CN1030446A - Low melting point pb-sb mould alloy - Google Patents
Low melting point pb-sb mould alloy Download PDFInfo
- Publication number
- CN1030446A CN1030446A CN 87102055 CN87102055A CN1030446A CN 1030446 A CN1030446 A CN 1030446A CN 87102055 CN87102055 CN 87102055 CN 87102055 A CN87102055 A CN 87102055A CN 1030446 A CN1030446 A CN 1030446A
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- alloy
- melting point
- low melting
- mould
- antimony
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Abstract
Low melting point Pb-Sb mould alloy contains the antimony of 5-15% (weight), and surplus is plumbous, and its fusing point is about 255 ℃.Be applicable to the sheet stamping mould, blow mold, compression tool and ceramic die.When this alloy was used for mfg. moulding die, the method for its molding and effect and bismuth tin alloy were basic identical, and available this alloy replaces the bismuth tin alloy, and cost has only 1/4th of bismuth tin alloy.
Description
Domestic and international employed low melting point mould alloy is generally binary, ternary or the quad alloy that contains bismuth, tin, cadmium, lead etc. at present, and its fusing point is lower.The clear 46-16815(1971 of Japanese Patent May 10) the low melting point mould alloy of being introduced in, the composition of one of them be bismuth-containing 48, plumbous 28.5, tin 14.5, antimony 9(all by weight percentage), its fusing point is 227 ℃, also will add the calcium and the magnesium of trace, to improve cast(ing) surface.Domestic used low melting point mould alloy, its composition are bismuth-containing 58%, tin 42%, and fusing point is 138 ℃.This low melting point alloy need use the bismuth metal and the tin of more costliness, alloy smelting process complexity, cost height.
The objective of the invention is with the lower plumbous antimony binary alloy of price to replace bismuth lead, tin and stibium quad alloy,, save precious metal bismuth and tin to reduce die cost as mould alloy.
Feature of the present invention is that alloy contains antimony 5-15%(weight), all the other are plumbous; To contain antimony 10%-12%, surplus is plumbous best, and its alloy melting point is 251.2 ℃-255 ℃.If antimony is lower than 5%, its alloy melting point raises, and hardness descends; If antimony is higher than 15%, its alloy melting point also raises, and hardness rises, and fragility increases, and both is mobile relatively poor, can not satisfy the mould requirement.When being used to make the low melting point mould, adopt the consecutive solidification teeming practice.
The mould of this alloy can be used for punching press metal sheet below 3 millimeters, and the product surface that stamps out is bright and clean on average more than 3000 a work-ing life for mold, clear-cut, and tolerance of dimension is qualified, and cost has only 1/4th of bismuth tin alloy.This alloy also can be used for doing ceramic die, blow mold, compression tool.The plumbous antimony aboundresources of China is promoted the low melting point Pb-Sb alloy mold, can save a large amount of expensive metal bismuths and tin for country, reduces production costs remarkable in economical benefits.
Embodiments of the invention 1 are got 10%(weight) antimony, 90%(weight) lead, add in the crucible and melt, after stirring, can direct pouring become mould; Or be cast into ingot, use for the user.Fusing point is 253 ℃, and good fluidity.
Embodiment 2, get 5%(weight) antimony, surplus is plumbous, makes alloy with the method for example 1, its fusing point is 295 ℃.
Embodiment 3, get 15%(weight) antimony, surplus is plumbous, makes alloy, its fusing point is 280 ℃.
Claims (3)
1, a kind of low melting point Pb-Sb mould alloy is characterized in that containing antimony 5-15% (weight), and surplus is plumbous.
2, alloy according to claim 1 is characterized in that alloy contains antimony and is preferably 10%-12%(weight), surplus is plumbous.
3, according to claim 1,2 described alloys, it is characterized in that when making large-scale mold, adopt the outer teeming practice of empty van filling machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87102055 CN1011246B (en) | 1987-07-04 | 1987-07-04 | Low melting point pb-sb mould alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 87102055 CN1011246B (en) | 1987-07-04 | 1987-07-04 | Low melting point pb-sb mould alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1030446A true CN1030446A (en) | 1989-01-18 |
| CN1011246B CN1011246B (en) | 1991-01-16 |
Family
ID=4813765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 87102055 Expired CN1011246B (en) | 1987-07-04 | 1987-07-04 | Low melting point pb-sb mould alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1011246B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589906A (en) * | 2013-11-13 | 2014-02-19 | 贵州钢绳股份有限公司 | Manufacturing method of electroplating lead beam |
| CN105316554A (en) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | Environment-friendly die alloy for casting machine |
| CN115233033A (en) * | 2022-07-14 | 2022-10-25 | 铅锂智行(北京)科技有限公司 | Lead-based alloy and product thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100402685C (en) * | 2005-07-25 | 2008-07-16 | 叶胜平 | Lead antimony alloy of agglutiant in sue for insulator in transmission and transform circuit line, and preparation method |
-
1987
- 1987-07-04 CN CN 87102055 patent/CN1011246B/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103589906A (en) * | 2013-11-13 | 2014-02-19 | 贵州钢绳股份有限公司 | Manufacturing method of electroplating lead beam |
| CN105316554A (en) * | 2015-12-02 | 2016-02-10 | 苏州龙腾万里化工科技有限公司 | Environment-friendly die alloy for casting machine |
| CN115233033A (en) * | 2022-07-14 | 2022-10-25 | 铅锂智行(北京)科技有限公司 | Lead-based alloy and product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1011246B (en) | 1991-01-16 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |