CN101077835A - High-frequency low-loss low-temperature co-burning ceramic raw material tape and preparation method thereof - Google Patents
High-frequency low-loss low-temperature co-burning ceramic raw material tape and preparation method thereof Download PDFInfo
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- CN101077835A CN101077835A CN200710024609.2A CN200710024609A CN101077835A CN 101077835 A CN101077835 A CN 101077835A CN 200710024609 A CN200710024609 A CN 200710024609A CN 101077835 A CN101077835 A CN 101077835A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 31
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000002994 raw material Substances 0.000 title claims description 38
- 239000002904 solvent Substances 0.000 claims abstract description 19
- 239000005388 borosilicate glass Substances 0.000 claims abstract description 13
- 239000006112 glass ceramic composition Substances 0.000 claims abstract description 13
- 238000005266 casting Methods 0.000 claims abstract description 7
- XCQWHUUYDVTFDE-UHFFFAOYSA-N [Si].[B].[Ca] Chemical class [Si].[B].[Ca] XCQWHUUYDVTFDE-UHFFFAOYSA-N 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 12
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 12
- 239000004902 Softening Agent Substances 0.000 claims description 12
- 238000000498 ball milling Methods 0.000 claims description 12
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000006185 dispersion Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000007766 curtain coating Methods 0.000 claims description 9
- 239000006063 cullet Substances 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 238000005303 weighing Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 239000012153 distilled water Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical group CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical group CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 4
- 230000004927 fusion Effects 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- ZEMPKEQAKRGZGQ-AAKVHIHISA-N 2,3-bis[[(z)-12-hydroxyoctadec-9-enoyl]oxy]propyl (z)-12-hydroxyoctadec-9-enoate Chemical group CCCCCCC(O)C\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CC(O)CCCCCC)COC(=O)CCCCCCC\C=C/CC(O)CCCCCC ZEMPKEQAKRGZGQ-AAKVHIHISA-N 0.000 claims description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 2
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229910010293 ceramic material Inorganic materials 0.000 abstract 3
- 229910008423 Si—B Inorganic materials 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000002518 antifoaming agent Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 239000002667 nucleating agent Substances 0.000 abstract 1
- 239000004014 plasticizer Substances 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
- 238000005245 sintering Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
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Abstract
The present invention relates to one kind of high frequency and low loss green ceramic material belt and its preparation process. The green ceramic material belt consists of inorganic glass ceramic material and organic flow casting system. The inorganic glass ceramic material consists of heterogenous Ca-Si-B and borosilicate glass ceramic and nucleating agent; and the organic flow casting system consists of solvent, dispersant, adhesive, plasticizer and defoaming agent. The 127 micron LTCC green ceramic material belt of the present invention is flat and smooth, has smallest winding radius without cracking of 15 mm, and may be sintered at about 850 deg.c to obtain sintered ceramic with excellent dielectric performance, including dielectric constant of 5-7 and dielectric loss lower than 0.002 at 10 GHz.
Description
Technical field
The present invention relates to a kind of high-frequency low-loss low-temperature co-burning ceramic raw material tape and preparation method thereof, belong to the stupalith field.
Background technology
LTCC (LTCC, the abbreviation of Low Temperature Co-fired Ceramics) is the new material technology by Hughes Electronics's exploitation at first in nineteen eighty-two, is used to realize high integration, high-performance electronic encapsulation technology aspect.Huge potential is being provided aspect design flexibility, wiring density and the reliability.Compare with tungsten, manganese, the molybdenum of the wiring of high-melting-point low conductivity with 1600 ℃ of High Temperature Co Fired Ceramic; LTCC then is the high silver of employing fusing point low conductivity, copper etc.; not only low price is a lot; and adopt silver element to connect up; sintering process can be not oxidized, need not atmosphere protection, and the LTCC substrate is formed variable simultaneously; can obtain the material of different electric and physicalies, can adjust as specific inductivity, thermal expansivity etc.Therefore research can with silver or copper be low temperature co-fired and the microwave dielectric material of suitable high frequency use, is one of hot subject that receives much concern.Extensively adopt the LTCC technology in the microelectronic circuit both at home and abroad in recent years, it is with suitable low sintering glass-ceramic powder, mixes being made into suspended nitride with organic solvent, tackiness agent etc., prepares raw material band with casting technique.With the raw material band is the base mateiral of multilayer microcircuit substrate, technologies such as punching, conductor paste printing are made circuitous pattern on raw material band, and a plurality of passive elements are imbedded wherein, overlap together, the disposable at low temperatures co-sintered of finishing glass-ceramic material and metallic circuit etc. is made passive integrated package.In a word, LTCC is present passive integrated mainstream technology, utilizes this technology can successfully produce various hi-tech microelectronic products.
For many years, be that a few countries of representative has been carried out deep research to the LTCC material in the world with the U.S., in high frequency microcircuit field, obtained to use widely.But they often produce a large amount of liquid phases by the product of development when sintering, can only use expensive quartz plate as load bearing board, and bonding quartzy backing plate occurs easily and cause substrate and quartzy backing plate to scrap at the place, part.China starts late studying aspect the LTCC material manufacturing technology, and China pays much attention to the research of this respect in recent years, has obtained comparatively significantly progress.But mainly also all still be in the laboratory development stage, the achievement that really has intellecture property almost is blank.Especially at CaO-B
2O
3-SiO
2The system aspect, specific inductivity is more single and to prepare the research of raw material band for the curtain coating of system very few, does not really implement in the middle of the practical application.
Summary of the invention
The objective of the invention is to improve the technological deficiency in high frequency microcircuit materials field, provide a kind of high frequency to hang down Jie's low-loss, low sintering LTCC raw material band.Another object of the present invention provides the preparation method of above-mentioned raw material band.
Technical scheme of the present invention is: a kind of high-frequency low-loss low-temperature co-burning ceramic raw material tape is characterized in that the weight percent that its material component and each component account for the raw material total amount is respectively: unorganic glass ceramic material 40～60%, organic curtain coating system 30～70%.
Wherein the unorganic glass ceramic material is made up of calcium silicon boron series vitro-ceramic, borosilicate series vitro-ceramic and nucleator; Wherein calcium silicon boron series vitro-ceramic account for unorganic glass ceramic material gross weight 46～90%, the borosilicate series vitro-ceramic accounts for 6～50% of unorganic glass ceramic material gross weight, nucleator accounts for 0.5～5% of unorganic glass ceramic material gross weight.
The weight percent that the each component of above-mentioned calcium silicon boron series vitro-ceramic and each component account for calcium silicon boron series vitro-ceramic total amount is respectively: CaO 30～50%, SiO
230～55%, B
2O
310～30%; The each component of described borosilicate series vitro-ceramic and each component account for the weight percent SiO of borosilicate series vitro-ceramic total amount
265～75%, B
2O
320～30%, Na
2O 0.5～3%, K
2O 0.5～3%, Li
2O 0.5～3%; Described nucleator is ZrO
2And/or TiO
2
Above-mentioned organic curtain coating system is made up of solvent, dispersion agent, binding agent, softening agent and defrother, the weight percent of each ingredients constitute machine curtain coating system total amount is respectively: solvent 75～85%, dispersion agent 1～5%, binding agent 3～10%, softening agent 1～5%, defrother 2～6%.Wherein solvent is dimethylbenzene, ethanol and Virahol, and dispersion agent is a Viscotrol C, and binding agent is a polyvinyl butyral acetal, and softening agent is a dibutyl phthalate, and defrother is propyl carbinol and/or ethylene glycol; Wherein the weight percent that each composition accounts for the solvent total amount in the solvent is respectively: dimethylbenzene 10～30%, ethanol 30～50%, Virahol 30～50%.
The present invention also provides the preparation method of above-mentioned high-frequency low-loss low-temperature co-burning ceramic raw material tape, and the concrete steps of its preparation are as follows:
A. claim ceramic formula to take by weighing CaO, SiO by calcium silicon boron respectively
2, B
2O
3, take by weighing SiO by the borosilicate glass ceramic formula
2, B
2O
3, Na
2O, K
2O and Li
2O mixes 4～8h;
B. in Platinum crucible, be incubated 1～2h down respectively and make its complete fusion and homogenizing, pour into and obtain transparent glass cullet in the distilled water in 1350～1500 ℃;
C. respectively resulting glass cullet are obtained calcium silicon boron, the borosilicate glass powder that median size is 0.5～2 μ m through wet ball grinding (using agate ball);
D. take by weighing above-mentioned prepared calcium silicon boron, borosilicate glass powder by proportioning, after adding solvent and dispersion agent ball milling, add binding agent and softening agent ball milling, add the defrother ball milling again, flow casting molding after froth in vacuum obtains LTCC raw material band of the present invention after the drying.
Wherein add solvent and dispersion agent ball milling 3～6h among the step D, add binding agent and softening agent ball milling 3～6h, add defrother ball milling 2～4h again, drying temperature is 25 ℃, and be 6～10h time of drying.
The present invention to prepared raw material band cut into slices, lamination, and waiting (30MPa) compression moulding under the static pressure.Be warmed up to 450 ℃ of insulation 2h from room temperature with 1 ℃/min then and fully get rid of, be warmed up to 850 ℃ of insulation 15min with 7 ℃/min then, the performance of sintered compact is tested to guarantee the organism the sample.
Beneficial effect:
(1) the raw material band surfacing of the present invention's preparation, smooth, 120 * 120mm of individual layer area
2, individual layer standard thickness 0.127 ± 0.05mm; Raw material band tensile strength 〉=760N/cm
2, reach 15mm around rolling up the radius-of-curvature minimum that do not ftracture; Place 30min in 70 ℃ of environment of raw material band, the base substrate shrinking percentage is less than 8/10000ths.
(2) sintering temperature of raw material band is low, about 850 ℃;
(3) percent of firing shrinkage 5～20% (X, Y-axis), 5～20% (Z axles), energy and Au, the wiring of low melting point metals such as Ag is burnt altogether, as shown in Figure 1;
(4) raw material band sintering porcelain body has excellent dielectric properties: at 10GHz, and specific inductivity low (5～7), dielectric loss＜0.002;
(5) can use the aluminum oxide burning plate of common, inexpensive during the raw material band sintering, save preparation cost.Sintered compact crystal grain is tiny, be evenly distributed, low, the compact structure of void content, as shown in Figure 2.
Description of drawings
Fig. 1 is that SEM figure is burnt in raw material band of the present invention and silver electrode wiring altogether.
Fig. 2 is the SEM figure after the raw material band sintered compact surface chemistry corrosion of the present invention (2%HF).
Embodiment
Table 1 illustrates each component content of the specific embodiment of the invention 1.Take by weighing CaO (45wt%), SiO by mass percentage respectively
2(30wt%), B
2O
3(25wt%) and SiO
2(71wt%), B
2O
3(26wt%), Na
2O (0.5wt%), K
2O (1wt%), Li
2O (1.5wt%), respectively behind the 8h mixing, in Platinum crucible, be incubated 2h down and make its complete fusion and homogenizing in 1500 ℃, pour into and obtain transparent calcium silicon boron, borosilicate glass cullet in the distilled water, resulting glass cullet are obtained calcium silicon boron, the borosilicate glass powder that median size is 2 μ m through wet ball grinding (glass and distilled water mass ratio are 1: 1, and the time is 24h).After carrying out the flow casting molding drying by the prescription of table 1, obtain raw material band of the present invention.Wherein nucleator consists of 50wt%TiO
2And 50wt%ZrO
2Solvent composition is 20wt% dimethylbenzene, 38wt% ethanol and 42wt% Virahol; Defrother is 50wt% propyl carbinol and 50wt% ethylene glycol.To raw material band cut into slices, lamination, and waiting (30MPa) compression moulding under the static pressure.Be warmed up to 450 ℃ of insulation 2h from room temperature with 1 ℃/min then and fully get rid of, be warmed up to 850 ℃ of insulation 15min with 7 ℃/min then to guarantee the organism the sample.Performance test to sintered compact is as shown in table 2.
Table 1 high-frequency low-consumption LTCC raw material band each components contents of material (wt%)
| Numbering | Unorganic glass material system | Organic curtain coating agent system | ||||||
| Calcium silicon boron glass | Borosilicate glass | Nucleator (TiO 2、ZrO 2) | Solvent | Dispersion agent | Softening agent | Binding agent | Defrother | |
| NO1 | 48.5 | 0 | 1.50 | 43 | 1 | 2 | 3 | 1 |
| NO2 | 44.1 | 3.43 | 1.47 | 43.86 | 1.53 | 1.02 | 3.06 | 1.53 |
| NO3 | 37.6 | 8.46 | 0.94 | 44.52 | 1.59 | 1.06 | 4.24 | 1.59 |
| NO4 | 30.8 | 12.32 | 0.88 | 45.36 | 2.24 | 1.12 | 5.04 | 2.24 |
| NO5 | 25.2 | 16.38 | 0.42 | 46.4 | 2.32 | 1.16 | 5.8 | 2.32 |
The performance of table 2 high-frequency low-consumption LTCC raw material band sintered compact
| Numbering | Density (gcm -3) | Shrinking percentage (%) | Specific inductivity (10GHz) | Dielectric loss (* 10 -3) | Thermal expansivity (* 10 -6℃ -1) (20-400℃) | |
| X, Y-axis | The Z axle | |||||
| NO1 | 2.73 | 12 | 8 | 6.85 | 1.2 | 7 |
| NO2 | 2.67 | 12.5 | 9 | 6.65 | 1.3 | 6.7 |
| NO3 | 2.58 | 13 | 9.5 | 6.55 | 1.12 | 7.6 |
| NO4 | 2.49 | 14 | 15 | 6.36 | 1.11 | 8.8 |
| NO5 | 2.42 | 15 | 17 | 6.25 | 1.5 | 9 |
Embodiment 2
Table 3 illustrates each component content of the specific embodiment of the invention 2.Take by weighing CaO (31wt%), SiO by mass percentage respectively
2(39wt%), B
2O
3(30wt%) and SiO
2(75wt%), B
2O
3(21wt%), Na
2O (1wt%), K
2O (1.5wt%), Li
2O (1.5wt%), respectively behind the 8h mixing, in Platinum crucible, be incubated 2h down and make its complete fusion and homogenizing in 1500 ℃, pour into and obtain transparent calcium silicon boron, borosilicate glass cullet in the distilled water, resulting glass cullet are obtained calcium silicon boron, the borosilicate glass powder that median size is 2 μ m through wet ball grinding (glass and distilled water mass ratio are 1: 1, and the time is 24h).After carrying out the flow casting molding drying by the prescription of table 3, obtain raw material band of the present invention.Wherein solvent composition is 15wt% dimethylbenzene, 50wt% ethanol and 35wt% Virahol; Defrother is 60wt% propyl carbinol and 40wt% ethylene glycol.To raw material band cut into slices, lamination, and waiting (30MPa) compression moulding under the static pressure.Be warmed up to 450 ℃ of insulation 2h from room temperature with 1 ℃/min then and fully get rid of, be warmed up to 850 ℃ of insulation 15min with 7 ℃/min then to guarantee the organism the sample.Performance test to sintered compact is as shown in table 4.
Table 3 high-frequency low-consumption LTCC raw material band each components contents of material (wt%)
| Numbering | Unorganic glass material system | Organic curtain coating agent system | ||||||
| Calcium silicon boron glass | Borosilicate glass | Nucleator TiO 2 | Solvent | Dispersion agent | Softening agent | Binding agent | Defrother | |
| NO6 | 47.5 | 2.24 | 1.5 | 42.4 | 1.8 | 1 | 3 | 0.56 |
| NO7 | 42.7 | 4.12 | 1.13 | 44.54 | 1.51 | 1.06 | 3.56 | 1.38 |
| NO8 | 34.63 | 10.58 | 0.74 | 45.43 | 1.59 | 1.05 | 4.49 | 1.49 |
| NO9 | 29.84 | 13.52 | 0.66 | 47.36 | 1.24 | 1.02 | 5.06 | 1.3 |
The performance of table 4 high-frequency low-consumption LTCC raw material band sintered compact
| Numbering | Density (gcm -3) | Shrinking percentage (%) | Specific inductivity (10GHz) | Dielectric loss (* 10 -3) | Thermal expansivity (* 10 -6℃ -1) (20-400℃) | |
| X, Y axle | The Z axle | |||||
| NO6 | 2.53 | 11 | 7 | 6 | 1.5 | 7.5 |
| NO7 | 247 | 13.5 | 8 | 5.7 | 2.3 | 8.7 |
| NO8 | 2.38 | 15.6 | 10.5 | 5.3 | 1.78 | 9.6 |
| NO9 | 2.35 | 17.8 | 15 | 5 | 2.11 | 10.8 |
Claims (7)
1, high-frequency low-loss low-temperature co-burning ceramic raw material tape is characterized in that the weight percent that its material component and each component account for the raw material total amount is respectively: unorganic glass ceramic material 40～60%, organic curtain coating system 30～70%.
2, raw material band according to claim 1 is characterized in that the unorganic glass ceramic material is made up of calcium silicon boron series vitro-ceramic, borosilicate series vitro-ceramic and nucleator; Wherein calcium silicon boron series vitro-ceramic account for unorganic glass ceramic material gross weight 46～90%, the borosilicate series vitro-ceramic accounts for 6～50% of unorganic glass ceramic material gross weight, nucleator accounts for 0.5～5% of unorganic glass ceramic material gross weight.
3, raw material band according to claim 2, it is characterized in that the each component of described calcium silicon boron series vitro-ceramic and the weight percent that each component accounts for calcium silicon boron series vitro-ceramic total amount are respectively: CaO 30～50%, SiO
230～55%, B
2O
310～30%; The each component of described borosilicate series vitro-ceramic and each component account for the weight percent SiO of borosilicate series vitro-ceramic total amount
265～75%, B
2O
320～30%, Na
2O0.5～3%, K
2O 0.5～3%, Li
2O 0.5～3%; Described nucleator is ZrO
2And/or TiO
2
4, raw material band according to claim 1, it is characterized in that described organic curtain coating system is made up of solvent, dispersion agent, binding agent, softening agent and defrother, the weight percent of each ingredients constitute machine curtain coating system total amount is respectively: solvent 75～85%, dispersion agent 1～5%, binding agent 3～10%, softening agent 1～5%, defrother 2～6%.
5, raw material band according to claim 4, it is characterized in that described solvent is dimethylbenzene, ethanol and Virahol, dispersion agent is a Viscotrol C, and binding agent is a polyvinyl butyral acetal, softening agent is a dibutyl phthalate, and defrother is propyl carbinol and/or ethylene glycol; Wherein the weight percent that each composition accounts for the solvent total amount in the solvent is respectively: dimethylbenzene 10～30%, ethanol 30～50%, Virahol 30～50%.
6, a kind of preparation method of high-frequency low-loss low-temperature co-burning ceramic raw material tape as claimed in claim 1, the concrete steps of its preparation are as follows:
A. claim ceramic formula to take by weighing CaO, SiO by calcium silicon boron respectively
2, B
2O
3, take by weighing SiO by the borosilicate glass ceramic formula
2, B
2O
3, Na
2O, K
2O and Li
2O mixes 4～8h;
B. in Platinum crucible, be incubated 1～2h down respectively and make its complete fusion and homogenizing, pour into and obtain transparent glass cullet in the distilled water in 1350～1500 ℃;
C. respectively resulting glass cullet are obtained calcium silicon boron, the borosilicate glass powder that median size is 0.5～2 μ m through wet ball grinding (using agate ball);
D. take by weighing above-mentioned prepared calcium silicon boron, borosilicate glass powder by proportioning, after adding solvent and dispersion agent ball milling, add binding agent and softening agent ball milling, add the defrother ball milling again, flow casting molding after froth in vacuum obtains LTCC raw material band of the present invention after the drying.
7, method according to claim 6 is characterized in that adding solvent and dispersion agent ball milling 3～6h, adds binding agent and softening agent ball milling 3～6h, adds defrother ball milling 2～4h again, and drying temperature is 25 ℃, and be 6～10h time of drying.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100246092A CN100564308C (en) | 2007-06-25 | 2007-06-25 | High-frequency low-loss low-temperature co-burning ceramic raw material tape and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100246092A CN100564308C (en) | 2007-06-25 | 2007-06-25 | High-frequency low-loss low-temperature co-burning ceramic raw material tape and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101077835A true CN101077835A (en) | 2007-11-28 |
| CN100564308C CN100564308C (en) | 2009-12-02 |
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ID=38905527
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|---|---|---|---|
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Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100564308C (en) |
Cited By (20)
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| CN101298368B (en) * | 2008-06-17 | 2011-12-21 | 南京工业大学 | Low-temperature rapid sintered high-frequency low-consumption glass ceramic and preparation thereof |
| CN102030471A (en) * | 2010-10-18 | 2011-04-27 | 南京工业大学 | Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof |
| CN102030471B (en) * | 2010-10-18 | 2012-12-19 | 南京工业大学 | Low-temperature cofiring glass and ceramic multilayer microcircuit substrate and preparation method thereof |
| CN103113094A (en) * | 2011-08-06 | 2013-05-22 | 江苏华兴电子有限公司 | Broadband high-permeability ferrite raw material belt and method for manufacturing same into chip-inductor element |
| CN102412059A (en) * | 2011-08-06 | 2012-04-11 | 江苏华兴电子有限公司 | Method for manufacturing chip inductance element from low-temperature cofired ferrite raw material belt |
| CN102412059B (en) * | 2011-08-06 | 2012-11-21 | 江苏华兴电子有限公司 | Method for manufacturing chip inductance element from low-temperature cofired ferrite raw material belt |
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| CN102826857A (en) * | 2011-08-06 | 2012-12-19 | 江苏华兴电子有限公司 | Chip inductance element manufactured by low-temperature co-firing ferrite unsintered tape |
| CN102390985B (en) * | 2011-08-06 | 2013-04-10 | 江苏华兴电子有限公司 | Broadband and high-magnetic-permeability ferrite teflon tape and production method thereof |
| CN103113094B (en) * | 2011-08-06 | 2014-04-16 | 江苏华兴电子有限公司 | Broadband high-permeability ferrite raw material belt and method for manufacturing same into chip-inductor element |
| CN102826857B (en) * | 2011-08-06 | 2013-09-18 | 江苏华兴电子有限公司 | Chip inductance element manufactured by low-temperature co-firing ferrite unsintered tape |
| CN102433088A (en) * | 2011-08-17 | 2012-05-02 | 广东风华高新科技股份有限公司 | Adhesive for chip multilayer ceramic capacitor and preparation method of adhesive |
| CN102531392A (en) * | 2012-02-01 | 2012-07-04 | 云南云天化股份有限公司 | Low-temperature co-fired ceramic material and preparation method thereof |
| CN103289158A (en) * | 2012-02-29 | 2013-09-11 | 深圳光启创新技术有限公司 | Substrate and preparation method thereof |
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| CN102627474A (en) * | 2012-04-18 | 2012-08-08 | 深圳顺络电子股份有限公司 | Treatment method for burning board |
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| CN104496442A (en) * | 2014-11-27 | 2015-04-08 | 中国计量学院 | Microwave dielectric ceramic powder with low dielectric constant, and preparation method thereof |
| CN108424000A (en) * | 2017-02-15 | 2018-08-21 | Tdk株式会社 | Glass ceramic frit body and coil electronic unit |
| CN108424000B (en) * | 2017-02-15 | 2021-01-08 | Tdk株式会社 | Glass ceramic sintered body and coil electronic component |
| CN107721395A (en) * | 2017-10-09 | 2018-02-23 | 宁夏钜晶电子材料科技有限公司 | Transparent alumina ceramics preparation method |
| CN111302792A (en) * | 2020-03-25 | 2020-06-19 | 广东风华高新科技股份有限公司 | Dielectric constant series adjustable low-temperature co-fired dielectric material and preparation method thereof |
| CN112341178A (en) * | 2020-11-06 | 2021-02-09 | 南京工业大学 | Broadband low-expansion-coefficient low-temperature co-fired glass composite ceramic and preparation method thereof |
| CN113372103A (en) * | 2021-07-13 | 2021-09-10 | 中国振华集团云科电子有限公司 | Low-dielectric low-high-frequency-loss LTCC ceramic material and preparation method thereof |
| CN113372103B (en) * | 2021-07-13 | 2023-01-20 | 中国振华集团云科电子有限公司 | Low-dielectric low-high-frequency-loss LTCC ceramic material and preparation method thereof |
| CN114644514A (en) * | 2022-03-25 | 2022-06-21 | 上海晶材新材料科技有限公司 | LTCC green tape material, LTCC substrate, LTCF-LTCC heterogeneous substrate and corresponding preparation method |
| CN115974531A (en) * | 2023-02-16 | 2023-04-18 | 浙江矽瓷科技有限公司 | Low-temperature co-fired ceramic tape-casting slurry and preparation method thereof |
| CN115974531B (en) * | 2023-02-16 | 2023-12-26 | 浙江矽瓷科技有限公司 | Low-temperature cofired ceramic tape casting slurry and preparation method thereof |
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Effective date of registration: 20181204 Address after: 210032 No. 28 Gaoke Road, Jiangbei New District, Nanjing City, Jiangsu Province Patentee after: Nanjing Yangzi Technological University Technology Co., Ltd. Address before: 210009 No. 200, Zhongshan North Road, Jiangsu, Nanjing Patentee before: Nanjing University of Technology |