CN106028661A - Production process of printed circuit board - Google Patents
Production process of printed circuit board Download PDFInfo
- Publication number
- CN106028661A CN106028661A CN201610614651.9A CN201610614651A CN106028661A CN 106028661 A CN106028661 A CN 106028661A CN 201610614651 A CN201610614651 A CN 201610614651A CN 106028661 A CN106028661 A CN 106028661A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit
- ink
- aluminium base
- solder mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a production process of a printed circuit board, and the production process has the advantages of few process steps, low production cost and great improvement of a yield rate. The process comprises the steps of (a) cutting a copper-coated aluminum substrate material, and grinding, cleaning and drying a cut copper-coated aluminum substrate, (b) printing circuit ink on the copper-coated aluminum substrate according to a circuit diagram, (c) drying the circuit link, (d) corroding redundant copper sheets outside the copper material coated by the circuit ink on the copper-coated aluminum substrate, (e) removing the circuit ink which coats the copper-coated aluminum substrate and exposing designed cooper sheet circuit, (f) drilling and positioning, (g) grinding, cleaning and drying the copper sheet circuit on the copper-coated aluminum substrate, (h) using the screen printing technology to print solder resist ink on separation grooves in the copper sheet circuit to fill the separation grooves, (i) drying the print solder resist ink poured in the separation grooves, (j) grinding, cleaning and drying the copper sheet circuit again, (k) printing solder resist ink on the whole copper-coated aluminum substrate, and does not printing photosensitive solder resist ink on the pad on the copper sheet circuit, and (l) drying the solder resist ink in the step (k) and obtaining a finished product.
Description
Technical field:
The present invention relates to a kind of production technology printed and manufacture wiring board.
Background technology:
The production method of the special printed wiring board of traditional LED lamp is as follows: carry out sawing sheet to covering copper aluminium base sheet material, and split
The copper aluminium base that covers of honest material carries out polishing, clean and drying；Circuit ink is stamped according to designed lines figure on copper aluminium base covering；
Dry circuit ink；Erode covering copper sheet unnecessary in addition to the copper product that above-mentioned circuit ink covers on copper aluminium base；
Return the circuit ink covered on copper aluminium base, manifest the copper sheet circuit of design；Bore hole, location；To the copper sheet covered on copper aluminium base
Circuit carry out polishing and, clean, dry；Cover on copper aluminium base at above-mentioned formation copper sheet circuit, stamp photosensitive solder resist oil comprehensively
Ink, (pad locations does not stamp solder mask so that it is exposing is to carry to stay pad locations not stamp solder mask during printing
For LED welding), then carry out drying and processing, obtain final products.
It is known that in above-mentioned technology, between the copper sheet 01 of copper sheet circuit, separation trough 02 can be there is, as it is shown in figure 1, at present
In industry, this separation trough 02 has two kinds of degree of depth, low-power LED, owing to current requirements is low, and the copper sheet line thicknesses that it requires
It is only 35 μm to be sufficient to, say, that separation trough 02 degree of depth is 35 μm, and high-powered LED lamp, owing to current requirements is relatively big, institute
To reach 70 μm with the copper sheet circuit required, namely separation trough 02 degree of depth reaches 70 μm, is now covering on copper aluminium base comprehensively
During printing solder mask, copper sheet circuit separation trough 02 is the situation of 35 μm, owing to separation trough 02 degree of depth is shallower, and welding resistance oil during printing
Ink can be easier to fill up separation trough 02.But when reaching 70 μm for separation trough 02 degree of depth, solder mask the most so holds
Easily fill up these separation troughs 02 on copper sheet circuit, in order to fill up these separation troughs 02, current technique is all first to separation
Groove 02 two side top carries out fillet or chamfering grinding process, and separation trough 02 top is polished the circle that radian is bigger
Angle or the bigger chamfering 03 of angle, also require during polishing first to polish the top side wall edge of separation trough 02 side, then
Again opposite side is polished, so obtain the separation trough that both sides top is all fillet or chamfering.As in figure 2 it is shown, then
During printing solder mask, due to these fillets or the existence of chamfering, solder mask is made to be easier to enter in separation trough 02, but actual
During production, or often occur solder mask to fill out to enter in separation trough 02, cause the generation of waste product, in order to solve this problem,
There is producer by increasing squeegee pressure, ensure that solder mask is reliably pressed in separation trough 02, but after increasing squeegee pressure,
The problem that solder mask is not fully filled with separation trough 02 occurs the most often.The problems referred to above cause wiring board production stage many,
Technological requirement is high, and yield rate is relatively low, adds the manufacturing cost of product.
Summary of the invention:
The invention aims to the shortcoming overcoming above-mentioned prior art, it is provided that a kind of process is few, production cost
Low, be greatly improved yield rate printing manufacture wiring board production technology.
The goal of the invention of the present invention can be realized by following technical scheme: printing manufactures the production work of wiring board
Skill, its step is as follows:
A. carry out sawing sheet to covering copper aluminium base sheet material, and the copper aluminium base that covers of split honest material carries out polishing, clean and drying；
B. circuit ink is stamped according to designed lines figure on copper aluminium base covering；
C. circuit ink is dried；
D. erode covering copper sheet unnecessary in addition to the copper product that above-mentioned circuit ink covers on copper aluminium base；
E. return the circuit ink covered on copper aluminium base, manifest the copper sheet circuit of design；
F. hole, location is bored；
G. the copper sheet circuit covered on copper aluminium base is polished and cleaned, dries；
H. utilize silk-screen technology that the separation trough in copper sheet circuit is stamped solder mask, make solder mask fill and lead up separation trough；
I. the solder mask being filled in separation trough is dried；
The most again copper sheet circuit polished and clean, dry；
K. stamp solder mask to covering copper aluminium base comprehensively, during printing, require that the pad locations on copper sheet circuit does not has
Stamp photosensitive solder resist ink；
L. dry the solder mask in k step, prepare finished product.
Owing to using technique scheme, the present invention compared with prior art, has the advantages that in this technology and takes
Disappear to separation trough side than the treatment process of polishing chamfering, decreased production stage, reduced product cost, improve the one-tenth of product
Product rate, cancels big pressure printing solder mask, reduces technological requirement.
Accompanying drawing illustrates:
Fig. 1 is the structure chart that prior art covers after obtaining copper sheet circuit on copper aluminium base；
Fig. 2 is the structure after prior art carries out edging chamfered to the copper sheet circuit separation trough covered on copper aluminium base
Figure；
Fig. 3 is that the present invention covers the upper TV structure figure after copper aluminium base stamps circuit ink；
Fig. 4 is to cover the sectional structure chart after copper aluminium base stamps circuit ink in step b of the present invention；
Fig. 5 is the structure chart after eroding beyond circuit ink the copper sheet at other region described in step d of the present invention；
Fig. 6 be move back described in step e of the present invention wash circuit ink after the structure chart of copper sheet circuit that obtains；
Fig. 7 is that step h of the present invention is toward the structure chart after the full solder mask of filling in separation trough；
Fig. 8 is the present invention toward covering on the comprehensive silk-screen of copper aluminium base the upper TV structure figure after solder mask；
Fig. 9 is the present invention toward covering on the comprehensive silk-screen of copper aluminium base the sectional structure chart after photosensitive solder resist ink.
Detailed description of the invention:
Below in conjunction with the accompanying drawings this technology is described further.
Produce required for the special printed wiring board of LED cover copper aluminium base by aluminum soleplate 1, PP film 2 and copper sheet 3 compound and
Become.
The LED circuit board production method of the present invention, its step is as follows:
A. carry out sawing sheet to covering copper aluminium base sheet material, and split honest material cover copper aluminium base carry out pickling, polish-brush, washing and
Dry；
B. circuit ink 4 is stamped by silk-screen technology, such as Fig. 3 and Fig. 4 institute covering to desire to make money or profit according to designed lines on copper aluminium base
Show；
C. circuit ink 4 is dried；
D. covering on copper aluminium base in addition to the copper product that above-mentioned circuit ink 4 covers, copper unnecessary on remaining region 5
Skin erodes, as shown in Figure 5；
E. utilize caustic lye of soda to move back and wash the circuit ink 4 covered on copper aluminium base, manifest the copper sheet circuit 31 of design, such as Fig. 6
Shown in；
F. hole 6, location is bored；
G. the copper sheet circuit 31 covered on copper aluminium base is carried out pickling, polish-brush, washes and dry；
H. utilize silk-screen technology that the separation trough 32 in copper sheet circuit 31 is stamped solder mask a, make solder mask a fill and lead up point
Separate slot 32, as it is shown in fig. 7, the step for be covering on copper aluminium base before overall printed solder mask, hinder for separation trough
Solder paste ink is filled and led up, it is ensured that in separation trough, the copper sheet of both sides is completely covered by solder mask；
I. the solder mask a in separation trough 32 is dried so that it is solidification；
J. the copper sheet circuit 31 covered on copper aluminium base is carried out pickling, polish-brush, washes and dry；
K. stamp solder mask b to covering copper aluminium base comprehensively, during printing, require the pad 33 on copper sheet circuit 31
Put and do not stamp solder mask b, and remaining region 7 all stamps solder mask b, as shown in Figure 8 and Figure 9；
L. dry the solder mask b in k step, and make it solidify, obtain final products.
This technology fully phases out and requires in conventional art that twice edging to separation trough 32 both sides wall body top falls
Angle step, reduces production process, improves yield rate, it is not required that reaches separation trough 32 by increase squeegee pressure and is filled
The requirement of solder mask, reduces technological requirement, and above-mentioned reason can be substantially reduced the manufacturing cost of product, it is also possible to improves and produces effect
Rate.
The above, be only presently preferred embodiments of the present invention, and the present invention not makees any pro forma restriction.Appoint
What those of ordinary skill in the art, without departing under technical solution of the present invention ambit, may utilize the side of the disclosure above
Technical solution of the present invention is made many possible variations and modification by method and technology contents, or the equivalence being revised as equivalent variations is real
Execute example.Therefore every content without departing from technical solution of the present invention, the equivalence change made according to the shape of the present invention, structure and principle
Change, all should be covered by protection scope of the present invention.
Claims (1)
1. printing manufactures the production technology of wiring board, and its step is as follows:
A. carry out sawing sheet to covering copper aluminium base sheet material, and the copper aluminium base that covers of split honest material carries out polishing, clean and drying；
B. circuit ink is stamped according to designed lines figure on copper aluminium base covering；
C. circuit ink is dried；
D. erode covering copper sheet unnecessary in addition to the copper product that above-mentioned circuit ink covers on copper aluminium base；
E. return the circuit ink covered on copper aluminium base, manifest the copper sheet circuit of design；
F. hole, location is bored；
G. the copper sheet circuit covered on copper aluminium base is polished and cleaned, dries；
H. utilize silk-screen technology that the separation trough in copper sheet circuit is stamped solder mask, make solder mask fill and lead up separation trough；
I. the solder mask being filled in separation trough is dried；
The most again copper sheet circuit polished and clean, dry；
K. stamp solder mask to covering copper aluminium base comprehensively, during printing, require that the pad locations on copper sheet circuit does not stamp
Photosensitive solder resist ink；
L. dry the solder mask in k step, prepare finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610614651.9A CN106028661A (en) | 2016-07-29 | 2016-07-29 | Production process of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610614651.9A CN106028661A (en) | 2016-07-29 | 2016-07-29 | Production process of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106028661A true CN106028661A (en) | 2016-10-12 |
Family
ID=57115693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610614651.9A Pending CN106028661A (en) | 2016-07-29 | 2016-07-29 | Production process of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106028661A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN108285686A (en) * | 2018-02-27 | 2018-07-17 | 深圳市硕晟科技有限公司 | A kind of ink and its preparation method and application covering protection for flexible printed board surface treatment |
| CN108718483A (en) * | 2018-06-05 | 2018-10-30 | 南通海舟电子科技有限公司 | Printed wire board production technology |
| CN109472077A (en) * | 2018-10-31 | 2019-03-15 | 济南浪潮高新科技投资发展有限公司 | A method of separating copper sheet automatically using Allegro software |
| CN111010821A (en) * | 2019-12-31 | 2020-04-14 | 广州京写电路板有限公司 | Manufacturing method of printed circuit board meeting high-precision requirement of pad position |
| CN112011223A (en) * | 2019-05-31 | 2020-12-01 | 广东高仕电研科技有限公司 | UV (ultraviolet) curing spray printing ink for filling PCB (printed circuit board) substrate and PCB |
| CN112020234A (en) * | 2019-05-31 | 2020-12-01 | 广东高仕电研科技有限公司 | Preparation method of PCB and PCB |
| CN113473739A (en) * | 2020-03-31 | 2021-10-01 | 深南电路股份有限公司 | Method for silk-screen solder resist ink of circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102781170A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Method for preparing mirror-surface aluminum substrate |
| CN103079355A (en) * | 2012-12-28 | 2013-05-01 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) thick copper board ink printing method |
| CN104202909A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | High-thermal-conductivity metal circuit board production method |
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
-
2016
- 2016-07-29 CN CN201610614651.9A patent/CN106028661A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102781170A (en) * | 2012-07-24 | 2012-11-14 | 中山市达进电子有限公司 | Method for preparing mirror-surface aluminum substrate |
| CN103079355A (en) * | 2012-12-28 | 2013-05-01 | 胜宏科技（惠州）股份有限公司 | PCB (printed circuit board) thick copper board ink printing method |
| CN104202909A (en) * | 2014-09-16 | 2014-12-10 | 四川海英电子科技有限公司 | High-thermal-conductivity metal circuit board production method |
| CN105188269A (en) * | 2015-10-28 | 2015-12-23 | 广州杰赛科技股份有限公司 | Ultra-thick copper circuit board and manufacturing method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN108285686A (en) * | 2018-02-27 | 2018-07-17 | 深圳市硕晟科技有限公司 | A kind of ink and its preparation method and application covering protection for flexible printed board surface treatment |
| CN108718483A (en) * | 2018-06-05 | 2018-10-30 | 南通海舟电子科技有限公司 | Printed wire board production technology |
| CN109472077A (en) * | 2018-10-31 | 2019-03-15 | 济南浪潮高新科技投资发展有限公司 | A method of separating copper sheet automatically using Allegro software |
| CN112011223A (en) * | 2019-05-31 | 2020-12-01 | 广东高仕电研科技有限公司 | UV (ultraviolet) curing spray printing ink for filling PCB (printed circuit board) substrate and PCB |
| CN112020234A (en) * | 2019-05-31 | 2020-12-01 | 广东高仕电研科技有限公司 | Preparation method of PCB and PCB |
| CN111010821A (en) * | 2019-12-31 | 2020-04-14 | 广州京写电路板有限公司 | Manufacturing method of printed circuit board meeting high-precision requirement of pad position |
| CN113473739A (en) * | 2020-03-31 | 2021-10-01 | 深南电路股份有限公司 | Method for silk-screen solder resist ink of circuit board |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161012 |
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| WD01 | Invention patent application deemed withdrawn after publication |