CN103115719A - Resonance-type micro electromechanical system wing wind power sensor and manufacturing method thereof - Google Patents
Resonance-type micro electromechanical system wing wind power sensor and manufacturing method thereof Download PDFInfo
- Publication number
- CN103115719A CN103115719A CN2013100348477A CN201310034847A CN103115719A CN 103115719 A CN103115719 A CN 103115719A CN 2013100348477 A CN2013100348477 A CN 2013100348477A CN 201310034847 A CN201310034847 A CN 201310034847A CN 103115719 A CN103115719 A CN 103115719A
- Authority
- CN
- China
- Prior art keywords
- resonance
- electromechanical system
- detecting electrode
- micro electromechanical
- bar shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses a resonance-type micro electromechanical system wing wind power sensor and a manufacturing method thereof. The resonance-type micro electromechanical system wing wind power sensor comprises a substrate, an insulating layer, a bar-shaped detecting electrode, two bar-shaped driving electrodes, a resonance structure and a packaging cover plate. The insulating layer is formed on the substrate. The bar-shaped detecting electrode is formed on the insulating layer. The two bar-shaped driving electrodes are formed on the insulating layer and arranged on two sides of the bar-shaped detecting electrode. The resonance structure crosses above the two bar-shaped driving electrodes and is perpendicularly connected with the bar-shaped driving electrode. The packaging cover plate is formed on the insulating layer and packages the bar-shaped detecting electrode, the two bar-shaped driving electrodes and the resonance structure together. The resonance-type MEMS (micro-electromechanical systems) wing wind power sensor utilizes a resonance-type MEMS sensor as a wind power testing sensor, can greatly improve measuring accuracy and lower complexity of measuring equipment, and can be widely used. The manufacturing method thereof is fast and effective, and can compare and analyze a simulated result in real time and improve experimental precision and efficiency.
Description
Technical field
The present invention relates to wing wind sensor and semiconductor fabrication, be specifically related to a kind of resonance micro electromechanical system (Micro-Electro-Mechanical Systems, MEMS) wing wind sensor and preparation method thereof.
Background technology
In the development process of aircraft, aerofoil surface needs a large amount of wind sensors to carry out the detection of lift, turbulent flow and the gas flow of aircraft.Because traditional measuring method needs complicated measuring equipment, and be limited to measuring principle, cause the precision of measurement data to be restricted.
Usually the resonance frequency of MEMS resonator much larger than the mechanical vibration frequency, has the high speed dynamic response to air pressure change.The MEMS resonator uses the semiconductor fine process technology to be made as micro-electro-mechanical sensors, has good controllability and precision.Device size is less, and the subtle change of air pressure also can cause the variation that the device motion state is large, and therefore the detection for tiny signal has inherent advantages.
In addition, MEMS resonator volume is little, and is lightweight, and impact resistance is strong, and is insensitive to acceleration, minimum to the airflow on surface distribution influence of wing, can be arranged in a large number aerofoil surface, and the gas-condition that the wing zones of different is carried out is monitored.
The above-mentioned advantage that the MEMS baroceptor has makes its application potential in the test of wing wind-force huge, is expected to become the important method of obtaining corresponding experimental data.
Summary of the invention
The technical matters that (one) will solve
In view of this, fundamental purpose of the present invention is to provide a kind of resonant mode MEMS wing wind sensor.
(2) technical scheme
For achieving the above object, the invention provides a kind of resonance micro electromechanical system wing wind sensor, comprising: substrate 4; Be formed at the insulation course 3 on substrate 4; Be formed at the bar shaped detecting electrode 2 on insulation course 3; Be formed on insulation course 3 and be positioned at two bar shaped drive electrodes 8 of bar shaped detecting electrode 2 both sides; Be across resonance structure 1 vertical with bar shaped detecting electrode 2 on two bar shaped drive electrodes 8 and that do not join; And be formed on insulation course 3 encapsulation cover plate 5 that bar shaped detecting electrode 2, two bar shaped drive electrodes 8 and resonance structure 1 are packaged together.
For achieving the above object, the present invention also provides a kind of method of making resonance micro electromechanical system wing wind sensor, and the method comprises:
Step 1: prepare high resistant silicon chip substrate 4;
Step 2: wet oxygen growth silicon dioxide, LPCVD grown silicon nitride are as insulation course 3 on substrate 4;
Step 3: LPCVD monocrystalline silicon and heavy doping and graphical on insulation course 3, make drive electrode 8 and detecting electrode 2;
Step 4: sputter growing metal and graphical detecting electrode pressure welding point 7 and the drive electrode pressure welding point 9 of making;
Step 5: growth sacrifice layer, LPCVD polysilicon and heavy doping and the graphical resonance structure 1 of making;
Step 6: releasing sacrificial layer forms the resonator main structure;
Step 7: the encapsulation cover plate 5 of preparing to have via-hole array 6;
Step 8: with encapsulation cover plate 5 resonator main structure bondings.
(3) beneficial effect
Can find out from technique scheme, the present invention has following beneficial effect:
1, this resonant mode MEMS wing wind sensor provided by the invention, to use resonant mode MEMS sensor as the wind-force testing sensor, resonant mode MEMS wing wind sensor is when utilizing physical construction resonance, quality factor are because the air damping effect, a kind of pressure test device along with the atmospheric pressure variation, therefore resonant mode MEMS wing wind sensor can greatly improve the complexity that measuring accuracy reduces testing apparatus, and can widely apply; The method is effective fast, can be in real time and analog result be analyzed, improve accuracy and the efficient of experiment.
2, this resonant mode MEMS wing wind sensor provided by the invention uses the MEMS processing technology to make sensor, and technique simply is easy to batch production, high conformity, and precision is high, can realize the high-precision sensing performance.The minimum size of resonant mode wind sensor is convenient to its integrated and array.Due to resonant mode wind sensor resonance frequency far above the mechanical vibration frequency, so the resonant mode wind sensor also has the characteristics of quick response.
Description of drawings
Fig. 1 is the sectional view of resonant mode MEMS wing wind sensor provided by the invention;
Fig. 2 is the relative position relation figure of resonance structure 1 and bar shaped detecting electrode 2 in Fig. 1;
Fig. 3 is the vertical view of resonant mode MEMS wing wind sensor primary structure in Fig. 1;
Fig. 4 is the vertical view of resonant mode MEMS wing wind sensor encapsulation cover plate 5 in Fig. 1.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
This resonant mode MEMS wing wind sensor provided by the invention, to use resonant mode MEMS sensor as the wind-force testing sensor, resonant mode MEMS wing wind sensor is when utilizing physical construction resonance, quality factor are because the air damping effect, a kind of pressure test device along with the atmospheric pressure variation, therefore resonant mode MEMS wing wind sensor can greatly improve the complexity that measuring accuracy reduces testing apparatus, and can widely apply.The method is effective fast, can be in real time and analog result be analyzed, improve accuracy and the efficient of experiment.
As shown in Figure 1, Fig. 1 is the sectional view of resonant mode MEMS wing wind sensor provided by the invention, and this resonance micro electromechanical system wing wind sensor comprises: substrate 4; Be formed at the insulation course 3 on substrate 4; Be formed at the bar shaped detecting electrode 2 on insulation course 3; Be formed on insulation course 3 and be positioned at two bar shaped drive electrodes 8 of bar shaped detecting electrode 2 both sides; Be across resonance structure 1 vertical with bar shaped drive electrode 8 on bar shaped detecting electrode 2 and that join; And be formed on insulation course 3 encapsulation cover plate 5 that bar shaped detecting electrode 2, two bar shaped drive electrodes 8 and resonance structure 1 are packaged together.
Resonant mode MEMS wing wind sensor shown in Fig. 1, it is the both-end fixed support structure, the hanging structure that resonance structure 1 props up admittedly for both-end, described resonance structure 1 is hanging structure, described bar shaped detecting electrode 2 is positioned at described resonance structure 1 bottom and vertical with described resonance structure 1, and described resonance structure 1 forms capacitance structure with described bar shaped detecting electrode 2.Substrate 4 is high resistant silicon chips, and resonance structure 1 is polysilicon, uses silicon dioxide and silicon nitride to insulate between substrate 4 and upper-layer functionality layer.
Resonant mode MEMS wing wind sensor can equivalence be a second order resonator system, and quality factor produce respective change with the air damping variation.When working sensor, two bar shaped drive electrodes 8 add that direct current biasing drives signal with exchanging, and bar shaped detecting electrode 2 adds the direct current biasing signal.Exchanging under the driving signal function, resonance occurs in resonance structure 1, air damping is one of key factor that affects resonance structure 1 motion state, therefore air-damped variation causes the variation of resonance structure 1 motion state, can obtain air-damped variation, i.e. the variation of air pressure by the variation that detects resonance structure 1 motion state.The method of this detection wing wind-force, simple fast, extremely responsive to air pressure change, can realize accurate detection the fast.
Wherein, the material that described substrate 4 adopts is silicon chip or glass, the material that described insulation course 3 adopts is silicon dioxide or silicon nitride, it is perhaps the composite bed of silicon dioxide and silicon nitride, the material that described bar shaped detecting electrode 2 and described bar shaped drive electrode 8 adopts is a kind of in polysilicon, monocrystalline silicon or silit, and the material that described resonance structure 1 adopts is a kind of in monocrystalline silicon, polysilicon, silit, gallium nitride or gallium arsenide.
A wherein end at bar shaped detecting electrode 2 is manufactured with detecting electrode pressure welding point 7, and a wherein end of described bar shaped drive electrode 8 is manufactured with drive electrode pressure welding point 9.The material that described detecting electrode pressure welding point 7 and described drive electrode pressure welding point 9 adopts is a kind of in metal, metal alloy or high-doped zone.
The material that described encapsulation cover plate 5 adopts is silicon chip or glass sheet, also is manufactured with via-hole array 6 on described encapsulation cover plate 5, is used for being communicated with test environment, keeps sensor package shell internal gas pressure consistent with ambient pressure to be measured.Described via-hole array 6 is a kind of being made of adopting in ICP, laser or machine drilling.
This sensor is based on resonance principle work, and mode of resonance comprises lateral resonant mode, vertically mode of resonance or mode of resonance radially, adopts the MEMS fabrication techniques to form, and the quality factor of this sensor are determined by operating pressure.This sensor is two-end fixed beam structure, free beam structure, cantilever beam structure, disc structure, circular ring structure or wineglass structure.
To resonance micro electromechanical system wing wind sensor shown in Figure 4, the present invention also provides a kind of method of making resonance micro electromechanical system wing wind sensor based on Fig. 1, and the method comprises: step 1: prepare high resistant silicon chip substrate 4; Step 2: wet oxygen growth silicon dioxide, LPCVD grown silicon nitride are as insulation course 3 on substrate 4; Step 3: LPCVD monocrystalline silicon and heavy doping and graphical on insulation course 3, make drive electrode 8 and detecting electrode 2; Step 4: sputter growing metal and graphical detecting electrode pressure welding point 7 and the drive electrode pressure welding point 9 of making; Step 5: growth sacrifice layer, LPCVD polysilicon and heavy doping and the graphical resonance structure 1 of making; Step 6: releasing sacrificial layer forms the resonator main structure; Step 7: the encapsulation cover plate 5 of preparing to have via-hole array 6; Step 8: with encapsulation cover plate 5 resonator main structure bondings.
In said method, resonant mode MEMS wing wind sensor insulation course 3 silicon dioxide can use the modes such as dried oxygen, wet oxygen, PECVD, LPCVD or MBE to grow, and adopt wet oxygen growth silicon dioxide in the present embodiment.Insulation course 3 silicon nitrides can use the modes such as PECVD, LPCVD or MBE to grow, and adopt the LPCVD grown silicon nitride in the present embodiment.Resonance structure 1 can use the modes such as PECVD, LPCVD or MBE to grow, and adopts the LPCVD growing polycrystalline silicon in the present embodiment.Insulation course graphically can use the modes such as reactive ion etching (ICP), wet etching to complete, and adopts ICP in the present embodiment.Resonance structure 1 discharges and can use the modes such as wet etching, gas phase release to realize, adopts wet etching to discharge in the present embodiment.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (14)
1. a resonance micro electromechanical system wing wind sensor, is characterized in that, comprising:
Substrate (4);
Be formed at the insulation course (3) on substrate (4);
Be formed at the bar shaped detecting electrode (2) on insulation course (3);
Be formed at insulation course (3) and go up and be positioned at two bar shaped drive electrodes (8) of bar shaped detecting electrode (2) both sides;
Be across resonance structure (1) vertical with bar shaped drive electrode (8) on bar shaped detecting electrode (2) and that join; And
Be formed at the upper encapsulation cover plate (5) that two bar shaped drive electrodes (8), bar shaped detecting electrode (2) and resonance structure (1) are packaged together of insulation course (3).
2. resonance micro electromechanical system wing wind sensor according to claim 1, is characterized in that, the material that described substrate (4) adopts is silicon chip or glass.
3. resonance micro electromechanical system wing wind sensor according to claim 1, is characterized in that, the material that described insulation course (3) adopts is silicon dioxide or silicon nitride, is perhaps the composite bed of silicon dioxide and silicon nitride.
4. resonance micro electromechanical system wing wind sensor according to claim 1, is characterized in that, the material that described bar shaped detecting electrode (2) and described bar shaped drive electrode (8) adopt is a kind of in polysilicon, monocrystalline silicon or silit.
5. resonance micro electromechanical system wing wind sensor according to claim 1, is characterized in that, the material that described resonance structure (1) adopts is a kind of in monocrystalline silicon, polysilicon, silit, gallium nitride or gallium arsenide.
6. resonance micro electromechanical system wing wind sensor according to claim 1, it is characterized in that, described resonance structure (1) is hanging structure, described bar shaped detecting electrode (2) is positioned at described resonance structure (1) bottom and vertical with described resonance structure (1), and described resonance structure (1) forms capacitance structure with described bar shaped detecting electrode (2).
7. resonance micro electromechanical system wing wind sensor according to claim 1, it is characterized in that, a wherein end of described bar shaped detecting electrode (2) is manufactured with detecting electrode pressure welding point (7), and a wherein end of described bar shaped drive electrode (8) is manufactured with drive electrode pressure welding point (9).
8. resonance micro electromechanical system wing wind sensor according to claim 7, it is characterized in that, the material that described detecting electrode pressure welding point (7) and described drive electrode pressure welding point (9) adopt is a kind of in metal, metal alloy or high-doped zone.
9. resonance micro electromechanical system wing wind sensor according to claim 1, is characterized in that, the material that described encapsulation cover plate (5) adopts is silicon chip or glass sheet.
10. resonance micro electromechanical system wing wind sensor according to claim 1, it is characterized in that, also be manufactured with via-hole array (6) on described encapsulation cover plate (5), be used for being communicated with test environment, keep sensor package shell internal gas pressure consistent with ambient pressure to be measured.
11. resonance micro electromechanical system wing wind sensor according to claim 10 is characterized in that, described via-hole array (6) is a kind of being made of adopting in ICP, laser or machine drilling.
12. resonance micro electromechanical system wing wind sensor according to claim 1 is characterized in that, this sensor is two-end fixed beam structure, free beam structure, cantilever beam structure, circular ring structure, disc structure or wineglass structure.
13. resonance micro electromechanical system wing wind sensor according to claim 1, it is characterized in that, this sensor is based on resonance principle work, mode of resonance comprises lateral resonant mode, vertically mode of resonance or mode of resonance radially, adopt the MEMS fabrication techniques to form, the quality factor of this sensor are determined by operating pressure.
14. a method of making resonance micro electromechanical system wing wind sensor is characterized in that, the method comprises:
Step 1: prepare high resistant silicon chip substrate (4);
Step 2: grow silicon dioxide, LPCVD grown silicon nitride as insulation course (3) at the upper wet oxygen of substrate (4);
Step 3: in the upper LPCVD monocrystalline silicon of insulation course (3) and heavy doping and graphical, make detecting electrode (2) and drive electrode (8);
Step 4: sputter growing metal and graphical detecting electrode pressure welding point (7) and the drive electrode pressure welding point (9) of making;
Step 5: growth sacrifice layer, LPCVD polysilicon and heavy doping and the graphical resonance structure (1) of making;
Step 6: releasing sacrificial layer forms the resonator main structure;
Step 7: the encapsulation cover plate (5) of preparing to have via-hole array (6);
Step 8: with encapsulation cover plate (5) resonator main structure bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100348477A CN103115719A (en) | 2013-01-29 | 2013-01-29 | Resonance-type micro electromechanical system wing wind power sensor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100348477A CN103115719A (en) | 2013-01-29 | 2013-01-29 | Resonance-type micro electromechanical system wing wind power sensor and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103115719A true CN103115719A (en) | 2013-05-22 |
Family
ID=48414140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100348477A Pending CN103115719A (en) | 2013-01-29 | 2013-01-29 | Resonance-type micro electromechanical system wing wind power sensor and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103115719A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104614115A (en) * | 2015-01-30 | 2015-05-13 | 河海大学 | MEMS device for measuring water pressure in real time and measuring method thereof |
| CN108254106A (en) * | 2018-01-30 | 2018-07-06 | 中国科学院半导体研究所 | A kind of silicon silica glass silicon four-layer structure resonant mode MEMS pressure sensor preparation method |
| CN117168662A (en) * | 2023-11-03 | 2023-12-05 | 华景传感科技（无锡）有限公司 | Resonant pressure sensor and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5834646A (en) * | 1995-04-12 | 1998-11-10 | Sensonor Asa | Force sensor device |
| CN101162170A (en) * | 2007-11-20 | 2008-04-16 | 东南大学 | Static excitation resonator capacitor vibration pick-up structure |
| CN101348233A (en) * | 2008-09-09 | 2009-01-21 | 西安交通大学 | Microstructure resonant beam pressure sensor |
| CN102374909A (en) * | 2010-08-11 | 2012-03-14 | 中国科学院电子学研究所 | Micromachine-based electromagnetic excitation resonant pressure sensor |
| CN102507050A (en) * | 2011-10-11 | 2012-06-20 | 北京航空航天大学 | Stimulation and vibration pick integrated pressure sensor of electric heating stimulation-piezoresistance vibration pick resonance beam |
| KR20120127051A (en) * | 2011-05-13 | 2012-11-21 | (주)마이크로인피니티 | MEMS resonator |
-
2013
- 2013-01-29 CN CN2013100348477A patent/CN103115719A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5834646A (en) * | 1995-04-12 | 1998-11-10 | Sensonor Asa | Force sensor device |
| CN101162170A (en) * | 2007-11-20 | 2008-04-16 | 东南大学 | Static excitation resonator capacitor vibration pick-up structure |
| CN101348233A (en) * | 2008-09-09 | 2009-01-21 | 西安交通大学 | Microstructure resonant beam pressure sensor |
| CN102374909A (en) * | 2010-08-11 | 2012-03-14 | 中国科学院电子学研究所 | Micromachine-based electromagnetic excitation resonant pressure sensor |
| KR20120127051A (en) * | 2011-05-13 | 2012-11-21 | (주)마이크로인피니티 | MEMS resonator |
| CN102507050A (en) * | 2011-10-11 | 2012-06-20 | 北京航空航天大学 | Stimulation and vibration pick integrated pressure sensor of electric heating stimulation-piezoresistance vibration pick resonance beam |
Non-Patent Citations (2)
| Title |
|---|
| 樊尚春等: "热激励谐振式硅微结构压力传感器", 《航空学报》 * |
| 高晓童等: "热激励硅谐振式压力传感器的研制", 《仪表技术与传感器》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104614115A (en) * | 2015-01-30 | 2015-05-13 | 河海大学 | MEMS device for measuring water pressure in real time and measuring method thereof |
| CN108254106A (en) * | 2018-01-30 | 2018-07-06 | 中国科学院半导体研究所 | A kind of silicon silica glass silicon four-layer structure resonant mode MEMS pressure sensor preparation method |
| CN108254106B (en) * | 2018-01-30 | 2020-05-19 | 中国科学院半导体研究所 | Preparation method of silicon-glass-silicon four-layer structure resonant MEMS pressure sensor |
| CN117168662A (en) * | 2023-11-03 | 2023-12-05 | 华景传感科技（无锡）有限公司 | Resonant pressure sensor and preparation method thereof |
| CN117168662B (en) * | 2023-11-03 | 2024-01-12 | 华景传感科技（无锡）有限公司 | Resonant pressure sensor and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101968495B (en) | Cantilever beam acceleration transducer manufactured by micro-machining on single side of single silicon chip and method | |
| CN102297741B (en) | Silicon resonant air pressure sensor based on Micro-Electro-Mechanical Systems | |
| Wang et al. | Monolithic integration of pressure plus acceleration composite TPMS sensors with a single-sided micromachining technology | |
| CN109485011B (en) | MEMS resonant pressure sensor based on Si-Si-Si-glass wafer bonding technology and manufacturing process | |
| CN103335751B (en) | A kind of double-harmonic oscillator silicon micropressure sensor and preparation method thereof | |
| CN107478862B (en) | Quartz vibrating beam accelerometer sensitive chip based on gold bonding | |
| CN103983395B (en) | A kind of micropressure sensor and preparation thereof and detection method | |
| CN108254106B (en) | Preparation method of silicon-glass-silicon four-layer structure resonant MEMS pressure sensor | |
| CN103674355B (en) | A kind of floated force-sensing sensor chip eliminating encapsulation stress and preparation method thereof | |
| CN102374909A (en) | Micromachine-based electromagnetic excitation resonant pressure sensor | |
| CN101271124B (en) | L-beam piezoresistance type micro-accelerometer and production method thereof | |
| CN103557970B (en) | Electrostatic excitation/piezoresistance detection miniature silicon resonant pressure sensor and manufacturing method thereof | |
| CN102494813A (en) | Silicon micro-resonant mode pressure sensor based on differential motion structure with coupling beam | |
| CN105181231A (en) | Pressure sensor of packaging structure and preparation method thereof | |
| CN104058361A (en) | Processing method of integrated piezoresistive accelerometer and pressure meter which are based on prefabricated cavity SOI (silicon on insulator) substrate | |
| CN103518138A (en) | Method of fabricating an inertial sensor | |
| CN105043603A (en) | Capacitive pressure sensor provided with self-detection apparatus, and preparation method thereof | |
| CN103115719A (en) | Resonance-type micro electromechanical system wing wind power sensor and manufacturing method thereof | |
| CN103454345B (en) | Based on the marine biochemical matter monitoring sensor of CMUT and preparation thereof and measuring method | |
| CN105021846A (en) | Six-axis integrated miniature acceleration sensor and manufacturing method therefor | |
| CN103675346A (en) | Accelerometer and manufacturing process thereof | |
| CN204008693U (en) | A kind of hotting mask wind speed wind direction sensor | |
| CN112034204A (en) | Linked contact capacitance type acceleration sensitive chip and manufacturing method thereof | |
| CN104198762A (en) | Eight-beam symmetrical silicon micro-accelerometer | |
| CN101655368A (en) | Electromagnet driven gyroscope based on nanometer film quantum tunneling effect |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130522 |