CN103094162A - Method for positioning center of wafer circle on manipulator - Google Patents
Method for positioning center of wafer circle on manipulator Download PDFInfo
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- CN103094162A CN103094162A CN2011103470363A CN201110347036A CN103094162A CN 103094162 A CN103094162 A CN 103094162A CN 2011103470363 A CN2011103470363 A CN 2011103470363A CN 201110347036 A CN201110347036 A CN 201110347036A CN 103094162 A CN103094162 A CN 103094162A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention discloses a method for positioning the center of a wafer circle on a manipulator, which comprises the following steps: the robot comprises a mechanical arm (1), a controller (2), an encoder (3), sensors 1(4), sensors 2(5), sensors 3(6), sensors 4(7) and a wafer (8), wherein the sensors 4(7) are standby. The mechanical arm (1) is used for conveying a wafer (8), the controller (2) controls and adjusts the direction and the distance of the wafer (8) taken by the mechanical arm through codes acquired by the encoder (3), after the mechanical arm (1) takes the wafer (8), the sensors (1), (4), the sensors (2), (5) and the sensors (3), (6) can detect 3 position codes of the wafer on the mechanical arm, then the 3 position codes are transmitted to the controller (2), and the center of the wafer (8) is finally positioned by the controller (2) through a series of operations.
Description
Technical field
The present invention relates to a kind of semiconductor device manufacturing control system, a kind of positioning mechanical that relates in particular to ion implantor is the method in the wafer center of circle on hand.
Background technology
Ion implantor is a kind of by guiding Impurity injection semiconductor wafer, thereby change the equipment of the conductivity of wafer, wherein the stability of wafer transmission system directly concerns the production efficiency of equipment and the benefit of enterprise, therefore most important once the effective wafer transmission control system of cover, and manipulator is unique transport vehicle in the wafer transmission control system, if therefore can improve stability and the precision that manipulator transmits wafer, the stability of whole system just improves significantly so.Improve stability and precision that manipulator transmits wafer, will positions wafer home position on manipulator, and then calculate the side-play amount of wafer on manipulator, and balance out these errors by direction and the position of regulating manipulator, reach precision and the stability of transmission.
Transmit the importance of wafer in view of manipulator, how to develop a kind of positioning mechanical on hand the method in the wafer center of circle be ion implantor stability urgent problem.
Summary of the invention
The present invention be directed to the offset error that can't determine wafer on manipulator in prior art, affect stabilization of equipment performance, may cause heavy losses to the client, and a kind of positioning mechanical of developing method in the wafer center of circle on hand.As Fig. 1 schematic diagram.
The present invention is achieved through the following technical solutions:
1. the positioning mechanical method in the wafer center of circle on hand, comprise: manipulator (1), controller (2), encoder (3), transducer 1 (4), transducer 2 (5), transducer 3 (6), transducer 4 (7), wafer (8), wherein transducer 4 (7) is standby.
2. the positioning mechanical method in the wafer center of circle on hand, wherein said manipulator (1) is used for transmitting wafer (8), the coding that controller (2) collects by encoder (3), control and regulate manipulator and fetch and deliver direction and the distance of wafer (8), after manipulator (1) is got wafer (8), transducer 1 (4) so, it is position encoded that transducer 2 (5) and transducer 3 (6) will detect 3 of wafer on manipulator, then these 3 the position encoded controllers (2) that pass to, controller (2) is by a series of computings, finally orient the center of circle of wafer (8).
3. the positioning mechanical method in the wafer center of circle on hand, as shown in Figure 2: the theoretical position that is provided with a wafer center of circle O, it is the home position that the theoretical position of wafer on manipulator calculates, draw a radius take O position, this center of circle as the center of circle and be the circle of 1 centimetre, as the safe range in the center of circle, if the home position that calculates in the actual transmissions process is in this circle, safe so, if no longer in this circle, so will alarm, can not carry out other actions downwards.It is in order to protect manipulator and wafer, to avoid collision, damage manipulator and wafer that this safe range is set.
The present invention has following remarkable advantage:
1. that considers is more comprehensive, is provided with a backup sensors, and avoiding occurring a transducer has problem, and manipulator can not normal transmission detects the wafer center of circle, affects the problem of device efficiency; Be provided with the safe range in a wafer center of circle, can effectively protect manipulator and wafer etc.
2. can simulate a three-dimensional model, calculate rapidly and accurately the home position of wafer, and the direction of transmission objectives point and distance.
3. increase substantially precision and the stability of manipulator transmission wafer, can not affect the efficiency of transmission of whole transmission system simultaneously.
Description of drawings
Fig. 1 is the positioning mechanical system assumption diagram in the wafer center of circle on hand.
Fig. 2 is the positioning mechanical concrete enforcement figure in the wafer center of circle on hand.
Embodiment
Be further introduced below in conjunction with accompanying drawing 1 and 2 couples of the present invention of accompanying drawing, but not as a limitation of the invention.
Fig. 2 is the positioning mechanical concrete enforcement figure in the wafer center of circle on hand, comprise: manipulator (1), controller (2), encoder (3), transducer 1 (4), transducer 2 (5), transducer 3 (6), transducer 4 (7), wafer (8), wherein transducer 4 (7) is standby.
As shown in FIG., wafer (8) (1) on manipulator has some skews, the position encoded point that transducer 1 (4), transducer 2 (5) and transducer 3 (6) can detect 3 points on the wafer circular arc is respectively A, B and C point, and the O point is the theoretical center of circle of wafer on manipulator.
use mathematical method, connect AB and BC, then make respectively the perpendicular bisector of AB and BC, its intersection point is the center of circle of wafer, D point in Fig. 2 is the actual center of circle of wafer, just can obtain the position coordinates of center of circle D by quadratic equation with one unknown, after obtaining coordinate, whether lower this center of circle D of judgement is take O as the center of circle, radius is in the circle of 1 centimetre, if, illustrate that wafer is in the safe transmission scope of manipulator, if do not exist, illustrate that wafer is offset too large on manipulator, not within the safe transmission scope of manipulator, can report to the police and propose, can't carry out following action.The center of circle D point of the gained in figure is in its circle, so manipulator is safe when transmitting wafer.
After obtaining the position coordinates that D orders, it is converted to coding site, adjusts direction and the distance of next step robot movement according to the position of impact point, improved the precision of transmission sheet, reduced fragment rate.
The specific embodiment of patent of the present invention elaborates the content of patent of the present invention.For persons skilled in the art, any apparent change of under the prerequisite that does not deviate from patent spirit of the present invention, it being done all consists of the infringement to patent of the present invention, will bear corresponding legal liabilities.
Claims (3)
1. the positioning mechanical method in the wafer center of circle on hand, comprise: manipulator (1), controller (2), encoder (3), transducer 1 (4), transducer 2 (5), transducer 3 (6), transducer 4 (7), wafer (8), wherein transducer 4 (7) is standby.it is characterized in that: manipulator (1) is used for transmitting wafer (8), the coding that controller (2) collects by encoder (3), control and regulate manipulator and fetch and deliver direction and the distance of wafer (8), after manipulator (1) is got wafer (8), transducer 1 (4) so, it is position encoded that transducer 2 (5) and transducer 3 (6) will detect 3 of wafer on manipulator, then these 3 the position encoded controllers (2) that pass to, controller (2) is by a series of computings, finally orient the center of circle of wafer (8).
2. a kind of positioning mechanical as claimed in claim 1 method in the wafer center of circle on hand, is characterized in that: by 3 location points on the upper wafer (8) of manipulator (1) being detected, just can navigate to rapidly the home position of this wafer (8).
3. a kind of positioning mechanical as claimed in claim 1 method in the wafer center of circle on hand, it is characterized in that: after the center of circle of the upper wafer (8) of manipulator (1) is determined, just can control accurately and effectively the precision of transmission, simultaneously because the time of communication and calculating is very short, when improving the transmission precision, reducing fragment rate, can not affect efficiency of transmission so yet.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110347036.3A CN103094162B (en) | 2011-11-07 | 2011-11-07 | Method for positioning center of wafer circle on manipulator |
| PCT/CN2012/081483 WO2013067852A1 (en) | 2011-11-07 | 2012-09-17 | Method for positioning centre of wafer on mechanical hand |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110347036.3A CN103094162B (en) | 2011-11-07 | 2011-11-07 | Method for positioning center of wafer circle on manipulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103094162A true CN103094162A (en) | 2013-05-08 |
| CN103094162B CN103094162B (en) | 2016-02-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110347036.3A Active CN103094162B (en) | 2011-11-07 | 2011-11-07 | Method for positioning center of wafer circle on manipulator |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103094162B (en) |
| WO (1) | WO2013067852A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531509A (en) * | 2013-09-26 | 2014-01-22 | 苏州经贸职业技术学院 | Method for precisely positioning circle center on workbench |
| CN104626205A (en) * | 2014-12-11 | 2015-05-20 | 珠海格力电器股份有限公司 | Method and device for detecting mechanical arm of robot |
| CN108878307A (en) * | 2017-05-11 | 2018-11-23 | 北京北方华创微电子装备有限公司 | Chip detection system and chip detection method |
| CN110534466A (en) * | 2018-05-25 | 2019-12-03 | 北京北方华创微电子装备有限公司 | Manipulator takes piece method and system |
| CN113257705A (en) * | 2021-06-29 | 2021-08-13 | 西安奕斯伟硅片技术有限公司 | Method, device and equipment for detecting wafer abnormity and computer storage medium |
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| JP2006351884A (en) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | Substrate conveyance mechanism and processing system |
| CN101447405A (en) * | 2007-11-30 | 2009-06-03 | 诺发系统有限公司 | Wafer position correction with a dual, side-by-side wafer transfer robot |
| US20100211203A1 (en) * | 2009-02-17 | 2010-08-19 | Tokyo Electron Limited | Substrate processing system and substrate transfer method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| ATE389237T1 (en) * | 1998-12-02 | 2008-03-15 | Newport Corp | ARM GRIP FOR SAMPLE HOLDER ROBOTS |
| CN201017864Y (en) * | 2007-03-28 | 2008-02-06 | 沈阳芯源先进半导体技术有限公司 | Wafer automatic position setting control device |
| CN101216686B (en) * | 2008-01-10 | 2010-08-25 | 上海微电子装备有限公司 | Wafer pre-aligning platform and wafer pre-alignment method using the platform |
| CN101832757B (en) * | 2010-04-29 | 2011-08-24 | 中微半导体设备(上海)有限公司 | Method for detecting offset position of wafer |
| CN201859153U (en) * | 2010-09-29 | 2011-06-08 | 上海星纳电子科技有限公司 | Pre-centered positioning system of semiconductor chip test system |
-
2011
- 2011-11-07 CN CN201110347036.3A patent/CN103094162B/en active Active
-
2012
- 2012-09-17 WO PCT/CN2012/081483 patent/WO2013067852A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006351884A (en) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | Substrate conveyance mechanism and processing system |
| CN101447405A (en) * | 2007-11-30 | 2009-06-03 | 诺发系统有限公司 | Wafer position correction with a dual, side-by-side wafer transfer robot |
| US20100211203A1 (en) * | 2009-02-17 | 2010-08-19 | Tokyo Electron Limited | Substrate processing system and substrate transfer method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531509A (en) * | 2013-09-26 | 2014-01-22 | 苏州经贸职业技术学院 | Method for precisely positioning circle center on workbench |
| CN104626205A (en) * | 2014-12-11 | 2015-05-20 | 珠海格力电器股份有限公司 | Method and device for detecting mechanical arm of robot |
| CN108878307A (en) * | 2017-05-11 | 2018-11-23 | 北京北方华创微电子装备有限公司 | Chip detection system and chip detection method |
| CN110534466A (en) * | 2018-05-25 | 2019-12-03 | 北京北方华创微电子装备有限公司 | Manipulator takes piece method and system |
| CN113257705A (en) * | 2021-06-29 | 2021-08-13 | 西安奕斯伟硅片技术有限公司 | Method, device and equipment for detecting wafer abnormity and computer storage medium |
| CN113257705B (en) * | 2021-06-29 | 2021-10-29 | 西安奕斯伟硅片技术有限公司 | Method, device and equipment for detecting wafer abnormity and computer storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103094162B (en) | 2016-02-10 |
| WO2013067852A1 (en) | 2013-05-16 |
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Effective date of registration: 20220506 Address after: 101111 1st floor, building 1, 6 Xingguang 2nd Street, Tongzhou District, Beijing Patentee after: Beijing Scintillation Section Zhongkexin Electronic Equipment Co.,Ltd. Address before: 101111, Beijing Zhongguancun science and Technology Park, Tongzhou Park light mechanical and electrical integration industrial base, two light street, No. 6 Patentee before: BEIJING ZHONGKEXIN ELECTRONICS EQUIPMENT Co.,Ltd. |