CN103105734B - Photosensitive resin composition - Google Patents
Photosensitive resin composition Download PDFInfo
- Publication number
- CN103105734B CN103105734B CN201210439627.8A CN201210439627A CN103105734B CN 103105734 B CN103105734 B CN 103105734B CN 201210439627 A CN201210439627 A CN 201210439627A CN 103105734 B CN103105734 B CN 103105734B
- Authority
- CN
- China
- Prior art keywords
- photosensitive resin
- resin composition
- content
- formula
- diisocyanate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 82
- 239000000178 monomer Substances 0.000 claims abstract description 15
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910000077 silane Inorganic materials 0.000 claims abstract description 7
- 150000007524 organic acids Chemical class 0.000 claims abstract description 5
- 239000003960 organic solvent Substances 0.000 claims abstract description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 12
- 239000002105 nanoparticle Substances 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000007334 copolymerization reaction Methods 0.000 claims description 9
- 239000005977 Ethylene Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000003999 initiator Substances 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 abstract description 10
- 239000002253 acid Substances 0.000 abstract description 5
- 229920000642 polymer Polymers 0.000 abstract description 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 125000000524 functional group Chemical group 0.000 abstract 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 abstract 1
- -1 mesaconic acid acid anhydride Chemical class 0.000 description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 18
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 229960004063 propylene glycol Drugs 0.000 description 6
- 235000013772 propylene glycol Nutrition 0.000 description 6
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 6
- 238000012360 testing method Methods 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 4
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 229910018557 Si O Inorganic materials 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 4
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000002671 adjuvant Substances 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
- 238000005984 hydrogenation reaction Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- FKRCODPIKNYEAC-UHFFFAOYSA-N propionic acid ethyl ester Natural products CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- DTZHXCBUWSTOPO-UHFFFAOYSA-N 1-isocyanato-4-[(4-isocyanato-3-methylphenyl)methyl]-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(CC=2C=C(C)C(N=C=O)=CC=2)=C1 DTZHXCBUWSTOPO-UHFFFAOYSA-N 0.000 description 2
- DMFAHCVITRDZQB-UHFFFAOYSA-N 1-propoxypropan-2-yl acetate Chemical compound CCCOCC(C)OC(C)=O DMFAHCVITRDZQB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- LCANECIWPMDASZ-UHFFFAOYSA-N 2-isocyanatoethanol Chemical class OCCN=C=O LCANECIWPMDASZ-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 2
- NGMNTLCQDNNBNT-UHFFFAOYSA-N C(C=C)(=O)OC.C(CS)(=O)OCCOC(CS)=O Chemical compound C(C=C)(=O)OC.C(CS)(=O)OCCOC(CS)=O NGMNTLCQDNNBNT-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 2
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 2
- NKKMVIVFRUYPLQ-UHFFFAOYSA-N but-2-enenitrile Chemical compound CC=CC#N NKKMVIVFRUYPLQ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229940119545 isobornyl methacrylate Drugs 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 2
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical group P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 2
- 229940059574 pentaerithrityl Drugs 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 2
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- STGNLGBPLOVYMA-MAZDBSFSSA-N (E)-but-2-enedioic acid Chemical compound OC(=O)\C=C\C(O)=O.OC(=O)\C=C\C(O)=O STGNLGBPLOVYMA-MAZDBSFSSA-N 0.000 description 1
- PAHUTFPWSUWSCR-XQHVRGAUSA-N (e)-2-methylbut-2-enedioic acid Chemical compound OC(=O)C(/C)=C/C(O)=O.OC(=O)C(/C)=C/C(O)=O PAHUTFPWSUWSCR-XQHVRGAUSA-N 0.000 description 1
- RLYNGYDVXRKEOO-XQHVRGAUSA-N (e)-but-2-enoic acid Chemical compound C\C=C\C(O)=O.C\C=C\C(O)=O RLYNGYDVXRKEOO-XQHVRGAUSA-N 0.000 description 1
- PAHUTFPWSUWSCR-BHPSOXLSSA-N (z)-2-methylbut-2-enedioic acid Chemical compound OC(=O)C(/C)=C\C(O)=O.OC(=O)C(/C)=C\C(O)=O PAHUTFPWSUWSCR-BHPSOXLSSA-N 0.000 description 1
- AILQKRSUWWXHIB-UHFFFAOYSA-N 1-(dimethylamino)ethanol Chemical compound CN(C)C(C)O.CN(C)C(C)O AILQKRSUWWXHIB-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- IFEOHIRRYZVBRP-UHFFFAOYSA-N 2-(ethoxymethyl)butanoic acid ethyl propanoate Chemical compound C(C)C(C(=O)O)COCC.C(CC)(=O)OCC IFEOHIRRYZVBRP-UHFFFAOYSA-N 0.000 description 1
- LELKUNFWANHDPG-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxymethyl)oxirane;prop-2-enoic acid Chemical compound OC(=O)C=C.C1OC1COCC1CO1 LELKUNFWANHDPG-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
- JDPZLHCKBWMLDH-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOCCOCCOCCOCCOCCOC(=O)C=C JDPZLHCKBWMLDH-UHFFFAOYSA-N 0.000 description 1
- UXFQFBNBSPQBJW-UHFFFAOYSA-N 2-amino-2-methylpropane-1,3-diol Chemical compound OCC(N)(C)CO UXFQFBNBSPQBJW-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- CTHJQRHPNQEPAB-UHFFFAOYSA-N 2-methoxyethenylbenzene Chemical compound COC=CC1=CC=CC=C1 CTHJQRHPNQEPAB-UHFFFAOYSA-N 0.000 description 1
- KZPMXWBRKHQGQJ-UHFFFAOYSA-N 2-methyl-4-(oxiran-2-yl)but-2-enoic acid oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound O1C(CC=C(C(=O)O)C)C1.C(C(=C)C)(=O)OCC1CO1 KZPMXWBRKHQGQJ-UHFFFAOYSA-N 0.000 description 1
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- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
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- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
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- HEBKCHPVOIAQTA-NGQZWQHPSA-N d-xylitol Chemical compound OC[C@H](O)C(O)[C@H](O)CO HEBKCHPVOIAQTA-NGQZWQHPSA-N 0.000 description 1
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Landscapes
- Materials For Photolithography (AREA)
Abstract
A photosensitive resin composition comprising: a polymer having three or more co-blocks comprising (A-1) an ethylenically unsaturated monomer having an acid group and (A-2) an ethylenically unsaturated monomer other than (A-1); (B) a monomer having at least one ethylenically unsaturated double bond; (C) a urethane resin oligomer having a reactive acrylic functional group; (D) an epoxy-silane copolymer compound; (E) an organic acid anhydride; (F) a photoinitiator and (G) an organic solvent. The above-mentioned (D) is a copolymer compound represented by the formula (I) or the formula (II). In the formula (I) and the formula (II), R is respectively and independently CH3Or OCH3(ii) a m, n, o and p are units with different repetition ratios respectively.
Description
Technical field
The invention relates to a kind of photosensitive resin composition (photo-sensitivity resin composition), and particularly relevant for a kind of photosensitive resin composition with good metal and glass attachment and high rigidity.
Background technology
In order to reach more convenient, volume, more lightly change and more humane object, the input mode of many information products, by devices such as traditional keyboard or slide-mouse, changes into and uses touch-control device as the mode of input.Touch-control device can be assembled in the flat-panel screens of all multiple types, so that flat-panel screens has the function of display frame and input operation information concurrently.With regard at present common touch-control device, capacitance type touch-control panel and electric resistance touch-control panel are the most universal.
In general contact panel processing procedure, conventionally can use photosensitive resin composition (photoresistance) to be used as dielectric layer between metal electrode or the protective seam of covering metal electrode.Therefore, above-mentioned photosensitive resin composition must possess can develop to protect the circuit of special graph and good metal or glass surface tack and high hardness, to avoid producing scratch and the problem of peeling off in processing procedure.Yet, during general large-size glass cutting, have foreign matter and adhere to from the teeth outwards, therefore on processing procedure, need to face ultrasonic shake and wash, often can there is the problem that organic photoresistance (being photosensitive resin composition) is peeled off.Tradition is unsatisfactory to metal or glass surface tack as the photoresistance of protective seam.
Summary of the invention
The invention provides a kind of photosensitive resin composition, it has good metal and glass attachment and high rigidity, can the processing procedure such as wash through the shake of high-temperature baking, ultrasonic and all not peel off.
The present invention proposes a kind of photosensitive resin composition, it comprises: (A) have urethane resin oligomer that the polymkeric substance of three above common blocks (block), monomer, (C) that (B) has at least one ethene unsaturated double-bond have reactable acrylic acid functional group, (D) epoxy-silane copolymerization, (E) organic acid anhydride, (F) light initiator and (G) organic solvent, wherein above-mentioned (D) epoxy-silane copolymerization is the copolymerization shown in formula (I) or formula (II)
In formula (I) and formula (II), R is independent is respectively CH
3or OCH
3; M, n, o, p are respectively the unit of different repetition ratios.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein, with total restatement of photosensitive resin composition, the content of above-mentioned (A) for example, between between 10wt% to 15wt%.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein take (A-1) be 100 weight portions with summation (A-2), the content of above-mentioned (A-1) for example, between 10 weight portion to 90 weight portions.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein take (A-1) be 100 weight portions with summation (A-2), the content of above-mentioned (A-2) for example, between 10 weight portion to 90 weight portions.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein, with total restatement of photosensitive resin composition, the content of above-mentioned (B) for example, between between 5wt% to 15wt%.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein, with total restatement of photosensitive resin composition, the content of above-mentioned (C) for example, between between 1wt% to 20wt%.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein, with total restatement of photosensitive resin composition, the content of above-mentioned it (D) is between between 0.1wt% to 10wt%.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein take (A) as 100 weight portions, the content of above-mentioned (E) for example, between 0.1 weight portion to 100 weight portion.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein take (A) as 100 weight portions, the content of above-mentioned (F) for example, between 0.1 weight portion to 100 weight portion.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein, with total restatement of photosensitive resin composition, the content of above-mentioned it (G) is between between 60wt% to 80wt%.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein the weight average molecular weight of above-mentioned (D) is 10k～60k.
Photosensitive resin composition according to described in the embodiment of the present invention, wherein more comprises (H) nano particle filling agent.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein above-mentioned (H) nano particle filling agent comprises monox, titanium dioxide or aluminium oxide.
According to the photosensitive resin composition described in the embodiment of the present invention, wherein, with total restatement of above-mentioned photosensitive resin composition, the content of above-mentioned (H) is between between 5wt% to 20wt%.
Based on above-mentioned, photosensitive resin composition of the present invention due to and metal and glass between there is good tack, and there is high rigidity, therefore can be applicable in the processing procedure of contact panel.When photosensitive resin composition of the present invention is after exposure and developing, can become the dielectric layer between metal electrode, or can become the protective seam of covering metal electrode, and wash also and can not be stripped from through ultrasonic shake.
For allowing, state feature and advantage on the present invention and can become apparent, special embodiment below is described in detail below.
Accompanying drawing explanation
Nothing.
Embodiment
The photosensitive resin composition that the present invention proposes has good tack for metal and glass, and has high rigidity.Therefore; such photosensitive resin composition can be applicable in contact panel processing procedure; form dielectric layer between metal electrode or the protective seam of covering metal electrode, processing procedures such as causing the problem of low yield to avoid metal electrode to be subject to scratch in processing procedure and can stand that high-temperature baking, ultrasonic shake in contact panel processing procedure washed is not all peeled off.
Photosensitive resin composition of the present invention comprises: (A) have urethane resin oligomer that the polymkeric substance of three above common blocks, monomer, (C) that (B) has at least one ethene unsaturated double-bond have reactable acrylic acid functional group, (D) epoxy-silane copolymerization, (E) organic acid anhydride, (F) light initiator and (G) organic solvent.
At (A), have in the polymkeric substance of more than three common blocks, these common blocks comprise: (A-1) containing the ethylene unsaturated monomer of acidic group and (A-2) ethylene unsaturated monomer except (A-1).That is to say, be at least (A) by (A-1) with (A-2) be polymerized.Certainly, (A) can be also to be formed with other monomer polymerizations by (A-1), (A-2).With total restatement of photosensitive resin composition, content (A) is for example between between 10wt% to 15wt%.
(A-1) ethylene unsaturated monomer containing acidic group can be unsaturated monobasic acids, such as (methyl) acrylic acid, crotonic acid (crotonic acid), α-chlorine (methyl) acrylic acid, (ethyl) acrylic acid, cinnamic acid (cinnamic acid) etc.; Unsaturated dibasic acid/anhydrides, such as maleic acid, maleic anhydride (maleic anhydride), fumaric acid (fumaric acid), itaconic acid (itaconic acid), itaconic anhydride (itaconic anhydride), citraconic acid (citraconic acid), citraconic anhydride (citraconic anhydride), mesaconic acid (mesaconic acid), mesaconic acid acid anhydride (mesaconic anhydride) etc.; Or unsaturated polybasic acids/anhydrides more than trivalent.Take (A-1) be 100 weight portions with summation (A-2), content (A-1) is for example between 10 weight portion to 90 weight portions.Above-mentioned (A-1) can be used alone or mix several uses.(A-1) in, contained acidic group contributes to improve the developing property of photosensitive resin composition.
(A-2) ethylene unsaturated monomer except (A-1) can be the vinyl compound containing allyl (allyl group), such as (methyl) allyl acrylate (allyl (meth) acrylate) etc., the vinyl compound that contains two acrylics, ethylene glycol bisthioglycolate (methyl) acrylate (ethylene glycol di (meth) acrylate) for example, two cyclopentene two (methyl) acrylate (dicyclopentenyl di (meth) acrylate), propylene glycol two (methyl) acrylate (propylene glycol di (meth) acrylate), 2, 2-dimethyl-1, ammediol two (methyl) acrylate (2, 2-dimethyl-1, 3-propylene glycol di (meth) acrylate), triethylene glycol two (methyl) acrylate (triethylene glycol di (meth) acrylate), tetraethylene glycol two (methyl) acrylate (tetraethylene glycol di (meth) acrylate), three (2-hydroxyethyl) isocyanates two (methyl) acrylate (tri (2-hydroxyethyl) isocyanate di (meth) acrylate) etc., nitrilation vinyl compound, such as (methyl) vinyl cyanide ((meth) acrylonitrile), α-chlorine (methyl) vinyl cyanide (α-chloro (meth) acrylonitrile) etc., aromatic ethenyl compound, such as styrene (styrene), methyl styrene, methoxy styrene etc., other vinyl compounds, such as cyclic alkyl (methyl) acrylic acid of C6 to C12 etc.(A-2) be preferably methacrylic acid dicyclo pentyl ester (dicyclopentanyl methacrylate), styrene, Isooctyl acrylate monomer (iso-octylacrylate), allyl methacrylate (allylmethacrylate), methacrylonitrile (methacrylonitrile), 2,2-dimethyl-1, ammediol diacrylate (2,2-dimethyl-1,3-propylene glycoldiacrylate).When (A-2) is styrene, can improve further thermotolerance and the endurance of photosensitive resin composition of the present invention.Take (A-1) be 100 weight portions with summation (A-2), content (A-2) is for example between 10 weight portion to 90 weight portions.Above-mentioned (A-2) can be used alone or mix several uses.
The weight average molecular weight that the polystyrene conversion that (A) measured with gel permeation chromatography obtains (Mw) is better for 2 * 10
3to 1 * 10
5between, better for 5 * 10
3to 5 * 10
4between.When the weight average molecular weight of (A) is lower than 2 * 10
3time, may there be formed dielectric layer or protective seam can produce the coarse problem of pattern, and after this dielectric layer or protective seam process high temperature process, can produce the problem of thickness attenuation, meaning is that pattern form, the thermotolerance of dielectric layer or protective seam can occur deteriorated.When the weight average molecular weight of (A) is higher than 1 * 10
5time, may there is the problem of the light sensitivity reduction of photosensitive resin composition, and also can reduce the degree of accuracy of dielectric layer or protective seam pattern.
(B) monomer that has at least one ethene unsaturated double-bond can be ethylene glycol bisthioglycolate (methyl) acrylate (ethylene glycol di (meth) acrylate); Polyglycol two (methyl) acrylate (polyethylene glycol di (meth) acrylate) with 2 to 14 Oxyranyles (ethyleneoxide group); Trimethylolpropane two (methyl) acrylate (trimethylol propane di (meth) acrylate); Trimethylolpropane tris (methyl) acrylate (trimethylol propane tri (meth) acrylate); Pentaerythrite three (methyl) acrylate (pentaerythritol tri (meth) acrylate); Pentaerythrite four (methyl) acrylate (pentaerythritol tetra (meth) acrylate); Propylene glycol two (methyl) acrylate (propyleneglycol di (meth) acrylate) with 2 to 14 epoxypropane bases (propyleneoxide group); Dipentaerythritol five (methyl) acrylate (dipentaerythritol penta (meth) acrylate); Dipentaerythritol six (methyl) acrylate (dipentaerythritol hexa (meth) acrylate, DPHA); Trihydroxymethylpropanyltri diglycidyl ether acrylic acid adjuvant (trimethylolpropanetriglycidylether acrylic acid additives); Bisphenol A diglycidyl ether acrylic acid adjuvant (bisphenol A diglycidylether acrylic acid additives); The ditridecyl phthalate of (methyl) propenoic acid beta-hydroxy ethyl ester (phthalate diesters of β-hydroxyethyl (meth) acrylate); Toluene diisocyanate adjuvant (toluene diisocyanate additives) ((methyl) propenoic acid beta-hydroxy ethyl ester (β-hydroxyethyl (meth) acrylate) for example; the monomer with ethene unsaturated link, therein ethylene unsaturated link is freely two trimethylolpropane tetra-acrylate (ditrimethylol propanetetraacrylate) of choosing, three (2-acrylyl oxy-ethyl) isocyanuric acid ester (tris (2-acryloxyethyl) isocyanurate), ethoxylation season pentitol tetraacrylate (ethoxylated pentaerylthritol-tetraacrylate) (EO4mol), tetramethylol methane tetraacrylate (pentaerythritoltetraacrylate) (EO35mol), ethoxylated trimethylolpropane triacrylate (ethoxylated trimethylolpropane-triacrylate) (EO9mol), ethoxylated trimethylolpropane triacrylate (EO3mol), propoxylated pentaerithytol tetraacrylate (propxylated pentaerythritoltetraacrylate) (PO4mol), nine glycol diacrylates (nonaethylene glycol diacrylate), double pentaerythritol methacrylate (dipentaerythritolhexa-acrylate-modified caprolactone) with caprolactone modification, the group that propoxylation trimethylolpropane triacrylate (trimethylolpropanepropoxylate triacrylate) forms.With total restatement of photosensitive resin composition, content (B) is for example between between 5wt% to 15wt%, better between 10wt% to 13wt%.Above-mentioned (B) can be used alone or mix several and use, and can improve by this hardness of photosensitive resin composition of the present invention.
(C) have reactable acrylic acid functional group's urethane resin oligomer, its acid value (mgKOH/g) can be between 0 to 100.Above-mentioned (C) can be general merchandise product, for example, can enumerate: KAYARAD DPHA-40H (Japanese chemical drug (strain) sells); U-4HA, U-6HA, U-6LPA, U-15HA, UA-32P, U-324A, U-4H, U-6H (Xin Zhong village chemical industry (strain) manufacture); UN-9000H, UN-3320HA, UN-3320HB, UN-3320HC, UN-901, UN-1200TPK, UN-904 (on root, industry (strain) is manufactured).The urethane resin segment of this urethane resin oligomer is to be polymerized by isocyanates and hydroxyl compound.Isocyanates can be aromatic diisocyanate, for example 2, 4-toluene diisocyanate (2, 4-tolylene diisocyanate), 2, 6-toluene diisocyanate (2, 6-tolylene diisocyanate), dimethylbenzene-1, 4-diisocyanate (xylene-1, 4-diisocyanate), dimethylbenzene-1, 3-diisocyanate (xylene-1, 3-diisocyanate), 4, 4'-methyl diphenylene diisocyanate (4, 4'-diphenylmethane diisocyanate, MDI), 2, 4'-methyl diphenylene diisocyanate (2, 4'-diphenylmethane diisocyanate), 4, 4'-diphenyl ether diisocyanate (4, 4'-diphenyl ether diisocyanate), 2-nitro diphenyl-4, 4'-diisocyanate (2-nitrodiphenyl-4, 4'-diisocyanate), 2, 2'-diphenyl propane-4, 4'-diisocyanate (2, 2'-diphenylpropane-4, 4'-diisocyanate), 3, 3'-dimethyl diphenylmethane-4, 4'-diisocyanate (3, 3'-dimethyldiphenylmethane-4, 4'-diisocyanate), 4, 4'-diphenyl propane diisocyanate (4, 4'-diphenylpropane diisocyanate), m-phenylene diisocyanate (m-phenylene diisocyanate), p-phenylene diisocyanate (p-phenylene diisocyanate), naphthylene-1, 4-diisocyanate (naphthylene-1, 4-diisocyanate), naphthylene-1, 5-diisocyanate (naphthylene-1, 5-diisocyanate), 3, 3'-dimethoxy diphenyl-4, 4'-diisocyanate (3, 3'-dimethoxydiphenyl-4, 4'-diisocyanate), aliphatic diisocyanate (aliphatic diisocyanates), for example tetramethylene diisocyanate (tetramethylene diisocyanate), hexamethylene diisocyanate (hexamethylene diisocyanate, HDI), lysinediisocyanate (lysine diisocyanate), alicyclic diisocyanate (alicyclic diisocyanates), the Xylene Diisocyanate (hydrogenated xylene diisocyanate) of for example toluene diisocyanate of isophorone diisocyanate (isophorone diisocyanate), hydrogenation (hydrogenated tolylene diisocyanate), hydrogenation, the methyl diphenylene diisocyanate (hydrogenated diphenylmethane diisocyanate) of hydrogenation, tetramethylxylene diisocyanate (tetramethylxylene diisocyanate).Above-mentioned isocyanates only, for explanation, but is not limited to this, and in order to the isocyanates of polymerization urethane resin segment, can be one or more and mix and use.Hydroxyl compound in order to polymerization urethane resin segment can be glycol, ethylene glycol (ethylene glycol) for example, propylene glycol (propylene glycol), 1, 4-butylene glycol (tetramethylene glycol), 1, 5-pentanediol (1, 5-pentanediol), 1, 6-hexanediol (1, 6-hexanediol), 1, 10-decanediol (1, 10-decanediol), 1, 4-dihydroxy cyclohexane (1, 4-dihydroxycyclohexane), 1, 4-dihydroxy methylcyclohexane (1, 4-dihydroxymethylcyclohexane), diglycol (diethylene glycol), triethylene glycol (triethylene glycol), amino alcohol, polymer polyol.Above-mentioned hydroxyl compound only, for explanation, but is not limited to this, and in order to the hydroxyl compound of polymerization urethane resin segment, also can be one or more and mix and use.With total restatement of photosensitive resin composition, content (C) is between between 1wt% to 20wt%, better between 3wt% to 15wt%, better between 5wt% to 10wt%.Above-mentioned (C) can be used alone or mix several uses.(C) can make photosensitive resin composition of the present invention there is pliability, to avoid (B) to make too much material embrittlement.
(D) epoxy-silane copolymerization is by the copolymerization shown in following formula (I) or formula (II).
In formula (I) and formula (II), R is independent is respectively CH
3or OCH
3; M, n, o, p are respectively the unit of different repetition ratios.
The oligomer (for example trade name E-102B) that above-mentioned (D) can adopt waste river chemistry to produce.With total restatement of photosensitive resin composition, content (D) is between between 0.1wt% to 10wt%.(D) weight average molecular weight is 10k～60k.(D) itself can sol gel (self-sol-gel), make in (D) CH with Si-O bond
3scission of link, and lose CH
3the Si-O of bond can with Si-O around bond and form cross-linked structure each other.This cross-linked structure can improve the tack between photosensitive resin composition of the present invention and metal or glass, and because the bond number of Si-O increases, also can make the hardness of photosensitive resin composition of the present invention improve.
(E) organic acid anhydride can be maleic anhydride (maleic anhydride, MA), itaconic anhydride (itaconic anhydride), tetrahydrochysene acid phthalic anhydride (tetrahydro-phthalic anhydride), citraconic anhydride (citraconic anhydride), mesaconic acid acid anhydride (mesaconic anhydride) etc.Take (A) as 100 weight portions, content (E) is for example between 0.1 weight portion to 100 weight portion.Above-mentioned it (E) can be used alone or mix several uses.(E) can make the formed pattern of photosensitive resin composition of the present invention become more meticulous.
(F) light initiator, it is when irradiation energy, (for example can produce the active substance of initial cross-linking reaction, free radical, kation or negative ion etc.) light initiator can be phosphine oxide (phosphine oxide) based compound, acetophenones (Acetophenone), styrax class (benzoin), benzophenone (benzophenone) carbonyl (carbonyl) based compound, amino carbonyl (aminocarbonyl) based compound, Anthraquinones (anthraquinone) triazine (triazine) based compound, oxime (oxime) based compound, amine (amine) based compound, alkoxy anthracene (alkoxyantharcene) based compound, thioxanthones (thioxanthone) based compound.Take (A) as 100 weight portions, content (F) is for example between 0.1 weight portion to 100 weight portion.Above-mentioned it (F) can be used alone or mix several and use, to obtain higher film speed.
(G) organic solvent can be benzene (benzene), toluene (toluene), dimethylbenzene (xylene), methyl alcohol (methanol), ethanol (ethanol), ethylene glycol ether (ethylene glycol monopropyl ether), diethylene glycol dimethyl ether (diethylene glycol dimethyl ether), diethylene glycol dimethyl ether (diethylene glycol methyl ether), methoxy methyl propionate (methyl methoxypropionate), ethoxyl ethyl propionate (ethyl ethoxypropionate), ethyl lactate (ethyllactate), tetrahydrofuran (tetrahydrofuran), glycol monoethyl ether (ethylene glycol monomethyl ether), ethylene glycol monoethyl ether (ethylene glycol monoethyl ether), methylcellosolve acetate (methyl cellosolve acetate), ethyl cellosolve acetate (ethyl cellosolve acetate), diethylene glycol monomethyl ether (diethylene glycol monomethyl ether), diethylene glycol monoethyl ether (diethylene glycol monoethyl ether), diethylene glycol monobutyl ether (diethylene glycol monobutyl ether), 1-Methoxy-2-propyl acetate (propylene glycol methyl ether acetate, PGMEA), propylene-glycol ethyl ether acetate (propylene glycol ethyl ether acetate), propylene glycol propyl ether acetate (propylene glycol propyl ether acetate), methyl isobutyl ketone (methyl isobutyl ketone), methyl ether ketone (methyl ether ketone), ketone (ketone), cyclohexanone (cyclohexanone), dimethyl formamide (dimethyl formamide, DMF), DMA (N, N-dimethylacetamide, DMAc), 1-METHYLPYRROLIDONE (N-Methyl pyrrolidone, NMP), gamma-butyrolacton (γ-butyrolactone).With total restatement of photosensitive resin composition, content (G) is for example between between 60wt% to 80wt%.Above-mentioned it (G) can be used alone or mix several uses.
In addition, photosensitive resin composition of the present invention also can comprise (H) nano particle filling agent.(H) nano particle filling agent comprises the nano particles such as monox, titanium dioxide or aluminium oxide.(H) nano particle in can react with above-mentioned (D); and cross-linked structure during these nano particles can embed above-mentioned (D) or carry out bond with the cross-linked structure in above-mentioned (D), and then cause photosensitive resin composition of the present invention to there is better adhesion and stability.In addition, the own hardness of nano particle in (H) is harder, also can make the hardness of photosensitive resin composition of the present invention improve, but nano particle itself also than less opaque, can be optionally and suitable interpolation.With total restatement of photosensitive resin composition, content (H) is for example between between 5wt% to 20wt%.
In sum, owing to thering is good tack between photosensitive resin composition of the present invention and metal and glass, and there is high rigidity, therefore can be applicable in the processing procedure of contact panel.When photosensitive resin composition of the present invention is after exposure and developing, the dielectric layer between metal electrode can be formed, or the protective seam of covering metal electrode can be formed, to avoid metal electrode to be subject to scratch in processing procedure, cause the problem of low yield.
Experimental example
Below will to photosensitive resin composition of the present invention, describe with experimental example.
(A) there is the preparation method of polymkeric substance of three above common blocks as follows:
The 3-ethoxyl ethyl propionate (ethyl3-ethoxypropionate) of 95.673kg is added in reactor as solvent.Then, pass into nitrogen and be stirred and heated to 130 ℃.Then, the t-butyl perbenzoate (t-butyl perbenzoate) of the isobornyl methacrylate (isobornyl methacrylate) of the methacrylic acid benzyl ester of the methacrylic acid of 24.451kg, 42.614kg (benzyl methacrylate), 42.443kg and 2.547kg is stirred, and splash into the reactor of 130 ℃ and (splash into approximately 6 hours time).Afterwards, add the 3-ethoxyl ethyl propionate of 72.195kg, and the temperature of reactor is fallen and is back to 50 ℃.Then, stop providing nitrogen, and add the glycidyl methacrylate (glycidyl methacrylate) of 6.636kg, the dimethylaminoethanol (dimethyl amino ethanol) (catalyzer) of 0.716kg, in air, stirring reaction is 4 hours to 6 hours.The solids content of the resin solution product of gained is 41.4wt.%, and viscosity is 2650cps/25 ℃, and acid value (acidity) is 88.3mgKOH/g, and weight average molecular weight is 12000.
In the photosensitive resin composition of experimental example 1-experimental example 3 and comparative example 1-comparative example 3, other compositions except above-mentioned (A) as shown in Table 1.
The tack of the photosensitive resin composition of the present invention after ultrasonic shake is washed will be inquired into below.
After above-mentioned experimental example 1～experimental example 3 and the photosensitive resin composition of comparative example 1～comparative example 3 are coated on ito glass with rotating speed 350rpm, be statically placed in the about 120sec of room temperature.Then be positioned on heating plate pre-baked approximately 100 ℃, 90sec.After rising again, carry out step of exposure, then carry out development step.Then in high temperature, carry out thermmohardening processing procedure and form photoresistance.
Only experimental example 1, experimental example 3 and the formed photoresistance of comparative example 2 being carried out to ultrasonic shake washes.The power of supersonic cleaning machine is 1200W, and vibration frequency is 40kHz.Finally experimental example 1～experimental example 3 and the formed photoresistance of comparative example 1～comparative example 3 are carried out to pencil hardness test and the test of hundred lattice tacks.Pencil hardness test is to use Mitsubishi pencil, and tack test is to use 3M adhesive tape.Test result and above-mentioned experiment condition are shown in table one.
Table one
As shown in Table 1, compare with general photosensitive resin composition (comparative example 2), through ultrasonic, shake still has good tack and high rigidity after washing to photosensitive resin composition of the present invention (experimental example 1 and experimental example 3).
As shown in Table 1, compare with general photosensitive resin composition (comparative example 3), photosensitive resin composition of the present invention (experimental example 2) has preferably tack because include (D).
Although the present invention discloses as above with embodiment; so it is not in order to limit the present invention; under any, in technical field, have and conventionally know the knowledgeable; without departing from the spirit and scope of the invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion depending on the appended claim person of defining.
Claims (13)
1. a photosensitive resin composition, is characterized in that: described photosensitive resin composition comprises:
(A) have the polymkeric substance of three above common blocks, these common blocks comprise:
(A-1) contain the ethylene unsaturated monomer of acidic group; And
(A-2) ethylene unsaturated monomer except (A-1);
(B) there is the monomer of at least one ethene unsaturated double-bond;
(C) there is reactable acrylic acid functional group's urethane resin oligomer;
(D) epoxy-silane copolymerization;
(E) organic acid anhydride;
(F) light initiator;
(G) organic solvent; And
(H) nano particle filling agent, wherein
Described (D) epoxy-silane copolymerization is the copolymerization shown in formula (I) or formula (II),
In formula (I) and formula (II), R is independent is respectively CH
3or OCH
3; M, n, o, p are respectively the unit of different repetition ratios.
2. photosensitive resin composition as claimed in claim 1, is characterized in that: with total restatement of this photosensitive resin composition, the content of described (A) is between between 10wt% to 15wt%.
3. photosensitive resin composition as claimed in claim 1, is characterized in that: take described (A-1) be 100 weight portions with the summation of described (A-2), the content of described (A-1) is between 10 weight portion to 90 weight portions.
4. photosensitive resin composition as claimed in claim 1, is characterized in that: take described (A-1) be 100 weight portions with the summation of described (A-2), the content of described (A-2) is between 10 weight portion to 90 weight portions.
5. photosensitive resin composition as claimed in claim 1, is characterized in that: with total restatement of described photosensitive resin composition, the content of described (B) is between between 5wt% to 15wt%.
6. photosensitive resin composition as claimed in claim 1, is characterized in that: with total restatement of described photosensitive resin composition, the content of described (C) is between between 1wt% to 20wt%.
7. photosensitive resin composition as claimed in claim 1, is characterized in that: with total restatement of described photosensitive resin composition, the content of described (D) is between between 0.1wt% to 10wt%.
8. photosensitive resin composition as claimed in claim 1, is characterized in that: take described (A) as 100 weight portions, the content of described (E) is between 0.1 weight portion to 100 weight portion.
9. photosensitive resin composition as claimed in claim 1, is characterized in that: take described (A) as 100 weight portions, the content of described (F) is between 0.1 weight portion to 100 weight portion.
10. photosensitive resin composition as claimed in claim 1, is characterized in that: with total restatement of described photosensitive resin composition, the content of described (G) is between between 60wt% to 80wt%.
11. photosensitive resin compositions as claimed in claim 1, is characterized in that: the weight average molecular weight of described (D) is 10k～60k.
12. photosensitive resin compositions as claimed in claim 1, is characterized in that: described (H) nano particle filling agent comprises monox, titanium dioxide or aluminium oxide.
13. photosensitive resin compositions as claimed in claim 1, is characterized in that: with total restatement of described photosensitive resin composition, the content of described (H) is between between 5wt% to 20wt%.
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| CN106444283B (en) * | 2015-08-05 | 2021-04-16 | 住友化学株式会社 | Photosensitive resin composition |
| CN109581814A (en) * | 2017-09-29 | 2019-04-05 | 互耐普勒斯有限公司 | Low temperature curing type Photosensitve resin composition |
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