CN103050473A - 具有可再造底部填充物的晶圆级芯片尺寸封装件 - Google Patents

具有可再造底部填充物的晶圆级芯片尺寸封装件 Download PDF

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CN103050473A
CN103050473A CN201210078641XA CN201210078641A CN103050473A CN 103050473 A CN103050473 A CN 103050473A CN 201210078641X A CN201210078641X A CN 201210078641XA CN 201210078641 A CN201210078641 A CN 201210078641A CN 103050473 A CN103050473 A CN 103050473A
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pcb
tube core
bottom filler
zone
central area
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CN103050473B (zh
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陈宪伟
王宗鼎
李建勋
蔡豪益
李明机
余振华
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

本发明公开了一种封装件，该封装件包括印刷电路板(PCB)以及通过焊球接合到PCB的管芯。可再造的底部填充物被分配在该PCB和该管芯之间的区域内中。本发明还提供了一种具有可再造底部填充物的晶圆级芯片尺寸封装件。

Description

具有可再造底部填充物的晶圆级芯片尺寸封装件
技术领域
本发明涉及半导体领域，更具体地，本发明涉及一种具有可再造底部填充物的晶圆级芯片尺寸封装件。
背景技术
在晶圆级芯片尺寸封装(WLCSP)结构的形成中，集成电路器件(如晶体管)首先形成在晶片上的半导体衬底的表面。然后，互连结构形成在集成电路器件上方。焊球固定到所述晶片的表面上。可以将该晶圆切割成管芯。
管芯可直接接合到印刷电路板(PCB)。通常，直接集合到PCB的管芯是小管芯。因此，施加到将管芯与各个PCB相接合的焊球的压力相对较小。近来，越来越多的大管芯需要与PCB相接合。因而产生在焊球上的应力越来越大，因此需要减少该应力的方法。然而，不能在WLCSP中使用底部填充物以保护焊球。原因是如果使用了底部填充物，那么管芯与PCB之间的接合是不可再造的，这样在管芯有缺陷的情况下该管芯不再能够从各个PCB中去除。因此，如果使用了底部填充物，那么一旦有缺陷管芯被接合就不能再用已知的优良管芯替换该有缺陷的管芯，从而整个PCB都不合格。
发明内容
为了解决现有技术中所存在的问题，根据本发明的一个方面，提供了一种封装件，包括：印刷电路板(PCB)；管芯，通过焊球接合到所述PCB；以及可再造的底部填充物，被分配在所述PCB和所述管芯之间的区域中。
在该封装件中，所述可再造的底部填充物具有范围在30,000和约300,000之间的分子量。
在该封装件中，所述PCB和所述管芯之间的区域包括：中心区域、角区域和边缘区域，所述角区域和所述边缘区域围绕所述中心区域，并且其中，所述底部填充物在所述角区域之一中，并且不在所述中心区域中。
在该封装件中，填充到两个相邻角区域中的所述底部填充物形成了两个相互分隔开的底部填充区域，并且没有底部填充物与所述两个填充区域互连。
在该封装件中，所述底部填充物进一步位于与所述两个填充区域相连接的所述边缘区域之一中。
在该封装件中，所述底部填充物与所述PCB和所述管芯中的其中一个物理接触，并且不与所述PCB和所述管芯中的另一个物理接触。
在该封装件中，所述底部填充物与所述PCB物理接触，并且不与所述管芯物理接触。
在该封装件中，所述底部填充物与所述管芯物理接触，并且不与所述PCB物理接触。
根据本发明的另一方面，提供了一种封装件，包括：印刷电路板(PCB)；管芯，其中，所述PCB与所述管芯之间的区域包括：与所述管芯的中心邻近的中心区域；与所述管芯的角邻近的角区域；与所述管芯的边缘邻近的边缘区域；其中，所述角区域和所述边缘区域围绕所述中心区域，并且其中，每个所述边缘区域均与两个所述角区域互连；焊球，将所述PCB接合到所述管芯，其中，所述中心区域、所述边缘区域和所述角区域中均包括至少一个所述焊球；以及底部填充物，被分配到所述角区域之一中，其中，所述底部填充物没有被分配到所述中心区域中。
在该封装件中，所述角区域之一中包括至少3×3个焊球，并且所述至少3×3个焊球与所述底部填充物相接触。
在该封装件中，所述PCB与所述管芯之间的区域包括四个角区域，其中，所述底部填充物被分配到所述四个角区域中，并且其中，至少一个所述边缘区域没有所述底部填充物。
在该封装件中，所述底部填充物被分配到四个角区域中和四个边缘区域中。
在该封装件中，从所述封装件的顶部向下观察，被分配到所述四个角区域中和所述四个边缘区域中的底部填充物形成了围绕所述中心区域的完整环状物。
在该封装件中，所述底部填充物与所述PCB和一些所述焊球物理接触，并且不与所述管芯物理接触。
根据本发明的又一方面，提供了一种封装件，包括：印刷电路板(PCB)；管芯，其中，所述PCB与所述管芯之间的区域包括：中心区域；角区域；边缘区域，其中，所述角区域和所述边缘区域围绕所述中心区域，每个所述边缘区域均与两个所述角区域互连；焊球，将所述PCB接合到所述管芯，其中，所述中心区域、所述边缘区域和所述角区域中均包括至少一个焊球；以及底部填充物，被分配在所述角区域内，以形成相互分隔开的不连续的底部填充区域，其中，所述底部填充物接触在所述角区域中的焊球，没有所述底部填充物填充在所述中心区域中，所述底部填充物与所述PCB相接触，并且不与所述管芯物理接触。
在该封装件中，从所述封装件的顶部向下观察，在所述中心区域中的所述焊球的部分被气隙环绕。
在该封装件中，至少一个所述边缘区域中的焊球不与所述底部填充物物理接触。
在该封装件中，从所述封装件的顶部向下观察，所述边缘区域中的焊球的部分被气隙围绕。
在该封装件中，在所述角区域之一中，所述底部填充物围绕至少三行乘以三列的焊球，并且与所述至少三行乘以三列的焊球相接触。
在该封装件中，所述底部填充物的高度为所述PCB和所述管芯的相隔距离的约25％到约75％之间，并且所述高度是在垂直于所述PCB的主表面的方向上测量出来的。
附图说明
为更完整的理解实施例及其优点，现将结合附图进行的以下描述作为参考，其中：
图1示出了将接合到印刷电路板(PCB)的管芯的一部分的横截面图；
图2A-图2B分别示出了根据实施例的晶圆级芯片尺寸封装(WLCSP)结构的横截面图和俯视图，其中，底部填充物被填入管芯和PCB之间的角区域，并且所述底部填充物接触管芯和PCB中的一个；
图3示出了根据可选实施例的WLCSP结构的横截面图，其中，底部填充物填入管芯和PCB之间的角区域，并且所述底部被填入物质与管芯和PCB两者都接触；
图4A和图4B分别示出了根据可选实施例的WLCSP结构的横截面图和俯视图，其中底部填充物被填入管芯和PCB之间的角区域和边缘区域，并且所述底部填充物接触管芯和PCB中的一个；
图5示出了根据可选实施例的WLCSP结构的横截面图，其中底部填充物被填入管芯和PCB之间的角区域和边缘区域，并且所述底部填充物与管芯和PCB两者都接触；以及
图6A和图6B分别示出了根据可选实施例的WLCSP结构的横截面图和俯视图，其中，易于去除的可再造底部填充物被填入管芯和PCB之间的角区域，边缘区域和中心区域。
具体实施例
下面详细讨论本发明各实施例的制造和使用。然而，应该理解，本发明提供了许多可以在各种具体环境中实现的可应用的概念。所讨论的具体实施例仅仅示出了制造和使用本发明的具体方式，而不用于限制本发明的范围。
根据实施例提出了一种晶圆级芯片尺寸封装(WLCSP)和形成该WLCSP的方法。在各种实施例中举例说明了制造的中间阶段。然后讨论了各实施例的变化。在各种附图和示例说明的实施例中，相同的参考数字用于表示相同的元件。
图1示出了根据实施例的示例性管芯100。可以了解，管芯具有的结构可不同于图1所示的管芯的结构。管芯100可包括衬底20，衬底20可以是半导体衬底，例如硅衬底，然而，该衬底20可以包含其他半导体材料，例如锗化硅、碳化硅、砷化镓或类似材料。诸如晶体管的有源器件(未示出)可形成在衬底20的表面。互连结构(未示出)形成在衬底上，该互连结构包括形成在其中的金属线和导通孔(未示出)，并且该金属线和导通孔电连接到半导体器件。
金属焊盘22形成在互连结构上方。金属焊盘22可包含铝、铜、银、金、镍及其合金，和/或其多层结构。金属焊盘22可通过例如下面的互连结构电连接到半导体器件。可形成钝化层30和聚合物层32以覆盖金属焊盘22的边缘部分。在示例性实施例中，钝化层30由电介质材料形成，例如二氧化硅、氮化硅或者其多层。开口形成在钝化层30和聚合物层32中以暴露出金属焊盘22。
形成有后钝化互连件(PPI)38，其中PPI 38包括在聚合物层32上的第一部分，以及延伸到钝化层30和聚合物层32中的开口中的第二部分。PPI 38的第二部分电连接到金属焊盘22并且可接触金属焊盘22。聚合物层39可形成在PPI 38上。形成凸点下金属层(UBM)40以延伸到聚合物层39中的开口中，其中，UBM 40电连接到PPI38，并且可接触PPI 38中的焊盘。焊球42置于UBM 40上并且被回流。管芯100可包括多个焊球42。
图2A和图2B分别示出了根据实施例的WLCSP的横截面图和俯视图。参考图2A，WLCSP封装件包括通过焊球42接合到印刷电路板(PCB)44的管芯100。因此，焊球42与管芯100和PCB 44物理接触。底部填充物46分配到区域50，该区域在管芯100和PCB 44之间。
图2B示出了图1中的WLSCP结构的一部分的俯视图，其中示出了焊球42，区域50和管芯100。焊球42可分布为遍及管芯100与PCB 44之间的区域50，其中每个圆圈表示焊球42之一。在示例性实施例中，焊球42被分布为矩形形状的阵列。区域50可分成角区域50A，与区域50A互连的相邻的边缘区域50B，以及中心区域50C。角区域50A、边缘区域50B和中心区域50C分别邻近管芯100的角，边缘和中心。在WLCSP结构的俯视图中，角区域50A和边缘区域50B结合在一起包围了中心区域50C。在一个实施例中，每个角区域50A，边缘区域50B和中心区域50C中具有至少一个并且可能多个焊球42。例如，角区域50A，边缘区域50B和中心区域50C均可包括2×2(两行乘两列)，3×3(三行乘三列)或者甚至更多的焊球42。
同样如图2B所示，底部填充物46可被分配到区域50的50A/50B/50C区域中的选定区域中，而区域50的区域50A/50B/50C中剩下的区域未分配有底部填充物46。在实施例中，空气填充在未分配底部填充物46的区域中，在WLCSP结构的俯视图中，焊球42可被气隙包围。因此，位于区域50A/50B/50C中的选定区域的焊球42与底部填充物46物理接触，并且可通过底部填充物46得到保护，而位于区域50A/50B/50C中剩下的区域的焊球不能通过底部填充物得到保护。在示例性实施例中，底部填充物46被分配到角区域50A，而边缘区域50B和中心区域50C未分配有底部填充物46。由于在角区域46A处到应力的中性点(DNP)的距离是最大的，因此角区域50A中的焊球42承受的应力可能高于中心区域50C和边缘区域50B中的焊球42承受的压力。因此，将底部填充物46分配到角区域50C在保护焊球42方面具有好的效果。另一方面，边缘区域50B和中心区域50C承受相对较小的应力，因此在该区域中可以没有分配的底部填充物46。在实施例中，底部填充物46被分配成接触角区域50A中的2×2或3×3的角焊球42，然而底部填充物46也可接触一个角焊球42或者超过3×3个角焊球(例如，4×4个边角焊球，5×5个角焊球或者类似布置的边角焊球)。在实施例中，如图2B所示，四个角区域50A被分配有底部填充物46。在可选实施例中，底部填充物46可分配到一个、两个或三个角区域50A，而剩下的角区域50A未分配有底部填充物46。
再参考图2A，在实施例中，底部填充物46具有高度H1，该高度H1小于管芯100与PCB 44之间的相隔距离H2。在底部填充物46(在相应区域中)最厚的地方测量出高度H1。底部填充物46与PCB 44物理接触，但是不与管芯100物理接触。例如，高度H1可以是相隔距离H2的约25％和约75％之间。换言之，在示出的示例性实施例中，接近PCB 44的角区域50A的部分填充有底部填充物46，而接近管芯100的角区域50A的部分未填充有底部填充物46。在可选实施例中，底部填充物46被分配到接近管芯100的角区域50A的部分，但是没有被分配到接近PCB 44的角区域50A的部分。因此，底部填充物46可与管芯100物理接触，但是不与PCB 44物理接触。
在整个描述中，根据各个实施例的底部填充物46可以是可再造的底部填充物，该底部填充物能够在加工处理后相对容易地去除。因此，如果管芯100在接合到PCB 44后发现有缺陷，可去除底部填充物46，例如采用溶剂，从而可使用另一管芯替代管芯100。在实施例中，在整个描述中的可再造的底部填充物46具有范围在30,000到约300,000的分子量。作为对比，不能再造的底部填充物具有大于大约500,000的分子量，使用溶剂去除该底部填充物不可能不损坏相应的封装件。在实施例中，通过将可再造的底部填充物46分配到外围区域，例如角区域50A、边缘区域50B(如图5B中所示)或者类似区域，并且底部填充物46不分配到中心区域50C中，将很容易去除底部填充物46并且去除有缺陷的管芯100。
图3示出了根据可选实施例的WLCSP结构的横截面图。图3中所示的WLSCP结构的俯视图也可以用图2表示。除非另外指定，在这些实施例和后续讨论的可选实施例中的参考标记表示的元件与图1到图2B中示出的实施例中的元件相同。除了底部填充物46与管芯100和PCB 44两个都物理接触外，图3中所示的实施例与图2A和图2B中所示的实施例相类似。因此，底部填充物46的高度H1等于相隔距离H2。
图4A和图4B分别示出了根据可选实施例的WLSCP结构的横截面图和俯视图。参考图4A，底部填充物46被分配在角区域50A和边缘区域50B中，并且没有被分配在中心区域50C中。图4B示出了俯视图。在实施例中，底部填充物46被分配到角区域50A和角区域50B中的至少一个区域中，其中，在角区域50A和边缘区域50B中的底部填充物46的部分可互连为一个组合填充区域。在其他实施例中，底部填充物46被分配到超过一个角区域50A和/或超过一个角区域50B中。然而，底部填充物46不连接以形成围绕中心区域50C的环形(在俯视图中)，该中心区域50C未填充有底部填充物46。在其他实施例中，如图4B所示，被分配到所有角区域50A和所有边缘区域50B中的底部填充物46互连以形成围绕中心区域50C的环形(在俯视图中)。然而，中心区域50C未分配有底部填充物46。在角区域50A和/或边缘区域50B中，一行、二行、三行、四行和类似的行数的焊球42可与底部填充物46相接触，而底部填充物46的内部行(inner rows)可不与底部填充物46相接触。
如图4A所示，底部填充物46具有小于管芯100和PCB 44的相隔距离H2的高度H1。因此，底部填充物46与PCB 44物理接触，但不与管芯100物理接触。在可选实施例中，底部填充物46与管芯100物理接触，但不与PCB44物理接触。
图5中示出了根据可选实施例的WLCSP结构的横截面图。图5中所示的WLCSP结构的俯视图也可用图4B表示。除了底部填充物46与管芯100和PCB44两者都物理接触之外，图5中所示的实施例与图4A和图4B的实施例类似。因此，底部填充物46的高度H1等于相隔距离H2。
图6A和图6B分别示出了根据其他实施例的WLCSP结构的横截面图和俯视图。参考图6A，WLCSP封装件包括管芯100，该管芯100通过焊球42接合到PCB 44。底部填充物46大体上分配到管芯100和PCB 44之间的整个区域50。图6B示出了俯视图，该俯视图示出了底部填充物46填充在包括角区域、边缘区域和中心区域的整个区域50中。底部填充物46是可再造的底部填充物，因此，在管芯100有缺陷并且需要用另一管芯替换的情况下，该底部填充物46是可去除的。
通过使用底部填充物以保护承受高应力的焊球，而承受低应力的焊球不通过底部填充物保护，在没有损坏相应PCB以接合在该PCB上的器件的情况下能够容易地去除底部填充物。使用可再造的底部填充物也使去除底部填充物变得可能。因此，可将有缺陷的WLCSP结构再造，从而可以用已知的好的管芯替换有缺陷的管芯。
虽然分配了较少的底部填充物，但是由于保护了最有可能在应力下发生故障的焊球，因此增加了相应WLCSP的使用期。仿真结果显示出与没有填充任何底部填充物的WLCSP中的应力相比，在相应管芯和PCB之间的整个区域填充有底部填充物的WLCSP中，角焊球的应力减少了大约52％。如果通过底部填充物保护了四个角区域中的3×3个焊球，并且没有底部填充物被分配到边缘区域和中心区域，则应力减少了大约49％。因此，即使底部填充物被分配在选定区域，而没有分配在中心区域，提供给受高压力的焊球的保护也与分配在PCB 44和管芯100之间的所有空间的底部填充物所提供的保护相接近。
根据实施例，一种封装件包括PCB、通过焊球接合到PCB的管芯。可再造的底部填充物被分配在PCB和管芯之间的区域内。
根据其他实施例，一种封装件包括PCB和管芯。PCB和管芯之间的区域包括与该管芯的中心邻近的中心区域，与该管芯的角邻近的角区域，以及与该管芯的边缘邻接的边缘区域。角区域和边缘区域包围中心区域。每个边缘区域与两个角区域互连。焊球将PCB与管芯相接合。中心区域、边缘区域和角区域中均包括至少一个焊球。底部填充物被分配到多个角区域之一中，并且没有被分配在中心区域。
根据另外的其他实施例，一种封装件包括PCB和管芯。PCB和管芯之间的区域包括中心区域，角区域和边缘区域，并且角区域和边缘区域围绕中心区域。每个边缘区域均与两个角区域互连。焊球将PCB与管芯相接合。中心区域、边缘区域和角区域中均包括至少一个焊球。底部填充物被分配到角区域以形成相互隔离开的不联系的底部填充物区域。底部填充物接触角区域中的焊球，其中，没有底部填充物填充在中心区域。底部填充物与PCB相接触，但是不与管芯物理接触。
尽管已经详细地描述了本发明及其优点，但应该理解为，在不背离所附权利要求限定的本发明主旨和范围的情况下，可以做各种不同的改变，替换和更改。而且，本申请的范围并不旨在仅限于本说明书中描述的工艺、机器、制造、材料组分、装置、方法和步骤的特定实施例。作为本领域普通技术人员应理解，通过本发明，现有的或今后开发的用于执行与根据本发明所采用的所述相应实施例基本相同的功能或获得基本相同结果的工艺、机器、制造，材料组分、装置、方法或步骤根据本发明可以被使用。因此，所附权利要求应该包括在这样的工艺、机器、制造、材料组分、装置、方法或步骤的范围内。此外，每条权利要求构成单独的实施例，并且多个权利要求和实施例的组合在本发明的范围内。

Claims (10)

1.一种封装件，包括：
印刷电路板(PCB)；
管芯，通过焊球接合到所述PCB；以及
可再造的底部填充物，被分配在所述PCB和所述管芯之间的区域中。
2.根据权利要求1所述的封装件，其中，所述可再造的底部填充物具有范围在30,000和约300,000之间的分子量。
3.根据权利要求1所述的封装件，其中，所述PCB和所述管芯之间的区域包括：中心区域、角区域和边缘区域，所述角区域和所述边缘区域围绕所述中心区域，并且其中，所述底部填充物在所述角区域之一中，并且不在所述中心区域中。
4.根据权利要求3所述的封装件，其中，填充到两个相邻角区域中的所述底部填充物形成了两个相互分隔开的底部填充区域，并且没有底部填充物与所述两个填充区域互连。
5.根据权利要求4所述的封装件，其中，所述底部填充物进一步位于与所述两个填充区域相连接的所述边缘区域之一中。
6.根据权利要求1所述的封装件，其中，所述底部填充物与所述PCB和所述管芯中的其中一个物理接触，并且不与所述PCB和所述管芯中的另一个物理接触。
7.根据权利要求6所述的封装件，其中，所述底部填充物与所述PCB物理接触，并且不与所述管芯物理接触。
8.根据权利要求6所述的封装件，其中，所述底部填充物与所述管芯物理接触，并且不与所述PCB物理接触。
9.一种封装件，包括：
印刷电路板(PCB)；
管芯，其中，所述PCB与所述管芯之间的区域包括：
与所述管芯的中心邻近的中心区域；
与所述管芯的角邻近的角区域；
与所述管芯的边缘邻近的边缘区域；其中，所述角区域和所述边缘区域围绕所述中心区域，并且其中，每个所述边缘区域均与两个所述角区域互连；
焊球，将所述PCB接合到所述管芯，其中，所述中心区域、所述边缘区域和所述角区域中均包括至少一个所述焊球；以及
底部填充物，被分配到所述角区域之一中，其中，所述底部填充物没有被分配到所述中心区域中。
10.一种封装件，包括：
印刷电路板(PCB)；
管芯，其中，所述PCB与所述管芯之间的区域包括：
中心区域；
角区域；
边缘区域，其中，所述角区域和所述边缘区域围绕所述中心区域，每个所述边缘区域均与两个所述角区域互连；
焊球，将所述PCB接合到所述管芯，其中，所述中心区域、所述边缘区域和所述角区域中均包括至少一个焊球；以及
底部填充物，被分配在所述角区域内，以形成相互分隔开的不连续的底部填充区域，其中，所述底部填充物接触在所述角区域中的焊球，没有所述底部填充物填充在所述中心区域中，所述底部填充物与所述PCB相接触，并且不与所述管芯物理接触。
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