CN103115700A - Mounting pressure test mechanism used for ball grid array (BGA) repair work - Google Patents
Mounting pressure test mechanism used for ball grid array (BGA) repair work Download PDFInfo
- Publication number
- CN103115700A CN103115700A CN 201110363390 CN201110363390A CN103115700A CN 103115700 A CN103115700 A CN 103115700A CN 201110363390 CN201110363390 CN 201110363390 CN 201110363390 A CN201110363390 A CN 201110363390A CN 103115700 A CN103115700 A CN 103115700A
- Authority
- CN
- China
- Prior art keywords
- bga
- pressure
- sliding
- mounting support
- stepping motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides a mounting pressure test mechanism used for ball grid array (BGA) repair work. The mounting pressure test mechanism used for the BGA repair work comprises a base and a guide rail mounting support, the guide rail mounting support and the base form an integral structure, a synchronous belt and a sliding rail are arranged on the guide rail mounting support, the upper end of the synchronous belt is connected with a stepping motor, and the lower end of the synchronous belt penetrates through a pulley. A printed circuit board (PCB) fixing mechanism is arranged on the base, and a sliding mounting support is perpendicularly arranged on the sliding rail and connected with the synchronous belt. A pressure sensor and a stepping motor controller are arranged on the upper portion of the sliding mounting support. The pressure sensor, the stepping motor controller and the stepping motor are connected through a wire, a BGA welding probe, a pressure detecting bar and a hot wind nozzle are arranged on the lower portion of the sliding mounting support by a connecting rod, the pressure detecting bar penetrates through the sliding mounting support and connected with the pressure sensor on the upper portion of the sliding mounting support, and an elastic element and the hot wind nozzle at the lower end of the pressure detecting bar can be contacted with a packaged BGA element simultaneously. The pressure sensor is utilized to control the stepping motor and avoids oversized or undersized pressure by BGA mounting.
Description
Technical field
The invention belongs to BGA reclamation work station structure field, be specifically related to a kind of placement pressure mechanism for testing for the BGA reclamation work.
Background technology
Development along with science and technology, large scale integrated circuit is used in all trades and professions widely, and the zone of the soldered elements on integrated circuit pcb board chip, integrated, the element of welding becomes increasingly complex, and the element of a lot of PCB all adopts the method for packing of BGA, its advantage is that package area is little, pin is many, and is powerful, and cost is low.But its shortcoming is also clearly, adopt exactly the pcb board of BGA welding method, one of them little chip breaks down, just may cause scrapping of monoblock PCB welded plate, as want to repair and to adopt identical method for packing, therefore arise at the historic moment in BGA reclamation work station, transfer to and adopt the pcb board of BGA encapsulation technology to reprocess, control cost greatly, and waste, extended the serviceable life of pcb board, but the placement pressure when mounting for the BGA potted element that robotization is controlled is moderate, cross conference and damage pcb board by pressure, too smallly may cause mounting failure.
Summary of the invention
The shortcoming that exists in order to overcome above-mentioned prior art the object of the present invention is to provide a kind of placement pressure mechanism for testing for the BGA reclamation work, has solved the excessive or too small problem of placement pressure when the BGA potted element mounts.
In order to achieve the above object, the present invention is by the following technical solutions:
a kind of placement pressure mechanism for testing for the BGA reclamation work, comprise base 2, be integrally formed the guide rail installation frame 12 of structure with base 2, be provided with Timing Belt 13 and slide rail 14 on guide rail installation frame 12, connection is connected in the upper end of Timing Belt 13 with stepper motor, pulley 16 is passed in the lower end, be provided with pcb board fixed mechanism 4 on base 2, sliding erecting frame 8 is vertically mounted on slide rail 14, and are connected connection with Timing Belt, pressure transducer 9 and controllor for step-by-step motor 15 are arranged on the top of sliding erecting frame 8, and pressure transducer 9, connect by wire 10 between controllor for step-by-step motor 15 and stepper motor 11, BGA welding probe 6, pressure detector bar 5 and hot-blast spray nozzle 1 are arranged on the bottom of sliding erecting frame 8 by connecting link 7, and pressure detector bar 5 passes the pressure transducer 9 that slides erecting frame 8 and its top and connects, flexible member is housed in pressure detector bar 5 lower ends and hot-blast spray nozzle 1 can touch encapsulation BGA element simultaneously.
Due to pressure detector bar 5 can be real-time monitoring BGA welding probe 6 on hot-blast spray nozzle 1 be applied to the pressure of BGA element, utilize pressure transducer to come the control step motor, when having avoided BGA to mount, pressure is excessive or too small.
Description of drawings
Accompanying drawing is apparatus of the present invention structural representation.
Description of reference numerals:
(1) hot-blast spray nozzle (2) base (3) adjustable support leg (4) PCB fixed mechanism (5) pressure detector bar (6) BGA welding probe (7) connecting link (8) slides erecting frame (9) pressure transducer (10) wire (11) stepper motor (12) guide rail installation frame (13) Timing Belt (14) slide rail (15) controllor for step-by-step motor (16) pulley
Embodiment
as shown in drawings, a kind of placement pressure mechanism for testing for the BGA reclamation work of the present invention, comprise base 2, be integrally formed the guide rail installation frame 12 of structure with base 2, be provided with Timing Belt 13 and slide rail 14 on guide rail installation frame 12, connection is connected in the upper end of Timing Belt 13 with stepper motor, pulley 16 is passed in the lower end, be provided with pcb board fixed mechanism 4 on base 2, sliding erecting frame 8 is vertically mounted on slide rail 14, and are connected connection with Timing Belt, pressure transducer 9 and controllor for step-by-step motor 15 are arranged on the top of sliding erecting frame 8, and pressure transducer 9, connect by wire 10 between controllor for step-by-step motor 15 and stepper motor 11, BGA welding probe 6, pressure detector bar 5 and hot-blast spray nozzle 1 are arranged on the bottom of sliding erecting frame 8 by connecting link 7, and pressure detector bar 5 passes the pressure transducer 9 that slides erecting frame 8 and its top and connects, along with sliding sliding up and down of erecting frame (8), flexible member is housed in pressure detector bar 5 lower ends and hot-blast spray nozzle 1 can touch encapsulation BGA element simultaneously.
Send electric signal by pressure transducer 9 along wire 10 and come the control step motor to controllor for step-by-step motor 15 after pressure detector bar 5 is experienced pressure, then slide erecting frame 8 by stepper motor 11 by Timing Belt 13 drives and slide up and down.
The principle of work of a kind of placement pressure mechanism for testing for the BGA reclamation work of the present invention is: the erecting frame 8 that slides that drives on Timing Belts 13 when stepper motor 11 mounts the BGA element from top to bottom, when hot-blast spray nozzle pushes the BGA element in the pcb board process, when pressure is excessive, the pressure that pressure detector bar 5 is experienced is passed to pressure transducer, pressure transducer 9 output electrical signals are to controllor for step-by-step motor 15, stop stepper motor 11 work by controllor for step-by-step motor 15 again, thereby reach the purpose of avoiding the excessive damage pcb board of pressure.
The above; only the embodiment of the inventive method; be not that the present invention is imposed any restrictions, the variation of every any simple modification of above embodiment being done according to technical solution of the present invention, structure replaces all still belonging in the protection domain of the technology of the present invention system.
Claims (1)
1. placement pressure mechanism for testing that is used for the BGA reclamation work, it is characterized in that: comprise base (2), and base (2) is integrally formed the guide rail installation frame (12) of structure, be provided with Timing Belt (13) and slide rail (14) on guide rail installation frame (12), the upper end of Timing Belt (13) is connected 11 with stepper motor) connect, pulley (16) is passed in the lower end, be provided with pcb board fixed mechanism (4) on base (2), sliding erecting frame (8) is vertically mounted on slide rail (14), and be connected 13 with Timing Belt) connect, pressure transducer (9) and controllor for step-by-step motor (15) are arranged on the top of sliding erecting frame (8), and pressure transducer (9), connect by wire (10) between controllor for step-by-step motor (15) and stepper motor (11), BGA welding probe (6), pressure detector bar (5) and hot-blast spray nozzle (1) are arranged on the bottom of sliding erecting frame (8) by connecting link (7), and pressure detector bar (5) passes the pressure transducer (9) that slides erecting frame (8) and its top and connects, slide up and down along with sliding erecting frame (8), flexible member is housed in pressure detector bar (5) lower end and hot-blast spray nozzle (1) can touch encapsulation BGA element simultaneously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110363390 CN103115700A (en) | 2011-11-16 | 2011-11-16 | Mounting pressure test mechanism used for ball grid array (BGA) repair work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110363390 CN103115700A (en) | 2011-11-16 | 2011-11-16 | Mounting pressure test mechanism used for ball grid array (BGA) repair work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103115700A true CN103115700A (en) | 2013-05-22 |
Family
ID=48414120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110363390 Pending CN103115700A (en) | 2011-11-16 | 2011-11-16 | Mounting pressure test mechanism used for ball grid array (BGA) repair work |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103115700A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105668326A (en) * | 2016-04-05 | 2016-06-15 | 常州光明包装机械有限公司 | Top pressing mechanism of winding machine |
| CN107860500A (en) * | 2017-11-13 | 2018-03-30 | 肇庆市高新区晓靖科技有限公司 | A kind of placement pressure test device of BGA repair workstations |
| CN109323788A (en) * | 2018-10-11 | 2019-02-12 | 中国电子科技集团公司第二研究所 | Contact pressure accurate detecting method |
-
2011
- 2011-11-16 CN CN 201110363390 patent/CN103115700A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105668326A (en) * | 2016-04-05 | 2016-06-15 | 常州光明包装机械有限公司 | Top pressing mechanism of winding machine |
| CN107860500A (en) * | 2017-11-13 | 2018-03-30 | 肇庆市高新区晓靖科技有限公司 | A kind of placement pressure test device of BGA repair workstations |
| CN109323788A (en) * | 2018-10-11 | 2019-02-12 | 中国电子科技集团公司第二研究所 | Contact pressure accurate detecting method |
| CN109323788B (en) * | 2018-10-11 | 2020-05-26 | 中国电子科技集团公司第二研究所 | Contact type pressure precision detection method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201749132U (en) | Test fixture | |
| CN101758031B (en) | Integrated circuit testing and sorting method and device thereof | |
| CN103048608A (en) | PCB (Printed Circuit Board) performance detection fixture | |
| CN203811714U (en) | Automatic testing tool for PCB boards | |
| CN103412212A (en) | PCB performance detection jig with positioning function | |
| CN103115700A (en) | Mounting pressure test mechanism used for ball grid array (BGA) repair work | |
| CN203535078U (en) | Continuity test fixture for plated-through hole on thick film hybrid integrated circuit module | |
| CN104914374A (en) | Device for detecting electrical performance of chips | |
| CN203367241U (en) | Power module PCB installation structure and power module | |
| CN210816323U (en) | Automatic testing arrangement of circuit board | |
| CN102072974A (en) | Clamp for power module reliability experiment | |
| CN201589822U (en) | GPS board card testing device before assembly | |
| CN203908748U (en) | Printed circuit board vibration test device | |
| CN202195797U (en) | Diode detecting device | |
| CN203092019U (en) | Electric energy meter neck board welding fixture | |
| CN105203708A (en) | BGA welding detection instrument and method | |
| CN205352964U (en) | Full -automatic cell -phone PCB board SMT paster quality detection device | |
| CN201886038U (en) | Test fixture for power module reliability | |
| CN209766399U (en) | Positioning assembly of shell in semiconductor packaging | |
| CN203636685U (en) | Clamp for X-ray detector | |
| CN203551737U (en) | Compact PCBA testing fixture apparatus | |
| CN107860500A (en) | A kind of placement pressure test device of BGA repair workstations | |
| CN203992707U (en) | A kind of chipset welder | |
| CN103325701A (en) | Installation method, installation structure and power module for power module PCB | |
| CN218856993U (en) | Optical lens aligning and clamping mechanism with multi-dimensional collision induction |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130522 |