CN103079355B - The thick copper coin ink printing method of a kind of PCB - Google Patents
The thick copper coin ink printing method of a kind of PCB Download PDFInfo
- Publication number
- CN103079355B CN103079355B CN201210578392.0A CN201210578392A CN103079355B CN 103079355 B CN103079355 B CN 103079355B CN 201210578392 A CN201210578392 A CN 201210578392A CN 103079355 B CN103079355 B CN 103079355B
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- copper
- solder mask
- pcb
- copper cash
- 15mil
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- Manufacturing Of Printed Circuit Boards (AREA)
- Printing Methods (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The thick copper coin ink printing method of a kind of PCB, after the method step is positioned at circuit etching layer operation, the method step comprises: a). and copper cash after the etching, copper face print solder mask, and solder mask covers copper cash, copper face and wider than copper cash, copper face edge 10 ~ 15mil; B). leave standstill 25 ~ 30 minutes; C). be toast in 70 DEG C ~ 75 DEG C environment in temperature, baking time is between 8min ~ 12min; D). at whole base material and line layer surface printing solder mask.Step of the present invention is easy to implement, low to operator's technical requirement, effectively can prevent the defect that ink colors is inconsistent, variable thickness causes, improve the quality of products.
Description
Technical field
The present invention relates to the improvement opportunity of PCB manufacture craft.
Background technology
The solder mask that current most of wiring board comprises base material, is covered in the circuit etching layer (line layer is etched by copper coin and formed) on base material and is covered on line layer.And in the PCB with thick copper coin (thickness >=2OZ) makes, if during by normal printing solder mask, often partially thin rubescent at the ink with place on line (copper cash, copper face covering position) of line layer, base material is biased thick, development lateral erosion is excessive, and line edges ink is wrinkling, printing difficulty is larger.And if adopt strengthen silk-screen pressure, the method for the print speed printing speed that slows down prints, then very easily make solder mask enter Kong Weizhong on PCB, printing process is to operator's technical requirement also corresponding raising, and it is more difficult to implement.
Summary of the invention
In view of this, the technical problem to be solved in the present invention is to provide and a kind ofly can prints solder mask on the PCB with thick copper coin and ink is smooth, the thick copper coin ink printing method of the PCB of outward appearance composite demand.
Thus, technical scheme proposed by the invention is as follows:
The thick copper coin ink printing method of a kind of PCB, after the method step is positioned at circuit etching layer operation, the method step comprises:
A). copper cash after the etching, copper face print solder mask, and solder mask covers copper cash, copper face and wider than copper cash, copper face edge 10 ~ 15mil;
B). leave standstill 25 ~ 30 minutes;
C). be toast in 70 DEG C ~ 75 DEG C environment in temperature, baking time is between 8min ~ 12min;
D). at whole base material and line layer surface printing solder mask.
Wherein, in a) step, the thickness of solder mask on copper cash, copper face is between 0.4mil ~ 1.2mil.
Wherein, in a) step, the position, hole of pcb board is coated with the catch preventing position, hole from printing upper solder mask, and it is between 10mil ~ 15mil that catch is greater than position, hole Edge Distance.
Step of the present invention is easy to implement, low to operator's technical requirement, effectively can prevent the defect that ink colors is inconsistent, variable thickness causes, improve the quality of products.
Embodiment
For ease of the understanding of those skilled in the art, below in conjunction with specific embodiment, the present invention is described in further detail.
The PCB thick copper coin ink printing method that the present embodiment discloses can carry out high-quality printing for the solder mask of the PCB with the thick copper coin of thickness >=2OZ, and after the method step is positioned at circuit etching layer operation, specifically, the method step comprises:
A). copper cash after the etching, copper face print solder mask, and solder mask covers copper cash, copper face and wider than copper cash, copper face edge 10 ~ 15mil (mil);
B). leave standstill 25 ~ 30 minutes;
C). be toast in 70 DEG C ~ 75 DEG C environment in temperature, baking time is between 8min (minute) ~ 12min;
D). at whole base material and line layer surface printing solder mask.
Wherein, in a) step, the thickness of solder mask on copper cash, copper face is between 0.4mil ~ 1.2mil; In a) step, the position, hole of pcb board is coated with the catch preventing position, hole from printing upper solder mask, and it is between 10mil ~ 15mil that catch is greater than position, hole Edge Distance.
In above-mentioned a) step, solder mask can be arbitrary value between 10 ~ 15mil wider than the distance at copper cash, copper face edge, as 10mil or 13mil or 15mil, the thickness of solder mask is the arbitrary value between 0.4mil ~ 1.2mil, as 0.4mil or 0.6mil or 0.8mil or 1.2mil etc., all there is identical invention effect; In b) step, time of repose can be arbitrary value between 25 ~ 30 minutes, as 25 minutes or 28 minutes or 30 minutes, all has identical invention effect; In c) step, baking temperature can be arbitrary value between 70 DEG C ~ 75 DEG C, and as 70 DEG C or 73 DEG C or 75 DEG C, and baking time can be arbitrary value between 8min ~ 12min, as 8min or 10min or 12min, all has identical invention effect; Catch size for position, hole can be arbitrary value between 10mil ~ 15mil for being greater than position, hole Edge Distance, as 10mil or 12mil or 15mil etc., all has identical invention effect.
Can with reference to the typography of existing solder mask for the concrete typography of solder mask in the present embodiment, therefore not to repeat here.
It is more than some specific implementation of the present invention; it describes comparatively concrete and detailed; but therefore can not be interpreted as the restriction to the scope of the claims of the present invention; it should be noted that; for the person of ordinary skill of the art; without departing from the inventive concept of the premise, these apparent replacement forms all belong to protection scope of the present invention.
Claims (1)
1. the thick copper coin ink printing method of PCB, is characterized in that, after the method step is positioned at circuit etching layer operation, the method step comprises:
A). copper cash after the etching, copper face print solder mask, and solder mask covers copper cash, copper face and wider than copper cash, copper face edge 10 ~ 15mil;
B). leave standstill 25 ~ 30 minutes;
C). be toast in 70 DEG C ~ 75 DEG C environment in temperature, baking time is between 8min ~ 12min;
D). at whole base material and line layer surface printing solder mask;
In a) step, the thickness of solder mask on copper cash, copper face is between 0.4mil ~ 1.2mil;
In a) step, the position, hole of pcb board is coated with the catch preventing position, hole from printing upper solder mask, and it is between 10mil ~ 15mil that catch is greater than position, hole Edge Distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210578392.0A CN103079355B (en) | 2012-12-28 | 2012-12-28 | The thick copper coin ink printing method of a kind of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210578392.0A CN103079355B (en) | 2012-12-28 | 2012-12-28 | The thick copper coin ink printing method of a kind of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103079355A CN103079355A (en) | 2013-05-01 |
| CN103079355B true CN103079355B (en) | 2015-07-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210578392.0A Active CN103079355B (en) | 2012-12-28 | 2012-12-28 | The thick copper coin ink printing method of a kind of PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN103079355B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103496261B (en) * | 2013-09-23 | 2015-09-09 | 胜华电子（惠阳）有限公司 | A kind of screen printing method of thick copper coin |
| CN104582300A (en) * | 2013-10-18 | 2015-04-29 | 重庆方正高密电子有限公司 | Circuit board anti-welding baseplate and circuit board manufacturing method |
| CN104742547B (en) * | 2015-04-03 | 2018-04-24 | 昆山万源通电子科技有限公司 | Two ounces of pcb board typographies |
| CN106211597A (en) * | 2016-07-21 | 2016-12-07 | 佛山市国立光电科技有限公司 | A kind of production method of LED circuit board |
| CN106028661A (en) * | 2016-07-29 | 2016-10-12 | 佛山市国立光电科技有限公司 | Production process of printed circuit board |
| CN107148158A (en) * | 2017-06-29 | 2017-09-08 | 珠海杰赛科技有限公司 | The preparation method and device of a kind of printed circuit board |
| CN113524885B (en) * | 2021-07-17 | 2022-07-08 | 江苏本川智能电路科技股份有限公司 | Thick copper plate solder mask printing equipment and printing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101547568A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Method for printing black soldermask on PCB board |
| CN102059867A (en) * | 2010-12-21 | 2011-05-18 | 梅州博敏电子有限公司 | Printing method of blind-hole printing solder mask of printed circuit board (PCB) |
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
-
2012
- 2012-12-28 CN CN201210578392.0A patent/CN103079355B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101547568A (en) * | 2009-04-24 | 2009-09-30 | 深圳市博敏电子有限公司 | Method for printing black soldermask on PCB board |
| CN102076176A (en) * | 2009-11-25 | 2011-05-25 | 北大方正集团有限公司 | A solder mask ink coating method |
| CN102059867A (en) * | 2010-12-21 | 2011-05-18 | 梅州博敏电子有限公司 | Printing method of blind-hole printing solder mask of printed circuit board (PCB) |
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| Publication number | Publication date |
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| CN103079355A (en) | 2013-05-01 |
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