CN103117968A - Wireless communication compensation method based on inductive coupling - Google Patents
Wireless communication compensation method based on inductive coupling Download PDFInfo
- Publication number
- CN103117968A CN103117968A CN2013100283152A CN201310028315A CN103117968A CN 103117968 A CN103117968 A CN 103117968A CN 2013100283152 A CN2013100283152 A CN 2013100283152A CN 201310028315 A CN201310028315 A CN 201310028315A CN 103117968 A CN103117968 A CN 103117968A
- Authority
- CN
- China
- Prior art keywords
- channels
- compensation
- passage
- group
- compensation channels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Near-Field Transmission Systems (AREA)
Abstract
The invention belongs to the technical field of three-dimensional chip stacking, and discloses a wireless communication compensation method based on inductive coupling. The method includes the following steps: step 1, dividing inductance channel array into a first group of channels and a second group of channels; step 2, controlling the first group of channels as signal transmission channels and the second group of channels as compensation channels in a rising edge of a clock, and controlling the second group of channels as the signal transmission channels and the first group of channels as the compensation channels in a falling edge of a clock; step 3, transmitting data 1 from the compensation channels when the number of data 0 transmitted by the signal transmission channels is greater than the number of data 1, and transmitting data 0 from the compensation channels when the number of data 1 transmitted by the signal transmission channels is greater than the number of data 0. After number compensation, the number of 0 is equal to the number of 1 in inductance channel array with evenly distribution; condition that the number of 0 or the number of 1 is so large that signal 1 or signal 0 is covered, error rate is reduced and communication effectiveness is guaranteed.
Description
Technical field
The invention belongs to three-dimensional chip Stack Technology field, more specifically, relate to a kind of radio communication compensation method based on inductance coupling high.
Background technology
The development of integrated circuit production technology and integrated circuit (IC) design technology makes people can realize more function on the same chip, even integrated whole system, namely usually said system level chip (System on Chip, SOC).SOC improves rapidly chip integration, and system cost reduces rapidly, and electronic equipment is more intelligent, but also makes chip size become increasing simultaneously, and design becomes increasingly complex.The more important thing is, existing technology can't effectively integrate the isomery functional module, as processor and dynamic random access memory etc.
Because there are some such problems in SOC, the researcher develops the stacking system integration mode of three-dimensional chip, and different functional parts is designed respectively and produces by corresponding requirements, and then with these chip-stacked three-dimensional structures that forms together.Three-dimensional chip is stacking has solved many problems that SOC exists, and makes level of integrated system further improve, and is the important development direction of chip design art and system integration technology from now on.Realize that three-dimensional chip is stacking, need to solve many relevant issues, the most important thing is wherein how the chip that these are stacking couples together, and the performance of interconnection technique will directly affect the performance of whole pile system.Interconnection technique is the key technology that realizes three-dimensional stacked system.
Wireless interconnection technology is the unique and novel interconnection technique of a class, and the inductance coupling high interconnection technique is exactly wherein a kind of.The basic principle of inductance coupling high interconnection technique does not have direct metal to connect as shown in Figure 1 between chip, but utilizes the coupling inductance that is positioned on the levels chip to form interconnected.Its at the middle and upper levels chip need to carry out attenuate to chip thickness through reduction process, make the distance between coupling inductance enough little, the degree of coupling is enough large.For interconnection technique, usually pay close attention to several aspects such as its cost, reliability, the scope of application, speed, density and power consumption.
Compare other interconnection technique, the inductance coupling high interconnection technique has many merits at aspects such as cost, performances: first, the inductance coupling high interconnection technique uses chip manufacturing process, chip thinning technique and the stacked package technique of existing maturation, therefore realizes that cost is low, reliability is high; The second, because communication distance is short, and do not need the ESD circuit, so interconnect speeds is fast.The 3rd, with respect to capacitive coupling, the distance between the interconnected desired coupling inductance of inductance coupling high can be larger, so the levels chip do not need aspectant stackingly, and can realize the stacking of multi-chip, and design flexibility is high; The 4th, the inductance coupling high interconnection technique uses the current drives mode, compares other wireless interconnection technologys, as the capacitive coupling interconnection technique, can adapt to lower operating voltage and more advanced technique.
The inductance coupling high interconnection technique has low cost, high reliability, the characteristics such as high-speed, also has good design flexibility simultaneously, and further improves the interconnected performance of inductance coupling high, need to further investigate aspect two of interconnected high density and low-power consumption.So-called high density refers to realize more interconnecting channels on unit are, satisfies the demand of the larger bandwidth of system.
Foreign scholar and research institution have carried out many research work aspect the high density of inductance coupling high interconnection technique, but the domestic pertinent literature report of also not seeing.In fact, the coupling inductance size of single passage can be done very littlely, and the reason that affects channel density is mainly, and together the time, it is very large that the impact of disturbing between passage will become, and make the passage cisco unity malfunction, as shown in Figure 2 when the passage close-packed arrays.Therefore, effectively anti-interference method is the key that realizes high density interconnect.
Summary of the invention
For the defective of prior art, the object of the present invention is to provide a kind of radio communication compensation method based on inductance coupling high, be intended to solve the problem that causes realizing high density interconnect a little less than the antijamming capability of prior art.
For achieving the above object, the invention provides a kind of radio communication compensation method based on inductance coupling high, comprise the steps:
S1: the induction passage matrix is divided into first group of passage and second group of passage;
S2: controlling described first group of passage at rising edge clock is that signal transmission passage and described second group of passage are compensation channels; Controlling described second group of passage at the clock trailing edge is that signal transmission passage and described first group of passage are compensation channels;
S3: the number that sends data 0 when described signal transmission passage is during greater than 1 number, and described compensation channels sends data 1; The number that sends data 1 when described signal transmission passage is during greater than 0 number, and described compensation channels sends data 0.
Further, when described compensation channels is positioned at described induction passage matrix middle, by will be adjacent with compensation channels and four signal transmission passages of off-diagonal position in send 0 number and compare with 1 number, the number when 0 is during greater than 1 number, compensation channels transmission 1; Number when 0 is during less than 1 number, and compensation channels sends 0; When the number when 0 equaled 1 number, compensation channels is transmitted signal not.
Further, when compensation channels is positioned at the position at the edge of access matrix and non-angle, by will be adjacent with compensation channels and three signal transmission passages of off-diagonal position in send 0 number and compare with 1 number, the number when 0 is during greater than 1 number, compensation channels transmission 1; Number when 0 is during less than 1 number, and compensation channels sends 0.
Further, when compensation channels is positioned at the corner location of access matrix, by will be adjacent with compensation channels and two signal transmission passages of off-diagonal position in send 0 number and compare with 1 number, the number when 0 is during greater than 1 number, compensation channels transmission 1; Number when 0 is during less than 1 number, and compensation channels sends 0; When the number when 0 equaled 1 number, compensation channels is transmitted signal not.
The present invention is suitable through " 0 " and " 1 " number in the induction passage matrix after digital compensation, and be evenly distributed, the capped situation of " 1 " or " 0 " signal can not occur making wherein because " 0 " or " 1 " density is excessive, reduce the error rate, guarantee the validity of communication.
Description of drawings
Fig. 1 is the stacked structure schematic diagram of the three-dimensional chip that provides of prior art;
Fig. 2 is that the single inductance that provides of prior art is to the interference schematic diagram of adjacency channel;
Fig. 3 is the realization flow figure of a kind of radio communication compensation method based on inductance coupling high of providing of the embodiment of the present invention;
Fig. 4 is the induction passage matrix grouping schematic diagram that the embodiment of the present invention provides;
Fig. 5 is the induction passage matrix time division multiplexing grouping schematic diagram that the embodiment of the present invention provides;
Fig. 6 is that the idle passage that the embodiment of the present invention provides carries out the digital compensation schematic diagram to adjacency channel.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Active Compensation mechanism is that the transmitting terminal of its adjacency channel also produces a corresponding compensating signal, in order to the suffered interference of the receiving terminal of offsetting adjacency channel when passage sends data.Active Compensation needs to estimate more exactly the size of interference, and interference size and the factor analysis such as shapes of inductors size, technological parameter, channel pitch, make like this design become very complicated, especially problem becomes more outstanding in the ever-reduced situation of inductor size, makes the mode of Active Compensation be difficult to realize.
Time division multiplexing is that passage is divided into groups, and every group is operated in the different time periods, because only have one group of passage in work in a time period, so the interference that produces can reduce greatly.The two-phase time division multiplexing is divided into two groups with passage, can directly utilize two phase places of clock signal this moment, therefore the mode of two-phase realizes relatively simple, but the time-multiplexed problem of two-phase is also to be not enough to interference is reduced to acceptable degree, especially in the situation that inductor size further reduce; Four phase time division multiplexinges have been divided into four groups with passage, although can be reduced to interference acceptable degree this moment, the mode that implementation complexity is compared two-phase increases greatly, and has further limited the raising of speed.
The present invention is applied to two-phase time division multiplexing and digital compensation combination technology in the three-dimensional chip stacked package of inductance coupling high.Interchannel interference is the key factor that affects the wireless interconnected performance of inductance coupling high.The two-phase time division multiplexing is divided into the coupling inductance passage two groups of the arrangement that is interspersed, and every group is operated in the different periods, has reduced the generation of interchannel interference; Coordinate digital compensation mechanism, utilize idle passage to send compensating signal, make the quantity of " 0 " and " 1 " in access matrix substantially suitable, and be evenly distributed, further reduce the intensity of disturbing.Of the present inventionly realize that circuit is simple, less to the transmission speed restriction, effectively is reduced to enough low level with interference.
As shown in Figure 3, the radio communication compensation method based on inductance coupling high that provides of the embodiment of the present invention comprises the steps:
S1: the induction passage matrix is divided into first group of passage a and second group of passage b;
S2: controlling first group of passage a at rising edge clock is that signal transmission passage and second group of passage b are compensation channels; Controlling second group of passage b at the clock trailing edge is that signal transmission passage and first group of passage a are compensation channels;
S3: the number that sends data 0 when signal transmission passage is during greater than 1 number, and compensation channels sends data 1; The number that sends data 1 when signal transmission passage is during greater than 0 number, and compensation channels sends data 0.
Fig. 4 shows the grouping of induction passage matrix; Fig. 5 shows the grouping of induction passage matrix time division multiplexing; Fig. 6 shows idle passage adjacency channel is carried out digital compensation; Now details are as follows by reference to the accompanying drawings:
As signal transmission passage, second group of passage b is at rising edge clock passage by way of compensation at rising edge clock for first group of passage a; As signal transmission passage, first group of passage a is at clock trailing edge passage by way of compensation at the clock trailing edge for second group of passage b; When compensation channels b3 is positioned at access matrix middle, by will be adjacent with compensation channels and four signal transmission passage a1, a3 of off-diagonal position, a4, a5 in send 0 number and 1 number compares, number when 0 is during greater than 1 number, and compensation channels b3 sends 1; Number when 0 is during less than 1 number, and compensation channels b3 sends 0; When the number that sends 0 equaled 1 number, compensation channels b3 is transmitted signal not.When compensation channels b2 is positioned at the position at the edge of access matrix and non-angle, send 0 number and 1 number in three signal transmission passage a1, a2 by relatively more adjacent with compensation channels b2 and off-diagonal position, a4, number when 0 is during greater than 1 number, and compensation channels b2 sends 1; Number when 0 is during less than 1 number, and compensation channels b2 sends 0.When compensation channels b1 is positioned at the corner location of access matrix, send 0 number and 1 number in two signal transmission passage a1, a3 by relatively more adjacent with compensation channels b1 and off-diagonal position, number when 0 is during greater than 1 number, and compensation channels b1 sends 1; Number when 0 is during less than 1 number, and compensation channels b1 sends 0; When the number that sends 0 equaled 1 number, compensation channels b1 is transmitted signal not.
The radio communication compensation method based on inductance coupling high that the embodiment of the present invention provides is mainly used in the three-dimensional chip stacked package of inductance coupling high, disturbs in order to reduce the interchannel signal, improves efficiency of transmission.
The embodiment of the present invention is with two or multi-plate chip stacked package.Chip chamber is realized interconnected by metal inductance coupling on sheet.On-chip inductor generally adopts chip top layer and time top-level metallic to make, and inductor size and inter-chip pitch are comparable.A pair of transmission on the chip of up and down, receiving inductance are aimed in vertical direction, consist of a signalling channel.The high-frequency digital signal is converted into fast-changing electric current by drive circuit, the transmission inductance of flowing through; Send the magnetic flux change that inductance produces, produce the mutual inductance electric current at receiving inductance, after receiving circuit amplifies, restore digital signal.A plurality of induction passages are matrix form to be arranged, and utilizes two-phase time division multiplexing and digital compensation technology to reduce the mutual interference mutually that brings due to the inductance close-packed arrays.
The present invention combines the two-phase time division multiplexing with digital compensation mode on the one hand, utilizes the two-phase time division multiplexing to realize relatively simple, smaller to the restriction of speed characteristics; On the other hand, add the mechanism of " compensation ", " compensation " and " timesharing " acting in conjunction are reduced to enough low level with the impact of disturbing.The two-phase time division multiplexing is divided into two groups with passage, and the arrangement that is interspersed.When certain passage sends data " 0 ", and 4 adjacent channels on its diagonal are when sending data " 1 ", and the interference that produces of adjacent channel will have influence on the transmission of data " 0 " so.Notice, when one group of passage work, another group passage is in idle state, therefore, can utilize the passage that is in idle state to do digital compensation.In above-mentioned situation, utilize 4 passages that are in idle state to send data " 0 ", in order to offsetting the impact of 4 diagonal interference that upper channel produces, thus the normal operation of assurance passage.
Those skilled in the art will readily understand; the above is only preferred embodiment of the present invention; not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (4)
1. the radio communication compensation method based on inductance coupling high, is characterized in that, comprises the steps:
S1: the induction passage matrix is divided into first group of passage and second group of passage;
S2: controlling described first group of passage at rising edge clock is that signal transmission passage and described second group of passage are compensation channels; Controlling described second group of passage at the clock trailing edge is that signal transmission passage and described first group of passage are compensation channels;
S3: the number that sends data 0 when described signal transmission passage is during greater than 1 number, and described compensation channels sends data 1; The number that sends data 1 when described signal transmission passage is during greater than 0 number, and described compensation channels sends data 0.
2. radio communication compensation method as claimed in claim 1, it is characterized in that, when described compensation channels is positioned at described induction passage matrix middle, by will be adjacent with compensation channels and four signal transmission passages of off-diagonal position in send 0 number and 1 number compares, number when 0 is during greater than 1 number, and compensation channels sends 1; Number when 0 is during less than 1 number, and compensation channels sends 0; When the number when 0 equaled 1 number, compensation channels is transmitted signal not.
3. radio communication compensation method as claimed in claim 1, it is characterized in that, when compensation channels is positioned at the position at the edge of access matrix and non-angle, by will be adjacent with compensation channels and three signal transmission passages of off-diagonal position in send 0 number and 1 number compares, number when 0 is during greater than 1 number, and compensation channels sends 1; Number when 0 is during less than 1 number, and compensation channels sends 0.
4. radio communication compensation method as claimed in claim 1, it is characterized in that, when compensation channels is positioned at the corner location of access matrix, by will be adjacent with compensation channels and two signal transmission passages of off-diagonal position in send 0 number and 1 number compares, number when 0 is during greater than 1 number, and compensation channels sends 1; Number when 0 is during less than 1 number, and compensation channels sends 0; When the number when 0 equaled 1 number, compensation channels is transmitted signal not.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310028315.2A CN103117968B (en) | 2013-01-25 | 2013-01-25 | Wireless communication compensation method based on inductive coupling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310028315.2A CN103117968B (en) | 2013-01-25 | 2013-01-25 | Wireless communication compensation method based on inductive coupling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103117968A true CN103117968A (en) | 2013-05-22 |
| CN103117968B CN103117968B (en) | 2015-07-22 |
Family
ID=48416245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310028315.2A Expired - Fee Related CN103117968B (en) | 2013-01-25 | 2013-01-25 | Wireless communication compensation method based on inductive coupling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103117968B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101013898A (en) * | 2006-01-19 | 2007-08-08 | 伦伯格连接器两合公司 | Antenna for telecommunication device |
-
2013
- 2013-01-25 CN CN201310028315.2A patent/CN103117968B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101013898A (en) * | 2006-01-19 | 2007-08-08 | 伦伯格连接器两合公司 | Antenna for telecommunication device |
Non-Patent Citations (4)
| Title |
|---|
| 余凯等: "Security strategy of powered-off SRAM for resisting physical attack to data remanence", <<JOURNAL OF SEMICONDUCTORS>>, vol. 30, no. 9, 30 September 2009 (2009-09-30) * |
| 邹志革等: "低压低功耗模拟集成电路设计技术及展望", <<微电子学>>, vol. 36, no. 1, 28 February 2006 (2006-02-28) * |
| 郑靖华等: "无线传感器网络节点芯片的软/ 硬件协同低功耗设计技术", <<计算机与数字工程>>, vol. 36, no. 230, 20 December 2008 (2008-12-20) * |
| 陈晓飞等: "峰值电流模式降压DC/DC变换器芯片设计", <<微电子学与计算机>>, vol. 25, no. 8, 31 August 2008 (2008-08-31) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103117968B (en) | 2015-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5635759B2 (en) | Multilayer semiconductor integrated circuit device | |
| CN109643704A (en) | Method and apparatus for managing the gate of the special power on multi-chip package | |
| CN104900249B (en) | Energy efficient power distribution for 3D IC stacks | |
| US7710329B2 (en) | System including an inter-chip communication system | |
| CN103413796B (en) | The large port interconnection class chip that a kind of substrate multi-chip is integrated and implementation method | |
| US11495521B2 (en) | Power module and method for manufacturing the same | |
| CN101127055A (en) | Method of designing integrated circuit, designing apparatus, system, substrate, package and circuit | |
| CN103107166A (en) | Inductor and wireless coupling communication system in three-dimensional stack packaging chip | |
| CN102800644A (en) | Double data rate (DDR) signal wiring encapsulation substrate and DDR signal wiring encapsulation method | |
| CN104851863A (en) | Integrated circuit, lead bonding packaging chip and flip packaging chip | |
| CN107979134A (en) | Charging circuit and mobile terminal | |
| CN103117968B (en) | Wireless communication compensation method based on inductive coupling | |
| CN206294066U (en) | A kind of filtering system for suppressing power module common-mode noise | |
| CN110555269B (en) | Top-level clock tree structure of system on chip | |
| CN114843262B (en) | Electrostatic surge protection circuit for low-power-consumption power management chip | |
| CN203057079U (en) | Domain structure of optical communication trans-impedance amplifier based on RF-CMOS (Radio Frequency-Complementary Metal Oxide Semiconductor) process | |
| CN111508921B (en) | Semiconductor chip set with double-sided external contact | |
| CN103367341A (en) | IGBT (Insulated Gate Bipolar Translator) lining plate structure | |
| CN210518987U (en) | PCB structure for optimizing nuclear power distribution network impedance of BGA packaged chip | |
| CN202818767U (en) | PCB (Printed Circuit Board) chip layout structure and electronic terminal applying the structure | |
| CN206515778U (en) | Power supply circuit | |
| CN208477471U (en) | Circuit device, electronic equipment dig mine machine and server | |
| CN203368298U (en) | A shell-entering pouring-sealing-type module power supply | |
| CN103383712B (en) | A kind of IC Layout method optimizing pad locations reduction chip area | |
| CN212324471U (en) | PCB structure based on hole optimizes power distribution network impedance in dish |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150722 Termination date: 20160125 |
|
| EXPY | Termination of patent right or utility model |