7 carries out demarcating the figure drawn.
In the present embodiment, closest to regulation measuring object point supplementary data striped number of times (comprising the striped number of times of the scope of supplementary data) as this measuring object point striped number of times and specify.
Such as, the supplementary data that the measuring object point of the regulation in the part irradiation area region of the 1st light pattern (only irradiate) WB1 is relevant be the occasion of "+1050 (μm) ", and the striped number of times of the 1st measured value of being correlated with by this measuring object point is appointed as " 3 " (reference Fig. 3).
At this, such as about above-mentioned measuring object point, the value obtained as the 1st measured value is such as the occasion of "-100 (μm) ", and the altitude information of this measuring object point being appointed as striped number of times is the value "+1100 (μm) " that the 1st measured value of " 3 " is corresponding.
If above-mentioned a series of process terminates, then the measurement data in visual field entirety (Zone Full of inspection area E) of making a video recording completes (with reference to Fig. 9).Fig. 9 carries out demarcating the figure drawn to the altitude information along the K-K line section in Fig. 5.
The measurement data of each inspection area E obtained like this is stored in the operation result memory storage 25 of control device 6.Then, according to the measurement data of each inspection area E, detect the print range of the solder(ing) paste H higher than reference field, Integral Processing is carried out to the height at each position within the scope of this, thus, calculate the amount of the solder(ing) paste H printed.Then, the data of the position of the solder(ing) paste H obtained like this, area, height or amount etc. and the reference data be pre-stored within setting data memory storage 26 are compared judgement, according to this comparative result whether in allowed band, judge that whether the printing state of the solder(ing) paste H of this inspection area E is good.
During carrying out above-mentioned process, control device 6 drive control motor 15,16, shifts to follow-on check region E by printed circuit board (PCB) 2, and then, above-mentioned a series of process is carried out repeatedly at whole inspection area E.
Like this, in the base board checking device 1 of present embodiment, while the mobile inspection area E of control by control device 6, carry out image procossing successively, thus, carry out the three-dimensional measurement of the elevation carrection of the solder(ing) paste H be included on printed circuit board (PCB) 2, at a high speed can positively check the printing state of solder(ing) paste H.
If as specifically described above, adopt present embodiment, the effect of following 2 can be obtained: as adopt the characteristic of the 2nd light pattern in longer cycle, can measurable altitude range be increased; And utilize adopt the characteristic of the 1st light pattern in shorter cycle, the high high-precision measurement of resolution can be realized.Consequently, high-resolution measurement can be carried out in wider dynamic range, more high-precision measurement can be realized.
Particularly, in the present embodiment, about the full illumination region WA1 that two light patterns all irradiate, WA2, using the altitude information of specifying according to the 1st measured value and the 2nd measured value as this full illumination region WA1, the altitude information of WA2 and obtaining, on the other hand, about a part of irradiation area WB1 of the one of only irradiating in the 1st light pattern or the 2nd light pattern, WB2, according to full illumination region WA1, the altitude information of WA2 calculates supplementary data, then, a part of irradiation area WB1 is specified according to it, 1st measured value of WB2 or the striped number of times of the 2nd measured value, using altitude information corresponding for the 1st measured value or the 2nd measured value with this striped number of times as this part of irradiation area WB1, the altitude information of WB2 and obtaining.
Thus, much less full illumination region WA1, WA2 about irradiation the 1st light pattern and the 2nd both light patterns are, equally for a part of irradiation area WB1, WB2 of the one of only irradiating in two light patterns, can obtain more high-precision altitude information.
In addition, if a part of irradiation area WB1, the shape comprised in WB2 is more smooth shape, the supplementary data obtained as linear supplementary grade is then also considered to be used as this part of irradiation area WB1 same as before, the altitude information of WB2, but, due to a part of irradiation area WB1 of solder(ing) paste H, WB2 not only one is decided to be such shape, also the concaveconvex shape in such as comparatively rising and falling is considered, therefore it is same about this part of irradiation area WB1, WB2, from obtaining more close to the aspect of the value of real value, best, adopt measured value (altitude information corresponding with the 1st measured value of striped number of times of regulation or the 2nd measured value) as former state.
Also have, in the present embodiment, each lighting device 4A, 4B from along the vertical view (X-Y plane) watched as the basic vertical direction (Z-direction) in the shooting direction of camera 5, be arranged at clamping printed circuit board 2 and faced by position.Thus, the danger of the part of all non-irradiated shade of any person in generation the 1st light pattern and the 2nd light pattern can be reduced, can more positively realize above-mentioned action effect.
Further, be not limited to the contents of above-mentioned embodiment, also can such as, implement as following.Obviously, other the example application do not enumerated below, change example are also possible certainly.
A () in the above-described embodiment, specific implementation three-dimensional measuring apparatus in the base board checking device 1 of the height of the solder(ing) paste H on printed circuit board (PCB) 2 is formed in measurement printing, but, be not limited to this, also can measure the solder ball that such as be printed on substrate or be installed on electron device on substrate etc. other parts height scheme in specific implementation.
B () in the above-described embodiment, the 2nd light pattern of 800 μm combines to list the cycle that to be the 1st light pattern of 600 μm and cycle be, carry out the example of the occasion of measurement when highly arriving 1500 μm, but cycle, the measurement range of obvious each light pattern are not limited to this.Also can such as, the formation cycle of the 1st light pattern is shorter (such as 400 μm), in the scope of the striped number of times of the 1st light pattern more than 4, can carry out the scheme measured.
Here, by the difference in the cycle in cycle and the 2nd light pattern of reducing the 1st light pattern further, the precision of a part of irradiation area WB1 of the 1st light pattern is only irradiated in further reduction, with the difference of precision of a part of irradiation area WB2 of only irradiating the 2nd light pattern.
C () in the above-described embodiment, is formed from both direction to printed circuit board (PCB) 2, the scheme of 2 kinds of light patterns that exposure period is different.But be not limited to this, also can form the scheme of the light pattern of more than 3 kind different to printed circuit board (PCB) 2 exposure period from 3 directions.
Obviously, be not only only a kind, 1 direction, also can form the scheme of the light pattern irradiating (same period) of the same race from multiple directions.Such as, also can be formed as above-mentioned embodiment, there are the 1st lighting device 4A arranged in the face of ground of 2 groups and the 2nd lighting device 4B, these 4 lighting device 4A and lighting device 4B centered by printed circuit board (PCB) 2, according to 90 ° of spaced schemes (with reference to Figure 10).
But, in this scenario, also there is the danger that the region of any one (oblique line portion with reference to Figure 10) in the 1st light pattern or the 2nd light pattern is only irradiated in generation.
This situation relatively, also can be formed such as, each two ground have the 1st lighting device 4A and the 2nd lighting device 4B respectively, and the 1st lighting device 4A and the 2nd lighting device 4B is centered by printed circuit board (PCB) 2, according to the scheme that 90 ° of intervals are alternately arranged, that is, formed two the 1st lighting device 4A according to faced by mode arrange, and two the 2nd lighting device 4B according to faced by the scheme (with reference to Figure 11) that arranges of mode.
By the program, compared with the scheme cited by above-mentioned Figure 10, can reduce to produce the ratio of only irradiating the region of any one in the 1st light pattern, the 2nd light pattern with doing one's utmost.Consequently, the higher measurement of precision can be carried out.
D () in the above-described embodiment, an opposite side of the printed circuit board (PCB) 2 of each light pattern and rectangle irradiates along X-direction abreast.That is, form the striped of light pattern and X-direction perpendicular, and the scheme of irradiating abreast with Y direction.Be not limited to this, also can be formed such as, the scheme that the striped of light pattern irradiates according to each limit mode that (such as from planar tilt 45 degree) intersects obliquely with the printed circuit board (PCB) 2 of rectangle, the shooting visual field (inspection area E) of camera 5.
E () in the above-described embodiment, form multiple lighting device 4A, 4B centered by printed circuit board (PCB) 2, the scheme arranged equally spacedly is watched from plane, but, multiple lighting device 4A, 4B need not be arranged equally spacedly, and the setting of each lighting device 4A, 4B still may correspond to the scheme etc. in printed circuit board (PCB) 2 and at random sets.
F () in the above-described embodiment, when being formed in the supplementary data obtaining a part of irradiation area WB1, WB2, according to the altitude information of full illumination region WA1, WA2, carries out linear scheme of supplementing.But the preparation method of supplementary data is not limited to this, the scheme of being undertaken by other method also can be formed.
G () in the above-described embodiment, form following structure, namely, when specifying the supplementary data of a part of irradiation area WB1, WB2 according to supplementary data, the striped number of times that the striped number of times (comprising the striped number of times of the scope of supplementary data) of supplementary data of being correlated with of the measuring object point closest to regulation is correlated with as this measuring object point and the scheme of specifying.Specify the method for the striped number of times of the measured value of a part of irradiation area WB1, WB2 to be not limited to this, also can form the scheme of being undertaken by other method.Also can be formed such as, calculate the mean value of the supplementary data in the regulation region that is made up of the multiple measuring object points (pixel) adjoined, using the striped number of times (comprising the striped number of times of the scope of this mean value) closest to this mean value as the striped number of times in this regulation region the scheme of specifying.
Claims (4)
1. a three-dimensional measuring apparatus, this three-dimensional measuring apparatus comprises:
Multiple irradiation means, it can irradiate multiple light pattern from different positions to measured object respectively, and the plurality of light pattern has the light intensity distributions of striated, and the cycle is different;
Image mechanism, it can be made a video recording to the above-mentioned measured object irradiating above-mentioned light pattern; And
Image procossing mechanism, it carries out three-dimensional measurement according to the view data of being taken by above-mentioned image mechanism;
It is characterized in that, above-mentioned image procossing mechanism comprises:
Measured value obtains mechanism, it is according to multiple view data, three-dimensional measurement is carried out by phase-shift method, obtained as the relevant measured value of above-mentioned light pattern by this measured value, above-mentioned multiple view data is relevant to: the above-mentioned light pattern taken by above-mentioned image mechanism after irradiating the above-mentioned light pattern that phase place repeatedly changes respectively;
1st altitude information obtains mechanism, and it is for the full illumination region of above-mentioned multiple light pattern full illumination, the altitude information that the altitude information of being specified by the above-mentioned measured value of being correlated with by above-mentioned multiple light pattern is relevant as this full illumination region and obtaining;
Supplementary data obtains mechanism, and it is according to the altitude information in above-mentioned full illumination region, obtains the supplementary data that a part of irradiation area of a part of only irradiating in above-mentioned multiple light pattern is relevant; And
2nd altitude information obtains mechanism, it is according to above-mentioned supplementary data, the striped number of times of the above-mentioned measured value of specifying above-mentioned a part of irradiation area to be correlated with, obtains altitude information relevant as this part of irradiation area for the altitude information corresponding to the measured value of this striped number of times.
2. a three-dimensional measuring apparatus, this three-dimensional measuring apparatus comprises:
1st irradiation means, it can irradiate the 1st light pattern in the 1st cycle to measured object from the 1st position, the 1st light pattern in the 1st cycle has the light intensity distributions of striated;
2nd irradiation means, it can from being different from the 2nd position of above-mentioned 1st position to the 2nd light pattern in measured object the 2nd cycle of irradiation, and the 2nd light pattern in the 2nd cycle has the light intensity distributions of striated and is greater than above-mentioned 1st cycle;
Image mechanism, it can be made a video recording to the above-mentioned measured object irradiating above-mentioned light pattern; And
Image procossing mechanism, it carries out three-dimensional measurement according to the view data of being taken by above-mentioned image mechanism;
It is characterized in that, above-mentioned image procossing mechanism comprises:
1st measured value obtains mechanism, it carries out three-dimensional measurement according to multiple view data by phase-shift method, is obtained by this measured value as the 1st measured value, above-mentioned 1st light pattern that the plurality of view data repeatedly changes by irradiating phase place, takes with above-mentioned image mechanism and obtains;
2nd measured value obtains mechanism, it carries out three-dimensional measurement according to multiple view data by phase-shift method, is obtained by this measured value as the 2nd measured value, above-mentioned 2nd light pattern that the plurality of view data repeatedly changes by irradiating phase place, takes with above-mentioned image mechanism and obtains;
1st altitude information obtains mechanism, and its full illumination region all irradiated for above-mentioned 1st light pattern and above-mentioned 2nd light pattern, obtains the altitude information of being specified by above-mentioned 1st measured value and above-mentioned 2nd measured value as the altitude information in this full illumination region;
Supplementary data obtains mechanism, and it is according to the altitude information in above-mentioned full illumination region, obtains the supplementary data that a part of irradiation area of the only one of irradiating in above-mentioned 1st light pattern or above-mentioned 2nd light pattern is relevant; And
2nd altitude information obtains mechanism, it is according to above-mentioned supplementary data, above-mentioned 1st measured value of specifying above-mentioned a part of irradiation area to be correlated with or the striped number of times of the 2nd measured value, obtain altitude information relevant as this part of irradiation area for altitude information corresponding for the 1st measured value or the 2nd measured value to this striped number of times.
3. three-dimensional measuring apparatus according to claim 2, is characterized in that, in the vertical view watched from the shooting direction along above-mentioned image mechanism, above-mentioned 1st irradiation means and the 2nd irradiation means be arranged at clamping above-mentioned measured object and faced by position.
4. three-dimensional measuring apparatus according to claim 2, it is characterized in that, there is 2 groups of above-mentioned 1st irradiation means and the 2nd irradiation means respectively, from the vertical view that the shooting direction along above-mentioned image mechanism is watched, centered by above-mentioned measured object, above-mentioned 1st irradiation means and the 2nd irradiation means are alternately arranged according to 90 ° of intervals.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011251171A JP5709009B2 (en) | 2011-11-17 | 2011-11-17 | 3D measuring device |
JP2011-251171 | 2011-11-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103123255A CN103123255A (en) | 2013-05-29 |
CN103123255B true CN103123255B (en) | 2015-11-25 |
Family
ID=48222211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210172459.0A Active CN103123255B (en) | 2011-11-17 | 2012-05-25 | Three-dimensional measuring apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US8693007B2 (en) |
JP (1) | JP5709009B2 (en) |
CN (1) | CN103123255B (en) |
DE (1) | DE102012217240B4 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9147102B2 (en) * | 2012-01-02 | 2015-09-29 | Camtek Ltd. | Method and system for measuring bumps based on phase and amplitude information |
JP5948496B2 (en) * | 2012-05-22 | 2016-07-06 | コー・ヤング・テクノロジー・インコーポレーテッド | Method for measuring the height of a three-dimensional shape measuring device |
JP2015099050A (en) * | 2013-11-18 | 2015-05-28 | セイコーエプソン株式会社 | Calibration method and shape measuring device |
JP5957575B1 (en) * | 2015-06-12 | 2016-07-27 | Ckd株式会社 | 3D measuring device |
TWI639021B (en) * | 2016-05-17 | 2018-10-21 | 南韓商Lg電子股份有限公司 | Mobile robot and method of controlling the same |
TWI653964B (en) * | 2016-05-17 | 2019-03-21 | Lg電子股份有限公司 | Mobile robot and its control method |
KR101917116B1 (en) * | 2016-05-17 | 2018-11-09 | 엘지전자 주식회사 | Robot cleaner |
CN207979622U (en) * | 2016-05-17 | 2018-10-19 | Lg电子株式会社 | Robot cleaner |
CN107271445B (en) * | 2017-05-16 | 2020-10-16 | 广州视源电子科技股份有限公司 | Defect detection method and device |
US20200408512A1 (en) * | 2018-03-16 | 2020-12-31 | Nec Corporation | Three-dimensional shape measuring apparatus, three-dimensional shape measuring method, program, and storage medium |
JP7090447B2 (en) * | 2018-03-22 | 2022-06-24 | 株式会社キーエンス | Image processing equipment |
JP7090446B2 (en) * | 2018-03-22 | 2022-06-24 | 株式会社キーエンス | Image processing equipment |
JP2020046326A (en) * | 2018-09-20 | 2020-03-26 | 株式会社Screenホールディングス | Three-dimensional shape measuring device and three-dimensional shape measuring method |
JP2021076531A (en) * | 2019-11-12 | 2021-05-20 | Juki株式会社 | Three-dimensional measuring device and three-dimensional measuring method |
CN114930119B (en) * | 2020-04-16 | 2024-07-12 | 雅马哈发动机株式会社 | Measuring device, inspection device, and surface mounting machine |
WO2023059618A1 (en) | 2021-10-07 | 2023-04-13 | Additive Monitoring Systems, Llc | Structured light part quality monitoring for additive manufacturing and methods of use |
CN116295046B (en) * | 2023-02-20 | 2023-12-19 | 上海赫立智能机器有限公司 | Method for measuring height of circuit board-mounted component in shape like Chinese character' hui |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001349710A (en) * | 2000-06-08 | 2001-12-21 | Ckd Corp | Three-dimensional measuring device |
CN1947153A (en) * | 2003-12-12 | 2007-04-11 | 斯皮德莱技术公司 | Systems and methods for detecting defects in printed solder paste |
JP2009250771A (en) * | 2008-04-04 | 2009-10-29 | Toshiba Corp | Size measuring method, mask manufacturing method, and size measuring device |
CN101726261A (en) * | 2008-10-13 | 2010-06-09 | 株式会社高永科技 | Apparatus and method for measuring three dimension shape using multi-wavelength |
CN101782525A (en) * | 2009-01-14 | 2010-07-21 | Ckd株式会社 | Three-dimensional measurement device |
CN101782375A (en) * | 2009-01-20 | 2010-07-21 | Ckd株式会社 | Three-dimensional measuring device |
JP2010181299A (en) * | 2009-02-06 | 2010-08-19 | Ckd Corp | Three-dimensional measuring instrument |
CN101889190A (en) * | 2007-08-08 | 2010-11-17 | Ckd株式会社 | Three-dimensional measurement device and board inspecting machine |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719825A (en) * | 1993-06-23 | 1995-01-20 | Sharp Corp | Substrate inspection apparatus |
JP3922784B2 (en) * | 1998-01-27 | 2007-05-30 | 松下電工株式会社 | 3D shape measuring device |
US6956963B2 (en) * | 1998-07-08 | 2005-10-18 | Ismeca Europe Semiconductor Sa | Imaging for a machine-vision system |
JP2001159510A (en) * | 1999-12-01 | 2001-06-12 | Matsushita Electric Ind Co Ltd | Three-dimensional shape measuring method and its device |
JP4090860B2 (en) * | 2002-12-12 | 2008-05-28 | オリンパス株式会社 | 3D shape measuring device |
JP4289893B2 (en) * | 2003-01-21 | 2009-07-01 | 株式会社ニッケ機械製作所 | Appearance measuring device |
JP4077754B2 (en) * | 2003-04-04 | 2008-04-23 | オリンパス株式会社 | 3D shape measuring device |
JP2005233780A (en) * | 2004-02-19 | 2005-09-02 | Olympus Corp | Height measuring method and apparatus therefor |
JP2006084286A (en) * | 2004-09-15 | 2006-03-30 | Olympus Corp | Three-dimensional measuring method and its measuring device |
DE102004052199A1 (en) * | 2004-10-20 | 2006-04-27 | Universität Stuttgart | Optical strip projection-triangulation device for three-dimensional acquisition of e.g. face of people, has pupils for laminar illumination with structured electromagnetic radiation and for laminar detection |
JP4670341B2 (en) * | 2004-12-22 | 2011-04-13 | パナソニック電工株式会社 | Three-dimensional shape measurement method, three-dimensional shape measurement device, and three-dimensional shape measurement program |
US7830528B2 (en) * | 2005-12-14 | 2010-11-09 | Koh Young Technology, Inc. | 3D image measuring apparatus and method thereof |
JP2007192623A (en) * | 2006-01-18 | 2007-08-02 | Tani Electronics Corp | Device and method for inspecting cream solder printed state of printed circuit board |
US7545512B2 (en) * | 2006-01-26 | 2009-06-09 | Koh Young Technology Inc. | Method for automated measurement of three-dimensional shape of circuit boards |
JP5123522B2 (en) * | 2006-12-25 | 2013-01-23 | パナソニック株式会社 | 3D measurement method and 3D shape measurement apparatus using the same |
JP4873485B2 (en) * | 2007-05-11 | 2012-02-08 | 国立大学法人 和歌山大学 | Shape measuring method and shape measuring apparatus using a number of reference surfaces |
WO2009094510A1 (en) * | 2008-01-25 | 2009-07-30 | Cyberoptics Corporation | Multi-source sensor for three-dimensional imaging using phased structured light |
DE102009015204A1 (en) * | 2009-03-26 | 2010-10-07 | Leuze Electronic Gmbh & Co Kg | Optical sensor i.e. distance sensor, for use in area of automatic control engineering to measure three-dimensional distance of object, has evaluation unit provided for evaluating output signals of surface camera |
DE102010064593A1 (en) * | 2009-05-21 | 2015-07-30 | Koh Young Technology Inc. | Form measuring device and method |
JP5256251B2 (en) * | 2009-07-03 | 2013-08-07 | コー・ヤング・テクノロジー・インコーポレーテッド | Inspection method of measurement object |
JP2011064482A (en) * | 2009-09-15 | 2011-03-31 | Kurabo Ind Ltd | Device and method of high-speed three-dimensional measurement |
JP4797109B2 (en) * | 2010-03-26 | 2011-10-19 | Necエンジニアリング株式会社 | Three-dimensional shape measuring apparatus and three-dimensional shape measuring method |
US8855403B2 (en) * | 2010-04-16 | 2014-10-07 | Koh Young Technology Inc. | Method of discriminating between an object region and a ground region and method of measuring three dimensional shape by using the same |
-
2011
- 2011-11-17 JP JP2011251171A patent/JP5709009B2/en active Active
-
2012
- 2012-05-25 CN CN201210172459.0A patent/CN103123255B/en active Active
- 2012-07-27 US US13/559,881 patent/US8693007B2/en active Active
- 2012-09-25 DE DE102012217240.8A patent/DE102012217240B4/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001349710A (en) * | 2000-06-08 | 2001-12-21 | Ckd Corp | Three-dimensional measuring device |
CN1947153A (en) * | 2003-12-12 | 2007-04-11 | 斯皮德莱技术公司 | Systems and methods for detecting defects in printed solder paste |
CN101889190A (en) * | 2007-08-08 | 2010-11-17 | Ckd株式会社 | Three-dimensional measurement device and board inspecting machine |
JP2009250771A (en) * | 2008-04-04 | 2009-10-29 | Toshiba Corp | Size measuring method, mask manufacturing method, and size measuring device |
CN101726261A (en) * | 2008-10-13 | 2010-06-09 | 株式会社高永科技 | Apparatus and method for measuring three dimension shape using multi-wavelength |
CN101782525A (en) * | 2009-01-14 | 2010-07-21 | Ckd株式会社 | Three-dimensional measurement device |
CN101782375A (en) * | 2009-01-20 | 2010-07-21 | Ckd株式会社 | Three-dimensional measuring device |
JP2010181299A (en) * | 2009-02-06 | 2010-08-19 | Ckd Corp | Three-dimensional measuring instrument |
Also Published As
Publication number | Publication date |
---|---|
DE102012217240A1 (en) | 2013-05-23 |
CN103123255A (en) | 2013-05-29 |
DE102012217240B4 (en) | 2016-10-06 |
US20130128282A1 (en) | 2013-05-23 |
JP2013104858A (en) | 2013-05-30 |
JP5709009B2 (en) | 2015-04-30 |
US8693007B2 (en) | 2014-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103123255B (en) | Three-dimensional measuring apparatus | |
KR101118195B1 (en) | Three-dimensional measurement device | |
CN103162641B (en) | Three-dimensional measuring apparatus | |
KR101152842B1 (en) | Three-dimensional measurement device and board inspecting machine | |
KR101121691B1 (en) | Three-dimensional measurement device | |
CN103162642B (en) | Three-dimensional measuring apparatus | |
CN101893428B (en) | Shape measurement apparatus and method | |
CN100491909C (en) | Three-dimensional measuring apparatus | |
CN101943571B (en) | Board inspection apparatus and method | |
CN208795188U (en) | A kind of structured light binocular vision detection system | |
US9417053B2 (en) | Three-dimensional measuring device | |
KR20130137660A (en) | Three-dimensional measuring apparatus | |
CN202255299U (en) | Solder paste thickness testing device | |
WO2020065850A1 (en) | Three-dimensional measuring device | |
TW201643371A (en) | Three-dimensional measurement device | |
CN106546193A (en) | A kind of high reflection body surface three-dimensional measuring method and system | |
JP4947559B2 (en) | 3D measuring device | |
CN102052907A (en) | BGA (ball grid array) coplanarity measuring system based on projection Moire principle | |
JP2013172038A (en) | Component mounting device, imaging device and imaging method | |
KR20150111944A (en) | System for determining a three-dimensional image of an electric circuit | |
Wu et al. | A parallel-structure solder paste inspection system | |
JP2002081924A (en) | Three-dimensional measuring device | |
JP6847088B2 (en) | Projection device and 3D measuring device | |
JP2020091203A (en) | Projection device and three-dimensional measuring device | |
KR19980030777A (en) | Soldering Height Inspection Device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |