CN103116119A - Test board based on hyper memory (HM) 276 stack-type electronic products and test method thereof - Google Patents

Test board based on hyper memory (HM) 276 stack-type electronic products and test method thereof Download PDF

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Publication number
CN103116119A
CN103116119A CN2011103660781A CN201110366078A CN103116119A CN 103116119 A CN103116119 A CN 103116119A CN 2011103660781 A CN2011103660781 A CN 2011103660781A CN 201110366078 A CN201110366078 A CN 201110366078A CN 103116119 A CN103116119 A CN 103116119A
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test
panel
data
tested
master control
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CN2011103660781A
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高洁
樊友诚
邢方圆
朱英
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Shanghai Aerospace Measurement Control Communication Institute
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Shanghai Aerospace Measurement Control Communication Institute
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Priority to CN2011103660781A priority Critical patent/CN103116119A/en
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Abstract

The invention relates to a testing device of satellite electronic products and discloses a test board based on hyper memory (HM) 276 stack-type electronic products. The invention further relates to a test method of the test board of the electronic products. Control and data information flows are sent to tested boards [109] through a test server [110] and a main control panel [108]. Data states on an HM 276 control bus [102] and data interaction states of the tested boards [109] are observed. Meanwhile, multiple blocks of the tested boards [109] can be in mutual connection through the test board [101] to carry out the control and data communication test of multiple boards. The problems of security flaws based on existing HM 276 stack-type electronic products and bad spread ability of the test are resolved. The test board based on the HM 276 stack-type electronic products has the advantages of being capable of improving safety and efficiency of the test of the stack-type electronic products, effectively reducing test cost and improving test efficiency.

Description

Test board and method of testing thereof based on the stacked electronic product of HM276
Technical field
The present invention relates to the testing apparatus of satellite electron product, especially a kind of test board based on the stacked electronic product of HM276.The invention still further relates to the method for testing of this electronic product test board.
Background technology
Adopt HM276 from the cabinet of the stacked structure of nested electric connector, because it has broken through the traditional design theory that adds casing with front baffle, loaded down with trivial details casing and framework latch mechanism have been removed, each module framework is both as the fixed frame of module board, can substitute the casing of complete machine again, thereby greatly reduce the volume and weight of complete machine, therefore widespread use on the satellite electron product.
Yet due to its stacked characteristic, make debugging and test the time can't measure the signal at its back side, and many flaggies folded after, the signal of the circuit board in middle layer can't be measured, no matter be veneer or complete machine, the measurement of signal is all an extremely difficult thing.Simultaneously, internal resistance was just surveyed in the test of veneer in the past, then just be combined into the test that complete machine carries out communication and function, in case break down, often needing to expend larger manpower and time carries out mistake and searches and correct, need plug veneer repeatedly in process, very easily cause bending and the short circuit of contact pin, burning apparatus appears in serious situation.
The present invention is exactly a kind of test platform and the technology in order to address the above problem.Do not find at present explanation or the report of similar correlation technique, not yet collect both at home and abroad similarly data yet.
Summary of the invention
In order to solve existing security flaw and the poor problem of test coverage based on the stacked electronic product test of HM276, improve Security of test and the efficiency of stacked electronic product, the object of the present invention is to provide a kind of test board based on the stacked electronic product of HM276.In test process, utilize the particular design of platform of the present invention, solved safety, test problem easily, solved the problem of veneer or complete machine multi-mode test difficulty and fault isolation, investigation poor efficiency.
In order to solve the deficiencies in the prior art, the object of the invention on the other hand, a kind of method of testing of the test board based on the stacked electronic product of HM276 also is provided, a kind of method of testing of this type systematic is provided, has solved convenience, safety, the accurate test problem of the stacked electronic product of HM276.
In order to reach the foregoing invention purpose, the present invention is that the technical scheme that its technical matters of solution adopts is to provide a kind of test board based on the stacked electronic product of HM276, and this device comprises:
A test board is equipped with removable slide block on it, movable HM276 plug parts are installed on removable slide block, is used for connecting tested test plate (panel) and HM276 control bus; External power supply is connected with the power supply post, is used for the power supply to tested test plate (panel), and the voltage and current monitoring; Be provided with the bus test round on test board, be used for connect oscillograph and voltage table, and by movable HM276 plug parts and HM276 control bus be connected test plate (panel) and be connected; On the movable HM276 plug parts of the power supply input of test board, master control borad is installed; Master control borad is used for controlling whole test board, be connected with integrated electronics product test server by test cable, receive the test vector of testing server, complete control and data communication to tested test plate (panel) by the HM276 control bus, observation test result on testing server, and complete the analysis of data; Testing apparatus is used for the signal of front or reverse side on tested test plate (panel) is measured and observed.
Another aspect of the present invention is to provide a kind of method of testing of the test board based on the stacked electronic product of HM276 for solving the problems of the technologies described above the technical scheme that adopts, comprise the steps:
Step 1 is carried out internal resistance measurement to tested test plate (panel), uses multimeter to measure at the corresponding positive-negative power point of bus test round;
Step 2 is carried out functional test to tested test plate (panel), and external power supply power to tested test plate (panel) by the power supply post, and whether observation voltage, electric current be in normal range;
Step 3, master control borad carries out initialization, calls the master control borad initializers at the testing server end, detects the front original state of master control borad test;
Step 4, according to address, data and the sequential requirement of tested test plate (panel), by testing server arrange that tested test plate (panel) needs the test vector type;
Step 5 to the server calls test vector, sends test vector by testing server to master control borad, comprises reading and writing data, special data read-write, the transmitting-receiving of control signal, AD test, the DA test of clock transmission, fixed address;
Step 6, master control borad receives and the transmitted test vector, tested test plate (panel) receives clock, data, address and the control signal that master control borad sends, through entering into the FPGA of Board Under Test after Bus isolation, completed sequential and the logical process of data by its FPGA, by the variation of testing apparatus Real Time Observation data, feedback data or directly export data; Feedback data is carried out the automaticdata comparison by master control borad; Directly the output data are by the testing apparatus Real-Time Monitoring;
Step 7, expansion connects the tested test plate (panel) of polylith, sends test vector by receiving the survey server to master control borad, and different test boards is read and write control, checks tested test plate (panel) shared bus whether to have conflict.
The present invention a kind of test board and method of testing thereof based on the stacked electronic product of HM276, owing to taking above-mentioned technical scheme, need not plug in the process of measuring, and send the polymorphic type test vector by testing server to master control borad, make the tester can complete quickly more test event within the shorter time, and can carry out veneer or the test of complete machine multi-mode, for fault isolation and investigation provide convenience, improve existing stacked electronic product test condition, increased substantially the system testing spreadability.
Measure method disclosed in this invention has certain versatility to the Security of test of the stacked electronic product of various models and spreadability aspect, can be applicable to the veneer performance test of like product.
The present invention is through the every experimental test in ground, prove that its technical scheme is effective, safe and reliable, solved existing security flaw and the poor problem of test coverage based on the stacked electronic product test of HM276, improve Security of test and the efficiency of stacked electronic product, obtain effective reduction testing cost, improve testing efficiency, avoid because testing the improper beneficial effects such as breaking-up that cause.
Description of drawings
Fig. 1 is the structured flowchart that the present invention is based on the test board of the stacked electronic product of HM276;
Fig. 2 is the process flow diagram that the present invention is based on the testing board method of the stacked electronic product of HM276.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is described in further detail:
Fig. 1 is first aspect present invention, a kind of based on the stacked electronic product test board of HM276, comprising: test board 101, HM276 control bus 102, movable HM276 plug parts 103, removable slide block 104, bus test round 105, power supply post 106, external power supply 107, master control borad 108, tested test plate (panel) 109, testing server 110 and testing apparatus 111.
As shown in the embodiment of Fig. 1, this device comprises:
Test board 101 is equipped with removable slide block 104, and movable HM276 plug parts 103 are installed on removable slide block 104, is used for connecting tested test plate (panel) 109 and HM276 control bus 102; Tested test plate (panel) 109 is connected with HM276 control bus 102 by movable HM276 plug parts 103; External power supply 107 is connected with power supply post 106, is used for the power supply to tested test plate (panel) 109, and the voltage and current monitoring; Be provided with bus test round 105 on test board 101, be used for connect oscillograph and voltage table, and by movable HM276 plug parts 103 and HM276 control bus 102 be connected test plate (panel) 109 and be connected; On the movable HM276 plug parts 103 of the power supply input of test board 101, master control borad 108 is installed; Master control borad 108 is used for controlling whole test board, be connected with integrated electronics product test server 110 by test cable, receive the test vector of testing server 110, complete control and data communication to tested test plate (panel) 109 by the HM276 control bus, observation test result on testing server 110, and complete the analysis of data.On 111 pairs of tested test plate (panel)s 109 of testing apparatus, the signal of front or reverse side is measured and is observed.The spacing of 15 to 45 centimetres is arranged between test board, can be convenient to use any testing apparatus 111 with this, the signal of front or reverse side on tested test plate (panel) 109 is measured and observed.
The below further is described the course of work of the present invention:
When needs are tested tested test plate (panel) 109, first utilize removable slide block 104 that it is arranged on position suitable on test board 101, then use activity HM276 plug parts 103 are connected to test board 101 with the bus of tested test plate (panel) 109, external power supply 107 is connected on power supply post 106, to tested test plate (panel) 109 power supplies, complete supply voltage and current monitoring to tested test plate (panel) 109, simultaneously the testing apparatuss such as oscillograph, voltage table are connected to bus test round 105, the variation of the signal of interest of the real-time tested test plate (panel) of observation.This device utilizes removable slide block 104 to complete tested test plate (panel) interconnected of different structure size, connect easily tested test plate (panel) 109 and HM276 control bus 102 by movable HM276 plug parts 103, complete control and the data communication of 108 of 109 of a plurality of tested test plate (panel)s, tested test plate (panel) 109 and master control borads; By bus test round 105 any one on test bus or a plurality of signal easily.After basic test is complete, testing requirement according to tested test plate (panel) 109, send test vector by 110 pairs of master control borads 108 of testing server, master control borad 108 receives and is transmitted to tested test plate (panel) 109, after tested test plate (panel) 109 receives test vector, feedback data can be sent to master control borad 108 to carry out the automaticdata comparison, perhaps data and waveform directly be exported to testing apparatus 111 by interface, by the special test equipment Real-Time Monitoring.
Fig. 2 is process flow diagram, and expression another aspect of the present invention is based on the method for testing of the stacked electronic product test board of HM276.This method of testing comprises the steps:
Step 1 is carried out internal resistance measurement to tested test plate (panel) 109, uses multimeter to measure at the corresponding positive-negative power point of bus test round 105;
Step 2 is carried out functional test to tested test plate (panel) 109, and external power supply 107 to tested test plate (panel) 109 power supplies, is observed voltage, electric current by power supply post 106 whether in normal range;
Step 3, master control borad 108 carries out initialization, calls master control borad 108 initializers at testing server 110 ends, detects the master control borad 108 front original states of test;
Step 4, according to address, data and the sequential requirement of tested test plate (panel) 109, by testing server 110 arrange that tested test plate (panel) 109 needs the test vector type;
Step 5 is called test vector to server 110, sends test vectors by testing server 110 to master control borad 108, comprises that clock sends, the transmitting-receiving of the reading and writing data of fixed address, special data read-write, control signal, AD test, DA test etc.;
Step 6, master control borad 108 receives and the transmitted test vector, tested test plate (panel) 109 receives clock, data, address and the control signal that master control borad 108 sends, through entering into the FPGA of Board Under Test 109 after Bus isolation, completed sequential and the logical process of data by its FPGA, by the variation of testing apparatus Real Time Observation data, feedback data or directly export data; Feedback data is carried out the automaticdata comparison by master control borad 108; Directly output is by testing apparatus 111 Real-Time Monitorings;
Step 7 can be expanded the tested test plate (panel) 109 of connection polylith, surveys server 110 to master control borad 108 transmission test vectors by receiving, and different test boards is read and write control, checks tested test plate (panel) 109 shared buses whether to have conflict.
In sum, when tested test plate (panel) 109 is tested, send test vectors by server 110 to master control borad 108, comprise that clock sends, the transmitting-receiving of the reading and writing data of fixed address, special data read-write, control signal etc.; Tested test plate (panel) receives clock, data, address and the control signal that master control borad sends, and through entering into the FPGA of Board Under Test after Bus isolation, is completed sequential and the logical process of data by its FPGA, by testing apparatus can the Real Time Observation data variation; Can expand simultaneously the tested test plate (panel) of connection polylith, send test vector by server to master control borad, different test boards is read and write control, check tested test plate (panel) shared bus whether to have conflict.
The present invention is for solving existing security flaw and the poor problem of test coverage based on the stacked electronic product test of HM276, the present invention adopts the veneer performance safety measuring technology based on the stacked electronic product test board of HM276, this technical scheme is comprised of internal bus HM276, master control borad and some combiners etc., and based on testing server, developed a kind of new veneer performance test methods, can for the tested test plate (panel) of difference in functionality, carry out unique vector test.With the test board based on the HM276 bus of different structure size, interconnected by test board, and can protect the contact pin of test board not bend, do not rupture, and greatly reduce the plug number of times of product connector; Tested veneer spacing can reach 45cm, is convenient to all kinds of testing apparatuss to signal measurement and the observation of test board.

Claims (3)

1. the test board based on the stacked electronic product of HM276, is characterized in that, this device comprises:
A test board is equipped with removable slide block on it, movable HM276 plug parts are installed on removable slide block, is used for connecting tested test plate (panel) and HM276 control bus; External power supply is connected with the power supply post, is used for the power supply to tested test plate (panel), and the voltage and current monitoring; Be provided with the bus test round on test board, be used for connect oscillograph and voltage table, and by movable HM276 plug parts and HM276 control bus be connected test plate (panel) and be connected; On the movable HM276 plug parts of the power supply input of test board, master control borad is installed, be used for controlling whole test board, be connected with integrated electronics product test server by test cable, receive the test vector of testing server, complete control and data communication to tested test plate (panel) by the HM276 control bus, observation test result on testing server, and complete the analysis of data; Testing apparatus is used for the signal of front or reverse side on tested test plate (panel) is measured and observed.
2. the test board of electronic product as claimed in claim 1, is characterized in that: the spacing of 15 to 45 centimetres is arranged between described test board.
3. the method for testing of the test board based on the stacked electronic product of HM276 as claimed in claim 1, is characterized in that, the method comprises the steps:
Step 1 is carried out internal resistance measurement to tested test plate (panel), uses multimeter to measure at the corresponding positive-negative power point of bus test round;
Step 2 is carried out functional test to tested test plate (panel), and external power supply power to tested test plate (panel) by the power supply post, and whether observation voltage, electric current be in normal range;
Step 3, master control borad carries out initialization, calls the master control borad initializers at the testing server end, detects the front original state of master control borad test;
Step 4, according to address, data and the sequential requirement of tested test plate (panel), by testing server arrange that tested test plate (panel) needs the test vector type;
Step 5 to the server calls test vector, sends test vector by testing server to master control borad, comprises reading and writing data, special data read-write, the transmitting-receiving of control signal, AD test, the DA test of clock transmission, fixed address;
Step 6, master control borad receives and the transmitted test vector, clock, data, address and control signal that master control borad sends, through entering into the FPGA of Board Under Test after Bus isolation, completed sequential and the logical process of data by its FPGA, by the variation of testing apparatus Real Time Observation data, feedback data or directly export data; Feedback data is carried out the automaticdata comparison by master control borad; Directly the output data are by the testing apparatus Real-Time Monitoring;
Step 7, expansion connects the tested test plate (panel) of polylith, sends test vector by receiving the survey server to master control borad, and different test boards is read and write control, checks tested test plate (panel) shared bus whether to have conflict.
CN2011103660781A 2011-11-17 2011-11-17 Test board based on hyper memory (HM) 276 stack-type electronic products and test method thereof Pending CN103116119A (en)

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CN2011103660781A CN103116119A (en) 2011-11-17 2011-11-17 Test board based on hyper memory (HM) 276 stack-type electronic products and test method thereof

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104505125A (en) * 2014-12-04 2015-04-08 中国科学院微电子研究所 Multichannel SRAM single-event test method and device
CN105093001A (en) * 2014-05-20 2015-11-25 中芯国际集成电路制造(上海)有限公司 Automatic analysis test system for characteristics of high-speed PLL and clock chip
CN106597169A (en) * 2016-12-26 2017-04-26 广州山锋测控技术有限公司 Measuring apparatus for electronic equipment
CN107422245A (en) * 2017-06-05 2017-12-01 安徽福讯信息技术有限公司 A kind of general-purpose circuit board Characteristics Detection system

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CN1556928A (en) * 2002-10-31 2004-12-22 ��ʽ���簮������� Connection unit, board mounting device to be measured, probe card, and device interface unit
CN201417298Y (en) * 2009-04-28 2010-03-03 普诚科技股份有限公司 Test circuit board

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CN1198817A (en) * 1996-08-09 1998-11-11 株式会社爱德万测试 Semiconductor device testing apparatus
US6351827B1 (en) * 1998-04-08 2002-02-26 Kingston Technology Co. Voltage and clock margin testing of memory-modules using an adapter board mounted to a PC motherboard
CN1477690A (en) * 2002-08-21 2004-02-25 南茂科技股份有限公司 Test method of complex semiconductor packaged structure
CN1556928A (en) * 2002-10-31 2004-12-22 ��ʽ���簮������� Connection unit, board mounting device to be measured, probe card, and device interface unit
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CN201417298Y (en) * 2009-04-28 2010-03-03 普诚科技股份有限公司 Test circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105093001A (en) * 2014-05-20 2015-11-25 中芯国际集成电路制造(上海)有限公司 Automatic analysis test system for characteristics of high-speed PLL and clock chip
CN104505125A (en) * 2014-12-04 2015-04-08 中国科学院微电子研究所 Multichannel SRAM single-event test method and device
CN104505125B (en) * 2014-12-04 2018-07-13 中国科学院微电子研究所 A kind of multichannel SRAM single-particles test method and device
CN106597169A (en) * 2016-12-26 2017-04-26 广州山锋测控技术有限公司 Measuring apparatus for electronic equipment
CN107422245A (en) * 2017-06-05 2017-12-01 安徽福讯信息技术有限公司 A kind of general-purpose circuit board Characteristics Detection system

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