CN103117351A - LED support - Google Patents
LED support Download PDFInfo
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- CN103117351A CN103117351A CN2013100327733A CN201310032773A CN103117351A CN 103117351 A CN103117351 A CN 103117351A CN 2013100327733 A CN2013100327733 A CN 2013100327733A CN 201310032773 A CN201310032773 A CN 201310032773A CN 103117351 A CN103117351 A CN 103117351A
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- Prior art keywords
- led
- led support
- conducting portion
- fin
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Abstract
The invention provides an LED support which comprises a base body and a concave portion in the base body. A body wall of the concave portion is provided with a smooth condensing reflective surface, the undersurface of the concave portion is a light reflective surface used for placement of a chip, the undersurface is provided with a conducting portion connected with the chip, and the bottom of the conducting portion is provided with a heat radiating piece with the upper surface contacting with the conducting portion and the lower surface contacting with air. The LED support has a function of heat radiation, so that addition of heat radiating parts in an application process is omitted, and energy saving and environment protection are realized.
Description
Technical field
The present invention relates to the LED field, particularly a kind of led support.
Background technology
LED(Light Emitting Diode), light-emitting diode mainly is comprised of support, elargol, wafer, gold thread, five kinds of materials of epoxy resin.
LED be a kind of can be the semiconductor of luminous energy with electric energy conversion, it has changed the principle that the incandescent lamp tungsten filament is luminous and the electricity-saving lamp tricolor powder is luminous, and adopts electroluminescence.According to one's analysis, the characteristics of LED are very obvious, and the life-span is long, light efficiency is high, radiation is hanged down with low in energy consumption.The spectrum of white light LEDs almost all concentrates on visible light frequency band, and its luminous efficiency can surpass 150lm/W.
Led support, the bottom susceptor of LED lamp pearl before encapsulation on the basis of led support, fixedly entered chip, and the positive and negative electrode of burn-oning is once in package shape with packaging plastic again.
Led support generally be copper do (iron material is arranged also at present, aluminium and pottery etc.), because the conductivity of copper is fine, the leaded electrode that connects LED lamp pearl inside of its inside meeting, after LED lamp pearl is in package shape, the lamp pearl can take off from support, and the copper pin at lamp pearl two namely becomes the both positive and negative polarity of lamp pearl, is used for being welded to LED light fixture or other LED finished product.
In the prior art, led support has three-decker, the first plastic layer, middle conductting layer, the second plastic layer, and heat radiation need to add mechanism in addition, and, having that light-emitting area is large not, angle is large not, needs other radiation fin, cost is higher.
Summary of the invention
The present invention proposes a kind of led support and LED illuminating part, and having solved needs other radiation fin, the problem that cost is higher.
Technical scheme of the present invention is achieved in that
The invention discloses a kind of led support, comprise the recess in base body and the described base body, the body wall of described recess has smooth spotlight camber, the bottom surface of described recess is for being used for the light reflection surface of chip placement, described bottom surface has the conducting portion that is connected with described chip, described conducting portion bottom has fin, and the upper surface of described fin contacts with conducting portion, and lower surface contacts with air.
In led support of the present invention, described fin is copper sheet.
In led support of the present invention, described bottom surface has silver coating.
In led support of the present invention, described fin thickness is: 0.1～0.3mm.
In led support of the present invention, described fin thickness is: 0.25mm.
The invention discloses a kind of LED illuminating part, comprise substrate and be distributed in plurality of LEDs luminescence unit on the substrate, described LED luminescence unit has above-mentioned led support.
In LED illuminating part of the present invention, described plurality of LEDs luminescence unit is evenly distributed on described substrate.
In LED illuminating part of the present invention, described LED luminescence unit has 8 at row to direction.
In LED illuminating part of the present invention, described LED luminescence unit power is not higher than 0.5W.
Implement a kind of led support of the present invention and LED illuminating part, have following useful technique effect:
Difference is that prior art need to add thermal component in addition, and the technical program carries heat sinking function, exempts and add thermal component, energy-conserving and environment-protective in application procedures.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, accompanying drawing in the following describes only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the vertical view of LED luminescence unit of the present invention;
Fig. 2 is the profile of the led support on the A-A direction among Fig. 1;
Fig. 3 is the vertical view of a kind of LED illuminating part of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
See also Fig. 1 and Fig. 2, embodiments of the invention, a kind of led support 50 comprises: base body 1, recess 5, light reflection surface 8, spotlight camber 10, fin 12, conducting line 15, light-emitting diode chip for backlight unit 20.
Wherein, base body 1 has recess 5, the body wall of recess 5 has smooth spotlight camber 10, the bottom surface of recess 5 is for being used for placing the light reflection surface 8 of light-emitting diode chip for backlight unit 20, the bottom surface has the conducting portion that is connected with light-emitting diode chip for backlight unit 20, the conducting portion bottom has fin 12, and the upper surface of fin 12 contacts with conducting portion, and lower surface contacts with air.
Further, fin 12 is copper sheet, and the bottom surface of recess 5 has silver coating.
Recess 5 is bowl-shape, and the bottom is for being used for light-emitting diode chip for backlight unit 20 placements, conducting, reflection, weld zone; Be spotlight camber 10 all around.
Further, fin 12 thickness are: 0.1～0.3mm.Preferably, fin 12 thickness are: 0.25mm.
Wherein, base body 1 has plastic cement section and conducting portion, and plastic cement section adopts resistant to elevated temperatures PPA material, and conducting portion adopts thermal conductivity to reach well the C194 copper material of corrosion resistance.
The course of work of this led support 50 is: after powering up startup, light-emitting diode chip for backlight unit 20 begins heating, and heat is radiated in the ambient air, thereby has independently finished heat radiation through the overheated fin 12 that conducts to the conducting portion bottom, need not other thermal component.
See also Fig. 3, a kind of LED illuminating part 100, comprise substrate 101 and be distributed in plurality of LEDs luminescence unit 102 on the substrate, LED luminescence unit 102 has above-mentioned led support 50.
Plurality of LEDs luminescence unit 102 is evenly distributed on substrate 101.
Implement a kind of led support of the present invention and LED illuminating part, have following useful technique effect:
Difference is that prior art need to add thermal component in addition, and the technical program carries heat sinking function, exempts and add thermal component, energy-conserving and environment-protective in application procedures.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. led support, comprise the recess in base body and the described base body, the body wall of described recess has smooth spotlight camber, the bottom surface of described recess is for being used for the light reflection surface of chip placement, described bottom surface has the conducting portion that is connected with described chip, it is characterized in that, described conducting portion bottom has fin, the upper surface of described fin contacts with conducting portion, and lower surface contacts with air.
2. led support according to claim 1 is characterized in that, described fin is copper sheet.
3. according to claim 1 to 2 each described led supports, it is characterized in that described bottom surface has silver coating.
4. according to claim 1 to 2 each described led supports, it is characterized in that described fin thickness is: 0.1～0.3mm.
5. led support according to claim 4 is characterized in that, described fin thickness is: 0.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100327733A CN103117351A (en) | 2013-01-28 | 2013-01-28 | LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100327733A CN103117351A (en) | 2013-01-28 | 2013-01-28 | LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103117351A true CN103117351A (en) | 2013-05-22 |
Family
ID=48415669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100327733A Pending CN103117351A (en) | 2013-01-28 | 2013-01-28 | LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103117351A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008244143A (en) * | 2007-03-27 | 2008-10-09 | Toshiba Corp | Method of manufacturing semiconductor light-emitting device |
| CN202259416U (en) * | 2011-09-20 | 2012-05-30 | 深圳市长盈精密技术股份有限公司 | Backlight LED (Light-emitting Diode) radiation bracket |
| CN202434565U (en) * | 2011-12-15 | 2012-09-12 | 深圳市长盈精密技术股份有限公司 | LED (light emitting diode) support with electrically isolated thermal path |
-
2013
- 2013-01-28 CN CN2013100327733A patent/CN103117351A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008244143A (en) * | 2007-03-27 | 2008-10-09 | Toshiba Corp | Method of manufacturing semiconductor light-emitting device |
| CN202259416U (en) * | 2011-09-20 | 2012-05-30 | 深圳市长盈精密技术股份有限公司 | Backlight LED (Light-emitting Diode) radiation bracket |
| CN202434565U (en) * | 2011-12-15 | 2012-09-12 | 深圳市长盈精密技术股份有限公司 | LED (light emitting diode) support with electrically isolated thermal path |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent for invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 516000, Guangdong County, Huizhou province Boluo County town, wind hill village committee on the Wai group Applicant after: Liang Jianzhong Address before: 516000, Guangdong County, Huizhou province Boluo County town, wind hill village committee on the Wai group Applicant before: Liang Jianzhong |
|
| CB03 | Change of inventor or designer information |
Inventor after: Liang Jianzhong Inventor before: Liang Jianzhong |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130522 |