CN103066001A - Universal leveling suction nozzle for collecting co-crystallizing welding machine chips - Google Patents
Universal leveling suction nozzle for collecting co-crystallizing welding machine chips Download PDFInfo
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- CN103066001A CN103066001A CN2012105815194A CN201210581519A CN103066001A CN 103066001 A CN103066001 A CN 103066001A CN 2012105815194 A CN2012105815194 A CN 2012105815194A CN 201210581519 A CN201210581519 A CN 201210581519A CN 103066001 A CN103066001 A CN 103066001A
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- chip
- suction nozzle
- chips
- mounting bracket
- welding machine
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Abstract
The invention belongs to the technical field of integrated circuit manufacture, and relates to an auxiliary device which is assembled on a welding head of a co-crystallizing welding machine and used for collecting co-crystallizing welding chips, in particular to a universal leveling suction nozzle for collecting the co-crystallizing welding machine chips. The lower portion of an installation support penetrates through a copper sleeve inner hole and is arranged inside a copper sleeve inner cavity. After a sealing ring is sleeved on the lower portion of the installation support, the lower portion of the installation support is screwed into the copper sleeve inner cavity through a pressing nut, and the installation support is provided with a first air passage along an axis. The universal leveling suction nozzle is simple, compact and reasonable in structure. The chips can be kept horizontally by means of rotation of a stainless piece-absorbing head, and the problems that the chips are broken or fissure slightly due to the fact that uneven stress is exerted on the chips during co-crystallizing welding are solved. The problems that the chips are not collected smoothly and the stress on the chips is uneven are solved. The universal leveling suction nozzle is made of metal materials such as stainless steel, and is high temperature resistant, wear resistant and long in service life.
Description
Technical field
The invention belongs to the ic manufacturing technology field, relate to a kind of being assemblied on the eutectic welding machine welding head, be used for the auxiliary implement of eutectic welding pick-up chip, specifically the Universal leveling suction nozzle used of a kind of eutectic welding machine pick-up chip.
Background technology
At present, eutectic welding pick-up chip has following two kinds of methods usually: by the method for tweezers gripping chip or employing vacsorb chip.Wherein, the mode of tweezers gripping is to pick up and put down chip by pneumatic tweezers, vacuum cups picks up and puts down weld tabs, prefabricated solder sheet is held with vacuum cups, be placed on the position of required eutectic, pick up tube core with tweezers, tweezers move by mechanical friction, just finish eutectic one time until molten alloy occurs around the chip.The mode of vacsorb chip is that the suction nozzle position holds chip by vacuum, then aims at the position of the sintering of wanting, chip placement, under the effect of heat and pressure, suction nozzle until have obvious fusion to occur around seeing chip, is finished eutectic by frictional vibration and substrate fusion one time.The chip discontinuity require chip to keep level during the chip eutectic, in order to avoid can not satisfy the bonding requirement with chip crushing or eutectic rear-inclined.
There is in actual use following problem:
When 1, the folder power of tweezers gripping chip is improper, easily be caught broken chip edge, even the situation that directly causes chip breakage, the particularly fragility such as ultra-thin chip or GaAs material more easily to be damaged; In addition, in tweezers gripping chip processes, when generating chip tilts, can cause weld failure.
2, conventional vacuum inhale sheet suction nozzle when chip pick-up tilts, or during the substrate surface out-of-flatness, can make the chip unbalance stress, cause the scolder around the welding zone inhomogeneous.In chip eutectic process, chip eutectic rear-inclined produces harmful effect to the postorder bond technology, cause losing efficacy, and the chip or make chip produce micro-crack of crushing.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, the Universal leveling suction nozzle that provides a kind of eutectic welding machine pick-up chip simple in structure, ingenious, rational to use, can be applicable to different chip sizes, when chip contacts with base plan, rotate adjusting by iron spheroid in the curved portions of copper sleeve, thereby regulate the relative level of chip and substrate, make chip and base plan maintenance level, can adapt to chip level, the stressed uniform requirement of the welding of packaged chip eutectic.
According to technical scheme provided by the invention: the Universal leveling suction nozzle that a kind of eutectic welding machine pick-up chip is used, be characterised in that: copper sleeve endoporus is passed in the mounting bracket bottom, be in the copper barrel bore, behind the suit sealing ring of described mounting bracket bottom, be tightened in the copper barrel bore by clamp nut, described mounting bracket is provided with the first airway along the axle center, the end that mounting bracket is in the copper barrel bore arranges magnet; Copper sleeve is positioned on the irony hemisphere, and described irony hemisphere lower end arranges stainless steel and inhales head, and the second airway is set on the irony hemisphere, and described stainless steel is inhaled on the head and corresponding to the second airway place the 3rd airway is set.
As a further improvement on the present invention, described mounting bracket boss fits tightly on copper sleeve end face, and mounting bracket tightly fits in the copper sleeve endoporus.
As a further improvement on the present invention, described copper sleeve and the hemispheroidal binding site of irony are set to arc shape.
As a further improvement on the present invention, described magnet is bonded in the mounting bracket end by glue.
As a further improvement on the present invention, described irony hemisphere closely bonds by glue and stainless steel suction head.
The present invention compared with prior art, advantage is: the present invention is simple in structure, compact, rationally; Can make chip maintenance level by rotating stainless steel suction head, when having solved the eutectic welding, chip (such as fragility materials such as ultra-thin chip or GaAs) discontinuity causes fragment or makes chip produce micro-crack; The invention solves the problem of chip pickup out-of-flatness, unbalance stress; The present invention adopts stainless steel and other metal materials to be processed into, high temperature resistant, wear-resistant, long service life.
Description of drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is cross-sectional view of the present invention.
Embodiment
The invention will be further described below in conjunction with concrete drawings and Examples.
Shown in Fig. 1 ~ 3, comprise mounting bracket 1, magnet 2, copper sleeve 3, sealing ring 4, clamp nut 5, irony hemisphere 6, stainless steel suction head 7, sleeve 7-1, base plate 7-2, substrate 7-3, mounting bracket boss 8, copper barrel bore 9, the first airway 10, copper sleeve endoporus 11, the 3rd airway 12, the second airway 13 etc.
Shown in Fig. 1 ~ 3, the present invention is the Universal leveling suction nozzle that a kind of eutectic welding machine pick-up chip is used, copper sleeve endoporus 11 is passed in mounting bracket 1 bottom, be in the copper barrel bore 9, behind the suit sealing ring 4 of described mounting bracket 1 bottom, be tightened in the copper barrel bore 9 by clamp nut 5, described mounting bracket 1 is provided with the first airway 10 along the axle center, and the end that mounting bracket 1 is in the copper barrel bore 9 arranges magnet 2; Copper sleeve 3 is positioned on the irony hemisphere 6, described irony hemisphere 6 lower ends arrange stainless steel and inhale head 7, stainless steel is inhaled head 7 can adjust arbitrarily horizontal plane, so that guaranteeing chip is horizontal all the time, the second airway 13 is set on the irony hemisphere 6, and described stainless steel is inhaled on the head 7 and corresponding to the second airway 13 places the 3rd airway 12 is set.
Described mounting bracket boss 8 fits tightly on copper sleeve 3 end faces, mounting bracket 1 tightly fits in the copper sleeve endoporus 11, by the friction tight mode of this kind, has avoided 3 in mounting bracket 1 and copper sleeve owing to cooperating the gas leak phenomenon that does not closely cause.
Described copper sleeve 3 is set to arc shape with the binding site of irony hemisphere 6, and the outer surface of this arc shape and irony hemisphere 6 is fitted fully.
Described magnet 2 is bonded in mounting bracket 1 end by glue.
Described irony hemisphere 6 is inhaled head 7 by glue and stainless steel and is closely bonded.
Described stainless steel is inhaled head 7 and is comprised sleeve 7-1, base plate 7-2, substrate 7-3, and sleeve 7-1 is enclosed in copper sleeve 3 wherein.
Mounting bracket 1 of the present invention inserts in the connecting hole of eutectic welding machine pressure-welding head, fixedly screws by screw, can work.
The present invention is simple in structure, compact, reasonable; Can make chip maintenance level by rotating stainless steel suction head, when having solved the eutectic welding, chip (such as fragility materials such as ultra-thin chip or GaAs) discontinuity causes fragment or makes chip produce micro-crack; The invention solves the problem of chip pickup out-of-flatness, unbalance stress; The present invention adopts stainless steel and other metal materials to be processed into, high temperature resistant, wear-resistant, long service life.
Claims (5)
1. Universal leveling suction nozzle that eutectic welding machine pick-up chip is used, it is characterized in that: copper sleeve endoporus (11) is passed in mounting bracket (1) bottom, be in the copper barrel bore (9), behind described mounting bracket (1) the bottom suit sealing ring (4), be tightened in the copper barrel bore (9) by clamp nut (5), described mounting bracket (1) is provided with the first airway (10) along the axle center, the end that mounting bracket (1) is in the copper barrel bore (9) arranges magnet (2); Copper sleeve (3) is positioned on the irony hemisphere (6), described irony hemisphere (6) lower end arranges stainless steel and inhales head (7), the second airway (13) is set on the irony hemisphere (6), and described stainless steel is inhaled head (7) and is upward located to arrange the 3rd airway (12) corresponding to the second airway (13).
2. the Universal leveling suction nozzle used of eutectic welding machine pick-up chip as claimed in claim 1, it is characterized in that: described mounting bracket boss (8) fits tightly on copper sleeve (3) end face, and mounting bracket (1) tightly fits in the copper sleeve endoporus (11).
3. the Universal leveling suction nozzle used of eutectic welding machine pick-up chip as claimed in claim 1, it is characterized in that: described copper sleeve (3) is set to arc shape with the binding site of irony hemisphere (6).
4. the Universal leveling suction nozzle used of eutectic welding machine pick-up chip as claimed in claim 1, it is characterized in that: described magnet (2) is bonded in mounting bracket (1) end by glue.
5. the Universal leveling suction nozzle used of eutectic welding machine pick-up chip as claimed in claim 1, it is characterized in that: described irony hemisphere (6) is inhaled head (7) by glue and stainless steel and is closely bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210581519.4A CN103066001B (en) | 2012-12-28 | 2012-12-28 | Universal leveling suction nozzle for collecting co-crystallizing welding machine chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210581519.4A CN103066001B (en) | 2012-12-28 | 2012-12-28 | Universal leveling suction nozzle for collecting co-crystallizing welding machine chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103066001A true CN103066001A (en) | 2013-04-24 |
| CN103066001B CN103066001B (en) | 2015-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210581519.4A Active CN103066001B (en) | 2012-12-28 | 2012-12-28 | Universal leveling suction nozzle for collecting co-crystallizing welding machine chips |
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| Country | Link |
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| CN (1) | CN103066001B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257904A (en) * | 2016-12-28 | 2018-07-06 | 林彦全 | Assembling structure for connecting suction nozzle |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1802735A (en) * | 2003-09-18 | 2006-07-12 | Nec机械股份有限公司 | Collet, chip bonder and chip pick-up method |
| CN101383277A (en) * | 2007-09-05 | 2009-03-11 | 株式会社迪思科 | Expansion method and expansion apparatus |
| CN201708140U (en) * | 2010-04-06 | 2011-01-12 | 河南鸿昌电子有限公司 | Tool for picking up semi-conductor crystal block |
| CN102290373A (en) * | 2010-06-17 | 2011-12-21 | 株式会社日立高新技术仪器 | Die bonder, pickup method, and pickup device |
| CN202205727U (en) * | 2011-08-19 | 2012-04-25 | 关羽翔 | Suction nozzle device |
| CN102496594A (en) * | 2011-11-16 | 2012-06-13 | 扬州扬杰电子科技股份有限公司 | Lifting and putting suction nozzle suitable for light and lamellate component |
-
2012
- 2012-12-28 CN CN201210581519.4A patent/CN103066001B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1802735A (en) * | 2003-09-18 | 2006-07-12 | Nec机械股份有限公司 | Collet, chip bonder and chip pick-up method |
| CN101383277A (en) * | 2007-09-05 | 2009-03-11 | 株式会社迪思科 | Expansion method and expansion apparatus |
| CN201708140U (en) * | 2010-04-06 | 2011-01-12 | 河南鸿昌电子有限公司 | Tool for picking up semi-conductor crystal block |
| CN102290373A (en) * | 2010-06-17 | 2011-12-21 | 株式会社日立高新技术仪器 | Die bonder, pickup method, and pickup device |
| CN202205727U (en) * | 2011-08-19 | 2012-04-25 | 关羽翔 | Suction nozzle device |
| CN102496594A (en) * | 2011-11-16 | 2012-06-13 | 扬州扬杰电子科技股份有限公司 | Lifting and putting suction nozzle suitable for light and lamellate component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108257904A (en) * | 2016-12-28 | 2018-07-06 | 林彦全 | Assembling structure for connecting suction nozzle |
| CN108257904B (en) * | 2016-12-28 | 2021-10-22 | 林彦全 | Assembling structure for connecting suction nozzle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103066001B (en) | 2015-04-22 |
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