CN106278224B - A kind of low temperature co-fired soft magnetism copper zinc ferrite material and preparation method thereof - Google Patents
A kind of low temperature co-fired soft magnetism copper zinc ferrite material and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a kind of low temperature co-fired soft magnetism copper zinc ferrite materials, it is sintered by main composition and secondary composition, wherein main composition is grouped as by the group of following molar content: 47~50%, 36~39%, 12.2~14.8%, on the basis of main composition gross mass, secondary composition is grouped as by the group of following mass percentage: 0.2~1.5%Bi2O3, 0.02~0.2%Mo2O3.Material prescription of the invention is rationally scientific, is all made of conventional raw material, at low cost, electromagnetic performance is preferable, and has good insulation performance and lower sintering temperature, and in cofiring, metallic silver is not easy to spread, it can guarantee that lamination sheet type multi-layer inductor device obtains excellent magnetic characteristic, consistency is preferable.The invention also discloses a kind of low temperature co-fired soft magnetism copper zinc ferrite material preparation methods, and processing step is simple, low manufacture cost, strong operability.
Description
Technical field
The present invention relates to a kind of magnetic materials, are used to prepare the low temperature co-fired of laminated chip inductor more particularly, to a kind of
With soft magnetism copper zinc ferrite material and preparation method thereof.
Background technique
With laptop high speed, high storage density, in terms of be showing improvement or progress day by day, and be with mobile phone
The mobile communication technology at center and it is wired, wireless digital communication net keep updating, electronic product is in past 20 years
It is developed rapidly towards miniaturization, portability direction.This has just driven change from analog circuit to high-speed digital circuit and surface from
The emergence of mounting technique (SMT).
SMT slice component can not only make miniaturization of electronic products, and be able to achieve the high-speed automated of machine assembly, chip
The extensive use of element, causes Electronic products manufacturing mode that profound change also has occurred, and manufacturer wishes printed circuit board whole
Using slice component.Over the past two decades, the development of the chip type technology of the resistor in three big passive elements and capacitor is very fast
Speed, product category and specification are increasingly complete, have reached the high volume applications stage, and minimize chip magnetic element (including inductance
Device, magnetic bead, filter, Microwave Iron Oxide Elements etc.) due to technology difficulty it is larger, therefore develop it is relatively slow.
To adapt to modern communications, computer, audio-visual equipment, electronic office equipment, automobile electronic system, military electronic devices
And the needs of electromagnetic compatibility (EMC) etc..Some countries put into a large amount of manpower financial capacities to research and develop magnetic element in recent years
Chip type technology simultaneously achieves significant effect, to greatly push the development of miniaturization chip magnetic element.With folded
The maturation of layer chip inductor MLCI technology, production capacity are increased every year with double-digit speed, have become most important chip
One of electronic component.It has many advantages, such as compared with coiling chip inductor: size is small, is conducive to the miniaturization of circuit, magnetic circuit
Closing, will not interfere the component of surrounding, will not be conducive to the high-density installation of component by the interference for closing on component；
Integral structure, high reliablity；Heat resistance, solderability are good；Shape is regular, is suitable for automating surface installation production, but exist
The disadvantage that qualification rate is low, at high cost, inductance is smaller, Q value is low.
Summary of the invention
The present invention is to provide one kind in order to solve the above problem present in the laminated chip inductor of the prior art and match
5 rationally, at low cost, sintering temperature is low, good insulating, can with Soft magnetic Ni-Zn ferrite material, Ag cofiring it is low temperature co-fired with soft
Magnetic copper zinc ferrite material, laminated chip inductor as made from it have excellent magnetic characteristic, and consistency is preferable.
The present invention also provides a kind of low temperature co-fired soft magnetism copper zinc ferrite material preparation methods, and processing step is simple,
Low manufacture cost, strong operability.
To achieve the goals above, the invention adopts the following technical scheme:
One kind of the invention is low temperature co-fired to use soft magnetism copper zinc ferrite material, the low temperature co-fired soft magnetism copper zinc ferrite
Material is sintered by main composition and secondary composition, wherein main composition is grouped as by the group of following molar content: 47~50%
Fe2O3, 36~39%ZnO, 12.2~14.8%CuO, the sum of each component content is 100%, on the basis of main composition gross mass,
Secondary composition is grouped as by the group of following mass percentage: 0.2~1.5%Bi2O3, 0.02~0.2%Mo2O3.The present invention is to material
The formula of material optimizes, and is formulated rationally science, is all made of conventional raw material, at low cost, the electromagnetic performance of material compared with
It is good, and there is good insulation performance, there is lower sintering temperature, metallic silver is not easy to spread in cofiring, can guarantee lamination
Chip multilayer inductor device obtains excellent magnetic characteristic, and consistency is preferable.
A kind of low temperature co-fired soft magnetism copper zinc ferrite material preparation method, specific steps are as follows:
(1) each component in main composition is mixed, after vibration, pre-burning is carried out in air kiln, obtains preburning powdered material；
(2) after carrying out coarse crushing to preburning powdered material, secondary composition is added into preburning powdered material, the poly- second of binder is added after sand milling
Enol simultaneously dries granulation to get low temperature co-fired with soft magnetism copper zinc ferrite material.
Preferably, calcined temperature is 750~810 DEG C, 120~150min of burn-in time in step (1).
Preferably, preburning powdered material coarse crushing partial size is 1~15 μm, and water content controls < 5% in step (2).
Preferably, the additional amount of binder polyvinyl alcohol is the 0.8~1% of preburning powdered material quality in step (2).
Therefore, the invention has the following beneficial effects:
(1) formula of material is optimized, is formulated rationally science, is all made of conventional raw material, at low cost, material
The electromagnetic performance of material is preferable, and has good insulation performance, has lower sintering temperature, metallic silver is not easy to expand in cofiring
It dissipates, can guarantee that lamination sheet type multi-layer inductor device obtains excellent magnetic characteristic, consistency is preferable；
(2) preparation method of the invention, processing step is simple, low manufacture cost, strong operability.
Specific embodiment
Below by specific embodiment, the present invention will be further described.
Embodiment 1
(1) by 49.2%Fe2O3, will be each after the mass percentage stoichiometry each component of 36%ZnO, 14.8%CuO
After component mixing, vibration, with 750 DEG C of pre-burning 150min in air kiln, preburning powdered material is obtained；
(2) it after preburning powdered material water content being controlled < 5%, carries out coarse powder and is broken to partial size to be 1 μm, be with main composition gross mass
0.2%Bi is added into preburning powdered material for benchmark2O3And 0.02%Mo2O3, the viscous of preburning powdered material quality 0.8% is incorporated as after sand milling
Knot agent polyvinyl alcohol simultaneously dries granulation to get low temperature co-fired with soft magnetism copper zinc ferrite material.
Embodiment 2
(1) by 47%Fe2O3, after the mass percentage stoichiometry each component of 39%ZnO, 14%CuO, by each component
After mixing, vibration, with 800 DEG C of pre-burning 130min in air kiln, preburning powdered material is obtained；
(2) it after preburning powdered material water content being controlled < 5%, carries out coarse powder and is broken to partial size to be 8 μm, be with main composition gross mass
1%Bi is added into preburning powdered material for benchmark2O3And 0.1%Mo2O3, the bonding of preburning powdered material quality 0.9% is incorporated as after sand milling
Agent polyvinyl alcohol simultaneously dries granulation to get low temperature co-fired with soft magnetism copper zinc ferrite material.
Embodiment 3
(1) by 50%Fe2O3, will be each after the mass percentage stoichiometry each component of 37.8%ZnO, 12.2%CuO
After component mixing, vibration, with 810 DEG C of pre-burning 120min in air kiln, preburning powdered material is obtained；
(2) it after preburning powdered material water content being controlled < 5%, carries out coarse powder and is broken to partial size to be 15 μm, with main composition gross mass
On the basis of, 1.5%Bi is added into preburning powdered material2O3And 0.2%Mo2O3, the viscous of preburning powdered material quality 1% is incorporated as after sand milling
Knot agent polyvinyl alcohol simultaneously dries granulation to get low temperature co-fired with soft magnetism copper zinc ferrite material.
By the soft magnetism copper zinc ferrite material that the various embodiments described above obtain be pressed into 20 × φ of standard toroidal blank φ 10 ×
5,880 lower sintering are then put into, soaking time 2 hours, are detected at U=0.5V, T=25 DEG C using HP4291B instrument
The magnetic permeability μ of magnetic powder ' value, using 8220 instrument of MS at U=500V, T=25 DEG C test surfaces resistance R, test result is as follows table
Shown in 1:
Sample tests made from soft magnetism copper zinc ferrite material in each embodiment of table 1
As seen from Table 1, the better performances of permeability μ ' of the invention at respective frequencies, and the higher energy of resistivity is full
The insulation characterisitic requirement of sufficient device.
Above-mentioned embodiment is only a preferred solution of the present invention, not the present invention is made in any form
Limitation, there are also other variations and modifications on the premise of not exceeding the technical scheme recorded in the claims.
Claims (5)
1. a kind of low temperature co-fired soft magnetism copper zinc ferrite material, which is characterized in that the low temperature co-fired soft magnetism copper zinc-iron oxygen
Body material is sintered by main composition and secondary composition, wherein main composition is grouped as by the group of following molar content: 47 ~ 50%
Fe 2 O 3, 36 ~ 39% ZnO, 12.2 ~ 14.8% CuO, the sum of each component content is 100%；On the basis of main composition gross mass,
Secondary composition is grouped as by the group of following mass percentage: 0.2 ~ 1.5%Bi2 O 3, 0.02 ~ 0.2% Mo2 O 3 。
2. a kind of low temperature co-fired with soft magnetism copper zinc ferrite material preparation method as described in claim 1, which is characterized in that
Specific steps are as follows:
(1) each component in main composition is mixed, after vibration, pre-burning is carried out in air kiln, obtains preburning powdered material；
(2) after carrying out coarse crushing to preburning powdered material, secondary composition is added into preburning powdered material, binder polyvinyl alcohol is added after sand milling
And it dries granulation and uses soft magnetism copper zinc ferrite material to get low temperature co-fired.
3. low temperature co-fired according to claim 2 use soft magnetism copper zinc ferrite material preparation method, which is characterized in that step
Suddenly in (1), calcined temperature is 750 ~ 810 DEG C, 120 ~ 150min of burn-in time.
4. low temperature co-fired according to claim 2 use soft magnetism copper zinc ferrite material preparation method, which is characterized in that step
Suddenly in (2), preburning powdered material coarse crushing partial size is 1 ~ 15 μm, and water content controls < 5%.
5. low temperature co-fired according to claim 2 use soft magnetism copper zinc ferrite material preparation method, which is characterized in that step
Suddenly in (2), the additional amount of binder polyvinyl alcohol is the 0.8 ~ 1% of preburning powdered material quality.
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| CN111875368B (en) * | 2020-07-17 | 2022-08-09 | 中国电子科技集团公司第九研究所 | Low-permeability ferrite magnetic medium material, and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411655A (en) * | 2012-06-26 | 2015-03-11 | 京瓷株式会社 | Sintered ferrite, ferrite core, and coil component |
| CN105702411A (en) * | 2016-04-01 | 2016-06-22 | 常州市好利莱光电科技有限公司 | Method for preparing copper zinc ferrite soft magnetic materials by copper slag recovery |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411655A (en) * | 2012-06-26 | 2015-03-11 | 京瓷株式会社 | Sintered ferrite, ferrite core, and coil component |
| CN105702411A (en) * | 2016-04-01 | 2016-06-22 | 常州市好利莱光电科技有限公司 | Method for preparing copper zinc ferrite soft magnetic materials by copper slag recovery |
Non-Patent Citations (1)
| Title |
|---|
| Preparation,structure and catalytic properties of copper-zinc ferrites;K.V.Koleva;《Bulgarian Chemical Communications》;20151231;第47卷(第1期);第348-353页 * |
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Denomination of invention: A soft magnetic copper zinc ferrite material for low-temperature co firing and its preparation method Effective date of registration: 20230522 Granted publication date: 20181221 Pledgee: Dongyang Branch of China Construction Bank Co.,Ltd. Pledgor: HENGDIAN GROUP DMEGC MAGNETICS Co.,Ltd. Registration number: Y2023330000949 |