CN103096225B - 骨传导麦克风 - Google Patents
骨传导麦克风 Download PDFInfo
- Publication number
- CN103096225B CN103096225B CN201110342919.5A CN201110342919A CN103096225B CN 103096225 B CN103096225 B CN 103096225B CN 201110342919 A CN201110342919 A CN 201110342919A CN 103096225 B CN103096225 B CN 103096225B
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- housing
- bone
- partition plate
- skin
- piezoelectric ceramics
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- 238000005192 partition Methods 0.000 claims abstract description 34
- 239000000919 ceramic Substances 0.000 claims description 77
- 239000000463 material Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 201000004624 Dermatitis Diseases 0.000 abstract description 3
- 210000003625 skull Anatomy 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 4
- 230000005236 sound signal Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000028327 secretion Effects 0.000 description 3
- 210000004243 sweat Anatomy 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 208000026935 allergic disease Diseases 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110342919.5A CN103096225B (zh) | 2011-11-03 | 2011-11-03 | 骨传导麦克风 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110342919.5A CN103096225B (zh) | 2011-11-03 | 2011-11-03 | 骨传导麦克风 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103096225A CN103096225A (zh) | 2013-05-08 |
CN103096225B true CN103096225B (zh) | 2018-05-18 |
Family
ID=48208263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110342919.5A Active CN103096225B (zh) | 2011-11-03 | 2011-11-03 | 骨传导麦克风 |
Country Status (1)
Country | Link |
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CN (1) | CN103096225B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103618985B (zh) * | 2013-11-19 | 2016-08-31 | 瑞声科技(南京)有限公司 | 骨导式麦克风 |
JP6415606B2 (ja) | 2015-01-21 | 2018-10-31 | 国立研究開発法人量子科学技術研究開発機構 | 血中物質濃度測定装置及び血中物質濃度測定方法 |
CN105476606B (zh) * | 2015-12-28 | 2020-02-21 | 中山阿迪通电子科技有限公司 | 一种骨传导睡眠监测装置及方法 |
EP4184946A4 (en) * | 2020-12-31 | 2024-02-21 | Shenzhen Shokz Co Ltd | BONE CONDUCTION BASED SOUND CONDUCTION DEVICE |
CN117641168A (zh) * | 2022-08-17 | 2024-03-01 | 华为技术有限公司 | 一种骨传导麦克风 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2441273Y (zh) * | 2000-07-14 | 2001-08-01 | 杨国耀 | 肌肤接触式麦克风 |
JP2006020247A (ja) * | 2004-07-05 | 2006-01-19 | Totsu Denshi Kk | 耐騒音マイク |
CN1805621A (zh) * | 2005-01-10 | 2006-07-19 | 久易科技股份有限公司 | 高传真接触型压电式麦克风结构 |
CN201215970Y (zh) * | 2008-07-18 | 2009-04-01 | 航宇救生装备有限公司 | 一种骨传导送话器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000341778A (ja) * | 1999-05-25 | 2000-12-08 | Temuko Japan:Kk | 骨伝導スピーカーを用いた送受話装置 |
CN201063848Y (zh) * | 2007-07-27 | 2008-05-21 | 北京开摩微电技术中心 | 压电式骨传导语音采集器 |
JPWO2009072237A1 (ja) * | 2007-11-13 | 2011-04-21 | 株式会社テムコジャパン | 骨伝導スピーカマイクロホン |
-
2011
- 2011-11-03 CN CN201110342919.5A patent/CN103096225B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2441273Y (zh) * | 2000-07-14 | 2001-08-01 | 杨国耀 | 肌肤接触式麦克风 |
JP2006020247A (ja) * | 2004-07-05 | 2006-01-19 | Totsu Denshi Kk | 耐騒音マイク |
CN1805621A (zh) * | 2005-01-10 | 2006-07-19 | 久易科技股份有限公司 | 高传真接触型压电式麦克风结构 |
CN201215970Y (zh) * | 2008-07-18 | 2009-04-01 | 航宇救生装备有限公司 | 一种骨传导送话器 |
Also Published As
Publication number | Publication date |
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CN103096225A (zh) | 2013-05-08 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Bone-conduction microphone and method of manufacturing the same Effective date of registration: 20200114 Granted publication date: 20180518 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: BEIJING MELST TECHNOLOGY DEVELOPMENT Co.,Ltd. Registration number: Y2020990000059 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211222 Granted publication date: 20180518 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: BEIJING MELST TECHNOLOGY DEVELOPMENT Co.,Ltd. Registration number: Y2020990000059 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Bone conduction microphone Effective date of registration: 20231228 Granted publication date: 20180518 Pledgee: Beijing Yizhuang International Financing Guarantee Co.,Ltd. Pledgor: BEIJING MELST TECHNOLOGY DEVELOPMENT Co.,Ltd. Registration number: Y2023980075550 |