CN103097394B - 钼(iv)酰胺前驱物和其在原子层沉积中的用途 - Google Patents

钼(iv)酰胺前驱物和其在原子层沉积中的用途 Download PDF

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Publication number
CN103097394B
CN103097394B CN201180041532.4A CN201180041532A CN103097394B CN 103097394 B CN103097394 B CN 103097394B CN 201180041532 A CN201180041532 A CN 201180041532A CN 103097394 B CN103097394 B CN 103097394B
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cyclopentadienyl
methyl
nmeet
precursor
formula
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CN103097394A (zh
Inventor
彼得·尼古拉·海斯
拉杰什·奥德德拉
萨拉赫·路易斯·欣德利
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Merck Patent GmbH
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Sigma Aldrich Co LLC
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/60Deposition of organic layers from vapour phase
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F17/00Metallocenes
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F11/00Compounds containing elements of Groups 6 or 16 of the Periodic Table
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/405Oxides of refractory metals or yttrium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
CN201180041532.4A 2010-08-27 2011-08-25 钼(iv)酰胺前驱物和其在原子层沉积中的用途 Expired - Fee Related CN103097394B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US37769210P 2010-08-27 2010-08-27
US61/377,692 2010-08-27
PCT/US2011/049155 WO2012027575A1 (en) 2010-08-27 2011-08-25 Molybdenum (iv) amide precursors and use thereof in atomic layer deposition

Publications (2)

Publication Number Publication Date
CN103097394A CN103097394A (zh) 2013-05-08
CN103097394B true CN103097394B (zh) 2016-03-02

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Country Link
US (1) US9802220B2 (enExample)
EP (1) EP2609102B1 (enExample)
JP (1) JP5873494B2 (enExample)
KR (1) KR101847953B1 (enExample)
CN (1) CN103097394B (enExample)
IL (1) IL224618A (enExample)
SG (1) SG187920A1 (enExample)
TW (1) TWI549958B (enExample)
WO (1) WO2012027575A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2432363B (en) 2005-11-16 2010-06-23 Epichem Ltd Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition
TWI382987B (zh) 2007-07-24 2013-01-21 Sigma Aldrich Co 應用於化學相沉積製程的有機金屬前驅物
EP2201149B1 (en) 2007-09-14 2013-03-13 Sigma-Aldrich Co. Methods of preparing titanium containing thin films by atomic layer deposition using monocyclopentadienyl titanium-based precursors
TWI467045B (zh) 2008-05-23 2015-01-01 Sigma Aldrich Co 高介電常數電介質薄膜與使用鈰基前驅物製造高介電常數電介質薄膜之方法
EP3150614B1 (en) 2009-08-07 2017-11-29 Sigma-Aldrich Co. LLC High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films
SG187920A1 (en) 2010-08-27 2013-03-28 Sigma Aldrich Co Llc Molybdenum (iv) amide precursors and use thereof in atomic layer deposition
US8927748B2 (en) 2011-08-12 2015-01-06 Sigma-Aldrich Co. Llc Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films
SG11201404375PA (en) 2012-01-26 2014-10-30 Sigma Aldrich Co Llc Molybdenum allyl complexes and use thereof in thin film deposition
WO2014140672A1 (en) * 2013-03-15 2014-09-18 L'air Liquide, Societe Anonyme Pour I'etude Et I'exploitation Des Procedes Georges Claude Bis(alkylimido)-bis(alkylamido)molybdenum molecules for deposition of molybdenum-containing films
JP6471371B2 (ja) * 2014-03-13 2019-02-20 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツングMerck Patent Gesellschaft mit beschraenkter Haftung モリブデンシルシクロペンタジエニル錯体、シリルアリル錯体、及び、薄膜堆積におけるその使用
KR102147190B1 (ko) * 2015-03-20 2020-08-25 에스케이하이닉스 주식회사 막형성조성물 및 그를 이용한 박막 제조 방법
KR102344660B1 (ko) * 2015-05-27 2021-12-29 에이에스엠 아이피 홀딩 비.브이. 몰리브덴 또는 텅스텐 함유 박막의 ald용 전구체의 합성 및 사용
US10662527B2 (en) 2016-06-01 2020-05-26 Asm Ip Holding B.V. Manifolds for uniform vapor deposition
KR102727616B1 (ko) 2016-10-07 2024-11-07 삼성전자주식회사 유기 금속 전구체, 이를 이용한 막 형성 방법 및 이를 이용한 반도체 장치의 제조 방법
US10358407B2 (en) 2016-10-12 2019-07-23 Asm Ip Holding B.V. Synthesis and use of precursors for vapor deposition of tungsten containing thin films
KR102474876B1 (ko) * 2017-06-15 2022-12-07 삼성전자주식회사 텅스텐 전구체 및 이를 이용한 텅스텐 함유막의 형성 방법
US11560625B2 (en) * 2018-01-19 2023-01-24 Entegris, Inc. Vapor deposition of molybdenum using a bis(alkyl-arene) molybdenum precursor
US11492701B2 (en) 2019-03-19 2022-11-08 Asm Ip Holding B.V. Reactor manifolds
KR20210048408A (ko) 2019-10-22 2021-05-03 에이에스엠 아이피 홀딩 비.브이. 반도체 증착 반응기 매니폴드
TWI865725B (zh) 2020-02-10 2024-12-11 荷蘭商Asm Ip私人控股有限公司 高深寬比孔內的氧化鉿之沉積
KR102793252B1 (ko) 2020-03-25 2025-04-08 삼성전자주식회사 몰리브덴 화합물과 이를 이용한 집적회로 소자의 제조 방법
TW202200828A (zh) 2020-06-24 2022-01-01 荷蘭商Asm Ip私人控股有限公司 含鉬薄膜的氣相沉積
US11584768B2 (en) * 2021-01-12 2023-02-21 Applied Materials, Inc. Arene molybdenum (0) precursors for deposition of molybdenum films
US11459347B2 (en) 2021-01-12 2022-10-04 Applied Materials, Inc. Molybdenum(IV) and molybdenum(III) precursors for deposition of molybdenum films
US11390638B1 (en) 2021-01-12 2022-07-19 Applied Materials, Inc. Molybdenum(VI) precursors for deposition of molybdenum films
US11434254B2 (en) 2021-01-12 2022-09-06 Applied Materials, Inc. Dinuclear molybdenum precursors for deposition of molybdenum-containing films
US11760768B2 (en) 2021-04-21 2023-09-19 Applied Materials, Inc. Molybdenum(0) precursors for deposition of molybdenum films
US20230002888A1 (en) * 2021-07-01 2023-01-05 Applied Materials, Inc. Method of depositing metal films
KR102812241B1 (ko) * 2023-06-16 2025-05-23 에스케이트리켐 주식회사 신규한 몰리브데넘 함유 박막 형성용 전구체 및 이를 이용한 몰리브데넘 함유 박막의 형성 방법.

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064686A (en) * 1990-10-29 1991-11-12 Olin Corporation Sub-valent molybdenum, tungsten, and chromium amides as sources for thermal chemical vapor deposition of metal-containing films
TW200912030A (en) * 2007-09-14 2009-03-16 Sigma Aldrich Co Methods of preparing thin films by atomic layer deposition using titanium-based precursors
CN101500989A (zh) * 2006-06-28 2009-08-05 哈佛学院院长等 四脒基金属(iv)化合物及其在气相沉积中的用途

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07107190B2 (ja) 1984-03-30 1995-11-15 キヤノン株式会社 光化学気相成長方法
GB9929279D0 (en) 1999-12-11 2000-02-02 Epichem Ltd An improved method of and apparatus for the delivery of precursors in the vapour phase to a plurality of epitaxial reactor sites
GB0017968D0 (en) 2000-07-22 2000-09-13 Epichem Ltd An improved process and apparatus for the isolation of pure,or substantially pure,organometallic compounds
AU2002337310A1 (en) 2001-10-26 2003-05-06 Epichem Limited Improved precursors for chemical vapour deposition
TW200411923A (en) 2002-07-19 2004-07-01 Asml Us Inc In-situ formation of metal insulator metal capacitors
JP4575362B2 (ja) 2003-03-17 2010-11-04 シグマ−アルドリッチ・カンパニー 金属酸化物層または膜を成膜するための前駆体
GB0412790D0 (en) 2004-06-08 2004-07-14 Epichem Ltd Precursors for deposition of silicon nitride,silicon oxynitride and metal silicon oxynitrides
GB2432363B (en) 2005-11-16 2010-06-23 Epichem Ltd Hafnocene and zirconocene precursors, and use thereof in atomic layer deposition
US7638645B2 (en) 2006-06-28 2009-12-29 President And Fellows Of Harvard University Metal (IV) tetra-amidinate compounds and their use in vapor deposition
US7956207B2 (en) * 2006-09-28 2011-06-07 Praxair Technology, Inc. Heteroleptic organometallic compounds
TWI382987B (zh) 2007-07-24 2013-01-21 Sigma Aldrich Co 應用於化學相沉積製程的有機金屬前驅物
TWI425110B (zh) 2007-07-24 2014-02-01 Sigma Aldrich Co 以化學相沉積法製造含金屬薄膜之方法
US8039062B2 (en) 2007-09-14 2011-10-18 Sigma-Aldrich Co. Llc Methods of atomic layer deposition using hafnium and zirconium-based precursors
TW200944535A (en) 2008-03-20 2009-11-01 Sigma Aldrich Co Purification and preparation of phosphorus-containing compounds
TW200949939A (en) 2008-05-23 2009-12-01 Sigma Aldrich Co High-k dielectric films and methods of producing using titanium-based β -diketonate precursors
WO2009143452A1 (en) 2008-05-23 2009-11-26 Sigma-Aldrich Co. High-k dielectric films and methods of producing using cerium-based precursors
TWI467045B (zh) 2008-05-23 2015-01-01 Sigma Aldrich Co 高介電常數電介質薄膜與使用鈰基前驅物製造高介電常數電介質薄膜之方法
TW200949006A (en) 2008-05-23 2009-12-01 Sigma Aldrich Co High-k dielectric films and methods of producing using titanium-based precursors
TW200951241A (en) 2008-05-30 2009-12-16 Sigma Aldrich Co Methods of forming ruthenium-containing films by atomic layer deposition
TW201014925A (en) 2008-06-20 2010-04-16 Sigma Aldrich Co Titanium pyrrolyl-based organometallic precursors and use thereof for preparing dielectric thin films
WO2010114386A1 (en) * 2009-03-30 2010-10-07 Universitetet I Oslo Thin films containing molybdenum oxide
EP2456906A1 (en) 2009-07-21 2012-05-30 Sigma-Aldrich Co. LLC Compositions and methods of use for forming titanium- containing thin films
EP3150614B1 (en) 2009-08-07 2017-11-29 Sigma-Aldrich Co. LLC High molecular weight alkyl-allyl cobalttricarbonyl complexes and use thereof for preparing dielectric thin films
US8318572B1 (en) * 2010-02-19 2012-11-27 Intermolecular, Inc. Inexpensive electrode materials to facilitate rutile phase titanium oxide
US20130052368A1 (en) 2010-03-19 2013-02-28 Sigma-Aldrich Co. Llc Methods for preparing thin films by atomic layer deposition using hydrazines
SG187920A1 (en) 2010-08-27 2013-03-28 Sigma Aldrich Co Llc Molybdenum (iv) amide precursors and use thereof in atomic layer deposition
US8927748B2 (en) 2011-08-12 2015-01-06 Sigma-Aldrich Co. Llc Alkyl-substituted allyl carbonyl metal complexes and use thereof for preparing dielectric thin films
SG11201404375PA (en) 2012-01-26 2014-10-30 Sigma Aldrich Co Llc Molybdenum allyl complexes and use thereof in thin film deposition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5064686A (en) * 1990-10-29 1991-11-12 Olin Corporation Sub-valent molybdenum, tungsten, and chromium amides as sources for thermal chemical vapor deposition of metal-containing films
CN101500989A (zh) * 2006-06-28 2009-08-05 哈佛学院院长等 四脒基金属(iv)化合物及其在气相沉积中的用途
TW200912030A (en) * 2007-09-14 2009-03-16 Sigma Aldrich Co Methods of preparing thin films by atomic layer deposition using titanium-based precursors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Synthesis of new amido, alkoxo and ç-cyclopentadienyl derivatives of molybdenum;Xuefeng Yan et al.;《Journal of the Chemical Society,Dalton Transactions》;19971231(第12期);第2091-2099页 *

Also Published As

Publication number Publication date
JP5873494B2 (ja) 2016-03-01
KR20130139866A (ko) 2013-12-23
CN103097394A (zh) 2013-05-08
TW201219405A (en) 2012-05-16
TWI549958B (zh) 2016-09-21
EP2609102A1 (en) 2013-07-03
WO2012027575A1 (en) 2012-03-01
SG187920A1 (en) 2013-03-28
IL224618A (en) 2015-02-26
KR101847953B1 (ko) 2018-04-11
JP2013540893A (ja) 2013-11-07
US20130196065A1 (en) 2013-08-01
US9802220B2 (en) 2017-10-31
EP2609102B1 (en) 2014-12-31

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