CN103065180B - A kind of processing technology for chipless RFID radio-frequency (RF) tag - Google Patents
A kind of processing technology for chipless RFID radio-frequency (RF) tag Download PDFInfo
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Abstract
The processing technology of a kind of chipless RFID radio-frequency (RF) tag of disclosure, this invention utilizes vacuum vapour deposition or hot and cold thermoprint legal system to make chipless RFID radio-frequency (RF) tag。Its process is as follows: design the antenna structure of chipless RFID radio-frequency (RF) tag as requested, then with PVC, PP, PET, paper, plastics etc. for base material, vacuum vapour deposition or hot and cold thermoprint method is utilized to transfer on substrate surface by conducting metal, finally carry out overlay film encapsulation, obtain chipless RFID radio-frequency (RF) tag。Utilize the advantages such as chipless RFID radio-frequency (RF) tag prepared by the method has excellent folding resistance and good toughness, cost of manufacture is low, operating procedure is simple, have broad application prospects。
Description
Technical field
The present invention relates to the processing technology of a kind of chipless RFID radio-frequency (RF) tag, particularly relate to the process utilizing vacuum vapour deposition or hot and cold thermoprint legal system to make chipless RFID radio-frequency label antenna。
Background technology
REID (RFID, RadioFrequencyIdentification) is one and utilizes radiofrequency signal to carry out the automatic identification technology of bidirectional transfer of information by Space Coupling。It is a kind of non-contact automatic identification technology, can automatically identify that destination object obtains related data by radiofrequency signal, identify that work does not need manual intervention, there is the advantages such as antimagnetic, waterproof, high temperature resistant, storage data capacity is big, it is possible to be widely used in such as no-stop charging system, train transport monitor system, managing physical distribution of merchandise, streamline manufacturing automation, gate inhibition's safety management, livestock management etc. and to collect and to process the application of data。
RFID technique is classified approximately according to use " active " label or " passive " label。Active label has the local energy (such as battery), in order to the signal that active label to be read by interrogator transmission。Active label has longer range of signal, and on the contrary, " passive " label does not have internal power source, and instead, passive label has reader to obtain the energy, and when receiving signal from reader, passive label is launched or forwarding information again。
Generally, two class labels all have integrated circuit or the electronic circuit of silicon form。Circuit storage also transmits identification data to reader。Except chip, label includes the some form of antenna being connected with chip。Active label merges the antenna with reader communication from label self energy, and for passive label, antenna is used as to be converted into the radio-frequency (RF) energy deriving from reader the transducer of electric energy, and chip subsequently becomes and is stimulated, and the communication function of execution and reader。
Selling at exorbitant prices relative to the technology such as bar code, RFID tag and arrangement for reading, although industry generally promise well to RFID technique, but really the actual system put into operation is few。Wherein the cost of label is that can the application of limit RFI D technology business obtain successful key。Although the cost that substantial amounts of research work makes chip RFID tag decreases, but common chip RFID tag is mainly made up of several parts such as IC chip, antenna and encapsulation, due to the existence of chip, its cost still cannot be competed with the bar shaped code-phase in automatic identification field。
Chipless RFID label refers to the RFID tag not containing silicon, both there is no integrated circuit also without separate electronic element, such as transistor, the main potential advantages of most promising chipless RFID label are in that it finally can be printed directly in product and packaging with the cost of 0.1 cent, replace annual 10000000000000 bar codes making consumption with more flexible reliable characteristic, open, with the chipless RFID radio-frequency (RF) tag that low cost is feature, another frontier that radio-frequency (RF) tag realizes。
Common chip RFID tag, is that specular scattering signal is modulated by the load impedance of data flow con-trol label antenna by chip-stored。Chipless RFID label does not have chip, but to complete data yet and preserve function and the label information of preservation is reflected back reader。This is accomplished by label construction carries out relating to of uniqueness, and each label structurally has small difference so that the back-scattered signal of label has the uniqueness of oneself, and can be obtained, identifies and be digitized into unique ID by reader。It is similarly to radar operation principle, the difference is that, it is intended that the back-scattered signal of label has certain rule, it is simple to digitized after reader demodulation。
The feature of chipless radio-frequency (RF) tag be ultra-thin, low cost, storage data volume are few。Jalaly proposes a kind of chipless RFID label, and it contains n the printed dipole antenna battle array with different element spacing, utilizes multiple frequency ranges of industry, science, medical treatment, creates the practical bar code of a 11bit。Utilize same principle McVay to propose a 5bitHilbert-Peano curve RFID tag covering 300MHz frequency band, fill due to the space of fractal curve and make its structure compacter。
Summary of the invention
It is an object of the invention to provide a kind of method adopting vacuum vapour deposition or hot and cold thermoprint method to draw line pattern on the base material that chipless RFID radio-frequency (RF) tag is used as resonant antenna, microstrip antenna etc.。
Chipless RFID label does not have chip, but to complete data yet and preserve function and the label information of preservation is reflected back reader。This design being accomplished by label construction carries out uniqueness, each label structurally has small difference so that the back-scattered signal of label has the uniqueness of oneself, and can be obtained, identifies and be digitized into unique ID by reader。
The chipless RFID label occurred at present is about based on two kinds of methods for designing:
1, label is made up of microstrip antenna, and the characteristic arranging each antenna port is different, or the load in port loaded microstrip structure so that amplitude or the phase place of antenna back-scattered signal change according to the difference of port identity。
2, label is designed to a RF transmit-receive circuit simplified, and is made up of a reception antenna, resonance circuit and a transmitting antenna。The reception antenna of label accepts the calling-on signal that reader is launched, and creates frequency spectrum, then through transmitting antenna, spectrum signal is reflected back reader after resonance circuit。Different resonance circuits creates different frequency spectrums, then be the unique ID of this label。
The processing technology of the present invention is as follows:
1. vacuum vapour deposition: design the antenna structure of chipless RFID radio-frequency (RF) tag first as requested, then with PVC, PP, PET, paper, plastics etc. are base material, primer is printed on substrate surface by the method utilizing printing, fully dried, conducting metal is deposited with on substrate surface by the method utilizing vacuum evaporation, and adopt gravure technique to protect ink according to the shape printing of designed antenna at layer on surface of metal, then the metal washing away the remainder beyond antenna pattern is dissolved with solvent, the metallic circuit with antenna pattern is retained, finally carry out overlay film encapsulation, obtain chipless RFID radio-frequency (RF) tag。
The conductive metal material of described vacuum evaporation metal can adopt aluminum or copper, wherein the fusing point of copper 1083 DEG C, boiling point 2595 DEG C；The fusing point of aluminum 660.4 DEG C, boiling point 2467 DEG C；The electrical conductivity of copper is higher than aluminum, and copper relatively aluminum cost increases little。
Described vacuum evaporation metal is under vacuum conditions, and METAL HEATING PROCESS melts to evaporation, and metallic atom condenses in polymer surface, forms very thin metal level。Vacuum evaporation metal requires that substrate surface is smooth, smooth, thickness is uniform；Deflection and coefficient of friction are suitable；Surface tension is more than 38dyn/cm；Good in thermal property, stands the heat radiation of evaporation source and the effect of condensation heat；Substrate moisture amount is lower than 0.1%。Plated metal material can be gold, silver, copper, zinc, chromium, aluminum etc., and wherein maximum are aluminum。
Described vacuum evaporation, its principle is as follows:
What the base material to be plated of drum was contained in vacuum evaporation plating machine unreels on station, base material is wound on rolling station through chill roll (evaporation roller), with vacuum pump evacuation, making the vacuum in deposited chamber reach 4 × more than 10-4mba, heating evaporation boat makes highly purified aluminium wire melt at the temperature of 1300-1400 DEG C and flash to gaseous aluminum。Start reel system, after the base material speed of service reaches certain numerical value, open baffle plate and make gaseous aluminum microgranule deposit at the substrate surface of movement, cool down the i.e. formation one layer metallic aluminum of light continuously。Control the thickness of aluminium coated by controlling the vacuum etc. in the evaporation rate of metallic aluminium, the translational speed of base material and deposited chamber, general aluminum layer thickness is at 250-
Utilize the chipless RFID radio-frequency (RF) tag that the method for vacuum evaporation prepares, have the advantage that
(1) compare the consumption greatly reducing metal with metal forming, save the energy and material, reduce cost。Metal foil thickness mostly is 7-9 μm, and vacuum vapour deposition gained metal layer thickness is about(0.04 μm) left and right, its consumption amount of metal is about the 1/200 of metal forming, and speed of production may be up to 700m/min。
(2) there is excellent folding resistance and good toughness, pin hole and breach seldom occur, without flexure crack performance。Antenna as chipless RFID radio-frequency (RF) tag has good electric conductivity。
(3) shielding or eluting can being adopted to carry out part aluminize, to obtain the chipless RFID radio-frequency antenna of different pattern, operating procedure is simple。
2. hot stamping technique: on thermoprinting machine, motion due to machinery, electrification metal scalding native gold is combined with thermoprint base material, the thermoprint template made according to antenna pattern applies pressure to the electrochemical metal scalding native gold combined and thermoprint base material local and transmits heat, so on corresponding position, electrification metal scalding native gold and thermoprint base material firmly combine due to the adhesive effect of adhesive layer, then by not peeled off from thermoprint base material by the unnecessary electrochemical metal scalding native gold of thermoprint, chipless RFID radio-frequency (RF) tag is obtained。
3. cold-hot stamping technique: according to antenna pattern, solidifies binding agent needing the gold stamping extraordinary binding agent UV of position printing, it would however also be possible to employ high molecular polymer latex prints。UV solidifies binding agent by UV drying device by the moisture removal in binding agent to a certain extent, and forms one layer of full-bodied thin pressure-sensitive adhesive layer, then starts cold-hot stamping, under the effect of pair of metal cylinder, makes metal forming be integrated with binding agent contact pressing。Owing to binding agent is very big with cohesive force between metal forming, so during waste discharge, substrate surface is stayed at the position that metal forming contacts with binding agent, it is integrally forming with base material, other parts of metal forming then with the tradition the same waste discharge of thermoprint, thus completing cold-hot stamping process, obtain chipless RFID radio-frequency (RF) tag。
Described electrochemical metal scalding native gold is point four layers (cold-hot stamping is divided into three layers): base membrane layer biaxial tension mylar (BOPET) or bidirectional stretching polypropylene film (BOPP) etc., base membrane layer can be selected to have intensity is big, stretch-proof, the performance such as high temperature resistant；Abscission layer adopts the coating such as organic siliconresin, emulsifing wax to form, and mainly helps material well to shift, should have and depart from performance preferably, otherwise can affect the quality of thermoprint product；The metal material of metal level can adopt through the aluminium foil of special handling, Copper Foil or the alloy of the two；Adhesive layer generally with meltable thermoplastic resin by coating machine drying on the metal layer adhesive layer, Main Function is to be bonded in thermoprint material, on boiling hot object, not contained adhesive layer in the electrochemical metal scalding printed material material used by cold-hot stamping。
Described thermoprinting machine is the one in Rotary type thermoprinting machine (Germany this take<steuer>), circle pressing type thermoprinting machine (Heidelberg 730 etc.) or concora crush flat pattern thermoprinting machine (sub-China 920, Ji Si 870, manually), wherein general with concora crush flat pattern thermoprinting machine, and the enforcement of Rotary type thermoprinting machine is line pressure, gross pressure is little, large area thermoprint on the spot can be easily accomplished by relatively small pressure, operate steadily, production efficiency is higher, is suitable for high-volume living-article thermoprint。
Detailed description of the invention
The present invention is described in detail for example below:
Embodiment 1
Associated microstrip radiating element concept is proposed in nineteen fifty-three by Deschamps at first。Patent is delivered by France Cutton and Baissinot in nineteen fifty-five。First practical antenna has Howell and Munson to develop, from that time, microstrip antenna and array are conducted extensive research and develop, it is intended to play its huge advantage, as lightweight, volume is little, cost is low, conformal structure and the compatibility feature etc. with integrated circuit, this causes that various application is given birth to, and result in this broad field of microwave antenna, and microstrip antenna problem is set up as an independent entity。
The present embodiment designs the chipless RFID radio-frequency (RF) tag of a kind of microstrip antenna, it is formed an aerial array by three microstrip elements, three microband antenna units have different resonant frequencies, and resonant frequency is closed on, all within the scope of 2.1GHz-2.5GHz, choose the suitable length of side according to the design theory of microstrip antenna and operating frequency。
Its processing technology is as follows:
With PVC for base material; primer is printed on PVC surface by the method utilizing printing; fully dried; conducting metal is deposited with on substrate surface by the method utilizing vacuum evaporation; and adopt gravure technique to protect ink according to the shape printing of designed microstrip antenna at layer on surface of metal, and the metal washing away the remainder beyond antenna pattern is then dissolved with solvent, the metallic circuit with antenna pattern is retained; finally carry out overlay film encapsulation, obtain chipless RFID radio-frequency (RF) tag。
The conductive metal material of above-mentioned vacuum evaporation metal is aluminum, the fusing point of aluminum 660.4 DEG C, boiling point 2467 DEG C。
Above-mentioned vacuum evaporation, its principle is as follows:
What the base material to be plated of drum was contained in vacuum evaporation plating machine unreels on station, is wound on rolling station by base material through chill roll (evaporation roller), with vacuum pump evacuation, makes the vacuum in deposited chamber reach 4 × 10-4More than Mpa, heating evaporation boat makes highly purified aluminium wire melt at the temperature of 1300-1400 DEG C and flash to gaseous aluminum。Start reel system, after the base material speed of service reaches certain numerical value, open baffle plate and make gaseous aluminum microgranule deposit at the substrate surface of movement, cool down the i.e. formation one layer metallic aluminum of light continuously。Control the thickness of aluminium coated by controlling the vacuum etc. in the evaporation rate of metallic aluminium, the translational speed of base material and deposited chamber, general aluminum layer thickness is at 250-
Embodiment 2
In order to reduce label cost and expand the label scope of application, chipless RFID radio-frequency (RF) tag can be simplified to the structure of only two antennas, the disk monopole antenna of one level plan is connected to the dipole antenna of a vertical polarization, the two antenna polarization direction is orthogonal, and receiving and transmitting signal has been isolated in same polarity diversity。FredericCroq et al. have devised a kind of signals layer and is made up of the parallel dipole resonator of multiple different lengths, the microstrip antenna of aperture-coupled, and it can realize three resonant frequencies within the scope of 4.5GHz-7.5GHz；FatonTefiku et al. devises a kind of double frequency dipole antenna, and a pair long dipole works in 0.9GHz, and a pair short dipole works in 1.5GHz。
The present embodiment designs the chipless RFID radio-frequency (RF) tag of a kind of dipole antenna, and its processing technology is as follows:
With plastics for base material, according to antenna pattern, solidify binding agent needing the gold stamping extraordinary binding agent UV of position printing。UV solidifies binding agent by UV drying device by the moisture removal in binding agent to a certain extent, and forms one layer of full-bodied thin pressure-sensitive adhesive layer, then starts cold-hot stamping, under the effect of pair of metal cylinder, makes metal forming be integrated with binding agent contact pressing。Owing to binding agent is very big with cohesive force between metal forming, so during waste discharge, substrate surface is stayed at the position that metal forming contacts with binding agent, it is integrally forming with base material, other parts of metal forming then with the tradition the same waste discharge of thermoprint, thus completing cold-hot stamping process, obtain chipless RFID radio-frequency (RF) tag。
The conductive metal material of above-mentioned vacuum evaporation metal adopts copper, the fusing point of copper 1083 DEG C, boiling point 2595 DEG C。
Above-mentioned electrochemical metal scalding native gold adopts the gold stamping paper tinsel of anodized aluminium copper alloy, and wherein base membrane layer selects bidirectional stretching polypropylene film (BOPP)；Abscission layer adopts cellulose acetate coating to form；The metal material of metal level adopts through the aluminum of special handling, copper alloy；Electrochemical metal scalding printed material material used by cold-hot stamping does not contain adhesive layer。
Above-mentioned thermoprinting machine is Rotary type thermoprinting machine。
Claims (3)
1. the processing technology of a chipless RFID radio-frequency (RF) tag, it is characterised in that specifically comprise the following steps that
First the antenna structure of chipless RFID radio-frequency (RF) tag is designed as requested, then with PVC, PP, PET, paper, plastics for base material, utilize vacuum vapour deposition to transfer on substrate surface by conducting metal, finally carry out overlay film encapsulation, obtain chipless RFID radio-frequency (RF) tag；
The technique of described vacuum vapour deposition is as follows:
Design the antenna structure of chipless RFID radio-frequency (RF) tag as requested, then with PVC, PP, PET, paper, plastics are base material, primer is printed on substrate surface by the method utilizing printing, fully dried, conducting metal is deposited with on substrate surface by the method utilizing vacuum evaporation, and adopt gravure technique to protect ink according to the shape printing of designed antenna at layer on surface of metal, then the metal washing away the remainder beyond antenna pattern is dissolved with solvent, the metallic circuit with antenna pattern is retained, finally carry out overlay film encapsulation, obtain chipless RFID radio-frequency (RF) tag；
Vacuum evaporation,
What the base material to be plated of drum was contained in vacuum evaporation plating machine unreels on station, is wound on rolling station by base material through chill roll or evaporation roller, with vacuum pump evacuation, makes the vacuum in deposited chamber reach 4 × 10-4More than ba, heating evaporation makes highly purified aluminium wire melt at the temperature of 1300-1400 DEG C and flash to gaseous aluminum；Start reel system, after the base material speed of service reaches certain numerical value, open baffle plate and make gaseous aluminum microgranule deposit at the substrate surface of movement, cool down and both formed that one layer continuous and the metallic aluminum of light；By controlling the evaporation rate of metallic aluminium, the vacuum etc. in the translational speed of base material and deposited chamber controls the thickness of aluminium coated, and general aluminum layer thickness exists
2. the processing technology of chipless RFID radio-frequency (RF) tag according to claim 1, it is characterised in that the conductive metallic material of vacuum evaporation metal adopts aluminum or copper, wherein the fusing point of copper 1083 DEG C, boiling point 2595 DEG C；The fusing point of aluminum 660.4 DEG C, boiling point 2467 DEG C；The electrical conductivity of copper is higher than aluminum。
3. the processing technology of chipless RFID radio-frequency (RF) tag according to claim 1, it is characterised in that vacuum evaporation metal is under vacuum conditions, and METAL HEATING PROCESS melts to evaporation, and metallic atom condenses in substrate surface, forms very thin metal level；Vacuum evaporation metal requires that substrate surface tension is more than 38dyn/cm；Good in thermal property, stands the heat radiation of evaporation source and the effect of condensation；Substrate moisture amount is lower than 0.1%。
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