CN103113094A - Broadband high-permeability ferrite raw material belt and method for manufacturing same into chip-inductor element - Google Patents
Broadband high-permeability ferrite raw material belt and method for manufacturing same into chip-inductor element Download PDFInfo
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- CN103113094A CN103113094A CN2013100873925A CN201310087392A CN103113094A CN 103113094 A CN103113094 A CN 103113094A CN 2013100873925 A CN2013100873925 A CN 2013100873925A CN 201310087392 A CN201310087392 A CN 201310087392A CN 103113094 A CN103113094 A CN 103113094A
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Abstract
The invention relates to a broadband high-permeability ferrite raw material belt and a production method thereof. The raw material belt comprises pre-sintering ferrite powder and an organic curtain coating system, wherein the pre-sintering ferrite powder comprise iron oxide, nickel oxide, copper oxide, zinc oxide, bismuth oxide and an additive; and the organic curtain coating system comprises a solvent, a dispersing agent, a bonding agent and a plasticizer. The LTCF (Low-Temperature Co-firing Ferrite) raw material belt of 65-75 microns, prepared by using the production method, is smooth in surface, compact when being sintered at about 900 DEG C and excellent in magnetic property of a sintering body; the primary permeability (100kHz) is greater than or equal to 450H/m; and the resistance is greater than or equal to 109omega.cm. A chip-inductor element which is manufactured by using the raw material belt has high inductance and quality factors, and meanwhile a low-temperature glass protecting coating is coated in the process that a silver paste circuit of the inductor element is printed, so that the element is prevented from failure caused by Ag diffusion when being used. Therefore, the broadband high-permeability ferrite raw material belt has great application prospects.
Description
The application divides an application, and the application number of original application is 201110224945.8, and the applying date is on August 6th, 2011, and invention and created name is " wideband high-magnetic-permeability ferrite teflon tape and production method thereof ".
Technical field
The present invention relates to belong to the technical field of magneticsubstance, specifically a kind of wideband high-magnetic-permeability ferrite teflon tape and make the method for chip inductor element.
Background technology
Inductance does not have hindrance function to galvanic current, and alternating current is had hindrance function.When passing through galvanic current in inductance, only present fixing magnetic line of force, not time to time change around it; When passing through alternating current in coil, will present the magnetic line of force of time to time change around it.This just makes the chip inductor element can be applied to high frequency nanohenry level inducer of mobile communication terminal etc.Chip-type laminated inductor dimensions is little, high, the short and small frivolous miniaturization that is conducive to circuit of integrated level; Magnetic circuit closed, the components and parts around can not disturbing also can not be closed on the interference of components and parts, are conducive to the high-density installation of components and parts; Integral structure, reliability is high; Thermotolerance, weldability are good; Shape is regular, is suitable for automatization surface installation and produces.Need high initial magnetoconductivity for Ferrite Material, high-curie temperature, but these two is conflicting, and the existing ferrite raw material band for chip inductor production on market is difficult to when keeping high initial magnetoconductivity, and Curie temperature is also high.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of wideband high-magnetic-permeability ferrite teflon tape, and it is suitable for Application and preparation in the ferrite raw material band of laminated inductive, and produces laminated inductive with this kind raw material band.
For solving the problems of the technologies described above, the invention provides a kind of wideband high-magnetic-permeability ferrite teflon tape, be characterized in: the mass percent that its material component and each component account for the raw material total amount is respectively: pre-burning ferrite powder 40%, organic curtain coating system 60%.
Particularly, described pre-burning ferrite powder comprises: ferric oxide, nickel oxide, cupric oxide, zinc oxide, bismuth oxide and additive, and the molar mass percentage composition of each component is: Fe
2O
347-53%; NiO18-25%; CuO2-10%; ZnO6-21%; Bi
2O
32-5%, described additive each component and each component account for ferric oxide, nickel oxide, cupric oxide, zinc oxide, bismuth oxide major ingredient weight percent V
2O
50-4wt%; Co
2O
30-3wt%; MnO0-4wt%; MoO
30-1wt%.
Described organic curtain coating system comprises: solvent, dispersion agent, binding agent and softening agent; The mass percent that each component that forms described organic curtain coating system is occupied machine curtain coating system total amount is respectively: solvent 85%, dispersion agent 1-5%, binding agent 3-10%, softening agent 1-5%.
Further, described solvent comprises methyl ethyl ketone, ethanol and Virahol; Dispersion agent is Viscotrol C, and binding agent is polyvinyl butyral acetal, and softening agent is dibutyl phthalate; Wherein, the weight percent that each composition in solvent accounts for the solvent total amount is respectively: methyl ethyl ketone 10-30%, ethanol 30-50%, Virahol 30-50%.
The preparation method of above-mentioned raw material band comprises the steps:
A). take respectively Fe
2O
3, NiO, CuO, ZnO, Bi
2O
3(wherein the molar mass percentage composition of each component is: Fe
2O
347-53mol%; NiO18-25mol%; CuO2-10mol%; ZnO6-21mol%; Bi
2O
32-5mol%), the pre-burning of sieving of wet-milling post-drying, the ferrite powder after pre-burning adds the wet-milling of additive secondary to obtain the pre-burning ferrite powder.
B). take above-mentioned prepared pre-burning ferrite powder by proportioning, after adding solvent and dispersion agent ball milling 3-6h, add binding agent and softening agent ball milling 3-6h, flow casting molding after froth in vacuum obtains low temperature co-fired ferrite raw material band after drying.
Utilize the preparation method of above-mentioned manufacturing chip inductance element from low-temperature cofired ferrite raw material belt, comprise the steps:
A). according to the structure design of chip inductor, accurate positional punch on the ferrite raw material band that makes.
B). adopt silk screen print method, will fill up the silver slurry in through hole.According to the circuit layout requirement, printed silver slurry conductor fig, cause the Ag diffusion for fear of excess Temperature in the device use procedure simultaneously on raw material band, republishes a layer low temperature glass supercoat at silver slurry patterned surface, prevents that the Ag diffusion from causing component failure.
C). with the raw material band that the prints number of plies and the order by design in advance, put into successively tight lamination mould, wait static pressure to form a complete multilager base plate base substrate.
D). the base substrate that will wait static pressure to process according to design requirement is divided into specific fritter.
E). the specific fritter after cutting is put into stove, is warming up to 450 ℃ of insulation 3h binder removals with 2 ℃/min, then is raised to 900 ℃ of insulation 3h with 2.5 ℃/min from 450 ℃ and carries out sintering.Control 10h in temperature-fall period and be down to 250 ℃, then with the stove naturally cooling.
F). after the silver-colored end-blocking of the brush of the electronic component after sintering is made electrode, just make laminated inductive element of the present invention.
The present invention carves ring, is warming up to 450 ℃ of insulation 3h binder removals with 2 ℃/min prepared raw material band, then is raised to 900 ℃ of insulation 3h with 2.5 ℃/min from 450 ℃ and carries out sintering.Control 10h in temperature-fall period and be down to 250 ℃, then with the stove naturally cooling, the sintered compact performance is tested.And the chip inductor element of making is carried out performance test.
The technique effect that the present invention has:
(1) ferrite raw material band of the present invention has the performance of following excellence: high initial magnetoconductivity, high quality factor, high-curie temperature.The chip inductor element made from above-mentioned raw material band has high inductance and quality factor, has applied the low temperature glass supercoat simultaneously in the printed silver slurry circuitry processes of inductance element, has prevented the component failure that the in use diffusion of Ag of device causes.
(2) the raw material band surfacing of the present invention's preparation, smooth, individual layer standard thickness 65-75 μ m; The sintering temperature of raw material band is low, 900 ℃ of left and right;
(3) percent of firing shrinkage 15-18%(X, Y-axis), the 15-18%(Z axle), can and Au, the low melting point metals such as Ag wirings is burnt altogether, as shown in Figure 1;
(4) raw material band has excellent magnetic performance: magnetic permeability (100kHZ) height 〉=450H/m, resistivity 〉=10
9Ω cm;
(5) raw material band sintered compact crystal grain tiny, be evenly distributed, void content is low, compact structure, as shown in Figure 2.
Description of drawings
For content of the present invention is more likely to be clearly understood, below the specific embodiment and by reference to the accompanying drawings of basis, the present invention is further detailed explanation, wherein
SEM figure is burnt in Fig. 1 raw material band of the present invention and silver electrode wiring altogether;
Fig. 2 low temperature co-baking NiCuZn ferrite raw material band of the present invention microtexture SEM figure.
Embodiment
The present invention is described in detail below in conjunction with drawings and Examples:
Embodiment 1:
Table 1 illustrates each component content of the specific embodiment of the invention 1.Take the pre-burning ferrite powder according to table 1 formula, after adding solvent and dispersion agent ball milling 3-6h, add binding agent and softening agent ball milling 3-6h, flow casting molding after froth in vacuum obtains low temperature co-fired ferrite raw material band of the present invention after drying.
The present invention carves ring to prepared raw material band and makes the standard testing ring, is warming up to 450 ℃ of insulation 3h binder removals with 2 ℃/min, then is raised to 900 ℃ of insulation 3h with 2.5 ℃/min from 450 ℃ and carries out sintering.Control 10h in temperature-fall period and be down to 250 ℃, then with the stove naturally cooling, the sintered compact performance is tested (as table 2).
The content (wt%) of each component of the low temperature co-fired ferrite raw material band of table 1
The performance of the low temperature co-fired ferrite raw material band of table 2 sintered compact
Embodiment 2
Table 4 illustrates each component content of the specific embodiment of the invention 2.Take the pre-burning ferrite powder according to table 4 formula, after adding solvent and dispersion agent ball milling 3-6h, add binding agent and softening agent ball milling 3-6h, flow casting molding after froth in vacuum obtains low temperature co-fired ferrite raw material band of the present invention after drying.
The present invention carves ring, is warming up to 450 ℃ of insulation 3h binder removals with 2 ℃/min prepared raw material band, then is raised to 900 ℃ of insulation 3h with 2.5 ℃/min from 450 ℃ and carries out sintering.Control 10h in temperature-fall period and be down to 250 ℃, then with the stove naturally cooling, the sintered compact performance is tested (as table 5).
The content (wt%) of each component of the low temperature co-fired ferrite raw material band of table 4
The performance of the low temperature co-fired ferrite raw material band of table 5 sintered compact
Obviously, above-described embodiment is only for example of the present invention clearly is described, and is not to be restriction to embodiments of the present invention.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give all embodiments exhaustive.And these belong to apparent variation or the change that spirit of the present invention extended out and still are among protection scope of the present invention.
Claims (3)
1. wideband high-magnetic-permeability ferrite teflon tape, it is characterized in that: the mass percent that the material component that it comprises and each component account for the raw material total amount is respectively: pre-burning ferrite powder 40%, organic curtain coating system 60%;
Ferric oxide, nickel oxide, cupric oxide, zinc oxide, bismuth oxide and additive, and the molar mass percentage composition of each component is: Fe
2O
347-53%; NiO 18-25%; CuO 2-10%; ZnO 6-21%; Bi
2O
32-5%, described additive each component and each component account for ferric oxide, nickel oxide, cupric oxide, zinc oxide, bismuth oxide major ingredient weight percent V
2O
50-4wt%; Co
2O
30-3wt%; MnO 0-4wt%; MoO
30-1wt%;
Described organic curtain coating system comprises: solvent, dispersion agent, binding agent and softening agent;
The mass percent that each component that forms described organic curtain coating system is occupied machine curtain coating system total amount is respectively: solvent 85%, dispersion agent 1-5%, binding agent 3-10%, softening agent 1-5%;
Described solvent is methyl ethyl ketone, ethanol and Virahol;
The mass percent that each composition in solvent accounts for the solvent total amount is respectively: methyl ethyl ketone 10-30%, ethanol 30-50%, Virahol 30-50%;
Described softening agent is dibutyl phthalate.
2. the production method of described raw material band claimed in claim 1, is characterized in that comprising the steps:
A). by taking respectively Fe
2O
3, NiO, CuO, ZnO, Bi
2O
3, the pre-burning of sieving of wet-milling post-drying, the ferrite powder after pre-burning adds the wet-milling of additive secondary to obtain the pre-burning ferrite powder;
B). take above-mentioned prepared pre-burning ferrite powder, after adding solvent and dispersion agent ball milling 3-6h, add binding agent and softening agent ball milling 3-6h, flow casting molding after froth in vacuum obtains low temperature co-fired ferrite raw material band after drying.
3. a preparation method who utilizes the described raw material band of the claims 1 to make the chip inductor element, comprise the steps:
A). according to the structure design of chip inductor, accurate positional punch on the ferrite raw material band that makes;
B). adopt silk screen print method, will fill up the silver slurry in through hole; According to the circuit layout requirement, printed silver slurry conductor fig on raw material band republishes a layer low temperature glass supercoat at silver slurry patterned surface;
C). with the raw material band that the prints number of plies and the order by design in advance, put into successively tight lamination mould, wait static pressure to form a complete multilager base plate base substrate;
D). the base substrate that will wait static pressure to process according to design requirement is divided into specific fritter;
E). the specific fritter after cutting is put into stove, is warming up to 450 ℃ of insulation 3h binder removals with 2 ℃/min, then is raised to 900 ℃ of insulation 3h with 2.5 ℃/min from 450 ℃ and carries out sintering; Control 10h in temperature-fall period and be down to 250 ℃, then with the stove naturally cooling;
F). after the silver-colored end-blocking of the brush of the electronic component after sintering is made electrode, just make the laminated inductive element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310087392.5A CN103113094B (en) | 2011-08-06 | 2011-08-06 | Broadband high-permeability ferrite raw material belt and method for manufacturing same into chip-inductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310087392.5A CN103113094B (en) | 2011-08-06 | 2011-08-06 | Broadband high-permeability ferrite raw material belt and method for manufacturing same into chip-inductor element |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110224945 Division CN102390985B (en) | 2011-08-06 | 2011-08-06 | Broadband and high-magnetic-permeability ferrite teflon tape and production method thereof |
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| Publication Number | Publication Date |
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| CN103113094A true CN103113094A (en) | 2013-05-22 |
| CN103113094B CN103113094B (en) | 2014-04-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103951403A (en) * | 2014-04-07 | 2014-07-30 | 深圳市力磁电子有限公司 | Low-temperature matching cofired method of non-magnetic material and NiCuZn ferrite material |
| CN104446421A (en) * | 2014-12-19 | 2015-03-25 | 宝鸡烽火诺信科技有限公司 | High-magnetic conductivity nickel and zinc soft magnetic ferrite material and preparation method |
| CN105541314A (en) * | 2014-11-04 | 2016-05-04 | 深圳振华富电子有限公司 | Preparation method of ferrite sheets |
| CN105924146A (en) * | 2016-04-25 | 2016-09-07 | 西南应用磁学研究所 | Wide temperature range nickel-zinc LTCF material for high power multilayer-chip type ferrite devices and preparation method therefor |
| CN108164270A (en) * | 2017-12-14 | 2018-06-15 | 深圳顺络电子股份有限公司 | A kind of method for improving component porcelain body densified sintering product |
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| CN101723657A (en) * | 2009-12-16 | 2010-06-09 | 电子科技大学 | Method for preparing NiCuZn microwave ferrite material |
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| CN1218778A (en) * | 1997-12-04 | 1999-06-09 | 达方电子股份有限公司 | Ferrite composite and method for making ceramic product by using said composite |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103951403A (en) * | 2014-04-07 | 2014-07-30 | 深圳市力磁电子有限公司 | Low-temperature matching cofired method of non-magnetic material and NiCuZn ferrite material |
| CN105541314A (en) * | 2014-11-04 | 2016-05-04 | 深圳振华富电子有限公司 | Preparation method of ferrite sheets |
| CN105541314B (en) * | 2014-11-04 | 2018-11-16 | 深圳振华富电子有限公司 | The preparation method of ferrite sheet material |
| CN104446421A (en) * | 2014-12-19 | 2015-03-25 | 宝鸡烽火诺信科技有限公司 | High-magnetic conductivity nickel and zinc soft magnetic ferrite material and preparation method |
| CN104446421B (en) * | 2014-12-19 | 2016-07-06 | 宝鸡烽火诺信科技有限公司 | A kind of high magnetic permeability Ni-Zn soft magnetic ferrite material and preparation method |
| CN105924146A (en) * | 2016-04-25 | 2016-09-07 | 西南应用磁学研究所 | Wide temperature range nickel-zinc LTCF material for high power multilayer-chip type ferrite devices and preparation method therefor |
| CN105924146B (en) * | 2016-04-25 | 2018-04-20 | 西南应用磁学研究所 | High-power multilayer sheet type ferrite device wide warm nickel zinc LTCF materials and preparation method |
| CN108164270A (en) * | 2017-12-14 | 2018-06-15 | 深圳顺络电子股份有限公司 | A kind of method for improving component porcelain body densified sintering product |
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