TWI485524B - Photosensitive resin composition and use thereof - Google Patents

Photosensitive resin composition and use thereof Download PDF

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TWI485524B
TWI485524B TW102131257A TW102131257A TWI485524B TW I485524 B TWI485524 B TW I485524B TW 102131257 A TW102131257 A TW 102131257A TW 102131257 A TW102131257 A TW 102131257A TW I485524 B TWI485524 B TW I485524B
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mercaptopropionate
photosensitive resin
resin composition
weight
compound
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TW102131257A
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TW201508421A (en
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Bo Nan Lin
Ya Chi Hsu
Hsiao Tzu Chen
Ta Chun Lan
Chih Yi Chang
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Everlight Chem Ind Corp
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感光性樹脂組成物及其用途Photosensitive resin composition and use thereof

本發明係關於一種感光性樹脂組成物及其用途,尤指一種適用於觸控面板產業之感光性樹脂組成物及其用途。The present invention relates to a photosensitive resin composition and use thereof, and more particularly to a photosensitive resin composition suitable for use in the touch panel industry and its use.

隨著半導體科技的快速發展及應用,為達到攜帶便利、輕量化及操作便利性等目的,許多電子產品已由傳統的鍵盤或滑鼠等輸入裝置,轉變為使用觸控面板(touch panel)作為輸入裝置。With the rapid development and application of semiconductor technology, in order to achieve portability, light weight and ease of operation, many electronic products have been converted from traditional keyboard or mouse input devices to touch panels. Input device.

傳統外掛式(add-on)觸控面板係設計為一片保護玻璃以及一片觸控感應玻璃之雙層結構。近年來,因考量到輕量化之需求,製造商係開始研發單片玻璃式之觸控面板。一般而言,製造商於製造單片玻璃式(One Glass Solution,OGS)之觸控面板時,通常係先將觸控面板之各種感應裝置設置於一強化玻璃母片表面,接著再以應力切割方式將強化玻璃母片切割為裝置所需之大小,以進行後端製程。然而,以此種方式切割之玻璃邊緣會有應力弱化現 象,易受外力衝擊而破碎。雖然此一問題可藉由使用雷射切割方式而獲得改善,但製造成本過高,並不利於大量生產。是以,提供一種低成本切割觸控面板玻璃之製程,且切割後之玻璃不會有應力弱化之問題,實有其所需。The traditional add-on touch panel is designed as a two-layer structure of a protective glass and a touch-sensitive glass. In recent years, due to the demand for lightweight, manufacturers have begun to develop single-glass glass touch panels. In general, when manufacturing a single-glass (One Glass Solution, OGS) touch panel, the manufacturer usually sets the various sensing devices of the touch panel on the surface of a tempered glass master, and then cuts the stress. The method cuts the tempered glass master into the size required for the device for the back end process. However, the edge of the glass cut in this way will have weak stress Like, it is vulnerable to external forces and broken. Although this problem can be improved by using a laser cutting method, the manufacturing cost is too high and it is not advantageous for mass production. Therefore, there is a need to provide a low-cost process for cutting the touch panel glass, and the glass after the cutting does not have the problem of weakening the stress.

本發明之主要目的係在透過應用一同時兼具耐氫氟酸蝕刻且易於剝除功效之新穎的負型感光性樹脂組成物於一觸控面板製程中,達到以低成本量產無邊緣應力弱化問題之觸控面板玻璃之目的。The main object of the present invention is to achieve a low-cost mass-free edge-free stress in a touch panel process by applying a novel negative photosensitive resin composition which is resistant to hydrofluoric acid etching and easy to strip. The purpose of the touch panel glass to weaken the problem.

為達成上述目的,本發明之一態樣係提供一種感光性樹脂組成物,包括:(A)30重量百分比至50重量百分比之鹼可溶樹脂;(B)10重量百分比至20重量百分比之單體;(C)5重量百分比至15重量百分比之光聚合起始劑;(D)2重量百分比至5重量百分比之多官能巰基化合物,其可為一支鏈型化合物或一環狀化合物,且該多官能巰基化合物包含至少2個巰基丙酸酯基;(E)2重量百分比至10重量百分比之矽烷類化合物;以及(F)餘量溶劑。In order to achieve the above object, an aspect of the present invention provides a photosensitive resin composition comprising: (A) 30% by weight to 50% by weight of an alkali-soluble resin; (B) 10% by weight to 20% by weight of a single (C) 5 to 15 weight percent of the photopolymerization initiator; (D) 2 to 5 weight percent of the polyfunctional mercapto compound, which may be a chain compound or a cyclic compound, and The polyfunctional mercapto compound comprises at least 2 mercaptopropionate groups; (E) from 2 weight percent to 10 weight percent of the decane compound; and (F) the balance solvent.

於上述本發明之感光性樹脂組成物中,只要可降低該感光性樹脂組成物之附著力並同時確保其耐氫氟酸蝕刻特性,任何種類之多官能巰基化合物皆可使用,本發明並不特別限制。舉例而言,於本發明之一態樣中,該多官能巰基化合物所含之該巰基丙酸酯基可經至少一取代基取代或未經取代,且該取代基可為C1-4 烷基。詳而言之,於 本發明之一具體態樣中,該多官能巰基化合物所含之巰基丙酸酯基可為3-巰基丙酸酯基。再者,更具體地,該多官能巰基化合物可包含3至6個巰基丙酸酯基。然而,本發明並不僅限於此。In the photosensitive resin composition of the present invention, any kind of polyfunctional mercapto compound can be used as long as the adhesion of the photosensitive resin composition can be reduced while ensuring its resistance to hydrofluoric acid etching. Special restrictions. For example, in one aspect of the present invention, the mercaptopropionate group contained in the polyfunctional mercapto compound may be substituted or unsubstituted with at least one substituent, and the substituent may be a C 1-4 alkane. base. In detail, in one embodiment of the present invention, the mercaptopropionate group contained in the polyfunctional mercapto compound may be a 3-mercaptopropionate group. Further, more specifically, the polyfunctional mercapto compound may contain 3 to 6 mercaptopropionate groups. However, the invention is not limited to this.

於上述本發明之感光性樹脂組成物中,該多官能巰基化合物之具體例子可包括,但不限於:三羥甲基丙烷三(3-巰基丙酸酯)(trimethylolpropane tris(3-mercaptopropionate),TMMP,式1)、季戊四醇四(3-巰基丙酸酯)(pentaerythritol tetrakis(3-mercaptopropionate),PEMP,式2)、二季戊四醇六(3-巰基丙酸酯)(dipentaerythritol hexakis(3-mercaptopropionate),DPMP,式3)、3-巰基丙酸-[2,4,6-三氧代-1,3,5-三嗪-1,3,5(2H,4H,6H)-次基]三-2,1-乙二醇酯(tris(thiopropionoylethyl)isocyanurate,TEMPIC,式4)、季戊四醇四(3-巰基丁酸酯)(pentaerythritol tetrakis(3-mercaptobutylate,PE 1,式5)、乙氧基季戊四醇四(3-巰基丙酸酯)(式6)、乙氧基三烴甲基丙烷三(3-巰基丙酸酯)(式7)、季戊四醇二(3-巰基丙酸酯)二(2-巰基乙酸酯)(式8)或其組合。In the above photosensitive resin composition of the present invention, specific examples of the polyfunctional mercapto compound may include, but are not limited to, trimethylolpropane tris (3-mercaptopropionate), TMMP, formula 1), pentaerythritol tetrakis (3-mercaptopropionate), PEMP, formula 2), dipentaerythritol hexakis (3-mercaptopropionate) , DPMP, formula 3), 3-mercaptopropionic acid-[2,4,6-trioxo-1,3,5-triazine-1,3,5(2H,4H,6H)-subunit] -2,1-ethylene glycol ester (tris(thiopropionoylethyl)isocyanurate, TEMPIC, formula 4), pentaerythritol tetrakis (3-mercaptobutylate, PE 1, formula 5), ethoxylate Pentaerythritol tetrakis(3-mercaptopropionate) (formula 6), ethoxytrimethylolpropane tris(3-mercaptopropionate) (formula 7), pentaerythritol bis(3-mercaptopropionate) di(2) - mercaptoacetate) (Formula 8) or a combination thereof.

式2 Equation 2

於上述本發明之感光性樹脂組成物中,該鹼可溶樹脂可為鹼可溶丙烯酸系樹脂。詳而言之,於本發明之一態樣中,該鹼可溶丙烯酸系樹脂可包括丙烯酸樹脂、丙烯酸-環氧樹脂、丙烯酸-苯乙烯樹脂、丙烯酸-三聚氰胺樹脂、或其組合。In the photosensitive resin composition of the present invention, the alkali-soluble resin may be an alkali-soluble acrylic resin. In detail, in one aspect of the present invention, the alkali-soluble acrylic resin may include an acrylic resin, an acrylic-epoxy resin, an acrylic-styrene resin, an acrylic-melamine resin, or a combination thereof.

於上述本發明之感光性樹脂組成物中,該單體可為一含多官能丙烯酸酯單體。舉例而言,該單體可包括 至少兩個丙烯酸酯;較佳地,該單體可包括2至6個丙烯酸酯;較佳地,該單體也可包括2至4個丙烯酸酯,但本發明並不僅限於此。詳而言之,該含多官能丙烯酸酯單體可為一非水溶性單體、一水溶性單體、或其組合。舉例而言,該非水溶性單體的例子可包括,但不限於:季戊四醇三丙烯酸酯(pentaerythritol triacrylate)、三甲基醚丙烷三丙烯酸酯(trimethylolpropane triacrylate)、三甲基醚丙烷三甲基丙烯酸酯(trimethylolpropane trimethacrylate)、三(2-烴乙基)異氰酸酯三丙烯酸酯(tris(2-hydroxy ethyl)isocyanurate triacrylate)、雙-三甲醇丙烷四丙烯酸酯(di-trimethylolpropane tetraacrylate)、五丙烯酸酯(pentaacrylate ester)、四乙酸異戊四醇(pentaerythritol tetraacrylate)、六乙酸二己四醇(dihexaerythritol hexaacrylate)、六乙酸二異戊四醇(dipentaerythritol hexaacrylate);該水溶性單體的例子可包括,但不限於:聚氧乙烯系單體:2(2-氧乙烯氧乙烯)乙烯基丙烯酸酯(2(2-ethoxyethoxy)ethyl acrylate)、15聚氧乙烯三甲醇丙烷三丙烯酸酯(ethoxylated(15)trimethylolpropane triacrylate)、30聚氧乙烯雙酚A二甲基丙烯酸酯(ethoxylated(30)bisphenol A diacrylate)、20聚氧乙烯三甲醇丙烷三丙烯酸酯(ethoxylated(20)trimethylolpropane triacrylate)、甲氧基聚乙二醇(350)單丙烯酸酯(methoxypolyethylene glycol(350)monomethacrylate)、甲氧基聚乙二醇(550)單丙烯酸酯(methoxypolyethylene glycol(550)monomethacrylate)、聚乙二醇(200)二丙烯酸酯(polyethylene glycol(200)diacrylate)、聚 乙二醇(400)二丙烯酸酯(polyethylene glycol(400)diacrylate)、聚乙二醇(600)二丙烯酸酯(polyethylene glycol(600)diacrylate)、聚氧丙烯單甲基丙烯酸酯(polypropylene glycol monomethacrylate)。然而應當了解的是,上述所列舉之單體例子僅為說明之目的,本發明並不僅限於此。In the above photosensitive resin composition of the present invention, the monomer may be a polyfunctional acrylate monomer. For example, the monomer can include At least two acrylates; preferably, the monomer may include from 2 to 6 acrylates; preferably, the monomer may also include from 2 to 4 acrylates, but the invention is not limited thereto. In detail, the polyfunctional acrylate monomer may be a water-insoluble monomer, a water-soluble monomer, or a combination thereof. For example, examples of the water-insoluble monomer may include, but are not limited to, pentaerythritol triacrylate, trimethylolpropane triacrylate, trimethyl ether propane trimethacrylate (trimethylolpropane trimethacrylate), tris(2-hydroxyethyl)isocyanurate triacrylate, di-trimethylolpropane tetraacrylate, pentaacrylate ester ), pentaerythritol tetraacrylate, dihexaerythritol hexaacrylate, dipentaerythritol hexaacrylate; examples of the water-soluble monomer may include, but are not limited to: Polyoxyethylene monomer: 2 (2-ethoxyethoxy)ethyl acrylate, 15 ethoxylated (15) trimethylolpropane triacrylate, 30 ethoxylated (30) bisphenol A diacrylate, 20 polyoxyethylene Ethoxylated (20) trimethylolpropane triacrylate, methoxypolyethylene glycol (350) monomethacrylate, methoxypolyethylene glycol (550) monoacrylate (methoxypolyethylene glycol (550) monomethacrylate), polyethylene glycol (200) diacrylate (polyethylene glycol (200) diacrylate), poly Polyethylene glycol (400) diacrylate, polyethylene glycol (600) diacrylate, polypropylene glycol monomethacrylate . However, it should be understood that the above-exemplified monomer examples are for illustrative purposes only and the invention is not limited thereto.

於上述本發明之感光性樹脂組成物中,只要能用以誘發光聚合反應,任何習知之光聚合起始劑皆可使用,本發明並不以此為限。舉例而言,於本發明之一態樣中,該光聚合起始劑可為苯乙酮系化合物、二苯甲酮系化合物、二咪唑系化合物、肟系化合物、或其組合。此外,該光聚合起始劑亦可選自於任何一種習知市售產品或其組合,例如Ciba Specialty Chemicals製造之Irgacure® 149、Irgacure® 184、Irgacure® 369、Irgacure® 500、Irgacure® 651、Irgacure® 784、Irgacure® 819、Irgacure® 907、Irgacure® 1700、Irgacure® 1800、Irgacure® 1850、Irgacure® 2959、Darocur® 1173、或Darocur® 4265,或Basf製造之Lucirin® TPO,但本發明並不僅限於此。In the above-mentioned photosensitive resin composition of the present invention, any conventional photopolymerization initiator can be used as long as it can be used to induce photopolymerization, and the present invention is not limited thereto. For example, in one aspect of the invention, the photopolymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a diimidazole-based compound, an anthraquinone-based compound, or a combination thereof. Further, the photopolymerization initiator may be selected from any of the conventional commercially available products or combinations thereof, such as Irgacure ® 149, Irgacure ® 184, Irgacure ® 369, Irgacure ® 500, Irgacure ® 651 manufactured by Ciba Specialty Chemicals. Irgacure ® 784, Irgacure ® 819, Irgacure ® 907, Irgacure ® 1700, Irgacure ® 1800, Irgacure ® 1850, Irgacure ® 2959, Darocur ® 1173, or Darocur ® 4265, or Lucirin ® TPO manufactured by Basf, but the invention is not only Limited to this.

於上述本發明之感光性樹脂組成物中,只要能適當地分散本發明感光性樹脂組成物之組成並達成所需之功效,任何類型之溶劑皆可使用,本發明並不特別限制。詳而言之,可做為本發明感光性樹脂組成物所需溶劑之具體例子包括,但不限於:乙二醇丙醚、二乙二醇二甲醚、四氫呋喃、乙二醇甲醚、乙二醇乙醚、二乙二醇甲醚、二乙二醇乙醚、二乙二醇丁醚、丙二醇甲醚醋酸酯、丙二醇 乙醚醋酸酯、丙二醇丙醚醋酸酯、3-乙氧基丙酸乙酯、乙酸乙酯、乙酸丁酯、二乙二醇二甲基乙醚、丙二醇甲醚、丙二醇丙醚、2-甲氧基乙酸乙酯、2-乙氧基乙酸乙酯、二乙二醇乙酸甲酯、二乙二醇乙酸乙酯、丙酮、甲基異丁基酮、環己酮、二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯烷酮、γ-丁內酯、二乙醚、乙二醇二甲醚、甲醇、乙醇、丙醇、異丙醇、2-甲氧乙醇、2-乙氧乙醇、二乙二醇甲醚、二乙二醇乙醚、二丙二醇甲醚、甲苯、二甲苯、己烷、庚烷、辛烷、或其組合。然而應當了解的是,上述所列舉之溶劑例子僅為說明之目的,本發明並不僅限於此。In the photosensitive resin composition of the present invention, any type of solvent can be used as long as the composition of the photosensitive resin composition of the present invention can be appropriately dispersed and the desired effect can be attained, and the present invention is not particularly limited. Specifically, specific examples of the solvent which can be used as the photosensitive resin composition of the present invention include, but are not limited to, ethylene glycol propyl ether, diethylene glycol dimethyl ether, tetrahydrofuran, ethylene glycol methyl ether, and B. Glycol diethyl ether, diethylene glycol methyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, propylene glycol methyl ether acetate, propylene glycol Ethyl acetate, propylene glycol propyl ether acetate, ethyl 3-ethoxypropionate, ethyl acetate, butyl acetate, diethylene glycol dimethyl ether, propylene glycol methyl ether, propylene glycol propyl ether, 2-methoxy Ethyl acetate, ethyl 2-ethoxyacetate, methyl diethylene glycol acetate, ethyl diethylene glycol, acetone, methyl isobutyl ketone, cyclohexanone, dimethylformamide, N , N-dimethylacetamide, N-methyl-2-pyrrolidone, γ-butyrolactone, diethyl ether, ethylene glycol dimethyl ether, methanol, ethanol, propanol, isopropanol, 2-methoxy Ethanol, 2-ethoxyethanol, diethylene glycol methyl ether, diethylene glycol diethyl ether, dipropylene glycol methyl ether, toluene, xylene, hexane, heptane, octane, or a combination thereof. However, it should be understood that the above-exemplified solvent examples are for illustrative purposes only, and the invention is not limited thereto.

於上述本發明之感光性樹脂組成物中,為了改善該感光性樹脂組成物之附著性及其硬度,以利於量產製程作業,本發明感光性樹脂組成物可包括任何類型之矽烷類化合物。舉例而言,於本發明之一態樣中,該矽烷類化合物可為一環氧基矽烷,但本發明並不以此為限。此外,該矽烷類化合物亦可選自於任何一種習知市售產品或其組合,例如Momentive公司製造之Silquest Y-9936、Silquest A-1100、Silquest A-1101、Silquest A-1102、Silquest A-1108、Silquest A-1110、Silquest A-1120、Silquest A-1122、Silquest A-1123、Silquest A-1126、Silquest A-1128、Silquest A-1130、Silquest A-1160、Silquest A-1170、Silquest A-1230、Silquest A-137、Silquest A-162、Silquest A-174、Silquest A-186、Silquest A-187、Silquest A-189、Silquest A-1891、Silquest A-2120、Silquest FR-522、或Silquest FR-693等,但本發明並不僅限 於此。In the photosensitive resin composition of the present invention, in order to improve the adhesion and hardness of the photosensitive resin composition to facilitate mass production process, the photosensitive resin composition of the present invention may include any type of decane compound. For example, in one aspect of the present invention, the decane compound may be an epoxy decane, but the invention is not limited thereto. Further, the decane compound may be selected from any of the conventional commercially available products or combinations thereof, such as Silquest Y-9936, Silquest A-1100, Silquest A-1101, Silquest A-1102, Silquest A- manufactured by Momentive. 1108, Silquest A-1110, Silquest A-1120, Silquest A-1122, Silquest A-1123, Silquest A-1126, Silquest A-1128, Silquest A-1130, Silquest A-1160, Silquest A-1170, Silquest A- 1230, Silquest A-137, Silquest A-162, Silquest A-174, Silquest A-186, Silquest A-187, Silquest A-189, Silquest A-1891, Silquest A-2120, Silquest FR-522, or Silquest FR -693, etc., but the invention is not limited herein.

再者,於上述本發明之感光性樹脂組成物中,該感光性樹脂組成物更可包括0.1重量百分比至5重量百分比之黏著促進劑,從而改善該感光性樹脂組成物對玻璃之附著力。再者,只要能夠改善本發明感光性樹脂組成物對玻璃之附著力,本發明並不特別限制黏著促進劑的種類。舉例而言,於本發明之一態樣中,該黏著促進劑可為三聚氰胺(melamine)。Further, in the photosensitive resin composition of the present invention, the photosensitive resin composition may further comprise 0.1% by weight to 5% by weight of an adhesion promoter, thereby improving the adhesion of the photosensitive resin composition to glass. Further, the present invention does not particularly limit the kind of the adhesion promoter as long as the adhesion of the photosensitive resin composition of the present invention to glass can be improved. For example, in one aspect of the invention, the adhesion promoter can be melamine.

此外,於上述本發明之感光性樹脂組成物中,該感光性樹脂組成物亦可依據實際應用時之需求,在不影響其功效的情況下,適度地添加其他成分之添加劑。舉例而言,於本發明之一態樣中,該添加劑可為著色劑、熱交連促進劑、流平劑、或其組合,但本發明並不以此為限。Further, in the photosensitive resin composition of the present invention, the photosensitive resin composition may be appropriately added with additives of other components without affecting the efficacy thereof depending on the needs of the actual application. For example, in one aspect of the present invention, the additive may be a colorant, a thermal crosslinking accelerator, a leveling agent, or a combination thereof, but the invention is not limited thereto.

據此,依據上述本發明感光性樹脂組成物配方,即可製備一同時兼具耐氫氟酸蝕刻及易於剝除功效之感光性樹脂組成物。According to the above, the photosensitive resin composition of the present invention can be used to prepare a photosensitive resin composition which is resistant to hydrofluoric acid etching and easy to remove.

本發明之另一目的係在提供一種感光性樹脂組成物之用途,其係透過該感光性樹脂組成物兼具耐氫氟酸蝕刻及易於剝除之特性,俾能利於應用至一觸控面板之玻璃切割製程中。Another object of the present invention is to provide a photosensitive resin composition which is resistant to hydrofluoric acid etching and easy to be peeled off through the photosensitive resin composition, and can be applied to a touch panel. In the glass cutting process.

為達成上述目的,本發明之另一態樣係提供一種上述感光性樹脂組成物之用途,其係將該感光性樹脂組成物使用於一玻璃之切割製程,以形成一具有切割路徑之光阻膜。舉例而言,該感光性樹脂組成物可塗佈於一觸控 面板之玻璃母片上,並透過任何習知之曝光顯影製程形成一具有切割路徑之光阻膜。接著,再將該玻璃母片浸置於一氫氟酸溶液中,使氫氟酸可沿著切割路徑切割該玻璃母片。最後,再將切割好的觸控面板玻璃上之光阻膜剝除,從而完成該觸控面板玻璃切割製程。In order to achieve the above object, another aspect of the present invention provides the use of the above photosensitive resin composition, which is used in a glass cutting process to form a photoresist having a cutting path. membrane. For example, the photosensitive resin composition can be applied to a touch A photoresist film having a cutting path is formed on the glass master of the panel by any conventional exposure and development process. Next, the glass master is immersed in a hydrofluoric acid solution so that hydrofluoric acid can cut the glass master along the cutting path. Finally, the photoresist film on the cut touch panel glass is stripped to complete the touch panel glass cutting process.

於上述本發明感光性樹脂組成物之用途中,由於本發明之感光性樹脂組成物具有降低與保護層光阻(overcoat,OC)及黑色光阻(Black Matrix,BM)之間的附著力並同時兼具耐氫氟酸蝕刻之特性,本發明感光性樹脂組成物相當適合應用於以氫氟酸切割觸控面板玻璃時保護觸控面板玻璃上之感應裝置等元件。In the use of the photosensitive resin composition of the present invention described above, the photosensitive resin composition of the present invention has a reduced adhesion to a protective layer overcoat (OC) and a black photoresist (Black Matrix, BM). At the same time, it has the characteristics of resistance to hydrofluoric acid etching, and the photosensitive resin composition of the present invention is quite suitable for use in an element such as an inductive device for protecting a touch panel glass when the touch panel glass is cut with hydrofluoric acid.

據此,透過應用本發明所製備之感光性樹脂組成物於一待切割之觸控面板玻璃母片上形成一具有切割路徑之光阻膜,即可透過以低成本之氫氟酸蝕刻法量產製備無邊緣應力弱化缺點之觸控面板。更詳細地說,本發明感光性樹脂組成物相當適合應用於製造單片玻璃式之觸控面板。Accordingly, by using the photosensitive resin composition prepared by the present invention to form a photoresist film having a cutting path on a touch panel glass master to be cut, mass production can be performed by low-cost hydrofluoric acid etching. A touch panel having the disadvantage of no edge stress weakening is prepared. In more detail, the photosensitive resin composition of the present invention is quite suitable for use in the manufacture of a single-glass type touch panel.

1‧‧‧玻璃母片1‧‧‧Glass master

1’‧‧‧觸控玻璃1'‧‧‧Touch glass

2‧‧‧觸控面板模組2‧‧‧Touch panel module

21‧‧‧線路區21‧‧‧Line area

22‧‧‧黑色光阻22‧‧‧Black photoresist

3‧‧‧光阻層3‧‧‧ photoresist layer

4‧‧‧切割路徑4‧‧‧ cutting path

圖1A至1D係本發明實施例10之觸控面板玻璃母片切割製程流程示意圖。1A to 1D are schematic views showing the flow of a process for cutting a glass master of a touch panel according to Embodiment 10 of the present invention.

製備例Preparation example

取2,2’-偶氮二異庚腈(2,2’-Azobis-2,4-dimethylvaleronitrile,ADVN)1.25克、甲基丙烯酸20克、甲基丙烯酸甲酯65克、及2-乙基丙烯酸己酯10克於144克之丙二醇甲醚醋酸酯中緩緩進行攪拌,在氮氣氣氛下於75℃進行一聚合反應。於4小時後,將上述反應物冷卻至室溫。該丙烯酸系樹酯經凝膠滲透層析法確認其重量平均分子量約為30,000。Take 2,2'-azobisisoheptanenitrile (2,2'-Azobis-2,4-dimethylvaleronitrile, ADVN) 1.25 g, 20 g of methacrylic acid, 65 g of methyl methacrylate, and 2-ethyl 10 g of hexyl acrylate was slowly stirred in 144 g of propylene glycol methyl ether acetate, and a polymerization reaction was carried out at 75 ° C under a nitrogen atmosphere. After 4 hours, the above reaction was cooled to room temperature. The acrylic resin was confirmed by gel permeation chromatography to have a weight average molecular weight of about 30,000.

實施例1至9Examples 1 to 9

請參考表1,係將鹼可溶樹脂、單體、光聚合起始劑、多官能巰基化合物、黏著促進劑、矽烷類化合物、流平劑、著色劑、及溶劑依照表1所示之組成配方配製為實施例1至9之感光性樹脂組成物,其中,所使用之鹼可溶樹脂為上述製備例所製備之鹼可溶丙烯酸系樹脂、單體為M-510(東亞合成製造)、光聚合起始劑為Irgacure® 184(Ciba Specialty Chemicals製造)及Lucirin® TPO(Basf製造)、黏著促進劑為三聚氰胺、矽烷類化合物為Silquest A-186(CAS:52682-88-9,Momentive製造)、流平劑為F-554(DIC製造)、著色劑為Blue 7(CAS:2390-690-5)、及溶劑為丙二醇甲醚醋酸酯,而各實施例所使用之多官能巰基化合物及其含量係如表1所示。Please refer to Table 1 for the composition of the alkali-soluble resin, monomer, photopolymerization initiator, polyfunctional sulfhydryl compound, adhesion promoter, decane compound, leveling agent, colorant, and solvent according to Table 1. The formulation is prepared as the photosensitive resin composition of Examples 1 to 9, wherein the alkali-soluble resin used is the alkali-soluble acrylic resin prepared in the above Preparation Example, and the monomer is M-510 (manufactured by Toagosei Co., Ltd.). The photopolymerization initiators are Irgacure ® 184 (manufactured by Ciba Specialty Chemicals) and Lucirin ® TPO (manufactured by Basf), the adhesion promoter is melamine, and the decane compound is Silquest A-186 (CAS: 52682-88-9, manufactured by Momentive). The leveling agent is F-554 (manufactured by DIC), the coloring agent is Blue 7 (CAS: 2390-690-5), and the solvent is propylene glycol methyl ether acetate, and the polyfunctional fluorenyl compound used in each of the examples and the same The content is shown in Table 1.

表1 Table 1

比較例1至4Comparative Examples 1 to 4

請參考表2,與實施例製備方法大致類似,依照表2所示之組成配方配製比較例1至4之感光性樹脂組成物。如表2所示,相較於上述實施例1至9,比較例1之差異主要在於不使用多官能巰基化合物,比較例2之差異主要在於多官能巰基化合物之含量,而比較例3及4之差異則在於使用直鏈型巰基化合物取代實施例所使用之多官能巰基化合物。Referring to Table 2, the photosensitive resin compositions of Comparative Examples 1 to 4 were prepared in accordance with the composition formula shown in Table 2, substantially similar to the preparation method of the examples. As shown in Table 2, Comparative Example 1 differs mainly from the above-described Examples 1 to 9 in that no polyfunctional fluorenyl compound is used, and Comparative Example 2 differs mainly in the content of the polyfunctional fluorenyl compound, and Comparative Examples 3 and 4 The difference is that the linear thiol compound is used in place of the polyfunctional fluorenyl compound used in the examples.

表2 Table 2

試驗例1至13Test examples 1 to 13

首先,準備一玻璃基材,並以去離子水及丙酮清潔該玻璃基材表面。接著,將上述實施例1至9、比較例1至4所製備之感光性樹脂組成物以旋轉塗佈方式分別均勻塗佈於該玻璃基材上。接著,於90℃下,軟烤10分鐘,並使用一光罩,直接以超高壓水銀燈(曝光能量:300mJ/cm2 )對上述塗佈於玻璃基材表面之感光性樹脂組成物進行曝光。接著,以0.04%氫氧化鉀顯影液進行顯影180秒。於140℃下,進行30分鐘之硬烤。最後,於25℃下以二次水清洗玻璃基板及該光阻層,從而獲得所需之樣本。First, a glass substrate was prepared and the surface of the glass substrate was cleaned with deionized water and acetone. Next, the photosensitive resin compositions prepared in the above Examples 1 to 9 and Comparative Examples 1 to 4 were uniformly applied onto the glass substrate by spin coating. Subsequently, the mixture was soft baked at 90 ° C for 10 minutes, and the photosensitive resin composition applied to the surface of the glass substrate was directly exposed with an ultrahigh pressure mercury lamp (exposure energy: 300 mJ/cm 2 ) using a photomask. Next, development was carried out for 180 seconds with a 0.04% potassium hydroxide developer. Hard roasting was carried out for 30 minutes at 140 °C. Finally, the glass substrate and the photoresist layer were washed with secondary water at 25 ° C to obtain a desired sample.

<耐蝕性><Corrosion resistance>

上述試驗例1至13製得之樣本係分別浸置於6%氫氟酸中4小時以進行耐蝕性測試。測試結果如表3所示。The samples prepared in the above Test Examples 1 to 13 were each immersed in 6% hydrofluoric acid for 4 hours for corrosion resistance test. The test results are shown in Table 3.

<剝除性><stripping>

上述試驗例1至13製得之樣本係分別浸置於40℃、5%之氫氧化鈉溶液中10分鐘以進行剝除性測試。測試結果如表3所示。The samples prepared in the above Test Examples 1 to 13 were each immersed in a sodium hydroxide solution at 40 ° C for 10 minutes for peeling test. The test results are shown in Table 3.

<儲存安定性><Storage Stability>

上述試驗例1至13製得之樣本係分別於25℃下靜置儲存3天。儲存安定性的判斷標準為儲存3天後,樣品是否形成膠態,若形成膠態則判定為無法儲存3天。測試結果如表3所示。The samples prepared in the above Test Examples 1 to 13 were each stored at 25 ° C for 3 days. The criterion for storage stability is whether the sample forms a colloidal state after 3 days of storage, and if it is formed into a colloidal state, it is determined that it cannot be stored for 3 days. The test results are shown in Table 3.

如表3所示,由於本發明組成配方配製之感光性樹脂組成物所含之多官能巰基化合物為支鏈型化合物(如實施例1至6)或環狀化合物(如實施例7及8),本發明之感 光性樹脂組成物皆具有優異的耐蝕性、易剝除性及儲存安定性。反之,如比較例1結果,當感光性樹脂組成物不含有該多官能巰基化合物時,雖可維持其耐氫氟酸蝕刻特性及儲存安定性,但卻難以將所形成之光阻層從玻璃基板上剝除。如比較例2結果所示,當多官能巰基化合物之含量高於本發明所請配方含量時,雖可改善其剝除性,然而儲存安定性卻下降。再者,如比較例3及4結果所示,雖用以替代多官能巰基化合物之直鏈型巰基化合物也含有一個巰基,仍無法使其易於由玻璃基板上剝除。As shown in Table 3, the polyfunctional mercapto compound contained in the photosensitive resin composition prepared by the composition of the present invention is a branched compound (such as Examples 1 to 6) or a cyclic compound (such as Examples 7 and 8). , the feeling of the invention The optical resin composition has excellent corrosion resistance, easy peelability, and storage stability. On the other hand, as a result of Comparative Example 1, when the photosensitive resin composition does not contain the polyfunctional fluorenyl compound, it is possible to maintain the resistance to hydrofluoric acid etching and storage stability, but it is difficult to form the photoresist layer from the glass. Strip on the substrate. As shown by the results of Comparative Example 2, when the content of the polyfunctional fluorenyl compound was higher than that of the present invention, although the peeling property was improved, the storage stability was lowered. Further, as shown by the results of Comparative Examples 3 and 4, although the linear mercapto compound which is used in place of the polyfunctional mercapto compound also contains a mercapto group, it is not easily peeled off from the glass substrate.

由上述結果可知,相較於比較例1至4,本案實施例1至9所製備之感光性樹脂組成物確實具有優異的耐蝕性、易剝除性及儲存安定性。From the above results, it was found that the photosensitive resin compositions prepared in Examples 1 to 9 of the present invention did have excellent corrosion resistance, peelability, and storage stability as compared with Comparative Examples 1 to 4.

實施例10Example 10

實施例10係為將實施例1所製備之感光性樹脂組成物應用於一觸控面板玻璃母片切割製程。請參考圖1A至1D,係為實施例10之觸控面板玻璃母片切割製程流程示意圖。首先,如圖1A所示,提供一觸控面板之玻璃母片1,該玻璃母片1上係形成有複數個觸控面板模組2,該觸控面板模組2係包括一線路區21及一黑色光阻22。接著,如圖1B所示,係將上述實施例1所製備之感光性樹脂組成物塗佈於該玻璃母片1上,乾燥該感光性樹脂組成物並進行一曝光顯影製程以形成一含有切割路徑4之光阻層3。請繼續參考圖1C,係將上述形成含有切割路徑4之光阻 層3之玻璃母片1浸置於6%氫氟酸溶液中以形成一包含一個觸控面板模組2之觸控玻璃1’。最後,如圖1D所示,將該含有一個觸控面板模組2之觸控玻璃1’浸置於5%氫氧化鈉溶液中以剝除覆蓋於其上之光阻層3,從而完成該觸控面板玻璃母片切割製程。In Example 10, the photosensitive resin composition prepared in Example 1 was applied to a touch panel glass master cutting process. Please refer to FIG. 1A to FIG. 1D , which are schematic diagrams of the process of cutting the glass master wafer of the touch panel of the embodiment 10. First, as shown in FIG. 1A, a glass master 1 of a touch panel is provided. The glass master 1 is formed with a plurality of touch panel modules 2, and the touch panel module 2 includes a line region 21 And a black photoresist 22. Next, as shown in FIG. 1B, the photosensitive resin composition prepared in the above Example 1 is applied onto the glass mother substrate 1, and the photosensitive resin composition is dried and subjected to an exposure and development process to form a cut-containing film. The photoresist layer 3 of the path 4. Please continue to refer to FIG. 1C, which is to form the photoresist having the cutting path 4 described above. The glass master 1 of layer 3 is immersed in a 6% hydrofluoric acid solution to form a touch glass 1' comprising a touch panel module 2. Finally, as shown in FIG. 1D, the touch glass 1' containing a touch panel module 2 is immersed in a 5% sodium hydroxide solution to strip the photoresist layer 3 overlying it, thereby completing the Touch panel glass master cutting process.

上述實施例僅係為了方便說明而舉例而已,本發明所主張之權利範圍自應以申請專利範圍所述為準,而非僅限於上述實施例。The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧玻璃母片1‧‧‧Glass master

3‧‧‧光阻層3‧‧‧ photoresist layer

4‧‧‧切割路徑4‧‧‧ cutting path

Claims (7)

一種感光性樹脂組成物之用途,其係使用於一利用氫氟酸進行之玻璃切割製程,以形成一具有切割路徑之光阻膜,該感光性樹脂組成物包括:(A)30重量百分比至50重量百分比之鹼可溶樹脂;(B)10重量百分比至20重量百分比之單體;(C)5重量百分比至15重量百分比之光聚合起始劑;(D)2重量百分比至5重量百分比之多官能巰基化合物,其係為一支鏈型化合物或一環狀化合物,且該多官能巰基化合物包含至少2個巰基丙酸酯基;以及(E)2重量百分比至10重量百分比之矽烷類化合物(F)餘量溶劑。 A use of a photosensitive resin composition for use in a glass cutting process using hydrofluoric acid to form a photoresist film having a cutting path, the photosensitive resin composition comprising: (A) 30% by weight to 50% by weight of alkali soluble resin; (B) 10% by weight to 20% by weight of monomer; (C) 5 to 15% by weight of photopolymerization initiator; (D) 2 to 5 weight percent a polyfunctional mercapto compound which is a chain compound or a cyclic compound, and the polyfunctional mercapto compound comprises at least 2 mercaptopropionate groups; and (E) 2 to 10% by weight of decane Compound (F) balance solvent. 如申請專利範圍第1項所述之用途,其中,該巰基丙酸酯基係經至少一取代基取代或未經取代,該取代基係為C1-4 烷基。The use according to claim 1, wherein the mercaptopropionate group is substituted or unsubstituted with at least one substituent, and the substituent is a C 1-4 alkyl group. 如申請專利範圍第2項所述之用途,其中,該巰基丙酸酯基係為3-巰基丙酸酯基。 The use according to claim 2, wherein the mercaptopropionate group is a 3-mercaptopropionate group. 如申請專利範圍第1項所述之用途,其中,該多官能巰基化合物係包含3至6個巰基丙酸酯基。 The use of claim 1, wherein the polyfunctional mercapto compound comprises from 3 to 6 mercaptopropionate groups. 如申請專利範圍第1項所述之用途,其中,該多官能巰基化合物係為三羥甲基丙烷三(3-巰基丙酸酯)(trimethylolpropane tris(3-mercaptopropionate),TMMP)、季戊四醇四(3-巰基丙酸酯)(pentaerythritol tetrakis(3-mercaptopropionate),PEMP)、二季戊四醇六(3-巰 基丙酸酯)(dipentaerythritol hexakis(3-mercaptopropionate),DPMP)、3-巰基丙酸-[2,4,6-三氧代-1,3,5-三嗪-1,3,5(2H,4H,6H)-次基]三-2,1-乙二醇酯(tris(thiopropionoylethyl)isocyanurate,TEMPIC)、季戊四醇四(3-巰基丁酸酯)(pentaerythritol tetrakis(3-mercaptobutvlate)、或其組合。 The use of the first aspect of the invention, wherein the polyfunctional mercapto compound is trimethylolpropane tris (3-mercaptopropionate, TMMP), pentaerythritol IV (trimethylolpropane tris (3-mercaptopropionate), TMMP) 3-mercaptopropionate (PEMP), dipentaerythritol (3-巯) Dipentaerythritol hexakis (3-mercaptopropionate, DPMP), 3-mercaptopropionic acid-[2,4,6-trioxo-1,3,5-triazine-1,3,5(2H , 4H, 6H)-sub-]tris (thiopropionoylethyl) isocyanurate (TEMPIC), pentaerythritol tetrakis (3-mercaptobutvlate), or combination. 如申請專利範圍第1項所述之用途,其中,該鹼可溶樹脂係為鹼可溶丙烯酸系樹脂。 The use according to claim 1, wherein the alkali-soluble resin is an alkali-soluble acrylic resin. 如申請專利範圍第1項所述之用途,其中,該單體係為一含多官能丙烯酸酯單體。 The use of claim 1, wherein the single system is a polyfunctional acrylate monomer.
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TW200928580A (en) * 2007-11-16 2009-07-01 Sumitomo Chemical Co Polymer resin composition
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Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101578303B (en) * 2007-01-15 2012-08-08 Lg化学株式会社 New polymer resin compounds and photoresist composition including new polymer resin compounds
CN101625525B (en) * 2008-07-11 2013-06-12 住友化学株式会社 Light-sensitive resin composition
CN102445849B (en) * 2010-09-30 2013-11-13 达兴材料股份有限公司 Light sensitive resin composition
TWI434138B (en) * 2011-11-09 2014-04-11 Daxin Materials Corp Photo-sensitivity resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200928580A (en) * 2007-11-16 2009-07-01 Sumitomo Chemical Co Polymer resin composition
TW201233734A (en) * 2011-01-28 2012-08-16 Toyo Ink Sc Holdings Co Ltd Diketopyrrolopyrrole pigment composition for color filter, coloring composition for color filter, and color filter

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