CN103113604A - Method for improving interlaminar shear strength of medium/low-temperature cured prepreg by using polyurethane prepolymer - Google Patents
Method for improving interlaminar shear strength of medium/low-temperature cured prepreg by using polyurethane prepolymer Download PDFInfo
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- CN103113604A CN103113604A CN2013100310836A CN201310031083A CN103113604A CN 103113604 A CN103113604 A CN 103113604A CN 2013100310836 A CN2013100310836 A CN 2013100310836A CN 201310031083 A CN201310031083 A CN 201310031083A CN 103113604 A CN103113604 A CN 103113604A
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- 229920001730 Moisture cure polyurethane Polymers 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 46
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 46
- 238000002360 preparation method Methods 0.000 claims abstract description 26
- 239000000835 fiber Substances 0.000 claims abstract description 17
- 239000012948 isocyanate Substances 0.000 claims abstract description 17
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 238000013329 compounding Methods 0.000 claims abstract description 9
- 239000004744 fabric Substances 0.000 claims abstract description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 229920000570 polyether Polymers 0.000 claims abstract description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000004593 Epoxy Substances 0.000 claims description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 16
- 238000013035 low temperature curing Methods 0.000 claims description 13
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 claims description 12
- -1 liquefied mdi Chemical compound 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 9
- 238000012986 modification Methods 0.000 claims description 9
- 239000002313 adhesive film Substances 0.000 claims description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 8
- 150000003672 ureas Chemical class 0.000 claims description 8
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 6
- 229920003986 novolac Polymers 0.000 claims description 6
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 4
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 4
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 3
- 229940106691 bisphenol a Drugs 0.000 claims description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 239000002131 composite material Substances 0.000 abstract description 10
- 229920001971 elastomer Polymers 0.000 abstract 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 2
- 229930185605 Bisphenol Natural products 0.000 abstract 1
- 229920005862 polyol Polymers 0.000 abstract 1
- 150000003077 polyols Chemical class 0.000 abstract 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 18
- 239000000203 mixture Substances 0.000 description 7
- 238000001723 curing Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
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Abstract
The invention provides a method for improving interlaminar shear strength of medium/low-temperature cured prepreg by using polyurethane prepolymer. The method comprises the following steps: firstly, reacting isocyanate with polyether polyol according to a controllable ratio to obtain a terminal isocyanate polyurethane prepolymer; grafting the terminal isocyanate polyurethane prepolymer to a bisphenol type epoxy resin, and adding a mixed epoxy resin to obtain a modified epoxy resin matrix; uniformly mixing the modified epoxy resin matrix with a curing agent and an accelerant to obtain a resin system for prepreg; and finally, preparing the resin system into a rubber film, compounding the rubber film with reinforced fibers or fabrics so as to prepare the medium/low-temperature cured prepreg with excellent adhesiveness. The prepreg preparation process is reasonable, the bonding strength of the resin system and fiber is high, the interlaminar shear strength of the composite material is obvious improved, and the method is particularly suitable for low-temperature cured prepreg.
Description
Technical field
The present invention relates to field of compound material, relate in particular to the preparation method of low temperature curing prepreg interlaminar shear strength in a kind of base polyurethane prepolymer for use as improvement.
Background technology
Along with the maturation day by day of prepreg technology, prepreg is applied to the manufacturing of large-scale composite material member more and more widely, as wind power generation blade, automotive composite material member etc.Has unique advantage at aspects such as starting material, technique, production technology, suitabilities due to middle low temperature curing prepreg, especially can save the die cost of large-scale component, extend the mold use life-span, therefore middle low temperature curing prepreg is more and more favored.
Different from the thermal expansivity of mold material due to fiber, resin, matrix material is serious in the hot setting post shrinkage, inevitablely produces internal stress at material internal, easily cause the warpage of large-scale component.Reduce solidification value, can reduce the internal stress of matrix material, but to compare the hot setting matrix material lower due to cross-linked network density, middle low-temperature curing composite property is on the low side, and especially the interlaminar shear strength of matrix material is on the low side.Therefore in low-temperature curing, need to further improve the interlayer shear performance of matrix material in guaranteeing prepreg, improve the weather resistance of matrix material.
Summary of the invention
The objective of the invention is to be low temperature curing prepreg interfacial bond property problem on the low side in solving, the preparation method of low temperature curing prepreg interlaminar shear strength in improving by a kind of base polyurethane prepolymer for use as, utilize high bond strength and the shock-resistance of polyurethane modified epoxy resin, obtain the prepreg that a kind of resin and fiber have high-peeling strength and high interlaminar shear strength.
Main technical schemes of the present invention: (1) adds isocyanic ester and the polyether glycol molar ratio according to 2:1 ~ 4:3 in reactor, in 70 ℃ of reaction 4 ~ 6h, obtains isocyanate terminated base polyurethane prepolymer for use as; (2) isocyanate terminated base polyurethane prepolymer for use as and bisphenol-type epoxy resin are reacted 5 ~ 8h in the stirring tank of 60 ~ 100 ℃, then add blending epoxy to stir, obtain the epoxy resin-base of modification; (3) add solidifying agent and promoter component in above-mentioned modified epoxy matrix, mix the final vacuum deaeration, preparation epoxy resin for prepreg system; (4) adopt adhesive film machine to film above-mentioned epoxy-resin systems, then compound with fortifying fibre or fabric via compounding machine, prepare the good middle low temperature curing prepreg of cohesiveness.
Described isocyanic ester is one or more in diphenylmethanediisocyanate (MDI), liquefied mdi, tolylene diisocyanate (TDI), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI); Described polyether glycol is one or more in polyoxyethylene glycol or poly(propylene oxide).
The molecular weight of described isocyanate terminated base polyurethane prepolymer for use as is 1000 ~ 2500.
Described bisphenol-type epoxy resin matrix can be one or more in dihydroxyphenyl propane glycidyl ether, Bisphenol F glycidyl ether, dihydroxyphenyl propane D glycidyl ether; Described blending epoxy can be the mixed assemblage of bisphenol-type epoxy resin and novolac epoxy, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, glycidyl amine type epoxy resin.
Described isocyanate terminated base polyurethane prepolymer for use as is 5:100 ~ 15:100 with the massfraction ratio of all epoxy resin.
Described solidifying agent can be a kind of of Dyhard RU 100, modification Dyhard RU 100 or its combination, and described promotor can be one or more in carbamide derivative, imdazole derivatives.
With respect to 100 parts of epoxy resin, the mass fraction of described solidifying agent is 5 ~ 10 parts, and the mass fraction of described promotor is 1 ~ 5 part.
The middle low temperature curing prepreg that described cohesiveness is good, its solidification value are 80 ~ 120 ℃.
Effect of the present invention is, utilize urethane and epoxy resin compound, can form unique interpenetrating polymer networks (IPN) system, the IPN structure force mutual appearance and synergistic effect, the snappiness of urethane and good heat resistance and the cementability of epoxy resin are organically combined, make polyurethane-modified epoxy-resin systems have high-adhesive-strength, good shock-resistance and good lap shear strength, especially can be used for improving the adhesive property that carbon fiber strengthens prepreg, thereby give the high stripping strength of prepreg and good interlaminar shear strength.Effect of the present invention is more obvious for the interlaminar shear strength of the prepreg that lesser temps solidifies, and specifically sees Fig. 1.
Description of drawings
Fig. 1 is the interlaminar shear strength schematic diagram of different prepreg systems.
Embodiment
Below by specific embodiment, the present invention is done more detailed description:
Embodiment 1:
isophorone diisocyanate (IPDI) and the poly(propylene oxide) molar ratio according to 4:3 is added in reactor, in 70 ℃ of reaction 6h, obtain molecular weight and be 2500 isocyanate terminated base polyurethane prepolymer for use as, with 15 parts of (mass fractions, calculate take the final consumption of epoxy resin as 100 parts, down together) isocyanate terminated base polyurethane prepolymer for use as and dihydroxyphenyl propane tetraglycidel ether epoxy resin react 8h in the stirring tank of 60 ℃, then add dihydroxyphenyl propane tetraglycidel ether epoxy resin and glycidyl amine type epoxy resin to stir, obtain the epoxy resin-base of modification, add again 10 parts of dicy-curing agents and 5 parts of carbamide derivative promotor, mix the final vacuum deaeration, preparation epoxy resin for prepreg system.Adopt adhesive film machine to film above-mentioned resin system, then compound via compounding machine and fortifying fibre, preparation Unidirectional fiber prepreg, the prepreg that cuts is placed in mould, in 80 ℃ of cure under pressures 8 hours, obtain composite board, the test interlaminar shear strength is 81MPa.
Embodiment 2:
diphenylmethanediisocyanate (MDI) and the polyoxyethylene glycol molar ratio according to 5:3 is added in reactor, in 70 ℃ of reaction 5h, obtain molecular weight and be 1800 isocyanate terminated base polyurethane prepolymer for use as, 10 parts of isocyanate terminated base polyurethane prepolymer for use as and Bisphenol F tetraglycidel ether epoxy resin are reacted 7h in the stirring tank of 80 ℃, then add dihydroxyphenyl propane tetraglycidel ether epoxy resin and novolac epoxy to stir, obtain the epoxy resin-base of modification, add again 6 parts of modification dicy-curing agents and 3 parts of carbamide derivative promotor, mix the final vacuum deaeration, preparation epoxy resin for prepreg system.Adopt adhesive film machine to film above-mentioned resin system, then compound via compounding machine and enhanced fabrics, preparation carbon fibre fabric prepreg, the prepreg of cutting is placed in mould, in 100 ℃ of cure under pressures 3 hours, obtain composite board, the test interlaminar shear strength is 85MPa.
Embodiment 3:
toluene di-iso-cyanide ester (TDI) and the polyoxyethylene glycol molar ratio according to 2:1 is added in reactor, in 70 ℃ of reaction 4h, obtain molecular weight and be 1000 isocyanate terminated base polyurethane prepolymer for use as, 5 parts of isocyanate terminated base polyurethane prepolymer for use as and dihydroxyphenyl propane tetraglycidel ether epoxy resin are reacted 5h in the stirring tank of 100 ℃, then add dihydroxyphenyl propane tetraglycidel ether epoxy resin and novolac epoxy to stir, obtain the epoxy resin-base of modification, add again 5 parts of dicy-curing agents and 1 part of carbamide derivative promotor, mix the final vacuum deaeration, preparation epoxy resin for prepreg system.Adopt adhesive film machine to film above-mentioned resin system, then compound via compounding machine and fortifying fibre, preparation Unidirectional fiber prepreg, the prepreg of cutting is placed in mould, in 120 ℃ of cure under pressures 1.5 hours, obtain composite board, the test interlaminar shear strength is 87MPa.
Comparative Examples 1:
Dihydroxyphenyl propane tetraglycidel ether epoxy resin and glycidyl amine type epoxy resin are stirred in the reactor of 60 ℃, add again 10 parts of modification dicy-curing agents and 5 parts of carbamide derivative promotor, mix the final vacuum deaeration, preparation epoxy resin for prepreg system.Adopt adhesive film machine to film above-mentioned resin system, then compound via compounding machine and fortifying fibre, preparation Unidirectional fiber prepreg, the prepreg of cutting is placed in mould, in 80 ℃ of cure under pressures 8 hours, obtain composite board, the test interlaminar shear strength is 65MPa.
Comparative Examples 2:
Dihydroxyphenyl propane tetraglycidel ether epoxy resin and novolac epoxy are stirred in the reactor of 80 ℃, then add 6 parts of dicy-curing agents and 3 parts of carbamide derivative promotor, mix the final vacuum deaeration, preparation epoxy resin for prepreg system.Adopt adhesive film machine to film above-mentioned resin system, then compound via compounding machine and fortifying fibre, preparation carbon fibre fabric prepreg, the prepreg of cutting is placed in mould, in 100 ℃ of cure under pressures 3 hours, obtain composite board, the test interlaminar shear strength is 73MPa.
Comparative Examples 3:
Dihydroxyphenyl propane tetraglycidel ether epoxy resin and novolac epoxy are stirred in the reactor of 100 ℃,, then add 5 parts of dicy-curing agents and 1 part of carbamide derivative promotor, mix the final vacuum deaeration, preparation epoxy resin for prepreg system.Adopt adhesive film machine to film above-mentioned resin system, then compound via compounding machine and fortifying fibre, preparation Unidirectional fiber prepreg, the prepreg of cutting is placed in mould, in 120 ℃ of cure under pressures 1.5 hours, obtain composite board, the test interlaminar shear strength is 79MPa.
Claims (8)
1. the preparation method of low temperature curing prepreg interlaminar shear strength during a base polyurethane prepolymer for use as improves, it is characterized by, comprise the following steps: (1) adds isocyanic ester and the polyether glycol molar ratio according to 2:1 ~ 4:3 in reactor, in 70 ℃ of reaction 4 ~ 6h, obtain isocyanate terminated base polyurethane prepolymer for use as; (2) above-mentioned isocyanate terminated base polyurethane prepolymer for use as and bisphenol-type epoxy resin are reacted 5 ~ 8h in the stirring tank of 60 ~ 100 ℃, then add blending epoxy to stir, obtain the epoxy resin-base of modification; (3) add solidifying agent and promoter component in above-mentioned modified epoxy matrix, mix the final vacuum deaeration, preparation epoxy resin for prepreg system; (4) adopt adhesive film machine to film above-mentioned epoxy-resin systems, then compound with fortifying fibre or fabric via compounding machine, prepare the good middle low temperature curing prepreg of cohesiveness.
2. according to claim 1 preparation method, it is characterized in that: described isocyanic ester is one or more in diphenylmethanediisocyanate (MDI), liquefied mdi, tolylene diisocyanate (TDI), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IPDI); Described polyether glycol is one or more in polyoxyethylene glycol or poly(propylene oxide).
3. according to claim 1 preparation method, it is characterized in that: the molecular weight of described isocyanate terminated base polyurethane prepolymer for use as is 1000 ~ 2500.
4. according to claim 1 preparation method, it is characterized in that: described bisphenol-type epoxy resin is one or more in dihydroxyphenyl propane glycidyl ether, Bisphenol F glycidyl ether, dihydroxyphenyl propane D glycidyl ether; Described blending epoxy is the mixed assemblage of bisphenol-type epoxy resin and novolac epoxy, o-cresol formaldehyde epoxy resin, bisphenol-A phenolic epoxy resin, glycidyl amine type epoxy resin.
5. according to claim 1 preparation method is characterized in that: the massfraction of described isocyanate terminated base polyurethane prepolymer for use as and all epoxy resin is than being 5:100 ~ 15:100.
6. according to claim 1 preparation method is characterized in that: described solidifying agent can be one or more in Dyhard RU 100, modification Dyhard RU 100, and described promotor can be one or more in carbamide derivative, imdazole derivatives.
7. according to claim 1 preparation method, it is characterized in that: with respect to 100 parts of epoxy resin, the mass fraction of described solidifying agent is 5 ~ 10 parts, and the mass fraction of described promotor is 1 ~ 5 part.
8. according to claim 1 preparation method, it is characterized in that: the middle low temperature curing prepreg that described cohesiveness is good, its solidification value are 80 ~ 120 ℃.
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