CN206515778U - Power supply circuit - Google Patents
Power supply circuit Download PDFInfo
- Publication number
- CN206515778U CN206515778U CN201621147700.4U CN201621147700U CN206515778U CN 206515778 U CN206515778 U CN 206515778U CN 201621147700 U CN201621147700 U CN 201621147700U CN 206515778 U CN206515778 U CN 206515778U
- Authority
- CN
- China
- Prior art keywords
- powered
- chip
- power supply
- circuit
- supply circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model embodiment discloses a kind of power supply circuit, it is related to power supply power supply technique field, one of which power supply circuit includes adjustment circuit and the multiple encapsulation units being connected in series between feeder ear and ground, include one or more groups of elements respectively in each encapsulation unit, include being connected in series a signal level converting unit respectively between the chip to be powered in a chip to be powered and Auxiliary Power Units being connected, two groups of adjacent elements per set of pieces；Each chip to be powered connects adjustment circuit respectively, and adjustment circuit enters trip temperature to each chip to be powered according to the working condition of each chip to be powered respectively or frequency is adjusted, so that all chips to be powered in power supply circuit are in normal operating conditions.The utility model embodiment can not only reduce design production cost, effectively overcome the problem of power supply energy transformation efficiency is low, can also reduce PCB volumes, make the operating voltage of each chip to be powered balanced.
Description
Technical field
The utility model is related to power supply power supply technique field, more particularly to a kind of power supply circuit.
Background technology
Bit coin ore deposit machine in the market is substantially the parallel connection type ore deposit machine using DC/DC (DC-DC) chip,
Because DC/DC has the problem of transformation efficiency is low, the waste of power supply energy is caused, meanwhile, DC/DC circuit design is more severe
Carve, the requirement of design can be increased, can also increase the cost of production design.
Therefore, a technical problem for needing those skilled in the art urgently to solve at present is exactly：How innovatively
A kind of effective measures are proposed, to meet the greater demand in practical application.
Utility model content
The utility model embodiment technical problem to be solved is to provide a kind of power supply circuit, virtual digit coin and digs ore deposit machine
And computer server.
In order to solve the above problems, a kind of power supply circuit disclosed in the utility model embodiment, including adjustment circuit and
The multiple chips to be powered being connected in series between feeder ear and ground；
In the multiple chip to be powered, a signal level is connected in series between two adjacent chips to be powered respectively and is turned
Unit is changed, each chip to be powered connects an Auxiliary Power Units respectively；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is respectively to each chip to be powered
Enter trip temperature or frequency adjustment.
The also disclosed another power supply circuit of the utility model embodiment, including adjustment circuit and on feeder ear and ground
Between multiple encapsulation units for being connected in series, one or more groups of elements are included respectively in each encapsulation unit, one is included per set of pieces
It is connected in series respectively between chip to be powered in the individual chip to be powered and Auxiliary Power Units being connected, two groups of adjacent elements
One signal level converting unit；
Each chip to be powered in the multiple encapsulation unit connects the adjustment circuit, the adjustment circuit difference respectively
Enter trip temperature or frequency adjustment to each chip to be powered.
Another power supply circuit disclosed in the utility model embodiment, including adjustment circuit and between feeder ear and ground
Multiple chips to be powered of serial connection；
In the multiple chip to be powered, each chip to be powered includes circuit to be powered respectively, and two adjacent to wait to supply
A signal level converting unit is connected in series between the circuit to be powered of electrical chip respectively, each chip to be powered is respectively further comprised
One Auxiliary Power Units for being connected with circuit to be powered；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is respectively to each chip to be powered
Enter trip temperature or frequency adjustment.
Another power supply circuit disclosed in the utility model embodiment, including adjustment circuit and between feeder ear and ground
Multiple chips to be powered of serial connection；
In the multiple chip to be powered, a signal level conversion is connected between each chip and ground to be powered respectively single
Member, each chip to be powered connects an Auxiliary Power Units respectively；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is respectively to each chip to be powered
Enter trip temperature or frequency adjustment.
Another power supply circuit disclosed in the utility model embodiment, including adjustment circuit and between feeder ear and ground
Include one or more groups of elements in one or more encapsulation units of serial connection, each encapsulation unit respectively, per set of pieces bag
A chip to be powered and Auxiliary Power Units being connected is included, one is connected between the chip to be powered and ground in every set of pieces
Signal level converting unit；
Each chip to be powered in one or more of encapsulation units connects the adjustment circuit, the adjustment electricity respectively
Trip temperature or frequency adjustment are entered in road to each chip to be powered respectively.
Another power supply circuit disclosed in the utility model embodiment, including adjustment circuit and between feeder ear and ground
Multiple chips to be powered of serial connection；
In the multiple chip to be powered, each chip to be powered includes a circuit to be powered respectively；Each chip to be powered
In, a signal level converting unit is connected between circuit to be powered and ground；Each circuit to be powered is also connected with an auxiliary electricity
Source unit；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is respectively to each chip to be powered
Enter trip temperature or frequency adjustment.
Power supply circuit, digging ore deposit machine and server that the utility model embodiment is provided, power supply circuit include serial connection
Multiple chips to be powered, effectively increase the power supply energy conversion efficiency of power supply circuit；
In the power supply circuit of multiple chips to be powered including serial connection, there is provided connecting respectively with each chip to be powered
The adjustment circuit connect, can enter trip temperature or frequency adjustment to each chip to be powered respectively, so that all in power supply circuit
Chip to be powered is in normal operating conditions, it is to avoid due to the Voltage unbalance between each chip to be powered of serial connection
Caused partly or entirely chip to be powered can not normal work, so as to influenceing the feelings of whole series-fed circuit normal work
Shape；
One or more groups of identical elements in power supply circuit, such as chip to be powered, Auxiliary Power Units, signal level
Converting unit, can be encapsulated in an encapsulation unit one integral module of formation, or, every group of signal level converting unit,
Auxiliary Power Units are arranged in corresponding chip to be powered, reduce printed circuit board (PCB) (Printed circuit board,
PCB the module number on), improves PCB integrated level, so as to reduce PCB space-consumings.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the accompanying drawing used required in description of the prior art does one and simply introduced, it should be apparent that, drawings in the following description are
Some embodiments of the present utility model, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the utility model power supply circuit first embodiment.
Fig. 2 is the structural representation of the utility model power supply circuit second embodiment.
Fig. 3 is the structural representation of the utility model power supply circuit 3rd embodiment.
Fig. 4 is the structural representation of the utility model power supply circuit fourth embodiment.
Fig. 5 is the structural representation of the embodiment of the utility model power supply circuit the 5th.
Fig. 6 is the structural representation of the utility model power supply circuit sixth embodiment.
Fig. 7 is the structural representation of the embodiment of the utility model power supply circuit the 7th.
Fig. 8 is the structural representation of the embodiment of the utility model power supply circuit the 8th.
Fig. 9 is the structural representation of the embodiment of the utility model power supply circuit the 9th.
Figure 10 is the signal that signal level converting unit is realized using optocoupler transformation approach in the utility model embodiment
Figure.
Figure 11 is that signal level converting unit is realized using transformer transformation approach in the utility model embodiment one shows
It is intended to.
Figure 12 is signal level converting unit uses that differential signal transmission method realizes in the utility model embodiment one
Schematic diagram.
Figure 13 is that signal level converting unit is realized using diode drop method in the utility model embodiment one shows
It is intended to.
Figure 14 is the structural representation that the utility model digs ore deposit machine one embodiment.
Figure 15 is the structural representation of the utility model server one embodiment.
Embodiment
It is new below in conjunction with this practicality to make the purpose, technical scheme and advantage of the utility model embodiment clearer
Accompanying drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that retouched
The embodiment stated is a part of embodiment of the utility model, rather than whole embodiments.Based on the implementation in the utility model
Example, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made is belonged to
The scope of the utility model protection.
Fig. 1 is the structural representation of the utility model power supply circuit first embodiment.As shown in figure 1, the utility model is real
Applying the power supply circuit of example includes adjustment circuit and the multiple chips to be powered being connected in series between feeder ear VCC and ground.Its
In, in multiple chips to be powered that power supply circuit includes, a signal is connected in series respectively between two adjacent chips to be powered
Level conversion unit, each chip to be powered connects an Auxiliary Power Units respectively.Wherein, Auxiliary Power Units can be connection
Chip to be powered in some special functional modules such as I/O (input/output) module, PLL (phaselocked loop) module power supply is provided,
It can generally be realized with DC-DC module.Multiple chips to be powered that power supply circuit includes connect adjustment circuit respectively, adjustment electricity
Trip temperature or frequency adjustment are entered in road to each chip to be powered respectively, so that all chips to be powered in power supply circuit are in just
Normal working condition.
In each embodiment of the utility model, adjustment circuit specifically can respectively according to the working condition of each chip to be powered,
For example, if in normal operating conditions (such as whether can normally transceiving data), voltage status, state of temperature, working frequency
State etc., trip temperature or frequency adjustment are entered to each chip to be powered.Adjustment circuit therein can specifically be realized by hardware,
It can be realized by software.For example, the working condition of chip to be powered is voltage status, state of temperature or working frequency state
When, when adjustment circuit is realized by hardware, it can realize that exemplarily, comparator can compare by comparator and adjuster
The magnitude of voltage of chip to be powered, temperature value, operating frequency value and standard voltage, temperature, the numerical value of working frequency or scope it
Between magnitude relationship, represent comparative result signal to adjuster output, for example, represents that comparative result is identical with 1,0 expression is compared
As a result it is different；It can also not exported only when comparative result is different to adjuster output 0 when comparative result is identical to adjuster
Any signal；The signal that adjuster is sent according to comparator is heightened or turned down chip to be powered and enters trip temperature or frequency.For another example, treat
When whether the working condition of power supply chip is is in normal operating conditions, when adjustment circuit is realized by hardware, it can specifically lead to
Cross monitor and adjuster realized, exemplarily, chip to be powered is monitored by monitor and currently whether is in normal operating conditions,
Comparative result signal is represented to adjuster output, for example, representing that working condition is normal with 1,0 represents working state abnormal；
Only in working state abnormal to adjuster output 0 any letter can not be exported when working condition is normal to adjuster
Number；The signal that adjuster is sent according to monitor is heightened or turned down chip to be powered and enters trip temperature or frequency.
In a particular application, the core voltage of the high current of chip typically to be powered is powered using power supply circuit, and first
The earth terminal of chip to be powered is as the feeder ear of the second chip to be powered, and the earth terminal of the second chip to be powered treats as the 3rd
The feeder ear of power supply chip, is sequentially connected in series according to this annexation.Boost voltage unit can be common LDO and/or DC/DC
Deng power generation circuit and/or chip.Introduce for convenience, it is N's (N >=2) that the quantity of chip to be powered, which has been shown in particular, in Fig. 1
Specific example.In the utility model embodiment, N value is the integer more than 1.Chip to be powered is respectively the first core to be powered
Piece A1, the second chip A2 ... N to be powered chip AN to be powered, accordingly, are connected in series between two adjacent chips to be powered
Signal level converting unit be respectively the first signal level converting unit B1, secondary signal level conversion unit B2 ... N-
1 signal level converting unit B N-1, it is respectively the first accessory power supply that each chip to be powered connects an Auxiliary Power Units respectively
Unit C1, the second Auxiliary Power Units C2 ... N Auxiliary Power Units CN.When chip internal resistance to be powered is suitable,
Directly partial pressure can be carried out using above-mentioned power supply circuit to power.
The power supply circuit that the utility model embodiment is provided, is connected in series multiple cores to be powered between feeder ear and ground
A signal level converting unit is connected in series respectively between piece, two adjacent chips to be powered, and each chip to be powered is connected respectively
One Auxiliary Power Units, effectively increases the power supply energy conversion efficiency of power supply circuit.
Because power supply circuit is included between multiple chips to be powered of serial connection, each chip to be powered of serial connection
Can cause in Voltage unbalance partially or completely chip to be powered can not normal work, so as to influence whole series-fed electricity
Road normal work.For the problem, the utility model embodiment in series-fed circuit be provided with respectively with each core to be powered
The adjustment circuit of piece connection, can enter trip temperature or frequency adjustment, so that in power supply circuit to each chip to be powered respectively
All chips to be powered are in normal operating conditions, it is to avoid due to the voltage between each chip to be powered of serial connection not
Caused by balance partly or entirely chip to be powered can not normal work, so as to influenceing whole series-fed circuit normal work
Situation.
Fig. 2 is the structural representation of the utility model power supply circuit second embodiment.Reference picture 2, the power supply of the embodiment
In circuit, including adjustment circuit and multiple encapsulation units for being connected in series between feeder ear VCC and ground, each encapsulation unit
Include one or more groups of elements respectively, a chip to be powered and Auxiliary Power Units being connected, two groups are included per set of pieces
A signal level converting unit is connected in series between chip to be powered in adjacent elements respectively.It is multiple that power supply circuit includes
Each chip to be powered in encapsulation unit connects adjustment circuit respectively, and the adjustment circuit enters trip temperature to each chip to be powered respectively
Or frequency adjustment, so that all chips to be powered in power supply circuit are in normal operating conditions.
Introduce for convenience, the quantity that chip to be powered is also illustrated in the present embodiment is N (N >=2) specific example,
Wherein, N is the integer more than 1.If each chip to be powered, each Auxiliary Power Units and each voltage-regulating circuit are disposed on
On PCB, it can make it that the electric elements quantity on PCB is more, cause PCB volume larger.
The power supply circuit of the utility model embodiment includes multiple chips to be powered of serial connection, effectively increases confession
The power supply energy conversion efficiency of circuit；Also, it is provided with what is be connected respectively with each chip to be powered in series-fed circuit
Adjustment circuit, can enter trip temperature or frequency adjustment, so that needing in power supply circuit is supplied to each chip to be powered respectively
Electrical chip is in normal operating conditions, it is to avoid because Voltage unbalance between each chip to be powered of serial connection causes
Part or all of chip to be powered can not normal work, so as to influenceing the situation of whole series-fed circuit normal work；Separately
Outside, the utility model embodiment often one or more groups of chips to be powered, Auxiliary Power Units will be separately positioned on an encapsulation list
An integral module is formed in member, so, PCB is upper can to set a number of encapsulation unit according to demand, so as to subtract
Small PCB volume, improves PCB integrated level, so as to reduce PCB space-consumings, reduces PCB design cost；Separately
Outside, every one or more groups of chips to be powered, Auxiliary Power Units are separately positioned in an encapsulation unit, can also be to be powered
Chip, the electric elements of Auxiliary Power Units are effectively protected.
Fig. 3 is the structural representation of the utility model power supply circuit 3rd embodiment.In order to further reduce on PCB
Electric elements quantity, the volume and design cost for reducing PCB, as shown in figure 3, in the further embodiment of power supply circuit, letter
Number level conversion unit can be specifically set in the encapsulation unit where one of element of two groups of adjacent elements.
Signal level converting unit is also disposed in encapsulation unit, can further reduce PCB volume, PCB is reduced
Design cost, and signal level converting unit can also be effectively protected.
Fig. 4 is the structural representation of the utility model power supply circuit fourth embodiment.As shown in figure 4, the confession of the embodiment
Circuit includes adjustment circuit, and the multiple chips to be powered being connected in series between feeder ear VCC and ground.Wherein, respectively wait to supply
Electrical chip includes being connected in series one respectively between a circuit to be powered, the circuit to be powered of two adjacent chips to be powered respectively
Individual signal level converting unit, each chip to be powered respectively further comprises an accessory power supply list being connected with the circuit to be powered
Member.Multiple chips to be powered that power supply circuit includes connect adjustment circuit respectively, and the adjustment circuit is respectively to each chip to be powered
Enter trip temperature or frequency adjustment, so that all chips to be powered in power supply circuit are in normal operating conditions.
Introduce for convenience, the quantity in the present embodiment using chip to be powered and circuit to be powered is introduced as N, its
In, N is the integer more than 1.Chip to be powered is respectively that the first chip A1 to be powered, the second chip A2 ... N to be powered are treated
Power supply chip AN, circuit to be powered is respectively the first circuit E1 to be powered, the second circuit E2 ... N to be powered circuits to be powered
EN.Accordingly, the signal level converting unit being connected in series between two adjacent circuits to be powered is respectively that the first signal level turns
Change unit B 1, secondary signal level conversion unit B2 ... N-1 signal levels converting unit BN-1, each circuit connection to be powered
Auxiliary Power Units be respectively the first Auxiliary Power Units C1, the second Auxiliary Power Units C2 ... N Auxiliary Power Units
CN.When chip internal resistance to be powered is suitable, partial pressure directly can be carried out using above-mentioned power supply circuit and powered.
The power supply circuit of the utility model embodiment includes multiple chips to be powered of serial connection, effectively increases confession
The power supply energy conversion efficiency of circuit；Also, it is provided with what is be connected respectively with each chip to be powered in series-fed circuit
Adjustment circuit, can enter trip temperature or frequency adjustment, so that needing in power supply circuit is supplied to each chip to be powered respectively
Electrical chip is in normal operating conditions, it is to avoid because Voltage unbalance between each chip to be powered of serial connection causes
Part or all of chip to be powered can not normal work, so as to influenceing the situation of whole series-fed circuit normal work；Separately
Outside, if each chip to be powered, each Auxiliary Power Units are disposed on PCB, can cause electric elements quantity on PCB compared with
It is many, cause PCB volume larger, the utility model embodiment sets the Auxiliary Power Units that each chip to be powered is connected
In the chip to be powered, so as to reduce PCB volume, PCB design cost is reduced.
Fig. 5 is the structural representation of the embodiment of the utility model power supply circuit the 5th.In order to further reduce the electricity on PCB
Device number of elements, the volume and design cost for reducing PCB, as shown in figure 5, in the further implementation of the utility model power supply circuit
, can also be by multiple chip packages to be powered in an encapsulation unit in example, the core to be powered encapsulated in each encapsulation unit
The quantity of piece can with different, can for example encapsulate 2,3 ... wait power supply chip.So, it can select according to the actual requirements
The encapsulation unit for selecting respective numbers including suitable number of chips to be powered is designed on PCB.
In addition, in based on the power supply circuit of any embodiment shown in Fig. 4 or Fig. 5, it is serial between two chips to be powered
The signal level converting unit of connection, can specifically be arranged on one of them chip to be powered of the two adjacent chips to be powered
In.Then in the embodiment, signal level converting unit is provided with N-1 chips to be powered in N number of chip to be powered, in addition
Signal level converting unit is not provided with 1 chip to be powered.
Signal level converting unit is also disposed in chip to be powered, can further reduce PCB volume, is reduced
PCB design cost, and signal level converting unit can also be effectively protected.
Fig. 6 is the structural representation of the utility model power supply circuit sixth embodiment.As shown in fig. 6, the confession of the embodiment
Circuit includes adjustment circuit, and the multiple chips to be powered being connected in series between feeder ear and ground.Wherein, power supply circuit bag
In the multiple chips to be powered included, a signal level converting unit is connected respectively between each chip and ground to be powered, respectively waits to supply
Electrical chip connects an Auxiliary Power Units respectively.Multiple chips to be powered that power supply circuit includes connect adjustment circuit respectively,
The adjustment circuit enters trip temperature or frequency adjustment to each chip to be powered respectively, so that all chips to be powered in power supply circuit
It is in normal operating conditions.
Introduce for convenience, same in the present embodiment is respectively that N is introduced with the quantity of chip to be powered, wherein, N is
Integer more than 1.Chip to be powered is respectively the first chip a1 to be powered, the second chip a2 ... N to be powered cores to be powered
Piece aN, accordingly, the signal level converting unit connected between each chip and ground to be powered are respectively the conversion of the first signal level
Unit b1, secondary signal level conversion unit b2 ... n-signal level conversion unit bN, each chip connection to be powered it is auxiliary
It is respectively the first Auxiliary Power Units c1, the second Auxiliary Power Units c2 ... N Auxiliary Power Units cN to help power subsystem.It is right
Directly partial pressure can be carried out in the suitable situation of chip internal resistance to be powered using above-mentioned power supply circuit to power.
The power supply circuit of the utility model embodiment includes multiple chips to be powered of serial connection, effectively increases confession
The power supply energy conversion efficiency of circuit；Also, it is provided with what is be connected respectively with each chip to be powered in series-fed circuit
Adjustment circuit, can enter trip temperature or frequency adjustment, so that needing in power supply circuit is supplied to each chip to be powered respectively
Electrical chip is in normal operating conditions, it is to avoid because Voltage unbalance between each chip to be powered of serial connection causes
Part or all of chip to be powered can not normal work, so as to influenceing the situation of whole series-fed circuit normal work.
Fig. 7 is the structural representation of the embodiment of the utility model power supply circuit the 7th.As shown in fig. 7, the confession of the embodiment
Circuit includes adjustment circuit, and the one or more encapsulation units being connected in series between feeder ear VCC and ground.Wherein, often
Include one or more groups of elements in individual encapsulation unit respectively, a chip to be powered being connected and auxiliary electricity are included per set of pieces
A signal level converting unit is connected between chip to be powered and ground in source unit, every set of pieces.What power supply circuit included
Multiple chips to be powered connect adjustment circuit respectively, and the adjustment circuit enters trip temperature to each chip to be powered respectively or frequency is adjusted
It is whole, so that all chips to be powered in power supply circuit are in normal operating conditions.
The present embodiment shown in Fig. 7 illustrate only is connected in series showing for multiple encapsulation units between feeder ear VCC and ground
Example, record of the those skilled in the art based on the utility model embodiment can be known for being gone here and there between feeder ear VCC and ground
Row connects the structure of an encapsulation unit and implemented.
The power supply circuit of the utility model embodiment includes multiple chips to be powered of serial connection, effectively increases confession
The power supply energy conversion efficiency of circuit；Also, it is provided with what is be connected respectively with each chip to be powered in series-fed circuit
Adjustment circuit, can enter trip temperature or frequency adjustment, so that needing in power supply circuit is supplied to each chip to be powered respectively
Electrical chip is in normal operating conditions, it is to avoid because Voltage unbalance between each chip to be powered of serial connection causes
Part or all of chip to be powered can not normal work, so as to influenceing the situation of whole series-fed circuit normal work；Separately
Outside, if each chip to be powered, each Auxiliary Power Units, each signal level converting unit are disposed on PCB, PCB can be caused
On electric elements quantity it is more, cause PCB volume larger, the utility model embodiment will be per one or more groups of cores to be powered
Piece, Auxiliary Power Units, signal level converting unit are individually enclosed in an encapsulation unit, so, and PCB is upper can be according to need
The a number of encapsulation unit of setting is sought, so as to reduce PCB volume, PCB design cost is reduced, also, will
Chip to be powered, Auxiliary Power Units, signal level converting unit are arranged in encapsulation unit, can also treat power supply chip,
Auxiliary Power Units, the electric elements of signal level converting unit are effectively protected.
Fig. 8 is the structural representation of the embodiment of the utility model power supply circuit the 8th.As shown in figure 8, the confession of the embodiment
Circuit includes adjustment circuit, and the multiple chips to be powered being connected in series between feeder ear VCC and ground.Wherein, respectively wait to supply
Electrical chip includes a circuit to be powered respectively.In each chip to be powered, a signal is connected between circuit to be powered and ground
Level conversion unit, circuit to be powered is also connected with an Auxiliary Power Units.Multiple chips to be powered that power supply circuit includes point
Adjustment circuit is not connected, the adjustment circuit enters trip temperature or frequency adjustment to each chip to be powered respectively, so that in power supply circuit
All chips to be powered be in normal operating conditions.
Introduce for convenience, same in the present embodiment is respectively that N (N >=2) is introduced with the quantity of chip to be powered, its
In, N is the integer more than 1.Chip to be powered is respectively that the first chip a1 to be powered, the second chip a2 ... N to be powered are treated
Power supply chip aN, circuit to be powered is respectively the first road e1 to be powered, the second circuit e2 ... N to be powered circuits to be powered
eN.Accordingly, the signal level converting unit connected between each circuit to be powered and ground, respectively the first signal level conversion is single
First b1, secondary signal level conversion unit b2 ... n-signal level conversion unit bN, what each circuit to be powered was connected respectively
Auxiliary Power Units, respectively the first Auxiliary Power Units c1, the second Auxiliary Power Units c2 ... N Auxiliary Power Units
cN.Directly partial pressure can be carried out when chip internal resistance to be powered is suitable using above-mentioned power supply circuit to power.
The power supply circuit of the utility model embodiment includes multiple chips to be powered of serial connection, effectively increases confession
The power supply energy conversion efficiency of circuit；Also, it is provided with what is be connected respectively with each chip to be powered in series-fed circuit
Adjustment circuit, can enter trip temperature or frequency adjustment, so that needing in power supply circuit is supplied to each chip to be powered respectively
Electrical chip is in normal operating conditions, it is to avoid because Voltage unbalance between each chip to be powered of serial connection causes
Part or all of chip to be powered can not normal work, so as to influenceing the situation of whole series-fed circuit normal work；Separately
Outside, if chip to be powered, each Auxiliary Power Units, signal level converting unit are disposed on PCB, it can cause on PCB
Electric elements quantity is more, causes PCB volume larger, the signal electricity that the utility model embodiment connects each chip to be powered
Flat converting unit, Auxiliary Power Units are arranged in corresponding chip to be powered, so as to reduce PCB volume, reduce PCB
Design cost.
Fig. 9 is the structural representation of the embodiment of the utility model power supply circuit the 9th.In order to further reduce the electricity on PCB
Device number of elements, the volume and design cost for reducing PCB, as shown in figure 9, in the further implementation of the utility model power supply circuit
, can also be by multiple chip packages to be powered in an encapsulation unit in example, the core to be powered encapsulated in each encapsulation unit
The quantity of piece can with different, can for example encapsulate 2,3 ... wait power supply chip.So, it can select according to the actual requirements
The module to be powered for selecting respective numbers including suitable number of chips to be powered is designed on PCB.
In each power supply circuit embodiment shown in the utility model above-mentioned Fig. 1 to Fig. 9, adjustment circuit can be specifically temperature
Adjustment circuit or frequency regulating circuit, enter trip temperature according to the working condition of each chip to be powered to each chip to be powered respectively
Or frequency adjustment.
In a specific example of each power supply circuit embodiment shown in the utility model above-mentioned Fig. 1 to Fig. 9, adjustment circuit
When entering line frequency adjustment to each chip to be powered, as frequency regulating circuit, specifically can respectively it be directed to by a detector
Each chip to be powered, detects whether the working condition of chip to be powered is normal according to predetermined period；If needing the work of power supply chip
Make state abnormal, can specifically improve or drop according to predeterminated frequency step-length in the range of predeterminated frequency by an adjuster
The working frequency of the chip to be powered of low working state abnormal.
The working frequency of chip to be powered, the overtension shared or too low, can all influence its normal work.This practicality is new
Type embodiment is limited to the working frequency for the chip to be powered that working state abnormal is improved or reduced in the range of predeterminated frequency,
I.e.：Ensure the working frequency after chip raising to be powered or reduction without departing from the predeterminated frequency scope.If according to predeterminated frequency
Step-length improve or reduction working frequency after, its working frequency can exceed predeterminated frequency scope, then can improve working frequency when,
Working frequency after raising is limited to the upper frequency limit to predeterminated frequency；When reducing working frequency, after reduction
Working frequency limits the lower-frequency limit to predeterminated frequency.By the working frequency for changing chip to be powered, thus it is possible to vary
The supply voltage that power consumption, heat dissipation capacity, chip temperature and chip of the chip to be powered are shared.For example, reduction by one is to be powered
The working frequency of chip, the power consumption of the chip to be powered can be reduced, and heat dissipation capacity can be reduced, and reduce the temperature of its whole chip, from
And the supply voltage that the chip to be powered is shared can be improved；Conversely, improving the working frequency of a chip to be powered, this is to be powered
The power consumption of chip can be improved, and heat dissipation capacity can increase, and the temperature of its whole chip can be raised, so that the confession that the chip to be powered is shared
Piezoelectric voltage can be reduced.
Predeterminated frequency scope therein is the frequency range that each chip to be powered can work in power supply circuit, for example, can be
200MHZ~700MHZ, predeterminated frequency step-length for example can be 6.25MHz.Due to being adopted between the chip to be powered in power supply circuit
With cascaded structure, when changing the working frequency of wherein one or more chips to be powered, other in power supply circuit can be influenceed to wait to supply
The supply voltage that electrical chip is shared, so as to influence the working condition of other chips to be powered.The utility model people is based on grinding
Study carefully discovery, when predeterminated frequency step-length is set to 6.25MHz, can both be effectively improved the abnormal core to be powered of current operating state
Piece working condition, the normal work of the normal chip to be powered of the working condition of other in power supply circuit is not interfered with also.
In another specific example of each power supply circuit embodiment shown in the utility model above-mentioned Fig. 1 to Fig. 9, adjustment electricity
, specifically can be by a detector as temperature adjustment circuit when trip temperature adjustment is entered on road to each chip to be powered, difference pin
To each chip to be powered, detect whether the working condition of chip to be powered is normal according to predetermined period；If needing power supply chip
Working state abnormal, specifically can improve or reduce working condition in the range of preset rotation speed not just by an adjuster
The rotating speed of fan in normal chip to be powered.
Chip to be powered it is too high or too low for temperature, can all influence its normal work.The utility model presets a rotating speed
Scope, fan is in the range of preset rotation speed, and the temperature of chip to be powered will not be too high or too low so as to influence its normal work.This
Utility model embodiment is limited to fan in the chip to be powered that working state abnormal is improved or reduced in the range of preset rotation speed
Rotating speed, i.e.,：Ensure to improve or reduce the rotating speed of aft-fan without departing from the preset rotation speed scope.By changing chip to be powered
The rotating speed of middle fan, thus it is possible to vary the supply voltage that the temperature of the chip to be powered and the chip are shared.For example, improving to be powered
The rotating speed of fan in chip, can reduce the temperature of its whole chip, so that the supply voltage that the chip to be powered is shared can be carried
It is high；Conversely, reducing the rotating speed of fan in chip to be powered, the temperature of its whole chip can be raised, so that the chip to be powered point
The supply voltage of load can be reduced.
In a further specific example, status register is both provided with each chip to be powered, can wait to supply
Self-inspection is carried out on electrical chip after electricity, and indicates the state of place chip to be powered, the state bag that status register therein is indicated
Include following any one or more：Voltage status, state of temperature, working frequency state.The state indicated according to status register,
It can know whether the state of chip to be powered is normal, when the state of chip to be powered is abnormal, can be alerted.Accordingly
In ground, the embodiment, when adjustment circuit detects whether the working condition of chip to be powered is normal, it is particularly used according to be powered
Whether the working condition for the condition adjudgement chip to be powered that status register is indicated is normal in chip.
Further, since each chip to be powered will carry out data transmit-receive, can be by chip to be powered whether to being sent to
The data of the chip to be powered have all carried out correct feedback, to judge whether the working condition of the chip to be powered is normal.Then exist
, specifically can be with when adjustment circuit detects whether the working condition of chip to be powered is normal in another further specific example
By a comparator, according to chip to be powered to being sent to the feedback data of the data of the chip to be powered, judge to be powered
Whether the working condition of chip is normal.For example, sending P group data to a chip to be powered, P is the integer more than 1, and detection should
Whether chip to be powered has all carried out correct feedback for the P groups data, if the chip to be powered is all carried out to the P groups data
Correct feedback, then judge that the working condition of the chip to be powered is normal；Otherwise, if the chip to be powered does not all enter to P groups data
Row feedback or the feedback error to wherein certain group data, it is possible to determine that the working state abnormal of the chip to be powered.
In another specific example of the above-mentioned each power supply circuit embodiment of the utility model, signal level converting unit can
With switching levels signal and differential signal, specifically use but be not limited to any one or more following mode and realize：Optocoupler is changed
Method, transformer transformation approach, differential signal transmission method, diode drop method.
For example, a kind of specific example that signal level converting unit is realized using optocoupler transformation approach is referred to Figure 10, the
One chip to be powered is connected by photoelectrical coupler with the second chip to be powered.
A kind of specific example that signal level converting unit is realized using transformer transformation approach is referred to Figure 11, and first treats
Power supply chip is connected by transformer with the second chip to be powered.
A kind of specific example that signal level converting unit is realized using differential signal transmission method is referred to Figure 12, first
Chip to be powered and the second chip signal level conversion to be powered are by USB, the standard such as SERDES or the differential signal such as privately owned
To realize.
A kind of specific example that signal level converting unit is realized using diode drop method is referred to Figure 13, and first treats
Power supply chip is connected by diode with the second chip to be powered.
The utility model embodiment additionally provides a kind of digging ore deposit machine of virtual digit coin.As shown in figure 14, it is that this practicality is new
Type digs the structural representation of ore deposit machine one embodiment.Referring to Figure 14, the digging ore deposit machine of the embodiment specifically includes cabinet 301, is located at
The control panel 302 of cabinet inside, the expansion board 303 being connected with control panel and the operation board 305 being connected with expansion board, it is therein
Operation board 305 includes power supply circuit 304.
Wherein, power supply circuit 304 can specifically be realized using the power supply circuit of any of the above-described embodiment of the utility model.Dig
Control panel 302 is the whole control centre for digging ore deposit machine in ore deposit machine, and control panel 302 is sent by input/output (IO) expansion board 303
Instruction and data, operation board 305 is powered using power supply circuit, is the whole arithmetic center for digging ore deposit machine.Control panel will instruct sum
According to I/O expansion plate 303 is issued to, instruction and data is forwarded to operation board 305 by I/O expansion plate 303, will after the computing of operation board 305
As a result control panel 302 is returned to by I/O expansion plate, control panel 302 is uploaded in internet by wired network interface.In addition,
Operation board 305 can also include other units, and such as power supply protection circuit, the power supply protection circuit can be in power supply circuit 304
Bulk temperature it is abnormal when cut off the power supply of power supply.
The utility model embodiment additionally provides a kind of server.Figure 15 is the utility model server one embodiment
Structural representation.As shown in figure 15, the server of the embodiment specifically includes mainboard 401, the ram disk electrically connected with mainboard 401
402 and hard disk 403, power supply 404 and CPU 406 comprising power supply circuit 405 for main board power supply.Wherein, supply
Circuit 405 specifically can based on any of the above-described embodiment of the utility model power supply circuit realize.
Each embodiment in this specification is described by the way of progressive, what each embodiment was stressed be with
Between the difference of other embodiment, each embodiment identical similar part mutually referring to.
Above to a kind of power supply circuit provided by the utility model, digging ore deposit machine and server, it is described in detail, this
Apply specific case in text to be set forth principle of the present utility model and embodiment, the explanation of above example is
It is used to help understand realization of the present utility model and its core concept；Simultaneously for those of ordinary skill in the art, according to this
The thought of utility model, will change in specific embodiments and applications, in summary, this specification content
It should not be construed as to limitation of the present utility model.
Claims (12)
1. a kind of power supply circuit, it is characterised in that what is be connected in series including adjustment circuit and between feeder ear and ground multiple treats
Power supply chip；
In the multiple chip to be powered, a signal level conversion is connected in series between two adjacent chips to be powered respectively single
Member, each chip to be powered connects an Auxiliary Power Units respectively；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is carried out to each chip to be powered respectively
Temperature or frequency adjustment.
2. a kind of power supply circuit, it is characterised in that the multiple envelopes being connected in series including adjustment circuit and between feeder ear and ground
Fill includes one or more groups of elements respectively in unit, each encapsulation unit, a core to be powered being connected is included per set of pieces
A signal level conversion is connected in series between chip to be powered in piece and Auxiliary Power Units, two groups of adjacent elements respectively single
Member；
Each chip to be powered in the multiple encapsulation unit connects the adjustment circuit respectively, and the adjustment circuit is respectively to each
Chip to be powered enters trip temperature or frequency adjustment.
3. power supply circuit according to claim 2, it is characterised in that signal level converting unit is specifically located at two groups of phases
In encapsulation unit where the one of which element of adjacent element.
4. a kind of power supply circuit, it is characterised in that what is be connected in series including adjustment circuit and between feeder ear and ground multiple treats
Power supply chip；
In the multiple chip to be powered, each chip to be powered includes a circuit to be powered, two adjacent cores to be powered respectively
A signal level converting unit is connected in series between the circuit to be powered of piece respectively, each chip to be powered respectively further comprises one
The Auxiliary Power Units being connected with circuit to be powered；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is carried out to each chip to be powered respectively
Temperature or frequency adjustment.
5. power supply circuit according to claim 4, it is characterised in that signal level converting unit is specifically located at two phases
In one of them chip to be powered of adjacent chip to be powered.
6. the power supply circuit according to claim 4 or 5, it is characterised in that the multiple chip to be powered is respectively arranged at
In multiple encapsulation units, include one or more chips to be powered in each encapsulation unit respectively.
7. power supply circuit according to claim 6, it is characterised in that the signal level converting unit specifically uses optocoupler
Transformation approach, transformer transformation approach, differential signal transmission method and or diode drop method realize.
8. a kind of power supply circuit, it is characterised in that what is be connected in series including adjustment circuit and between feeder ear and ground multiple treats
Power supply chip；
In the multiple chip to be powered, a signal level converting unit is connected respectively between each chip and ground to be powered, respectively
Chip to be powered connects an Auxiliary Power Units respectively；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is carried out to each chip to be powered respectively
Temperature or frequency adjustment.
9. a kind of power supply circuit, it is characterised in that be connected in series including adjustment circuit and between feeder ear and ground one or
In multiple encapsulation units, each encapsulation unit respectively include one or more groups of elements, per set of pieces include one be connected treat
One signal level conversion of connection is single between chip to be powered and ground in power supply chip and Auxiliary Power Units, every set of pieces
Member；
Each chip to be powered in one or more of encapsulation units connects the adjustment circuit, the adjustment circuit point respectively
It is other to enter trip temperature or frequency adjustment to each chip to be powered.
10. a kind of power supply circuit, it is characterised in that what is be connected in series including adjustment circuit and between feeder ear and ground is multiple
Chip to be powered；
In the multiple chip to be powered, each chip to be powered includes a circuit to be powered respectively；In each chip to be powered,
A signal level converting unit is connected between circuit and ground to be powered；Each circuit to be powered is also connected with an accessory power supply list
Member；
The multiple chip to be powered connects the adjustment circuit respectively, and the adjustment circuit is carried out to each chip to be powered respectively
Temperature or frequency adjustment.
11. power supply circuit according to claim 10, it is characterised in that the multiple chip to be powered is respectively arranged at many
In individual encapsulation unit, include one or more chips to be powered in each encapsulation unit respectively.
12. the power supply circuit according to any one in claim 1 to 5,8 to 10, it is characterised in that the signal level
Converting unit specifically using optocoupler transformation approach, transformer transformation approach, differential signal transmission method and or diode drop method realize.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621147700.4U CN206515778U (en) | 2016-10-21 | 2016-10-21 | Power supply circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621147700.4U CN206515778U (en) | 2016-10-21 | 2016-10-21 | Power supply circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206515778U true CN206515778U (en) | 2017-09-22 |
Family
ID=59860216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621147700.4U Active CN206515778U (en) | 2016-10-21 | 2016-10-21 | Power supply circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206515778U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108923778A (en) * | 2018-06-22 | 2018-11-30 | 比飞力（深圳）科技有限公司 | A kind of logic level converting circuit and integrated circuit |
-
2016
- 2016-10-21 CN CN201621147700.4U patent/CN206515778U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108923778A (en) * | 2018-06-22 | 2018-11-30 | 比飞力（深圳）科技有限公司 | A kind of logic level converting circuit and integrated circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106383566A (en) | Power supply circuit | |
| CN106774767A (en) | Series-fed chip and system, virtual digit coin dig ore deposit machine and server | |
| CN206523836U (en) | Series-fed chip and system | |
| Shenoy et al. | Differential power processing for DC systems | |
| CN106249834A (en) | Power supply circuits, virtual digit coin dig ore deposit machine and computer server | |
| CN105045364A (en) | Serial power supply circuit, virtual digital coin mining machine and computer server | |
| US10447166B2 (en) | Power module | |
| CN206039425U (en) | Supply circuit , virtual digital coin dig ore deposit machine and computer server | |
| CN207976832U (en) | Power supply circuit, circuit board with level conversion unit and virtual digit coin dig mine machine | |
| CN103412637A (en) | Energy-saving method of phase number variable CPU VR (Central Processing Unit Voltage Regulation) | |
| CN107272860A (en) | A kind of server hard disc electric power-feeding structure and its design method | |
| CN101645223A (en) | LED display screen and internal power supply system and signal transmitting system thereof | |
| CN205121469U (en) | Series connection supply circuit , virtual digital coin dig ore deposit machine and computer server | |
| CN206515778U (en) | Power supply circuit | |
| CN103490907A (en) | POE power source receiving method and POE power source receiving device | |
| CN206193677U (en) | Power management chip and notebook computer | |
| CN108762456A (en) | A kind of rack-mount server construction for electricity and its implementation | |
| CN106326174B (en) | A kind of two line telecommunication circuits | |
| US20140016259A1 (en) | Multi-motherboard power data communication architecture for power supplies | |
| CN115149514B (en) | Shared control type power supply device for wafer processor | |
| CN206505350U (en) | A kind of industrial panel computer for turning pci expansion slot with MINI PCIE | |
| CN108111016A (en) | Power module | |
| US20140019777A1 (en) | Power data communication architecture | |
| CN109874314B (en) | Series power supply circuit, system and method | |
| CN111512265A (en) | Series power supply circuit, system and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170926 Address after: 100029 Beijing, Haidian District North Austrian industrial base project, building 2, floor 6 Patentee after: BEIJING BITMAIN TECHNOLOGY CO., LTD. Address before: 100029 Beijing city Haidian District Baosheng Road No. 1 Building No. 25 hospital three Patentee before: Feng Feng Technology (Beijing) Co., Ltd. |
|
| TR01 | Transfer of patent right |