CN103094162B - Method for positioning center of wafer circle on manipulator - Google Patents

Method for positioning center of wafer circle on manipulator Download PDF

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Publication number
CN103094162B
CN103094162B CN201110347036.3A CN201110347036A CN103094162B CN 103094162 B CN103094162 B CN 103094162B CN 201110347036 A CN201110347036 A CN 201110347036A CN 103094162 B CN103094162 B CN 103094162B
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Prior art keywords
wafer
circle
center
manipulator
transducer
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CN103094162A (en
Inventor
杨亚兵
蔡先武
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Beijing Scintillation Section Zhongkexin Electronic Equipment Co ltd
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Beijing Zhongkexin Electronic Equipment Co Ltd
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Priority to CN201110347036.3A priority Critical patent/CN103094162B/en
Priority to PCT/CN2012/081483 priority patent/WO2013067852A1/en
Publication of CN103094162A publication Critical patent/CN103094162A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

The invention discloses a method for positioning the center of a wafer circle on a manipulator, which comprises the following steps: the robot comprises a mechanical arm (1), a controller (2), an encoder (3), sensors 1(4), sensors 2(5), sensors 3(6), sensors 4(7) and a wafer (8), wherein the sensors 4(7) are standby. The mechanical arm (1) is used for conveying a wafer (8), the controller (2) controls and adjusts the direction and the distance of the wafer (8) taken by the mechanical arm through codes acquired by the encoder (3), after the mechanical arm (1) takes the wafer (8), the sensors (1), (4), the sensors (2), (5) and the sensors (3), (6) can detect 3 position codes of the wafer on the mechanical arm, then the 3 position codes are transmitted to the controller (2), and the center of the wafer (8) is finally positioned by the controller (2) through a series of operations.

Description

The method in a kind of positioning mechanical wafer center of circle on hand
Technical field
The present invention relates to a kind of semiconductor device manufacturing control system, the method in a kind of positioning mechanical the particularly relating to ion implantor wafer center of circle on hand.
Background technology
Ion implantor is a kind of by guiding impurity to inject semiconductor wafer, thus change the equipment of the conductivity of wafer, wherein the stability of wafer transmission system directly concerns the production efficiency of equipment and the benefit of enterprise, therefore a set of effective wafer transmission control system is just most important, and manipulator is unique transport vehicle in wafer transmission control system, if therefore can improve stability and precision that manipulator transmits wafer, so the stability of whole system just improves significantly.Improve stability and precision that manipulator transmits wafer, will positions wafer home position on a robotic arm, and then calculate the side-play amount of wafer on manipulator, balance out these errors by the direction and position regulating manipulator, reach precision and the stability of transmission.
In view of manipulator transmits the importance of wafer, the method how developing a kind of positioning mechanical wafer center of circle is on hand ion implantor stability urgent problem.
Summary of the invention
The present invention be directed to the offset error cannot determining wafer on manipulator in prior art, affect stabilization of equipment performance, heavy losses may be caused to client, and the method in a kind of positioning mechanical the developed wafer center of circle on hand.As Fig. 1 schematic diagram.
The present invention is achieved through the following technical solutions:
1. the method in the positioning mechanical wafer center of circle on hand, comprise: manipulator (1), controller (2), encoder (3), transducer 1 (4), transducer 2 (5), transducer 3 (6), transducer 4 (7), wafer (8), wherein transducer 4 (7) is for subsequent use.
2. the method in the positioning mechanical wafer center of circle on hand, wherein said manipulator (1) is used for transmitting wafer (8), the coding that controller (2) is collected by encoder (3), control and regulate manipulator to fetch and deliver direction and the distance of wafer (8), after wafer (8) got by manipulator (1), so transducer 1 (4), transducer 2 (5) and transducer 3 (6) will on inspecting manipuator 3 of wafer position encoded, then position encodedly controller (2) is passed to these 3, controller (2) is by a series of computing, finally orient the center of circle of wafer (8).
3. the method in the positioning mechanical wafer center of circle on hand, as shown in Figure 2: the theoretical position being provided with a wafer center of circle O, the i.e. home position that calculates of wafer theoretical position on a robotic arm, with O position, this center of circle for the circle that a radius is 1 centimetre is drawn in the center of circle, as the safe range in the center of circle, if the home position calculated in actual transmissions process is in this circle, so safe, if no longer in this circle, so will alarm, other actions can not be performed downwards.Arranging this safe range is to protect manipulator and wafer, collision free, damage manipulator and wafer.
The present invention has following remarkable advantage:
1. that considers is relatively more comprehensive, is provided with a backup sensors, avoids occurring that a transducer has problem, and manipulator normal transmission can not detect the wafer center of circle, affects the problem of device efficiency; Be provided with the safe range in a wafer center of circle, can available protecting manipulator and wafer etc.
2. can simulate a three-dimensional model, calculate the home position of wafer rapidly and accurately, and the direction of transmission objectives point and distance.
3. increased substantially precision and stability that manipulator transmits wafer, the efficiency of transmission of whole transmission system can not have been affected simultaneously.
Accompanying drawing explanation
Fig. 1 is the system assumption diagram in the positioning mechanical wafer center of circle on hand.
Fig. 2 is the concrete enforcement figure in the positioning mechanical wafer center of circle on hand.
Embodiment
Be further introduced below in conjunction with accompanying drawing 1 and accompanying drawing 2 couples of the present invention, but not as a limitation of the invention.
Fig. 2 is the concrete enforcement figure in the positioning mechanical wafer center of circle on hand, comprise: manipulator (1), controller (2), encoder (3), transducer 1 (4), transducer 2 (5), transducer 3 (6), transducer 4 (7), wafer (8), wherein transducer 4 (7) is for subsequent use.
As shown in FIG., wafer (8) on a robotic arm (1) has some to offset, transducer 1 (4), transducer 2 (5) and transducer 3 (6) can detect the position encoded point of 3 points on wafer circular arc and be respectively A, B and C point, and O point is the theoretical center of circle of wafer on manipulator.
Use mathematical method, connect AB and BC, then the perpendicular bisector of AB and BC is made respectively, its intersection point is the center of circle of wafer, D point in Fig. 2 is the actual center of circle of wafer, the position coordinates of center of circle D just can be being obtained by quadratic equation with one unknown, after obtaining coordinate, judge whether lower this center of circle D is taking O as the center of circle, radius is in the circle of 1 centimetre, if, illustrate that wafer transmits scope in the safety of manipulator, if do not existed, illustrate that wafer offsets on a robotic arm too large, not within the safety transmission scope of manipulator, to report to the police proposition, action below can't be performed.The center of circle D point of the gained in figure, in its circle, is therefore safe during manipulator transmission wafer.
After obtaining the position coordinates of D point, it is converted to coding site, carries out according to the position of impact point the direction and the distance that adjust next step robot movement, improve the precision of transmission sheet, reduce fragment rate.
The specific embodiment of patent of the present invention elaborates the content of patent of the present invention.For persons skilled in the art, to any apparent change that it does under the prerequisite not deviating from patent spirit of the present invention, all form the infringement to patent of the present invention, corresponding legal liabilities will be born.

Claims (3)

1. the method in the positioning mechanical wafer center of circle on hand, comprise: manipulator (1), controller (2), encoder (3), transducer 1(4), transducer 2(5), transducer 3(6), transducer 4(7), wafer (8), wherein transducer 4(7) be for subsequent use, it is characterized in that: manipulator (1) is used for transmitting wafer (8), the coding that controller (2) is collected by encoder (3), control and regulate manipulator to fetch and deliver direction and the distance of wafer (8), after wafer (8) got by manipulator (1), so transducer 1(4), transducer 2(5) and transducer 3(6) will on inspecting manipuator 3 of wafer position encoded, then position encodedly controller (2) is passed to these 3, controller (2) is by a series of computing, finally orient the center of circle of wafer (8), be provided with the theoretical position in the wafer center of circle that calculates with wafer theoretical position on a robotic arm, drawing a radius using the theoretical position in this wafer center of circle for the center of circle is that the circle of 1 centimetre is as the safe range in the center of circle, in actual transmissions process, if the home position calculated is in this circle, so safe, if not in this circle, so will alarm, other actions can not be performed downwards.
2. the method in a kind of positioning mechanical as claimed in claim 1 wafer center of circle on hand, is characterized in that: by 3 location points on the upper wafer (8) of manipulator (1) being detected, just can navigate to the home position of this wafer (8) rapidly.
3. the method in a kind of positioning mechanical as claimed in claim 1 wafer center of circle on hand, it is characterized in that: after on manipulator (1), the center of circle of wafer (8) is determined, just can the precision of controls transfer accurately and effectively, time simultaneously due to communication and calculating is very short, like this while raising transmission precision, reduction fragment rate, also efficiency of transmission can not be affected.
CN201110347036.3A 2011-11-07 2011-11-07 Method for positioning center of wafer circle on manipulator Active CN103094162B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201110347036.3A CN103094162B (en) 2011-11-07 2011-11-07 Method for positioning center of wafer circle on manipulator
PCT/CN2012/081483 WO2013067852A1 (en) 2011-11-07 2012-09-17 Method for positioning centre of wafer on mechanical hand

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110347036.3A CN103094162B (en) 2011-11-07 2011-11-07 Method for positioning center of wafer circle on manipulator

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CN103094162A CN103094162A (en) 2013-05-08
CN103094162B true CN103094162B (en) 2016-02-10

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WO (1) WO2013067852A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531509A (en) * 2013-09-26 2014-01-22 苏州经贸职业技术学院 Method for precisely positioning circle center on workbench
CN104626205B (en) * 2014-12-11 2016-06-08 珠海格力电器股份有限公司 The detection method of robot arm and device
CN108878307B (en) * 2017-05-11 2020-12-08 北京北方华创微电子装备有限公司 Chip detection system and chip detection method
CN110534466A (en) * 2018-05-25 2019-12-03 北京北方华创微电子装备有限公司 Manipulator takes piece method and system
CN113257705B (en) * 2021-06-29 2021-10-29 西安奕斯伟硅片技术有限公司 Method, device and equipment for detecting wafer abnormity and computer storage medium

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Publication number Priority date Publication date Assignee Title
ATE389237T1 (en) * 1998-12-02 2008-03-15 Newport Corp ARM GRIP FOR SAMPLE HOLDER ROBOTS
JP2006351884A (en) * 2005-06-16 2006-12-28 Tokyo Electron Ltd Substrate conveyance mechanism and processing system
CN201017864Y (en) * 2007-03-28 2008-02-06 沈阳芯源先进半导体技术有限公司 Wafer automatic position setting control device
US9002514B2 (en) * 2007-11-30 2015-04-07 Novellus Systems, Inc. Wafer position correction with a dual, side-by-side wafer transfer robot
CN101216686B (en) * 2008-01-10 2010-08-25 上海微电子装备有限公司 Wafer pre-aligning platform and wafer pre-alignment method using the platform
JP5208800B2 (en) * 2009-02-17 2013-06-12 東京エレクトロン株式会社 Substrate processing system and substrate transfer method
CN101832757B (en) * 2010-04-29 2011-08-24 中微半导体设备(上海)有限公司 Method for detecting offset position of wafer
CN201859153U (en) * 2010-09-29 2011-06-08 上海星纳电子科技有限公司 Pre-centered positioning system of semiconductor chip test system

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WO2013067852A1 (en) 2013-05-16

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Effective date of registration: 20220506

Address after: 101111 1st floor, building 1, 6 Xingguang 2nd Street, Tongzhou District, Beijing

Patentee after: Beijing Scintillation Section Zhongkexin Electronic Equipment Co.,Ltd.

Address before: 101111, Beijing Zhongguancun science and Technology Park, Tongzhou Park light mechanical and electrical integration industrial base, two light street, No. 6

Patentee before: BEIJING ZHONGKEXIN ELECTRONICS EQUIPMENT Co.,Ltd.