CN101786865A - Low dielectric constant ceramic powder and cofiring method thereof with nickel zinc copper ferrite powder - Google Patents
Low dielectric constant ceramic powder and cofiring method thereof with nickel zinc copper ferrite powder Download PDFInfo
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- CN101786865A CN101786865A CN200910188913A CN200910188913A CN101786865A CN 101786865 A CN101786865 A CN 101786865A CN 200910188913 A CN200910188913 A CN 200910188913A CN 200910188913 A CN200910188913 A CN 200910188913A CN 101786865 A CN101786865 A CN 101786865A
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Abstract
The invention relates to a low dielectric constant ceramic powder and cofiring method thereof with nickel zinc copper ferrite powder. The low dielectric constant ceramic powder is formed by sintering mixture of 40-70wt% of borosilicate glass and balance of alumina at 800-950 DEG C, and dielectric constant is 4.0-6.0. Nickel zinc copper ferrite powder is formed by presintering mixture composed of 45-50% of iron trioxide, 1-35% of zinc oxide, 6-50% of nickel oxide and balance of copper oxide by mol weight percent at 700-1000 DEG C. By regulating formula and sintering curve, curve deformation and boundary crack after sintering are prevented. The invention provides a low dielectric constant ceramic powder, and nickel zinc copper ferrite powder mutually immersed with the low dielectric constant ceramic powder is selected to produce a multiple device, product performance can be obviously improved, and application field of chip multiple device such as various multilayer chip inductance device, EMI filter and power module is widened.
Description
Technical field
The present invention relates to common burning technology, the method that particularly relates to a kind of low-k ceramics powder and burn altogether with the nickel zinc copper ferrite powder.
Background technology
Specific inductivity is about the ceramics powder of 5 low-k, with the nickel zinc copper ferrite powder relative merits are arranged respectively, its application of product of making all has certain limitation, can not satisfy the requirements at the higher level of lightening day by day compoundization to electronic devices and components of increasingly sophisticatedization of electronic product function, volume.For example nickel zinc copper ferrite can burn till and have higher magnetic permeability at low temperatures, generally be used for preparing the magnetic ceramics layer of laminated ceramic parts inductive part, yet the specific inductivity of nickel zinc copper ferrite is about 15, lower from humorous frequency, limited the use of ferrite inductance at high frequency; And specific inductivity is about the ceramic inductance applying frequency height that the ceramics powder of the low-k about 5 is made, and still, the magnetic permeability of the ceramics powder of low-k is 1, causes the inductance value of ceramic inductance lower.
Summary of the invention
A technical problem to be solved by this invention is the application limitation that remedies existing ferrite inductance and ceramic inductance, and a kind of low-k ceramics powder is provided.
Another technical problem to be solved by this invention is the application limitation that remedies existing ferrite inductance and ceramic inductance, the method that provides a kind of low-k ceramics powder and nickel zinc copper ferrite powder to burn altogether.
Low-k ceramics powder of the present invention is that weight percent is the mixture of the aluminum oxide of 40~70% borosilicate glass and surplus, burns till at 800 ℃~950 ℃, and specific inductivity is 4.0~6.0.
The characteristics of the method that low-k ceramics powder of the present invention and nickel zinc copper ferrite powder burn altogether are:
Described nickel zinc copper ferrite powder is the nickel zinc copper ferrite powder that soaks into mutually when burning altogether with the low-k ceramics powder, with described nickel zinc copper ferrite powder is the nickel zinc copper ferrite slurry of major ingredient preparation, identical with the shrinking percentage of low-k ceramics powder slurry that with described low-k ceramics powder is major ingredient preparation, the shrinkage curve of determining to test respectively earlier nickel zinc copper ferrite slurry and low-k ceramics powder slurry of sintering curre, obtain the temperature that two kinds of slurries begin to shrink, it is the shortest that two kinds of slurries reach time required between the temperature that begins respectively to shrink when adjusting temperature rise rate again and make heating up, to prevent the flexural deformation behind the sintering, interface crackings etc. are bad.
Further, described nickel zinc copper ferrite powder is that molar weight per-cent is that 45~50% ferric oxide, molar weight per-cent are that 1~35% zinc oxide, molar weight per-cent are the mixture of the cupric oxide of 6~50% nickel oxide and surplus, 700 ℃~1000 ℃ pre-burnings, initial permeability is 1~500.
With described nickel zinc copper ferrite powder is the nickel zinc copper ferrite slurry of major ingredient preparation, identical with the shrinking percentage of low-k ceramics powder slurry that with described low-k ceramics powder is the major ingredient preparation, is earlier according to the theoretical formula of shrinking percentage:
Determine the proportioning of nickel zinc copper ferrite powder and adapted organic solvent respectively, and the proportioning of low-k ceramics powder and adapted organic solvent, finely tuning proportioning again, to reach both shrinking percentages identical.
Described low-k ceramics powder formula of size is as follows:
The low-k ceramics powder;
Account for the tackiness agent of powder weight 1~5%;
Account for the dispersion agent of powder weight 1~5%;
Account for the softening agent of powder weight 1~5%;
Account for the solvent of powder weight 100~150%.
Described tackiness agent is an ethyl cellulose.
Described dispersion agent is 9228 dispersion agents.
Described softening agent is a dibutyl phthalate.
Described solvent is a kind of in Terpineol 350, dehydrated alcohol, the Diethylene Glycol butyl ether.
Described low-k ceramic size making method is as follows:
With the low-k ceramics powder, account for powder weight 1~5% tackiness agent, account for powder weight 1~5% dispersion agent, account for the softening agent of powder weight 1~5%, drop into the solvent that accounts for powder weight 100~150% and to be rolled to few three circulations in the three roller roll forming machines, be the low-k ceramic size.
Described nickel zinc copper ferrite formula of size is as follows:
The nickel zinc copper ferrite powder;
Account for the tackiness agent of powder weight 1~5%;
Account for the dispersion agent of powder weight 1~5%;
Account for the softening agent of powder weight 1~5%;
Account for the solvent of powder weight 50~80%.
Described tackiness agent is an ethyl cellulose.
Described dispersion agent is the X-100 dispersion agent.
Described softening agent is a dibutyl phthalate.
Described solvent is a kind of in Terpineol 350, dehydrated alcohol, the Diethylene Glycol butyl ether.
Described nickel zinc copper ferrite slurry making method is as follows:
With the nickel zinc copper ferrite powder, account for powder weight 1~5% tackiness agent, account for powder weight 1~5% dispersion agent, account for the softening agent of powder weight 1~5%, drop into the solvent that accounts for powder weight 50~80% and to be rolled to few three circulations in the three roller roll forming machines, be the nickel zinc copper ferrite slurry.
Further, the method that low-k ceramics powder and nickel zinc copper ferrite powder burn altogether may further comprise the steps:
1) powder process: prepare low-k ceramics powder and nickel zinc copper ferrite powder respectively;
2) slurrying: prepare low-k ceramic size and nickel zinc copper ferrite slurry respectively;
3) moulding: according to the structure fabrication work in-process of goods;
4) sintering: the work in-process of making are inserted in the sintering oven, according to the sintering curre of nickel zinc copper ferrite slurry at 850 ℃~950 ℃ following sintering.
The present invention is compared with the prior art beneficial technical effects:
The present invention proposes a kind of low-k ceramics powder, and select and nickel zinc copper ferrite powder that it soaks into when burning is altogether mutually made multiple device, can obviously enhance product performance, widen the chip multiple device, as the Application Areas of various particular requirement laminated chip inductor spares, electromagnetic interface filter and power module.
Description of drawings
Fig. 1 is the structural upright synoptic diagram of lamination sheet type common mode choke;
Fig. 2 is the A-A sectional view of Fig. 1;
Fig. 3 is that the lamination sheet type common mode choke of Fig. 1 is made the lower cover synoptic diagram;
Fig. 4 is a synoptic diagram of making inner electrode layer on the lower cover that Fig. 3 makes;
Fig. 5 is a synoptic diagram of making upper cover plate on the inner electrode layer that Fig. 4 makes;
Fig. 6 is the half-finished synoptic diagram that the middle product that Fig. 5 makes is cut into single size;
Fig. 7 makes the synoptic diagram that end electrode is set behind the work in-process sintering with Fig. 6.
Embodiment
Below in conjunction with so that to make lamination sheet type common mode choke be embodiment and contrast accompanying drawing the present invention is described in detail.
Lamination sheet type common mode choke shown in Fig. 1,2 and 7 comprises support plate 6, be arranged at the lower cover 5 made by the nickel zinc copper ferrite slurry on the support plate 6, be arranged on the lower cover 5 by the Ag inner electrode 2 of coiled type, be positioned at the nickel zinc copper ferrite slurry 3 of coil electrode 2 cores and be positioned at electrode 2 peripheral parts of coiled type low-k ceramic size 4, cover the upper cover plate of making by the nickel zinc copper ferrite slurry on the inner electrode layer 7, and the end electrode 8 that is coated with the metallic substance that is connected with back processing procedure circuit.Its electrical specification is: coil impedance height during common-mode state, be that the coil core is the nickel zinc copper ferrite of high magnetic permeability, coil impedance is low during the differential mode state, be that medium between the interior electrode 2 of coiled type partly is the low-k ceramics powder, magnetic permeability is low, specific inductivity is low, reaches difference mode signal and passes through and the repressed effect of common-mode noise.
Adopt the concrete making flow process of co-burning method making lamination sheet type common mode choke of the present invention as follows:
1) powder process:
With weight percent is that 55% borosilicate glass and weight percent are that 45% aluminum oxide drops into the wet control equipment of ball mill to mix the back oven dry standby for the low-k ceramics powder;
With molar weight per-cent is that 49% ferric oxide, molar weight per-cent are that 30% zinc oxide, molar weight per-cent are that 7% nickel oxide and molar weight per-cent are that 14% cupric oxide drops into the wet control equipment of ball mill and mixes the back oven dry and grind and be the nickel zinc copper ferrite powder, standby at 800 ℃ of pre-burning 2hr again;
2) slurrying:
Standby low-k ceramics powder, the ethyl cellulose that accounts for powder weight 3%, 9228 dispersion agents that account for powder weight 2%, the Terpineol 350 that accounts for the dibutyl phthalate of powder weight 4% and account for powder weight 121% are dropped into and roll three circulations in the three roller roll forming machines, be the low-k ceramic size;
Standby nickel zinc copper ferrite powder, the ethyl cellulose that accounts for powder weight 1%, the X-100 dispersion agent that accounts for powder weight 4%, the Terpineol 350 that accounts for the dibutyl phthalate of powder weight 2% and account for powder 56% are dropped into and roll three circulations in the three roller roll forming machines, be the nickel zinc copper ferrite slurry;
3) moulding: method is as follows:
3-1) make lower cover: adopt print process that the nickel zinc copper ferrite slurry is made the lower cover 5 that is arranged on the support plate 6, as shown in Figure 3;
3-2) make inner electrode layer: Ag inner electrode 2, nickel zinc copper ferrite slurry 3 and low-k ceramic size by coiled type are made the inner electrode layer that is arranged on the lower cover 5 with the mode lamination of printing in design attitude, as shown in Figure 4;
3-3) make upper cover plate: adopt print process that the nickel zinc copper ferrite slurry is made the upper cover plate 7 that is arranged on the inner electrode layer, as shown in Figure 5;
3-4) make work in-process: with 3-1)~3-3) make in the middle of product cut into the lamination sheet type common mode choke work in-process of single size, as shown in Figure 6;
4) sintering: the work in-process of cutting are inserted in the sintering oven, according to the sintering curre of nickel zinc copper ferrite slurry at 900 ℃ of following sintering;
5) end electrode is set: the work in-process behind the sintering are coated with the end electrode 8 that the metallic substance that is connected with back processing procedure circuit is set, as shown in Figure 7;
6) electroplate: adopt mode electroless nickel layer and tin layer outside end electrode 8 of barrel plating, make finished product.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention; make some alternative or obvious modification that are equal to without departing from the inventive concept of the premise; and performance or purposes are identical, then should be considered as belonging to the protection domain that the present invention is determined by claims of being submitted to.
Claims (7)
1. low-k ceramics powder is characterized in that:
Be that weight percent is the mixture of the aluminum oxide of 40~70% borosilicate glass and surplus, burn till that specific inductivity is 4.0~6.0 at 800 ℃~950 ℃.
2. low-k ceramics powder and the nickel zinc copper ferrite powder method of burning altogether is characterized in that:
Described nickel zinc copper ferrite powder is the nickel zinc copper ferrite powder that soaks into mutually when burning altogether with the low-k ceramics powder, with described nickel zinc copper ferrite powder is the nickel zinc copper ferrite slurry of major ingredient preparation, identical with the shrinking percentage of low-k ceramics powder slurry that with described low-k ceramics powder is major ingredient preparation, the shrinkage curve of determining to test respectively earlier nickel zinc copper ferrite slurry and low-k ceramics powder slurry of sintering curre, obtain the temperature that two kinds of slurries begin to shrink, it is the shortest that two kinds of slurries reach time required between the temperature that begins respectively to shrink when adjusting temperature rise rate again and make heating up.
3. the method that low-k ceramics powder as claimed in claim 2 and nickel zinc copper ferrite powder burn altogether is characterized in that:
Described nickel zinc copper ferrite powder is that molar weight per-cent is that 45~50% ferric oxide, molar weight per-cent are that 1~35% zinc oxide, molar weight per-cent are the mixture of the cupric oxide of 6~50% nickel oxide and surplus, 700 ℃~1000 ℃ pre-burnings, initial permeability is 1~500.
4. the method for burning altogether as claim 2 or 3 described low-k ceramics powders and nickel zinc copper ferrite powder is characterized in that:
With described nickel zinc copper ferrite powder is the nickel zinc copper ferrite slurry of major ingredient preparation, identical with the shrinking percentage of low-k ceramics powder slurry that with described low-k ceramics powder is the major ingredient preparation, is earlier according to the theoretical formula of shrinking percentage:
Determine the proportioning of nickel zinc copper ferrite powder and adapted organic solvent respectively, and the proportioning of low-k ceramics powder and adapted organic solvent, finely tuning proportioning again, to reach both shrinking percentages identical.
5. the method that low-k ceramics powder as claimed in claim 4 and nickel zinc copper ferrite powder burn altogether is characterized in that:
Described low-k ceramics powder formula of size is as follows:
The low-k ceramics powder;
Account for the tackiness agent of powder weight 1~5%;
Account for the dispersion agent of powder weight 1~5%;
Account for the softening agent of powder weight 1~5%;
Account for the solvent of powder weight 100~150%.
6. the method that low-k ceramics powder as claimed in claim 5 and nickel zinc copper ferrite powder burn altogether is characterized in that:
Described nickel zinc copper ferrite formula of size is as follows:
The nickel zinc copper ferrite powder;
Account for the tackiness agent of powder weight 1~5%;
Account for the dispersion agent of powder weight 1~5%;
Account for the softening agent of powder weight 1~5%;
Account for the solvent of powder weight 50~80%.
7. the method that low-k ceramics powder as claimed in claim 6 and nickel zinc copper ferrite powder burn altogether is characterized in that:
May further comprise the steps:
1) powder process: prepare low-k ceramics powder and nickel zinc copper ferrite powder respectively;
2) slurrying: prepare low-k ceramic size and nickel zinc copper ferrite slurry respectively;
3) moulding: according to the structure fabrication work in-process of goods;
4) sintering: the work in-process of making are inserted in the sintering oven, according to the sintering curre of nickel zinc copper ferrite slurry at 850 ℃~950 ℃ following sintering.
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102863222A (en) * | 2012-06-28 | 2013-01-09 | 深圳市固电电子有限公司 | Ceramic material and ceramic material and ferrite material low-temperature lamination cofiring method |
CN103093947A (en) * | 2011-11-07 | 2013-05-08 | 三星电机株式会社 | Layered inductor and manufacturing method fo the same |
CN103265274A (en) * | 2013-05-15 | 2013-08-28 | 江粉磁材(武汉)技术研发有限公司 | Preparation method of ferrite noise suppression sheet |
CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
CN103606448A (en) * | 2013-11-28 | 2014-02-26 | 深圳顺络电子股份有限公司 | Electronic element and manufacturing method thereof |
CN106783063A (en) * | 2016-12-09 | 2017-05-31 | 深圳顺络电子股份有限公司 | A kind of lamination sheet type ceramic component preparation method |
CN108358615A (en) * | 2018-03-06 | 2018-08-03 | 李宏伟 | A kind of ceramic material of low-k and preparation method thereof |
CN111863411A (en) * | 2020-07-06 | 2020-10-30 | 杭州电子科技大学 | Integrated magnetic device and preparation method thereof |
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2009
- 2009-12-14 CN CN200910188913A patent/CN101786865A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103093947A (en) * | 2011-11-07 | 2013-05-08 | 三星电机株式会社 | Layered inductor and manufacturing method fo the same |
CN102863222A (en) * | 2012-06-28 | 2013-01-09 | 深圳市固电电子有限公司 | Ceramic material and ceramic material and ferrite material low-temperature lamination cofiring method |
CN103265274A (en) * | 2013-05-15 | 2013-08-28 | 江粉磁材(武汉)技术研发有限公司 | Preparation method of ferrite noise suppression sheet |
CN103325675A (en) * | 2013-05-30 | 2013-09-25 | 深圳顺络电子股份有限公司 | Method for manufacturing electronic element of narrow-line-width electrode |
CN103606448A (en) * | 2013-11-28 | 2014-02-26 | 深圳顺络电子股份有限公司 | Electronic element and manufacturing method thereof |
CN106783063A (en) * | 2016-12-09 | 2017-05-31 | 深圳顺络电子股份有限公司 | A kind of lamination sheet type ceramic component preparation method |
CN108358615A (en) * | 2018-03-06 | 2018-08-03 | 李宏伟 | A kind of ceramic material of low-k and preparation method thereof |
CN111863411A (en) * | 2020-07-06 | 2020-10-30 | 杭州电子科技大学 | Integrated magnetic device and preparation method thereof |
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Application publication date: 20100728 |