CN103097394B - 钼(iv)酰胺前驱物和其在原子层沉积中的用途 - Google Patents
钼(iv)酰胺前驱物和其在原子层沉积中的用途 Download PDFInfo
- Publication number
- CN103097394B CN103097394B CN201180041532.4A CN201180041532A CN103097394B CN 103097394 B CN103097394 B CN 103097394B CN 201180041532 A CN201180041532 A CN 201180041532A CN 103097394 B CN103097394 B CN 103097394B
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- CN
- China
- Prior art keywords
- cyclopentadienyl
- methyl
- nmeet
- precursor
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F11/00—Compounds containing elements of Groups 6 or 16 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37769210P | 2010-08-27 | 2010-08-27 | |
| US61/377,692 | 2010-08-27 | ||
| PCT/US2011/049155 WO2012027575A1 (en) | 2010-08-27 | 2011-08-25 | Molybdenum (iv) amide precursors and use thereof in atomic layer deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103097394A CN103097394A (zh) | 2013-05-08 |
| CN103097394B true CN103097394B (zh) | 2016-03-02 |
Family
ID=44545976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180041532.4A Expired - Fee Related CN103097394B (zh) | 2010-08-27 | 2011-08-25 | 钼(iv)酰胺前驱物和其在原子层沉积中的用途 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9802220B2 (enExample) |
| EP (1) | EP2609102B1 (enExample) |
| JP (1) | JP5873494B2 (enExample) |
| KR (1) | KR101847953B1 (enExample) |
| CN (1) | CN103097394B (enExample) |
| IL (1) | IL224618A (enExample) |
| SG (1) | SG187920A1 (enExample) |
| TW (1) | TWI549958B (enExample) |
| WO (1) | WO2012027575A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2432363B (en) | 2005-11-16 | 2010-06-23 | Epichem Ltd | Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition |
| TWI382987B (zh) | 2007-07-24 | 2013-01-21 | Sigma Aldrich Co | 應用於化學相沉積製程的有機金屬前驅物 |
| EP2201149B1 (en) | 2007-09-14 | 2013-03-13 | Sigma-Aldrich Co. | Methods of preparing titanium containing thin films by atomic layer deposition using monocyclopentadienyl titanium-based precursors |
| TWI467045B (zh) | 2008-05-23 | 2015-01-01 | Sigma Aldrich Co | 高介電常數電介質薄膜與使用鈰基前驅物製造高介電常數電介質薄膜之方法 |
| EP3150614B1 (en) | 2009-08-07 | 2017-11-29 | Sigma-Aldrich Co. LLC | High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films |
| SG187920A1 (en) | 2010-08-27 | 2013-03-28 | Sigma Aldrich Co Llc | Molybdenum (iv) amide precursors and use thereof in atomic layer deposition |
| US8927748B2 (en) | 2011-08-12 | 2015-01-06 | Sigma-Aldrich Co. Llc | Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films |
| SG11201404375PA (en) | 2012-01-26 | 2014-10-30 | Sigma Aldrich Co Llc | Molybdenum allyl complexes and use thereof in thin film deposition |
| WO2014140672A1 (en) * | 2013-03-15 | 2014-09-18 | L'air Liquide, Societe Anonyme Pour I'etude Et I'exploitation Des Procedes Georges Claude | Bis(alkylimido)-bis(alkylamido)molybdenum molecules for deposition of molybdenum-containing films |
| JP6471371B2 (ja) * | 2014-03-13 | 2019-02-20 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung | モリブデンシルシクロペンタジエニル錯体、シリルアリル錯体、及び、薄膜堆積におけるその使用 |
| KR102147190B1 (ko) * | 2015-03-20 | 2020-08-25 | 에스케이하이닉스 주식회사 | 막형성조성물 및 그를 이용한 박막 제조 방법 |
| KR102344660B1 (ko) * | 2015-05-27 | 2021-12-29 | 에이에스엠 아이피 홀딩 비.브이. | 몰리브덴 또는 텅스텐 함유 박막의 ald용 전구체의 합성 및 사용 |
| US10662527B2 (en) | 2016-06-01 | 2020-05-26 | Asm Ip Holding B.V. | Manifolds for uniform vapor deposition |
| KR102727616B1 (ko) | 2016-10-07 | 2024-11-07 | 삼성전자주식회사 | 유기 금속 전구체, 이를 이용한 막 형성 방법 및 이를 이용한 반도체 장치의 제조 방법 |
| US10358407B2 (en) | 2016-10-12 | 2019-07-23 | Asm Ip Holding B.V. | Synthesis and use of precursors for vapor deposition of tungsten containing thin films |
| KR102474876B1 (ko) * | 2017-06-15 | 2022-12-07 | 삼성전자주식회사 | 텅스텐 전구체 및 이를 이용한 텅스텐 함유막의 형성 방법 |
| US11560625B2 (en) * | 2018-01-19 | 2023-01-24 | Entegris, Inc. | Vapor deposition of molybdenum using a bis(alkyl-arene) molybdenum precursor |
| US11492701B2 (en) | 2019-03-19 | 2022-11-08 | Asm Ip Holding B.V. | Reactor manifolds |
| KR20210048408A (ko) | 2019-10-22 | 2021-05-03 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 증착 반응기 매니폴드 |
| TWI865725B (zh) | 2020-02-10 | 2024-12-11 | 荷蘭商Asm Ip私人控股有限公司 | 高深寬比孔內的氧化鉿之沉積 |
| KR102793252B1 (ko) | 2020-03-25 | 2025-04-08 | 삼성전자주식회사 | 몰리브덴 화합물과 이를 이용한 집적회로 소자의 제조 방법 |
| TW202200828A (zh) | 2020-06-24 | 2022-01-01 | 荷蘭商Asm Ip私人控股有限公司 | 含鉬薄膜的氣相沉積 |
| US11584768B2 (en) * | 2021-01-12 | 2023-02-21 | Applied Materials, Inc. | Arene molybdenum (0) precursors for deposition of molybdenum films |
| US11459347B2 (en) | 2021-01-12 | 2022-10-04 | Applied Materials, Inc. | Molybdenum(IV) and molybdenum(III) precursors for deposition of molybdenum films |
| US11390638B1 (en) | 2021-01-12 | 2022-07-19 | Applied Materials, Inc. | Molybdenum(VI) precursors for deposition of molybdenum films |
| US11434254B2 (en) | 2021-01-12 | 2022-09-06 | Applied Materials, Inc. | Dinuclear molybdenum precursors for deposition of molybdenum-containing films |
| US11760768B2 (en) | 2021-04-21 | 2023-09-19 | Applied Materials, Inc. | Molybdenum(0) precursors for deposition of molybdenum films |
| US20230002888A1 (en) * | 2021-07-01 | 2023-01-05 | Applied Materials, Inc. | Method of depositing metal films |
| KR102812241B1 (ko) * | 2023-06-16 | 2025-05-23 | 에스케이트리켐 주식회사 | 신규한 몰리브데넘 함유 박막 형성용 전구체 및 이를 이용한 몰리브데넘 함유 박막의 형성 방법. |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064686A (en) * | 1990-10-29 | 1991-11-12 | Olin Corporation | Sub-valent molybdenum, tungsten, and chromium amides as sources for thermal chemical vapor deposition of metal-containing films |
| TW200912030A (en) * | 2007-09-14 | 2009-03-16 | Sigma Aldrich Co | Methods of preparing thin films by atomic layer deposition using titanium-based precursors |
| CN101500989A (zh) * | 2006-06-28 | 2009-08-05 | 哈佛学院院长等 | 四脒基金属(iv)化合物及其在气相沉积中的用途 |
Family Cites Families (28)
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|---|---|---|---|---|
| JPH07107190B2 (ja) | 1984-03-30 | 1995-11-15 | キヤノン株式会社 | 光化学気相成長方法 |
| GB9929279D0 (en) | 1999-12-11 | 2000-02-02 | Epichem Ltd | An improved method of and apparatus for the delivery of precursors in the vapour phase to a plurality of epitaxial reactor sites |
| GB0017968D0 (en) | 2000-07-22 | 2000-09-13 | Epichem Ltd | An improved process and apparatus for the isolation of pure,or substantially pure,organometallic compounds |
| AU2002337310A1 (en) | 2001-10-26 | 2003-05-06 | Epichem Limited | Improved precursors for chemical vapour deposition |
| TW200411923A (en) | 2002-07-19 | 2004-07-01 | Asml Us Inc | In-situ formation of metal insulator metal capacitors |
| JP4575362B2 (ja) | 2003-03-17 | 2010-11-04 | シグマ−アルドリッチ・カンパニー | 金属酸化物層または膜を成膜するための前駆体 |
| GB0412790D0 (en) | 2004-06-08 | 2004-07-14 | Epichem Ltd | Precursors for deposition of silicon nitride,silicon oxynitride and metal silicon oxynitrides |
| GB2432363B (en) | 2005-11-16 | 2010-06-23 | Epichem Ltd | Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition |
| US7638645B2 (en) | 2006-06-28 | 2009-12-29 | President And Fellows Of Harvard University | Metal (IV) tetra-amidinate compounds and their use in vapor deposition |
| US7956207B2 (en) * | 2006-09-28 | 2011-06-07 | Praxair Technology, Inc. | Heteroleptic organometallic compounds |
| TWI382987B (zh) | 2007-07-24 | 2013-01-21 | Sigma Aldrich Co | 應用於化學相沉積製程的有機金屬前驅物 |
| TWI425110B (zh) | 2007-07-24 | 2014-02-01 | Sigma Aldrich Co | 以化學相沉積法製造含金屬薄膜之方法 |
| US8039062B2 (en) | 2007-09-14 | 2011-10-18 | Sigma-Aldrich Co. Llc | Methods of atomic layer deposition using hafnium and zirconium-based precursors |
| TW200944535A (en) | 2008-03-20 | 2009-11-01 | Sigma Aldrich Co | Purification and preparation of phosphorus-containing compounds |
| TW200949939A (en) | 2008-05-23 | 2009-12-01 | Sigma Aldrich Co | High-k dielectric films and methods of producing using titanium-based β -diketonate precursors |
| WO2009143452A1 (en) | 2008-05-23 | 2009-11-26 | Sigma-Aldrich Co. | High-k dielectric films and methods of producing using cerium-based precursors |
| TWI467045B (zh) | 2008-05-23 | 2015-01-01 | Sigma Aldrich Co | 高介電常數電介質薄膜與使用鈰基前驅物製造高介電常數電介質薄膜之方法 |
| TW200949006A (en) | 2008-05-23 | 2009-12-01 | Sigma Aldrich Co | High-k dielectric films and methods of producing using titanium-based precursors |
| TW200951241A (en) | 2008-05-30 | 2009-12-16 | Sigma Aldrich Co | Methods of forming ruthenium-containing films by atomic layer deposition |
| TW201014925A (en) | 2008-06-20 | 2010-04-16 | Sigma Aldrich Co | Titanium pyrrolyl-based organometallic precursors and use thereof for preparing dielectric thin films |
| WO2010114386A1 (en) * | 2009-03-30 | 2010-10-07 | Universitetet I Oslo | Thin films containing molybdenum oxide |
| EP2456906A1 (en) | 2009-07-21 | 2012-05-30 | Sigma-Aldrich Co. LLC | Compositions and methods of use for forming titanium- containing thin films |
| EP3150614B1 (en) | 2009-08-07 | 2017-11-29 | Sigma-Aldrich Co. LLC | High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films |
| US8318572B1 (en) * | 2010-02-19 | 2012-11-27 | Intermolecular, Inc. | Inexpensive electrode materials to facilitate rutile phase titanium oxide |
| US20130052368A1 (en) | 2010-03-19 | 2013-02-28 | Sigma-Aldrich Co. Llc | Methods for preparing thin films by atomic layer deposition using hydrazines |
| SG187920A1 (en) | 2010-08-27 | 2013-03-28 | Sigma Aldrich Co Llc | Molybdenum (iv) amide precursors and use thereof in atomic layer deposition |
| US8927748B2 (en) | 2011-08-12 | 2015-01-06 | Sigma-Aldrich Co. Llc | Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films |
| SG11201404375PA (en) | 2012-01-26 | 2014-10-30 | Sigma Aldrich Co Llc | Molybdenum allyl complexes and use thereof in thin film deposition |
-
2011
- 2011-08-25 SG SG2013012679A patent/SG187920A1/en unknown
- 2011-08-25 US US13/817,591 patent/US9802220B2/en not_active Expired - Fee Related
- 2011-08-25 EP EP11752057.7A patent/EP2609102B1/en not_active Not-in-force
- 2011-08-25 CN CN201180041532.4A patent/CN103097394B/zh not_active Expired - Fee Related
- 2011-08-25 KR KR1020137006186A patent/KR101847953B1/ko not_active Expired - Fee Related
- 2011-08-25 WO PCT/US2011/049155 patent/WO2012027575A1/en not_active Ceased
- 2011-08-25 JP JP2013527130A patent/JP5873494B2/ja not_active Expired - Fee Related
- 2011-08-26 TW TW100130779A patent/TWI549958B/zh not_active IP Right Cessation
-
2013
- 2013-02-07 IL IL224618A patent/IL224618A/en active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064686A (en) * | 1990-10-29 | 1991-11-12 | Olin Corporation | Sub-valent molybdenum, tungsten, and chromium amides as sources for thermal chemical vapor deposition of metal-containing films |
| CN101500989A (zh) * | 2006-06-28 | 2009-08-05 | 哈佛学院院长等 | 四脒基金属(iv)化合物及其在气相沉积中的用途 |
| TW200912030A (en) * | 2007-09-14 | 2009-03-16 | Sigma Aldrich Co | Methods of preparing thin films by atomic layer deposition using titanium-based precursors |
Non-Patent Citations (1)
| Title |
|---|
| Synthesis of new amido, alkoxo and ç-cyclopentadienyl derivatives of molybdenum;Xuefeng Yan et al.;《Journal of the Chemical Society,Dalton Transactions》;19971231(第12期);第2091-2099页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5873494B2 (ja) | 2016-03-01 |
| KR20130139866A (ko) | 2013-12-23 |
| CN103097394A (zh) | 2013-05-08 |
| TW201219405A (en) | 2012-05-16 |
| TWI549958B (zh) | 2016-09-21 |
| EP2609102A1 (en) | 2013-07-03 |
| WO2012027575A1 (en) | 2012-03-01 |
| SG187920A1 (en) | 2013-03-28 |
| IL224618A (en) | 2015-02-26 |
| KR101847953B1 (ko) | 2018-04-11 |
| JP2013540893A (ja) | 2013-11-07 |
| US20130196065A1 (en) | 2013-08-01 |
| US9802220B2 (en) | 2017-10-31 |
| EP2609102B1 (en) | 2014-12-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171220 Address after: Darmstadt Patentee after: MERCK PATENT GmbH Address before: American Missouri Patentee before: SIGMA-ALDRICH Co.,LLC |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 |