CN103107206A - Packaged solar cell wafer and manufacturing method thereof - Google Patents
Packaged solar cell wafer and manufacturing method thereof Download PDFInfo
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- CN103107206A CN103107206A CN2011103616420A CN201110361642A CN103107206A CN 103107206 A CN103107206 A CN 103107206A CN 2011103616420 A CN2011103616420 A CN 2011103616420A CN 201110361642 A CN201110361642 A CN 201110361642A CN 103107206 A CN103107206 A CN 103107206A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a packaged solar cell wafer which comprises a packaging body and the solar cell wafer sealed in the packaging body, and the solar cell wafer is provided with a light inlet face and a shady face. The packaged solar cell wafer is characterized in that the packaging body comprises a packaging inner layer and a packaging outer layer, the packaging inner layer is made from transparent material, and a suede layer is arranged on the surface of the packaging inner layer. Due to the fact that the suede layer is arranged on the surface of the packaging inner layer, the flame light effect of the solar cell wafer can be improved, and therefore the efficiency of a solar cell is improved. Correspondingly, the invention further provides a method for packaging the solar cell wafer. The surface of the packaging body is imprinted through the utilization of a suede mould, or the surface of the packaging body is etched so as to form the suede layer of the packaging body. The manufacturing technology is simple, and meanwhile the antireflection effect and the flame light effect are improved, and the conversion efficiency of the solar cell is enhanced.
Description
Technical field
The present invention relates to area of solar cell, particularly a kind of solar cell wafer of encapsulation and manufacture method thereof.
Background technology
In recent years, due to problems such as energy shortage and environmental pollutions, solar energy becomes one of scheme that addresses these problems, and along with the developing rapidly of solar cell and semiconductor industry, solar cell is widely used in every field.
Since coming out from solar cell, the conversion efficiency that improves solar cell is to be engaged in the technical staff's of solar cell working target always.Improving the solar cell intrinsic property and improving the light absorbing ability of solar cell is to improve two importances of conversion efficiency of solar cell.Effectively reducing sunlight is an important method that improves the solar energy conversion efficiency in the reflection loss of silicon chip surface, is two kinds of methods commonly using at crystal silicon solar energy battery surface formation antireflective coating or matte.
Form matte in solar cell surface, namely surperficial matte, playing an important role aspect the efficient that improves battery, and the first reaches by again collecting surface emitting light the effect that reduces the surface reflection loss; It two is to form sunken light at inside battery, by internal reflection, light is trapped in inside battery, thereby improves significantly the conversion efficiency of battery.
At present, for monocrystalline or polycrystal silicon cell, form surperficial matte, main method by the corrosion etching, etching stopping { is forming on the 100} crystal face.But this method need to be completed in the manufacturing process of solar cell wafer, and manufacture craft is relatively complicated, relatively is difficult to control the etching degree and forms desirable suede structure.
Therefore, be necessary to propose a kind of manufacture craft simple, and can improve the solar cell wafer of antireflective and sunken light effect.
Summary of the invention
The objective of the invention is for the deficiencies in the prior art, proposed a kind of manufacture craft simple, and can improve the solar cell wafer of antireflective and sunken light effect.
To achieve these goals, technical scheme of the present invention is: a kind of solar cell wafer of encapsulation, comprise packaging body and be sealed in the interior solar cell wafer of packaging body, solar cell wafer has upper and lower faces, it is characterized in that, described packaging body is comprised of transparent material, and suede structure is arranged on packaging body.
For solar cell, advancing light face and shady face is different for the requirement of incident light.For battery advance the light face, usually wish by suede structure, the repeatedly incident of light to be reduced the reflection of light loss, make most of incident light can enter inside battery, obtain to absorb; But at the shady face of battery, wish in some cases to obtain smooth planar structure, strengthen reflection of light, make the incident light through battery material to reflect back, again obtain to absorb.For the battery wafer of two-sided suede structure, although obtained suede structure advancing the light face, strengthened incident power, also produced suede structure at shady face simultaneously.Like this when battery operated, during incident light arrival shady face that part not have to absorb, according to the anti-reflection principle of suede structure, approximately there is 2/3 light directly to transmit outside cell body, make incident light effectively not utilize, caused the reduction of battery efficiency.
So for two-sided matte battery wafer; need to apply one deck reflectance coating and diaphragm at the back, obtain planar structure, wherein reflectance coating is to return in order to transmit the outer light reflection of cell body; strengthened the conversion efficiency of light, single suede structure can not apply any film.In addition, if the shady face electrode layer of solar cell is conductive metal film, its effect is equivalent to reflectance coating, can strengthen the conversion efficiency of light, so when the material of shady face electrode layer was conductive metal film, the shady face of packaging body can apply reflectance coating.Diaphragm is used for preventing that reflectance coating is worn and light leak.
Because the material of the shady face electrode layer of solar cell is conductive metal film and when being covered fully by metal film, the shady face of packaging body can apply reflectance coating, and solar cell is that single face advances light or two-sidedly advances the light time situation and also have any different, so it can be divided into following several situation:
(1) solar cell is that single face advances light
(a) when the material that advances light face and shady face electrode layer of solar cell is respectively TCO (transparent conductive oxide) and conducting metal, advance light direction, advance the face of light face electrode layer for advancing the light face, this moment, the light face that advances of packaging body had matte, and shady face can not have matte, and packaging body can be single matte or two matte.When being single matte, the packaging body skin is the combination of diaphragm and reflectance coating or need apply any film; When being two matte, the packaging body skin is diaphragm;
When (b) material that advances light face and shady face electrode layer of solar cell all was TCO, the light face that advances of packaging body had matte, and shady face also must have matte, and this moment, the packaging body skin was the combination of diaphragm and reflectance coating;
(2) solar cell is the two-sided light that advances
At this moment the material that advances light face and shady face electrode layer of solar cell is all TCO, and this moment, the matte of packaging body can be single matte or two matte, and during two matte, the packaging body skin is diaphragm; During single matte, the packaging body skin does not need to apply any film.
The invention still further relates to a kind of method that encapsulates solar cell wafer, it comprises the following steps: to form solar cell wafer;
Solar cell wafer is sealed in packaging body;
Form the matte layer on packaging body.
The invention has the beneficial effects as follows: the solar cell wafer of encapsulation according to the present invention, has matte on the packaging body of solar cell wafer, can be when forming the light transmissive material packaging body, it is impressed or etching forms the matte layer, manufacture craft is simple, and improved antireflective and the sunken light effect of wafer, thereby improve the conversion efficiency of solar cell.
Description of drawings
By reading the detailed description that non-limiting example is done of doing with reference to the following drawings, it is more obvious that other features, objects and advantages of the present invention will become:
Fig. 1 is the flow chart according to an embodiment of a kind of manufacture method that encapsulates solar cell wafer of the present invention; And
Fig. 2 to Fig. 8 is in solar cell wafer process according to the method manufacturing and encapsulation shown in Fig. 1, the schematic diagram of each structure.
Embodiment
For making the purpose, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiments of the invention are described in detail.
The below describes embodiments of the invention in detail, and the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Disclosing hereinafter provides many different embodiment or example to be used for realizing different structure of the present invention.Of the present invention open in order to simplify, hereinafter parts and the setting of specific examples are described.Certainly, they are only example, and purpose does not lie in restriction the present invention.In addition, the present invention can be in different examples repeat reference numerals and/or letter.This repetition is in order to simplify and purpose clearly, itself not indicate the relation between the various embodiment that discuss of institute and/or setting.In addition, the various specific technique that the invention provides and the example of material, but those of ordinary skills can recognize the property of can be applicable to of other techniques and/or the use of other materials.In addition, First Characteristic described below Second Characteristic it " on " structure can comprise that the first and second Characteristics creations are the direct embodiment of contact, also can comprise the embodiment of other Characteristics creation between the first and second features, such the first and second features may not be direct contacts.
At first the below is described the solar cell wafer structure of various packing forms provided by the invention with reference to figs. 2 to Fig. 7.As shown in Figure 2, the solar cell wafer of this encapsulation comprises packaging body 100 and is sealed in the interior solar cell wafer 200 of packaging body, solar cell wafer 200 has into light face and shady face, and optics 001 is from advancing this solar cell wafer 200 of light face incident, and another side is shady face.Described packaging body 100 comprises encapsulate inner layer 101 and encapsulation skin 102, and encapsulate inner layer 101 is comprised of transparent material, and advancing of encapsulate inner layer 101 has matte layer 105 on the light face.Encapsulation outer 102 can be wrapped up a side or the part that whole encapsulate inner layer 101 also can cover described encapsulate inner layer 101.Wherein:
As shown in Figure 8, the solar cell wafer 200 of described encapsulation comprises semiconductor substrate 204, and the semiconductor layer 206,207 of different doping types is arranged on semiconductor substrate 204 surfaces, for example P type or N-type doping is electrode layer 208,210 on semiconductor layer 206,207; And, the electrode layer 208 of semiconductor substrate 204 both sides, 210 can be as advancing the light face, can be also that wherein a lateral electrode layer is for advancing the light face, electrode layer 208,210 be respectively the first electrode layer and the second electrode lay, and its electrode material is TCO or conductive metallic material.
The encapsulation of solar cell wafer described in Fig. 2 200 outer 102 covers the shady face of encapsulate inner layer 101.Cause optical energy loss in order to prevent that light from penetrating from shady face, encapsulation outer 102 comprises the combination of diaphragm 104 and reflectance coating 103.Reflectance coating 103 is generally metal coating, is used for light reflection is returned solar cell wafer 200, increases photoelectric conversion efficiency.Can form by the mode of chemical gaseous phase electrode or plating described reflectance coating 103.Reflectance coating 103 is generally metal coating, is used for light reflection is returned solar cell wafer 200, increases photoelectric conversion efficiency.Form the metal coating of described reflectance coating 103 by chemical vapor deposition or electric plating method.Diaphragm 104 is used for preventing that reflectance coating 103 is worn, and can makes the packaging body outer surface smooth, easy to clean.the material of described encapsulate inner layer 101 is transparent polymer material, include but not limited to: ethane-acetic acid ethyenyl resin copolymer (EVA), polyvinyl butyral resin (PVB), PETG (PET), Merlon (PC), polymethyl methacrylate (PMMA), high density polyethylene (HDPE) (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE) (LDPE), polypropylene (PP), polystyrene (PS), TPU, silicone, ionomer, a kind of or its combination in any in light-cured resin.Impress on encapsulate inner layer 101 or etching can form predetermined suede structure by predetermined mould.
The matte layer 105 on encapsulate inner layer 101 surfaces can be single matte layer or two matte layer.One of upper and lower faces of described solar cell wafer is to be all into the light face into light face or two faces, can single face advances light or two-sidedly advances light.
Concrete, when single face advances the light time, when if the electrode layer 208 of solar cell wafer 200,210 material are respectively TCO and conducting metal, the face of electrode layer 208 is for advancing the light face, this moment, the light face that advances of packaging body 100 had matte, and shady face can not have matte, and at this moment packaging body 100 is single suede structures.When encapsulate inner layer 101 was single suede structure, packaging body skin 102 comprised the combination of diaphragm 104 and reflectance coating 103.
As shown in Figure 3, also can there is no described encapsulation skin 102, at this moment solar cell wafer 200 shady faces are covered by metal electrode 210 fully, are used for light reflection is returned solar cell wafer 200 to increase photoelectric conversion efficiency.
As shown in Figure 5; when if the electrode layer 208 of solar cell 200,210 material all are TCO; the light face that advances of packaging body 100 has matte; and shady face also can have matte; to increase sunken light effect; the shady face of the outer 102 covering encapsulate inner layer 101 of packaging body this moment, and encapsulation outer 102 comprises the combination of diaphragm 104 and reflectance coating 103.On matte on the shady face of the reflectance coating 103 whole encapsulate inner layer 101 of covering, light reflection is returned solar cell wafer 200.
If solar cell 200 is the two-sided light time of advancing, at this moment the electrode layer 208 of solar cell 200,210 material are all TCO, and this moment, the matte of packaging body was preferably two mattes.Described packaging body can only have encapsulate inner layer 101, impresses on encapsulate inner layer 101 or is etched with suede structure, to increase sunken light effect, as shown in Figure 4.Because suede structure is exposed to the outer cleaning that is not easy, therefore can also cover encapsulation outer 102 on the matte of encapsulate inner layer 101.Encapsulation outer 102 also can be called protective layer, is used for making the packaging body outer surface smooth smooth, avoids dirt to embed in suede structure, is convenient to cleaning.The material of encapsulation outer 102 is transparent polymer material, and in order to realize the effect of matte anti-reflection, the refractive index of encapsulation outer 102 is preferably lower than the material of encapsulate inner layer 101, as shown in Figure 7.
As shown in Figure 8, be the structure of solar cell wafer 100.Described solar cell wafer comprises semiconductor substrate 204, described semiconductor substrate 204 has the first doping type, described semiconductor substrate 204 comprises first surface 203 and the second surface 205 relative with it, the material of described semiconductor substrate, comprise Si, Ge, SiGe, III-V or II-VI compound semiconductor and combination thereof, described semiconductor substrate has the first doping type, and described the first doping type can be p-type or N-shaped doping.Described wafer also comprises and is formed at the first semiconductor layer 206 on substrate first surface 203, that have the second doping type, alternatively, also comprises being formed at the second semiconductor layer 207 on substrate second surface 205, that have the first doping type.The material of described the first and second semiconductor layers can be, for example: polysilicon, amorphous silicon and combination thereof.Also comprise the first electrode layer 208 that is formed at respectively on the first semiconductor layer 206, and be formed at the second electrode lay 210 on substrate second surface 205.Wherein said the first electrode layer 208 is for advancing the light face, and it can be formed by the TCO material, for example SnO
2, In
2O
3, ZnO, ITO, CdO, Cd
2SnO
4, FTO, AZO or its combination.Described the second electrode lay 210 also can be used as into light face 202, namely also can be formed by the TCO material, selectively, its can be not yet as advancing the light face, and formed by the metal material that is suitable for conducting electricity.The embodiment of above-mentioned solar cell wafer is only example, can also be other structures, and the present invention is not done any restriction.
Hereinafter the method for this encapsulation solar cell wafer is set forth.
Please refer to Fig. 1, the method comprises:
Step S100 forms solar cell wafer 200;
Step S101 is sealed in solar cell wafer 200 in packaging body, forms the matte layer of packaging body 100;
Step S102 at packaging body 100 surface formation diaphragms, completes encapsulation.
Below in conjunction with Fig. 2 to Fig. 8, step S100 is described to step S102.Need to prove, the accompanying drawing of each embodiment of the present invention is only for the purpose of illustrating, therefore is not necessarily to scale.The method that it is pointed out that step S100 solar cell wafer 200 comprises the following steps:
(1) be ready to semiconductor substrate 204, adulterate;
(2) form semiconductor layer 206,207, doping semiconductor layer 206,207 on semiconductor substrate 204;
(3) form electrode layer 208,210 on semiconductor layer 206,207.
Wherein, described doping type is p-type or N-shaped.
After step S100, solar cell wafer 200 structures comprise: the semiconductor layer 206,207 of doping is arranged on semiconductor substrate 204, semiconductor substrate 204 surfaces, is electrode layer 208,210 on semiconductor layer 206,207.
Then execution in step S101, be sealed in solar cell wafer 200 in packaging body, forms the matte layer of packaging body 100.Wherein, the matte layer on packaging body 100 surfaces is to form by impression or its surperficial matte of etching.
Be step S102 at last, at packaging body 100 surface formation diaphragms, complete encapsulation.The method for preparing diaphragm in described step comprises the processing of hot pressing film.
Although describe in detail about example embodiment and advantage thereof, be to be understood that and carry out various variations, substitutions and modifications to these embodiment in the situation that do not break away from the protection range that spirit of the present invention and claims limit.For other examples, when those of ordinary skill in the art should easily understand within keeping protection range of the present invention, the order of processing step can change.
In addition, range of application of the present invention is not limited to technique, mechanism, manufacturing, material composition, means, method and the step of the specific embodiment of describing in specification.From disclosure of the present invention, to easily understand as those of ordinary skill in the art, for the technique, mechanism, manufacturing, material composition, means, method or the step that have existed or be about to later on develop at present, wherein they carry out identical function or the identical result of acquisition cardinal principle of corresponding embodiment cardinal principle of describing with the present invention, can use them according to the present invention.Therefore, claims of the present invention are intended to these technique, mechanism, manufacturing, material composition, means, method or step are included in its protection range.
Claims (17)
1. the solar cell wafer of an encapsulation, comprise packaging body (100) and be sealed in the interior solar cell wafer (200) of packaging body, solar cell wafer (200) has upper and lower faces, it is characterized in that, described packaging body (100) is comprised of transparent material, and suede structure (105) is arranged on packaging body (100).
2. the solar cell wafer of encapsulation according to claim 1, it is characterized in that, packaging body (100) comprises encapsulate inner layer (101) and encapsulation outer (102), and wherein encapsulation outer (102) covers at least a portion encapsulate inner layer (101).
3. the solar cell wafer of encapsulation according to claim 1, it is characterized in that, solar cell wafer (200) comprises semiconductor substrate (204), the semiconductor layer (206 that doping is arranged on semiconductor substrate (204) surface, 207), electrode layer (208,210) on semiconductor layer (206,207).
4. the solar cell wafer of encapsulation according to claim 3, it is characterized in that: the material of electrode layer is TCO material or conductive metallic material.
5. the solar cell wafer of encapsulation according to claim 4, it is characterized in that: the TCO material is SnO
2, In
2O
3, ZnO, ITO, CdO, Cd
2SnO
4, FTO, AZO or its combination; And
Described metal material is Al, Cr, Cu, Ag, Au, Fe, Ni, Pb, Zn, Co, Ti, M, a kind of or its combination in any in Sn.
6. the solar cell wafer of encapsulation according to claim 1, is characterized in that, encapsulate inner layer (101) has two faces, wherein has matte layer (105) at least one face.
7. the solar cell wafer of encapsulation according to claim 6, is characterized in that, described matte layer (105) is upward to form in described encapsulate inner layer (101) by the mode that impresses.
8. the solar cell wafer of encapsulation according to claim 2, is characterized in that, encapsulation outer (102) comprises reflector (103) and protective layer (104), and described reflector is positioned at shady face one side of solar cell wafer.
9. the solar cell wafer of encapsulation according to claim 1, it is characterized in that, the material of described encapsulate inner layer (101) and/or encapsulation outer (102) is selected from following material one or a combination set of: ethane-acetic acid ethyenyl resin copolymer (EVA), polyvinyl butyral resin (PVB), PETG (PET), Merlon (PC), polymethyl methacrylate (PMMA), high density polyethylene (HDPE) (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE) (LDPE), polypropylene (PP), polystyrene (PS), TPU, silicone, ionomer, light-cured resin.
10. the solar cell wafer of encapsulation according to claim 2, the refractive index of wherein said encapsulation outer (102) is lower than the refractive index of encapsulate inner layer (101).
11. a method that encapsulates solar cell wafer, it comprises the following steps:
Form solar cell wafer (200);
Solar cell wafer (200) is sealed in packaging body;
At the upper matte layer (105) that forms of packaging body (100).
12. the method for encapsulation solar cell wafer according to claim 11 is characterized in that, the method for described formation solar cell wafer (200) comprises the following steps:
Preparation semiconductor substrate (204);
Adulterate and form doping semiconductor layer (206,207); And
At the upper electrode layer (208,210) that forms of semiconductor layer (206,207).
13. the method for encapsulation solar cell wafer according to claim 11; it is characterized in that, comprise by predetermined mold in the upper step that forms matte layer (105) of packaging body (100) forming matte layer (105) at packaging body (100) top die or etching.
14. the method for encapsulation solar cell wafer according to claim 13, it is characterized in that, described packaging body (100) comprises encapsulate inner layer (101) and encapsulation outer (102), and wherein encapsulation outer (102) covers at least a portion encapsulate inner layer (101).
15. the method for encapsulation solar cell wafer according to claim 14, it is characterized in that, described matte layer (105) is formed on interface between the upper or encapsulate inner layer (101) of described encapsulate inner layer (101) and encapsulation skin (102).
16. the method for encapsulation solar cell wafer according to claim 14, it is characterized in that, the material of described encapsulate inner layer (101) and/or encapsulation outer (102) is selected from following material one or a combination set of: ethane-acetic acid ethyenyl resin copolymer (EVA), polyvinyl butyral resin (PVB), PETG (PET), Merlon (PC), polymethyl methacrylate (PMMA), high density polyethylene (HDPE) (HDPE), polyvinyl chloride (PVC), low density polyethylene (LDPE) (LDPE), polypropylene (PP), polystyrene (PS), TPU, silicone, ionomer, light-cured resin.
17. the solar cell wafer of encapsulation according to claim 14, the refractive index of wherein said encapsulation outer (102) is lower than the refractive index of encapsulate inner layer (101).
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| CN2011103616420A CN103107206A (en) | 2011-11-15 | 2011-11-15 | Packaged solar cell wafer and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103616420A CN103107206A (en) | 2011-11-15 | 2011-11-15 | Packaged solar cell wafer and manufacturing method thereof |
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| CN103107206A true CN103107206A (en) | 2013-05-15 |
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| CN2011103616420A Pending CN103107206A (en) | 2011-11-15 | 2011-11-15 | Packaged solar cell wafer and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103928548A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Solar cell module and forming method thereof |
| CN103928549A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Pouring solidification type solar module and forming method thereof |
| CN103928547A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Floating type solar cell panel and forming method thereof |
| CN105355672A (en) * | 2015-11-30 | 2016-02-24 | 中信博新能源科技（苏州）有限公司 | Application device for double-sided photovoltaic cells |
| CN106129148A (en) * | 2016-06-24 | 2016-11-16 | 珠海格力电器股份有限公司 | Photovoltaic module and packaging technology thereof |
| CN109461776A (en) * | 2018-09-25 | 2019-03-12 | 南昌大学 | A kind of low-cost high-efficiency crystal silicon solar batteries component |
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| JP2005099693A (en) * | 2003-09-05 | 2005-04-14 | Hitachi Chem Co Ltd | Composition for forming antireflection film, method for manufacturing antireflection film using the same, optical components and solar battery unit |
| JP2005101513A (en) * | 2003-09-05 | 2005-04-14 | Hitachi Chem Co Ltd | Condensing film and solar cell unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103928548A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Solar cell module and forming method thereof |
| CN103928549A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Pouring solidification type solar module and forming method thereof |
| CN103928547A (en) * | 2014-04-28 | 2014-07-16 | 杭州勇电照明有限公司 | Floating type solar cell panel and forming method thereof |
| CN105355672A (en) * | 2015-11-30 | 2016-02-24 | 中信博新能源科技（苏州）有限公司 | Application device for double-sided photovoltaic cells |
| CN106129148A (en) * | 2016-06-24 | 2016-11-16 | 珠海格力电器股份有限公司 | Photovoltaic module and packaging technology thereof |
| CN109461776A (en) * | 2018-09-25 | 2019-03-12 | 南昌大学 | A kind of low-cost high-efficiency crystal silicon solar batteries component |
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Application publication date: 20130515 |