CN103076822A - Control method for adjusting temperature of component to be manufactured in vacuum equipment and implementing device thereof - Google Patents
Control method for adjusting temperature of component to be manufactured in vacuum equipment and implementing device thereof Download PDFInfo
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- CN103076822A CN103076822A CN2012105830599A CN201210583059A CN103076822A CN 103076822 A CN103076822 A CN 103076822A CN 2012105830599 A CN2012105830599 A CN 2012105830599A CN 201210583059 A CN201210583059 A CN 201210583059A CN 103076822 A CN103076822 A CN 103076822A
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Abstract
The invention relates to a control method for adjusting the temperature of a component to be manufactured in vacuum equipment and an implementing device thereof. The device comprises a positioning device, a heating device and a cooling device, wherein the positioning device is used for positioning and installing the component to be manufactured, and the heating device is positioned between the positioning device and the cooling device. A positioning slot of which the size and the structure are matched with those of the component to be manufactured is arranged in the positioning device; tunnel holes are arranged in the heating device, a heating component is installed in each tunnel hole, and the electrodes of the heating components are mutually connected in parallel or connected in series; and a liquid-state cooling-medium passage is arranged in the cooling device, and two liquid-state cooling-medium interfaces are arranged in the cooling device. The positioning device, the heating device and the cooling device of the implementing device can also be designed into an integrated structure. According to the invention, the heating device and the cooling device are artfully combined into a whole, so that the accurate temperature control for the temperature rise and reduction of the component to be manufactured in the vacuum equipment is realized with high efficiency, the energy of the heating device is utilized with the maximum efficiency, and thermal resistance on a heat passage between the heating device and the cooling device is reduced.
Description
Technical field
The present invention relates to the semiconductor electronic technical field, particularly a kind of temperature-controlled process and implement device thereof of regulating device temperature to be made in the vacuum equipment.
Background technology
In semiconductor electronic technology and field of optoelectronic devices, there are a lot of manufacturing technologies and technique to relate to vacuum equipment, such as vacuum coating equipment, Vacuum Eutectic soldering furnace etc., some manufacturing process and Implementation Technology, need to be in these vacuum equipments, carrying out accurately to chip or device wait system product, temperature control could realize, in other words, temperature is very important technological parameter in these process conditions, can be sensitive and accurately control technological temperature, it is the key that realizes related manufacturing process (such as the solder eutectic welding technology between the different elements), therefore, accurately heat, each temperature controlling stages such as constant temperature and cooling is the necessary condition that realizes these technologies.The heat sink that temperature control equipment in the existing Vacuum Eutectic welding gear is not established heat sink or setting usually can't be realized the fast cooling of device to be made, and the efficiency of utilization of heating arrangement is low, is unfavorable for treating device processed and realizes accurate temperature controlling.Common Vacuum Eutectic welding gear temperature control equipment typical structure as shown in Figure 1, infrared heating fluorescent tube 4 places below the warm table 3, eutectic weld jig 2 places on the warm table 3, device 1(to be made for example treats eutectic welding device) be installed in the eutectic weld jig 2, infrared heating fluorescent tube 4 is by its electrode 41 energising heating, can be that electricity is connected in parallel or electricity is connected in series between each infrared lamp, infrared heating fluorescent tube 4 also can be substituted by other the equipment with heating function, such as heater strip or ceramic heating pipe etc., after the 4 energising heating of infrared heating fluorescent tube, warm table 3 temperature are raise, warm table 3 adopts graphite material to make usually, have good thermal conductivity and thermal radiation absorption ability, warm table 3 passes through heat exchange pattern, heat is conducted to eutectic weld jig 2, thereby heat is delivered on the device 1 to be made the most at last, realize the needed temperature conditions of its manufacture craft, the said temperature control device does not arrange heat sink, this stepped construction also is difficult for the design and installation heat sink, under vacuum environment, be difficult to realize fast cooling, and, infrared lamp 4 sends heat by radiation, in the said apparatus, only the radiation towards warm table 3 just can be absorbed, thermal loss is comparatively serious, and, this mode of coming transferring heat by sandwich construction, making has sizable temperature difference between warm table 3 and the device to be made 1, this is unfavorable for accurately controlling the technological temperature of device to be made.Therefore, existing Vacuum Eutectic welding gear temperature control equipment is not installed heat sink, be difficult to realize fast cooling, under vacuum environment, the temperature difference is larger between the heating fluorescent tube of this device and the device to be made, and is difficult to realize treating the accurate temperature control of device processed, and, the heating fluorescent tube efficiency of utilization of this device is lower, and the used heat that does not utilize also easily causes the temperature fluctuation of other parts of vacuum equipment inside cavity.
Summary of the invention
Technical matters to be solved by this invention provides a kind of temperature-controlled process and implement device thereof of vacuum equipment, with heat riser with heat sink is ingenious is combined as a whole, the efficient accurate temperature control that realizes heating and cooling, can utilize to maximum efficiency the heating arrangement energy, and reduced the thermal resistance on the heat passage between heating arrangement and the heat sink, thereby for realizing that accurate temperature controlling provides good physical arrangement.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of temperature control equipment of regulating device temperature to be made for vacuum equipment, it is characterized in that, comprise locating device, heating arrangement and heat sink, described locating device is used for location and the installation of device to be made, described locating device is positioned on the heating arrangement, and described heating arrangement is positioned on the heat sink.
On the basis of technique scheme, the present invention can also do following improvement:
Further, described locating device is provided with locating slot, and the size of described locating slot and structure and device to be made are complementary.
Further, be provided with Tunnel-hole in the described heating arrangement, in the described Tunnel-hole heater element be installed, described Tunnel-hole diameter is greater than the heater element diameter, and leaves the gap between described Tunnel-hole and the described heater element.This tunnel structure can with the heat absorption of most of heater element, greatly improve the energy utilization efficiency of heating arrangement.
Further, described heater element quantity is identical with Tunnel-hole quantity.
Further, the electrode of described heater element is connected to each other, and described being connected to is connected in parallel or is connected in series.
Further, described heater element is infrared heating fluorescent tube, heater strip or ceramic heating pipe.
Further, be provided with liquid cooled medium passage in the described heat sink, described liquid cooled medium passage two ends are connected with liquid cooled ature of coal output interface with liquid cooled medium input interface respectively.
Further, the described temperature control equipment of regulating device temperature to be made for vacuum equipment is integrated, and the material of described temperature control equipment is graphite, and graphite has good thermal conductivity and thermal radiation absorption ability.
Another technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of temperature-controlled process of regulating device temperature to be made in the vacuum equipment is characterized in that may further comprise the steps:
Device to be made is located, is installed in the locating device of described temperature control equipment;
To the heating arrangement energising heating of described temperature control equipment, heating arrangement is passed to locating device by the heat conduction with heat, and the device to be made in the locating device is heated;
Reduce the temperature of the heat sink of described temperature control equipment by the liquid cooled ature of coal, heat sink absorbs the heat of heating arrangement and locating device by the heat conduction, the device to be made in the locating device is lowered the temperature.
Further, be provided with Tunnel-hole in the described heating arrangement, in the described Tunnel-hole heater element be installed, the described electrifying electrodes that energising is heated to be the heater element in the Tunnel-hole of heating arrangement to heating arrangement heats.
Further, be provided with liquid cooled medium passage in the described heat sink, described liquid cooled medium passage two ends are connected with liquid cooled ature of coal output interface with liquid cooled medium input interface respectively, and the described temperature of heat sink that reduces by the liquid cooled ature of coal is for passing into the temperature that the liquid cooled medium reduces heat sink by the input of liquid cooled medium, output interface in the liquid cooled medium passage of heat sink.
The invention has the beneficial effects as follows: the invention provides and a kind ofly realize treating device temperature precision Control Technology implementation method processed and temperature control equipment for Vacuum Eutectic welding gear or similar vacuum equipment, with heat riser with heat sink is ingenious is combined as a whole, efficiently realize the accurate temperature control of device heating and cooling to be made, utilize to maximum efficiency the heating arrangement energy, and reduced the thermal resistance on the heat passage between heating arrangement and the heat sink, thereby for realizing that accurate temperature controlling provides good physical arrangement, realized that the temperature of the device to be made in the vacuum equipment accurately controls, as heating up, constant temperature, cooling etc.
Description of drawings
Fig. 1 is the heating apparatus typical structure schematic diagram in the existing Vacuum Eutectic welding gear;
Fig. 2 is temperature control equipment (lifting/lowering temperature) the typical structure schematic diagram in the Vacuum Eutectic welding gear of the present invention;
Fig. 3 is temperature control equipment (lifting/lowering temperature) diagrammatic cross-section in the Vacuum Eutectic welding gear of the present invention;
Fig. 4 is the temperature control device structure schematic diagram in the Vacuum Eutectic welding gear of integral structure of the present invention;
Fig. 5 is the temperature control equipment diagrammatic cross-section in the Vacuum Eutectic welding gear of integral structure of the present invention;
Fig. 6 is the temperature control equipment blast structural representation in the Vacuum Eutectic welding gear of integral structure of the present invention.
In the accompanying drawing, the list of parts of each label representative is as follows:
A, integral structure device, B, device to be made, C, infrared heating fluorescent tube, C1, electrode, D, eutectic weld jig, E, warm table, E1, Tunnel-hole, F, refrigeratory, F1, liquid cooled medium passage, F2, liquid cooled medium interface.
Embodiment
Below in conjunction with accompanying drawing principle of the present invention and feature are described, institute gives an actual example and only is used for explaining the present invention, is not be used to limiting scope of the present invention.
As shown in Figures 2 and 3, be provided with Tunnel-hole E1 in the middle of the warm table E, infrared heating fluorescent tube C is installed among the Tunnel-hole E1 of warm table E, infrared heating fluorescent tube C quantity is consistent with Tunnel-hole E1 quantity, Tunnel-hole E1 diameter is a bit larger tham the diameter of infrared heating fluorescent tube C, infrared heating fluorescent tube C external diameter does not contact with Tunnel-hole E1 hole wall on the warm table E, infrared lamp C is by its electrode C1 energising heating, can be that electricity is connected in parallel between each infrared lamp also can be that electricity is connected in series, infrared lamp C also can be substituted by other the equipment with heating function, such as heater strip or ceramic heating pipe etc., eutectic weld jig D is installed on the warm table E upper surface, warm table E is installed on the refrigeratory F upper surface, refrigeratory F adopts the liquid cooled medium to realize cooling function, be provided with liquid cooled medium passage F1 among the refrigeratory F, and be provided with two liquid cooled medium interface F2, respectively as the input and output interface, device B to be made is installed in the locating slot of the eutectic weld jig D that mates with its structure and size, this structure has realized the combination of heat riser and heat sink, when device B to be made needs to heat up in technique, the infrared heating fluorescent tube C work of switching on, by heat radiation, Tunnel-hole E1 hole wall heating with warm table E, this tunnel structure, can be with the heat absorption of most of infrared heating fluorescent tube C radiation, greatly improved the energy utilization efficiency of heating arrangement, raise by eutectic weld jig D and the device B temperature to be made of heat conduction with warm table E top, if need cooling, in refrigeratory F, pass into the liquid cooled medium, just can reduce the temperature of refrigeratory F, pass through heat exchange pattern, absorb the heat of warm table E, reduce its temperature, thereby reduce the technological temperature of device B to be made, by reasonably utilizing infrared heating lamp system device and chiller system device, can in the Vacuum Eutectic welding gear, realize the accurate temperature controlling of temperature control equipment.
The said temperature control device is in vacuum environment, between warm table E and eutectic weld jig D and the refrigeratory F a plurality of physical interfaces are arranged, if surface ratio is more coarse or flatness is not high, may cause larger thermal resistance is arranged in the heat passage, the present invention also provides a kind of technic relization scheme that reduces this interface resistance, and warm table E, eutectic weld jig D and refrigeratory F are designed to integral structure.
Such as Fig. 4, Fig. 5 and shown in Figure 6, integral structure device A is provided with Tunnel-hole A1, be used for installation infrared heating fluorescent tube C, realize heating function, integral structure device A bottom is provided with liquid cooled medium passage A3 and liquid cooled medium interface A4, pass into the liquid cooled medium and can realize the function that cools, integral structure device A top is provided with locating slot A2, be used for location and the installation of device B to be made, this temperature control equipment can ideally realize treating the accurate temperature controlling of device B processed, and integral structure device A generally can adopt graphite material.
The above only is preferred embodiment of the present invention, and is in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. one kind is used for the temperature control equipment that vacuum equipment is regulated device temperature to be made, it is characterized in that, comprise locating device, heating arrangement and heat sink, described locating device is used for location and the installation of device to be made, described locating device is positioned on the heating arrangement, and described heating arrangement is positioned on the heat sink.
2. described a kind of temperature control equipment of regulating device temperature to be made for vacuum equipment according to claim 1 is characterized in that, described locating device is provided with locating slot, and the size of described locating slot and structure and device to be made are complementary.
3. described a kind of temperature control equipment of regulating device temperature to be made for vacuum equipment according to claim 1, it is characterized in that, be provided with Tunnel-hole in the described heating arrangement, in the described Tunnel-hole heater element is installed, described Tunnel-hole diameter is greater than the heater element diameter, and leaves the gap between described Tunnel-hole and the described heater element.
4. described a kind of temperature control equipment of regulating device temperature to be made for vacuum equipment according to claim 3 is characterized in that, described heater element quantity is identical with Tunnel-hole quantity.
5. described a kind of temperature control equipment of regulating device temperature to be made for vacuum equipment according to claim 4 is characterized in that, the electrode of described heater element is connected to each other, and described being connected to is connected in parallel or is connected in series.
6. according to claim 3,4 or 5 described a kind of temperature control equipments of regulating device temperature to be made for vacuum equipment, it is characterized in that, described heater element is infrared heating fluorescent tube, heater strip or ceramic heating pipe.
7. according to claim 1,2,3,4 or 5 described a kind of temperature control equipments of regulating device temperature to be made for vacuum equipment, it is characterized in that, be provided with liquid cooled medium passage in the described heat sink, described liquid cooled medium passage two ends are connected with liquid cooled ature of coal output interface with liquid cooled medium input interface respectively.
8. described a kind of temperature control equipment of regulating device temperature to be made for vacuum equipment according to claim 7 is characterized in that, described temperature control equipment is integrated, and the material of described temperature control equipment is graphite.
9. temperature-controlled process of regulating device temperature to be made in the vacuum equipment is characterized in that may further comprise the steps:
Device to be made is located, is installed in the locating device such as the arbitrary described temperature control equipment of claim 1 to 8;
To the heating arrangement energising heating of described temperature control equipment, heating arrangement is passed to locating device by the heat conduction with heat, and the device to be made in the locating device is heated;
Reduce the temperature of the heat sink of described temperature control equipment by the liquid cooled ature of coal, heat sink absorbs the heat of heating arrangement and locating device by the heat conduction, the device to be made in the locating device is lowered the temperature.
10. described a kind of temperature-controlled process of regulating device temperature to be made in the vacuum equipment according to claim 9, it is characterized in that, heating arrangement energising heating to described temperature control equipment, heating arrangement is passed to locating device by the heat conduction with heat, in the step that device to be made in the locating device is heated, described energising is heated to be electrifying electrodes heating to the heater element in the Tunnel-hole of heating arrangement to heating arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210583059.9A CN103076822B (en) | 2012-12-27 | 2012-12-27 | Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210583059.9A CN103076822B (en) | 2012-12-27 | 2012-12-27 | Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment |
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| CN103076822A true CN103076822A (en) | 2013-05-01 |
| CN103076822B CN103076822B (en) | 2015-09-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107219030A (en) * | 2016-03-21 | 2017-09-29 | 中国科学院深圳先进技术研究院 | Membrane stress tester and its method of testing |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60245776A (en) * | 1984-05-21 | 1985-12-05 | Hitachi Ltd | Thin film forming device |
| EP0746010A2 (en) * | 1993-06-07 | 1996-12-04 | Applied Materials, Inc. | Sealing device and method useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential |
| WO1998029704A1 (en) * | 1997-01-02 | 1998-07-09 | Cvc Products, Inc. | Thermally conductive chuck for vacuum processor |
| CN1472359A (en) * | 2003-06-27 | 2004-02-04 | 西北工业大学 | Heating temperature controller and method for preparing method |
| CN101038856A (en) * | 2006-03-17 | 2007-09-19 | 中国电子科技集团公司第四十八研究所 | Enclosed infrared heating device for semiconductor chip |
| CN101465285A (en) * | 2007-12-21 | 2009-06-24 | 新光电气工业株式会社 | Substrate temperature adjusting-fixing devices |
-
2012
- 2012-12-27 CN CN201210583059.9A patent/CN103076822B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60245776A (en) * | 1984-05-21 | 1985-12-05 | Hitachi Ltd | Thin film forming device |
| EP0746010A2 (en) * | 1993-06-07 | 1996-12-04 | Applied Materials, Inc. | Sealing device and method useful in semiconductor processing apparatus for bridging materials having a thermal expansion differential |
| WO1998029704A1 (en) * | 1997-01-02 | 1998-07-09 | Cvc Products, Inc. | Thermally conductive chuck for vacuum processor |
| CN1472359A (en) * | 2003-06-27 | 2004-02-04 | 西北工业大学 | Heating temperature controller and method for preparing method |
| CN101038856A (en) * | 2006-03-17 | 2007-09-19 | 中国电子科技集团公司第四十八研究所 | Enclosed infrared heating device for semiconductor chip |
| CN101465285A (en) * | 2007-12-21 | 2009-06-24 | 新光电气工业株式会社 | Substrate temperature adjusting-fixing devices |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107219030A (en) * | 2016-03-21 | 2017-09-29 | 中国科学院深圳先进技术研究院 | Membrane stress tester and its method of testing |
| CN107219030B (en) * | 2016-03-21 | 2020-07-21 | 中国科学院深圳先进技术研究院 | Film stress tester and testing method thereof |
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| CN103076822B (en) | 2015-09-09 |
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Address after: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee after: Yantai Rui micro nano technology Limited by Share Ltd Address before: 264006 Yantai economic and Technological Development Zone, Guiyang, No. 11 main street, Shandong Patentee before: Yantai Raytron Technology Co., Ltd. |