CN103065180A - Manufacturing technology of chipless radio frequency identification (RFID) radio frequency tag - Google Patents
Manufacturing technology of chipless radio frequency identification (RFID) radio frequency tag Download PDFInfo
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Abstract
The invention discloses a manufacturing technology of a chipless radio frequency identification (RFID) radio frequency tag. According to the invention, a vacuum evaporation method or a cold and hot stamping process is used to manufacture the chipless RFID radio frequency tag. A technology process comprises the following steps: according to a requirement, designing an antenna structure of the chipless RFID radio frequency tag; then taking PVC, PP, PET, paper, a plastic and the like as a base material; using the vacuum evaporation method or the cold and hot stamping process to transfer a conductive metal to a surface of the base material; finally carrying out film coating and packaging so as to obtain the chipless RFID radio frequency tag. The chipless RFID radio frequency tag manufactured by using the above process possesses excellent folding resistance and good toughness. And the tag possesses the following advantages that manufacturing cost is low; an operation technology is simple and easy to operate and so on. A wide application prospect is possessed.
Description
Technical field
The present invention relates to a kind of manufacture craft of chipless RFID radio-frequency (RF) tag, relate in particular to the process of utilizing vacuum vapour deposition or hot and cold thermoprint legal system to make the chipless RFID radio-frequency label antenna.
Background technology
REID (RFID, Radio Frequency Identification) is an automatic identification technology that utilizes radiofrequency signal to carry out bidirectional transfer of information by Space Coupling.It is a kind of non-contact automatic identification technology, can automatically identify destination object by radiofrequency signal and obtain related data, identification work does not need manual intervention, have antimagnetic, waterproof, high temperature resistant, the advantage such as the storage data capacity is large, can be widely used in that such as no-stop charging system, train transport monitor system, managing physical distribution of merchandise, streamline manufacturing automation, gate inhibition's safety management, livestock management etc. will be collected and the application of deal with data.
The RFID technology is roughly classified according to using " active " label or " passive " label.Active label has the local energy (for example battery), so that active label is transmitted the signal that will read by interrogator.Active label has long range of signal, and on the contrary, " passive " label does not have internal power source, and instead, passive label has reader to obtain the energy, and when receiving signal from reader, passive label is launched or forwarding information again.
Usually, the two class labels electronic circuit that all has integrated circuit or silicon form.Circuitry stores also transmits recognition data to reader.Except chip, label comprises the antenna of some forms that are connected with chip.Active label merges from the label self energy and the antenna reader communication, and for passive label, antenna is converted into the converter of electric energy as the radio-frequency (RF) energy that will derive from reader, and then chip becomes and be stimulated, and the communication function of execution and reader.
With respect to technology such as bar codes, the selling at exorbitant prices of RFID label and arrangement for reading, although industry generally to the promise well of RFID technology, the real actual system that puts into operation is few.Wherein the cost of label is the key that can the commercial application of limit RFI D technology achieve success.Although a large amount of research work decreases the cost of chip RFID label, but common chip RFID label mainly is made of several parts such as IC chip, antenna and encapsulation, because the existence of chip, its cost still can't be competed mutually with the bar code in the automatic identification field.
The chipless RFID label refers to the RFID tag that does not contain silicon, both there be not integrated circuit not have separating electronic components yet, transistor for example, the main potential advantages of the promising chipless RFID label of tool are that it finally can be printed directly on 0.1 cent cost on product and the packing, replace the bar code of annual 10000000000000 use amounts with the characteristic of flexibility and reliability more, the chipless RFID radio-frequency (RF) tag take low cost as feature has been opened up another frontier that radio-frequency (RF) tag realizes.
Common chip RFID label is that the loaded impedance of the data flow con-trol label antenna by chip-stored comes the specular scattering signal is modulated.The chipless RFID label does not have chip, but will finish the data hold function yet and the label information of preserving is reflected back reader.This just need to carry out unique relating to label construction, and each label structurally has small difference, so that the back-scattered signal of label has the uniqueness of oneself, and can be obtained, identify and be digitized into unique ID by reader.This is similar to the radar principle of work, and different is, we wish that the back-scattered signal of label has certain rule, is convenient to digitizing after the reader demodulation.
The characteristics of chipless radio-frequency (RF) tag be ultra-thin, low-cost, the stored data amount is few.Jalaly proposes a kind of chipless RFID label, and it has comprised n and has had the printed dipole antenna battle array of different element spacings, utilizes a plurality of frequency ranges of industry, science, medical treatment, has created the practical bar code of a 11bit.Utilize same principle McVay to propose a 5bit Hilbert-Peano curve RFID label that covers the 300MHz frequency band, because the space-filling of fractal curve makes its structure compacter.
Summary of the invention
The object of the present invention is to provide a kind of method that adopts vacuum vapour deposition or hot and cold thermoprint method drafting line pattern in the chipless RFID radio-frequency (RF) tag as the base material of resonant antenna, microstrip antenna etc.
The chipless RFID label does not have chip, but will finish the data hold function yet and the label information of preserving is reflected back reader.This just need to carry out unique design to label construction, and each label structurally has small difference, so that the back-scattered signal of label has the uniqueness of oneself, and can be obtained, identify and be digitized into unique ID by reader.
The chipless RFID label that occurs at present roughly is based on two kinds of methods for designing:
1, label is made of microstrip antenna, and the characteristic that each antenna port is set is different, perhaps in the load of port loaded microstrip structure, so that the amplitude of antenna back-scattered signal or phase place change according to the difference of port identity.
2, label design becomes the RF transmit-receive circuit of a simplification, is comprised of a receiving antenna, resonant circuit and an emitting antenna.The receiving antenna of label is accepted the interrogation signal of reader emission, has created frequency spectrum behind resonant circuit, through emitting antenna spectrum signal is reflected back reader again.Different resonant circuits creates different frequency spectrums, then is the unique ID of this label.
Manufacture craft of the present invention is as follows:
1. vacuum vapour deposition: the antenna structure that designs at first as requested the chipless RFID radio-frequency (RF) tag; then with PVC; PP; PET; paper; plastics etc. are base material; utilize the method for printing that primer is printed on substrate surface; fully after the drying; the method of utilizing vacuum evaporation with the conducting metal evaporation on substrate surface; and at the shape printing protection printing ink of layer on surface of metal employing gravure technique according to designed antenna; then use the metal of dissolution with solvents flush away antenna pattern remainder in addition; metallic circuit with antenna pattern is retained; carry out at last the overlay film encapsulation, obtain the chipless RFID radio-frequency (RF) tag.
The metallic conduction material of described vacuum evaporation metal can adopt aluminium or copper, wherein 1083 ℃ of the fusing points of copper, 2595 ℃ of boiling points; 660.4 ℃ of the fusing points of aluminium, 2467 ℃ of boiling points; The conductivity of copper is higher than aluminium, and copper increases little than the aluminium cost.
Described vacuum evaporation metal is under vacuum state, and METAL HEATING PROCESS is melted to evaporation, and metallic atom condenses in polymer surface, forms metal level as thin as a wafer.The vacuum evaporation metal requires smooth, smooth, the even thickness of substrate surface; Deflection and friction factor are suitable; Surface tension is greater than 38dyn/cm; Good in thermal property is stood the heat radiation of evaporation source and the effect of heat of condensation; The base material water cut is lower than 0.1%.Can be gold, silver, copper, zinc, chromium, aluminium etc. by metallization, wherein the maximum of usefulness be aluminium.
Described vacuum evaporation, its principle is as follows:
The base material to be plated of drum is contained in unreeling on the station of vacuum evaporation plating machine, base material is passed chill roll (evaporation roller) to be wound on the rolling station, vacuumize with vacuum pump, vacuum tightness in the deposited chamber is reached more than 4 * 10-4mba, and the heating evaporation boat melts highly purified aluminium wire and flashes to gaseous aluminum under 1300-1400 ℃ temperature.Start reel system, after the base material travelling speed reaches certain numerical value, open baffle plate and make the gaseous aluminum particulate namely form one deck continuously and the metal aluminium lamination of light in mobile substrate surface deposition, cooling.Velocity of evaporation, the translational speed of base material and the vacuum tightness in the deposited chamber etc. by the control metallic aluminium are controlled the thickness of aluminium coated, and general aluminum layer thickness is at 250-
The chipless RFID radio-frequency (RF) tag of utilizing the method for vacuum evaporation to prepare has the following advantages:
(1) compares the consumption that has greatly reduced metal with metal forming, saved the energy and material, reduced cost.Metal foil thickness mostly is 7-9 μ m, and vacuum vapour deposition gained metal layer thickness is about
About (0.04 μ m), its consumption amount of metal is about 1/200 of metal forming, and speed of production can be up to 700m/min.
(2) have good folding resistance and good toughness, pin hole and breach seldom occur, without the flexure crack performance.Antenna as the chipless RFID radio-frequency (RF) tag has good electric conductivity.
(3) can adopt shielding or wash-out to carry out part and aluminize, to obtain the chipless RFID radio-frequency antenna of different pattern, operating procedure is simple.
2. hot stamping technique: on thermoprinting machine, because the motion of machinery, electrification metal scalding goldleaf and thermoprint base material are combined, the thermoprint template of making according to antenna pattern is to the electrochemical metal scalding goldleaf that combines and exert pressure in thermoprint base material part and transferring heat, electrochemical metal scalding goldleaf and thermoprint base material firmly combine owing to the adhesive effect of adhesive layer on corresponding position like this, then will do not peeled off from the thermoprint base material by the unnecessary electrochemical metal scalding goldleaf of thermoprint, namely get the chipless RFID radio-frequency (RF) tag.
3. cold-hot stamping technique: according to antenna pattern, print extraordinary bonding agent at the gold stamping position of needs---UV cure adhesive also can adopt the high molecular polymer latex to print.The UV cure adhesive arrives the moisture removal in the bonding agent to a certain degree by the UV drying device, and forms the full-bodied thin pressure-sensitive adhesive layer of one deck, then begins cold-hot stamping, under the effect of pair of metal cylinder, metal forming is integrated with bonding agent contact and pressing.Because bonding agent is very large with cohesive force between the metal forming, so during waste discharge, substrate surface is stayed at the position that metal forming contacts with bonding agent, become one with base material, other parts of metal forming are then with the same waste discharge of traditional thermoprint, thereby finish the cold-hot stamping process, obtain the chipless RFID radio-frequency (RF) tag.
Described electrochemical metal scalding goldleaf is minute four layers (cold-hot stamping is divided into three layers): base membrane layer can select that two-way stretch mylar (BOPET) or bidirectional stretching polypropylene film (BOPP) etc., base membrane layer should have that intensity is large, stretch-proof, the performance such as high temperature resistant; Abscission layer adopts the coatings such as organic siliconresin, emulsifying wax to form, and mainly is that the help material well shifts, and should have to break away from preferably performance, otherwise can affect the quality of thermoprint product; The metal material of metal level can adopt aluminium foil, Copper Foil or the alloy of the two through special processing; Adhesive layer general with meltable thermoplastic resin by coating machine on metal level drying adhesive layer, Main Function be with the thermoprint material binding on by boiling hot object, do not contain adhesive layer in the used electrochemical metal scalding printed material material of cold-hot stamping.
Described thermoprinting machine is pressed a kind of in round thermoprinting machine (this takes Germany＜steuer 〉), circle pressing type thermoprinting machine (Heidelberg 730 etc.) or the concora crush flat pattern thermoprinting machine (inferior China 920, Ji Si 870, manually) for circle, wherein general with concora crush flat pattern thermoprinting machine, and the round thermoprinting machine enforcement of circle pressure is linear pressure, general pressure is little, pressure that can less is easily finished large tracts of land thermoprint on the spot, operate steadily, production efficiency is higher, is fit to living-article thermoprint in enormous quantities.
Embodiment
The present invention is described in detail for following embodiment:
Embodiment 1
The associated microstrip radiating element concept is proposed in nineteen fifty-three by Deschamps at first.Deliver patent in nineteen fifty-five by French Cutton and Baissinot.First practical antenna has Howell and Munson development, from that time, microstrip antenna and array are conducted extensive research and develop, be intended to bring into play its huge advantage, as lightweight, volume is little, cost is low, conformal structure and with compatibility feature of integrated circuit etc., this causes various application and gives birth to, and has caused this broad field of microwave antenna, and the microstrip antenna problem is as an entity and setting up independently.
Present embodiment designs a kind of chipless RFID radio-frequency (RF) tag of microstrip antenna, it forms an aerial array by three microstrip elements, three microband antenna units have different resonance frequencies, and resonance frequency is closed on, all in the 2.1GHz-2.5GHz scope, choose the suitable length of side according to design theory and the frequency of operation of microstrip antenna.
Its manufacture craft is as follows:
Take PVC as base material; utilize the method for printing that primer is printed on the PVC surface; fully after the drying; the method of utilizing vacuum evaporation with the conducting metal evaporation on substrate surface; and at the shape printing protection printing ink of layer on surface of metal employing gravure technique according to designed microstrip antenna, then use the metal of dissolution with solvents flush away antenna pattern remainder in addition, the metallic circuit with antenna pattern is retained; carry out at last the overlay film encapsulation, obtain the chipless RFID radio-frequency (RF) tag.
The metallic conduction material of above-mentioned vacuum evaporation metal is aluminium, 660.4 ℃ of the fusing points of aluminium, 2467 ℃ of boiling points.
Above-mentioned vacuum evaporation, its principle is as follows:
The base material to be plated of drum is contained in unreeling on the station of vacuum evaporation plating machine, base material is passed chill roll (evaporation roller) be wound on the rolling station, vacuumize with vacuum pump, make the vacuum tightness in the deposited chamber reach 4 * 10
-4More than the Mpa, the heating evaporation boat melts highly purified aluminium wire and flashes to gaseous aluminum under 1300-1400 ℃ temperature.Start reel system, after the base material travelling speed reaches certain numerical value, open baffle plate and make the gaseous aluminum particulate namely form one deck continuously and the metal aluminium lamination of light in mobile substrate surface deposition, cooling.Velocity of evaporation, the translational speed of base material and the vacuum tightness in the deposited chamber etc. by the control metallic aluminium are controlled the thickness of aluminium coated, and general aluminum layer thickness is at 250-
Embodiment 2
In order to reduce the label cost and to enlarge the label scope of application, the chipless RFID radio-frequency (RF) tag can be simplified to the structure of only having two antennas, the disk monopole antenna of a level plan is connected to the dipole antenna of a vertical polarization, these two antenna polarization direction quadratures, receiving and transmitting signal has been isolated in same polarity diversity.The people such as Frederic Croq have designed a kind of signals layer and have been comprised of the parallel dipole resonator of a plurality of different lengths, the microstrip antenna of aperture-coupled, and it can realize three resonance frequencies in the 4.5GHz-7.5GHz scope; The people such as Faton Tefiku have designed a kind of double frequency dipole antenna, and long a pair of dipole works in 0.9GHz, and short a pair of dipole works in 1.5GHz.
Present embodiment designs a kind of chipless RFID radio-frequency (RF) tag of dipole antenna, and its manufacture craft is as follows:
Take plastics as base material, according to antenna pattern, print extraordinary bonding agent at the gold stamping position of needs---the UV cure adhesive.The UV cure adhesive arrives the moisture removal in the bonding agent to a certain degree by the UV drying device, and forms the full-bodied thin pressure-sensitive adhesive layer of one deck, then begins cold-hot stamping, under the effect of pair of metal cylinder, metal forming is integrated with bonding agent contact and pressing.Because bonding agent is very large with cohesive force between the metal forming, so during waste discharge, substrate surface is stayed at the position that metal forming contacts with bonding agent, become one with base material, other parts of metal forming are then with the same waste discharge of traditional thermoprint, thereby finish the cold-hot stamping process, obtain the chipless RFID radio-frequency (RF) tag.
The metallic conduction material of above-mentioned vacuum evaporation metal adopts copper, 1083 ℃ of the fusing points of copper, 2595 ℃ of boiling points.
Above-mentioned electrochemical metal scalding goldleaf adopts the gold stamping paper tinsel of anodized aluminium aldary, and wherein base membrane layer is selected bidirectional stretching polypropylene film (BOPP); Abscission layer adopts the cellulose acetate coating to form; The metal material of metal level adopts aluminium, the aldary through special processing; Do not contain adhesive layer in the used electrochemical metal scalding printed material material of cold-hot stamping.
Above-mentioned thermoprinting machine is pressed round thermoprinting machine for circle.
Claims (9)
1. the manufacture craft of a chipless RFID radio-frequency (RF) tag, its concrete steps are as follows:
Design at first as requested the antenna structure of chipless RFID radio-frequency (RF) tag, then take PVC, PP, PET, paper, plastics etc. as base material, utilize vacuum vapour deposition or hot and cold thermoprint method that conducting metal is transferred on the substrate surface, carry out at last the overlay film encapsulation, obtain the chipless RFID radio-frequency (RF) tag.
2. the technique of vacuum vapour deposition according to claim 1 is as follows:
Design as requested the antenna structure of chipless RFID radio-frequency (RF) tag; then with PVC; PP; PET; paper; plastics etc. are base material; utilize the method for printing that primer is printed on substrate surface; fully after the drying; the method of utilizing vacuum evaporation with the conducting metal evaporation on substrate surface; and at the shape printing protection printing ink of layer on surface of metal employing gravure technique according to designed antenna; then use the metal of dissolution with solvents flush away antenna pattern remainder in addition; metallic circuit with antenna pattern is retained; carry out at last the overlay film encapsulation, obtain the chipless RFID radio-frequency (RF) tag.
3. the metallic conduction material of vacuum evaporation metal according to claim 2 can adopt aluminium or copper, wherein 1083 ℃ of the fusing points of copper, 2595 ℃ of boiling points; 660.4 ℃ of the fusing points of aluminium, 2467 ℃ of boiling points; The conductivity of copper is higher than aluminium, and copper increases little than the aluminium cost.
4. vacuum evaporation metal according to claim 2 is under vacuum state, and METAL HEATING PROCESS is melted to evaporation, and metallic atom condenses in polymer surface, forms metal level as thin as a wafer; The vacuum evaporation metal requires smooth, smooth, the even thickness of substrate surface; Deflection and friction factor are suitable; Surface tension is greater than 38dyn/cm; Good in thermal property is stood the heat radiation of evaporation source and the effect of heat of condensation; The base material water cut is lower than 0.1%.
5. vacuum evaporation according to claim 2, its principle is as follows:
The base material to be plated of drum is contained in unreeling on the station of vacuum evaporation plating machine, base material is passed chill roll (evaporation roller) to be wound on the rolling station, vacuumize with vacuum pump, vacuum tightness in the deposited chamber is reached more than 4 * 10-4mba, and the heating evaporation boat melts highly purified aluminium wire and flashes to gaseous aluminum under 1300-1400 ℃ temperature; Start reel system, after the base material travelling speed reaches certain numerical value, open baffle plate and make the gaseous aluminum particulate namely form one deck continuously and the metal aluminium lamination of light in mobile substrate surface deposition, cooling; Velocity of evaporation, the translational speed of base material and the vacuum tightness in the deposited chamber etc. by the control metallic aluminium are controlled the thickness of aluminium coated, and general aluminum layer thickness is at 250-
6. hot stamping technique according to claim 1 is as follows:
On thermoprinting machine, because the motion of machinery, electrification metal scalding goldleaf and thermoprint base material are combined, the thermoprint template of making according to antenna pattern is to the electrochemical metal scalding goldleaf that combines and exert pressure in thermoprint base material part and transferring heat, electrochemical metal scalding goldleaf and thermoprint base material firmly combine owing to the adhesive effect of adhesive layer on corresponding position like this, then will do not peeled off from the thermoprint base material by the unnecessary electrochemical metal scalding goldleaf of thermoprint, namely get the chipless RFID radio-frequency (RF) tag.
7. cold-hot stamping technique according to claim 1 is as follows:
According to antenna pattern, print extraordinary bonding agent at the gold stamping position of needs---the UV cure adhesive, also can adopt the high molecular polymer latex to print.The UV cure adhesive arrives the moisture removal in the bonding agent to a certain degree by the UV drying device, and forms the full-bodied thin pressure-sensitive adhesive layer of one deck, then begins cold-hot stamping, under the effect of pair of metal cylinder, metal forming is integrated with bonding agent contact and pressing.Because bonding agent is very large with cohesive force between the metal forming, so during waste discharge, substrate surface is stayed at the position that metal forming contacts with bonding agent, become one with base material, other parts of metal forming are then with the same waste discharge of traditional thermoprint, thereby finish the cold-hot stamping process, obtain the chipless RFID radio-frequency (RF) tag.
8. according to claim 5,6 described electrochemical metal scalding goldleaf are minute four layers (cold-hot stamping is divided into three layers): base membrane layer can select that two-way stretch mylar (BOPET) or bidirectional stretching polypropylene film (BOPP) etc., base membrane layer should have that intensity is large, stretch-proof, the performance such as high temperature resistant; Abscission layer adopts the coatings such as organic siliconresin, emulsifying wax to form, and mainly is that the help material well shifts, and should have to break away from preferably performance, otherwise can affect the quality of thermoprint product; The metal material of metal level can adopt aluminium foil, Copper Foil or the alloy of the two through special processing; Adhesive layer general with meltable thermoplastic resin by coating machine on metal level drying adhesive layer, Main Function be with the thermoprint material binding on by boiling hot object, do not contain adhesive layer in the used electrochemical metal scalding printed material material of cold-hot stamping.
9. according to claim 5,6 described thermoprinting machines are pressed a kind of in round thermoprinting machine (this takes Germany＜steuer 〉), circle pressing type thermoprinting machine (Heidelberg 730 etc.) or the concora crush flat pattern thermoprinting machine (inferior China 920, Ji Si 870, manually) for circle, wherein general with concora crush flat pattern thermoprinting machine, and the round thermoprinting machine enforcement of circle pressure is linear pressure, general pressure is little, pressure that can less is easily finished large tracts of land thermoprint on the spot, operate steadily, production efficiency is higher, is fit to living-article thermoprint in enormous quantities.
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