CN103031012B - A kind of compositions and the method for preparing diamond fretsaw thereof - Google Patents
A kind of compositions and the method for preparing diamond fretsaw thereof Download PDFInfo
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- CN103031012B CN103031012B CN201210539446.2A CN201210539446A CN103031012B CN 103031012 B CN103031012 B CN 103031012B CN 201210539446 A CN201210539446 A CN 201210539446A CN 103031012 B CN103031012 B CN 103031012B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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Abstract
The invention provides a kind of compositions and the method for preparing diamond fretsaw thereof, including the α cyanacrylate of 85 ~ 95wt%, the viscosifier of 3 ~ 8wt%, the stabilizer of 1 ~ 3wt%, 2 ~ 4wt% polymerization inhibitor. Solve diamond irregular arrangement in prior art, wire diameter is uneven, machining accuracy is poor, the technical problem that diamond cut utilization rate is low.
Description
Technical field
The present invention relates to the field of photocuring scroll saw, especially, relate to a kind of compositions, further relate to a kind of method that foregoing is used for preparing diamond fretsaw.
Background technology
Hard brittle material includes various silicon crystal, quartz crystal, sapphire, hard alloy and ceramic material etc. Hard brittle material is mostly electrical insulator or quasiconductor, is generally of high rigidity, high fragility, high-wearing feature, high resistance to corrosion, high antioxidant, high resistivity, high temperature resistant, the not performance such as magnetic conduction. Due to the property of crisp and hard material, the process technology of crisp and hard material is proposed requirements at the higher level. Cutting is the key step to crisp and hard material processing, and cutting method mainly has diamond saw blade cutting, the cutting of banding instrument, laser beam cutting etc. These cutting methods have the advantages such as high efficiency, low cost, joint-cutting narrow, not damaged, non-environmental-pollution; Wherein diamond saw sheet cutting equipment has the advantages such as easy to operate, efficiency is high, crudy is good, but noise is bigger, can only cut by monolithic, efficiency is low, blade poor rigidity, cut object size limited size, in cutting process, saw blade is easily generated runout, sideslip, causes that the depth of parallelism of cut workpiece is poor. The saw kerf of banding instrument cutting is little, and saw cutting speed is fast, and cutter material consumes the advantages such as little, noise is little, but it requires raw material regular, and can not carry out multi-disc cutting. The scope of application of laser beam cutting is relatively wide, but depth of cut is limited, and according to high power laser, then the high-temperature plasma produced between laser and workpiece cognition substantially reduces working (machining) efficiency, increases the discharge difficulty of fused mass and equipment investment somewhat expensive.
Diamond fretsaw is that the diamond particles of high rigidity, high-wearing feature is fixedly arranged at a kind of cutting tool that steel wire substrates is made. Diamond fretsaw can make different diameters and length as required; May be mounted at and different equipment is formed different processing modes, such as reciprocation cycle (saw frame) formula, high speed band saw type, single line cutting type and multi-wire saw formula etc. The advantages such as electroplating diamond wire saw is narrow because of its joint-cutting, and cutting efficiency is high and economic and environment-friendly, are particularly well-suited to cutting silicon crystal, the valuable hard brittle material cutting processing such as sapphire, magnetic material, pottery, crystal.
Diamond fretsaw preparation method is typically with electric plating method and deposits layer of metal on tinsel embryo line, and in the metal of deposition consolidated diamond granule. The coat of metal is bonding agent, and diamond particles is used for machining. Prior art adopts sand method on common composite electrodeposition, and diamond arrangement is irregular in a jumble, and diamond cut utilization rate is relatively low, and cutting surfaces stria is relatively deep, and machining accuracy dimensional discrepancy is bigger.
Summary of the invention
Present invention aim at providing a kind of compositions and the method for preparing diamond fretsaw thereof, to solve diamond irregular arrangement in prior art, wire diameter is uneven, machining accuracy is poor, the technical problem that diamond cut utilization rate is low.
For achieving the above object, according to an aspect of the invention, it is provided a kind of compositions, including the ethyl α-cyanoacrylate of 85～95wt%, the viscosifier of 3～8wt%, the stabilizer of 1～3wt%, 2～4wt% polymerization inhibitor.
Further, including the ethyl α-cyanoacrylate of 90wt%, the viscosifier of 5wt%, the stabilizer of 2wt%, 3wt% polymerization inhibitor.
Further, viscosifier are rosin resin; Stabilizer is lead sulfate tribasic; Polymerization inhibitor is tert-butyl catechol.
The preparation method that another aspect of the present invention additionally provides a kind of diamond fretsaw, comprises the following steps:
Coating screened film: aforesaid compositions is coated in the surface of embryo line, makes compositions form the organic screen film with regular hole on embryo line surface by curing schedule, obtains the embryo line with organic screen film;
Plating: by diamond particles by electroplating the hole place being attached to the embryo line with organic screen film, obtain the diamond fretsaw with organic screen film;
Remove organic screen film: the diamond fretsaw with organic screen film is soaked removing organic screen film in organic solvent and obtains diamond fretsaw first product;
Reinforce plating: diamond fretsaw first product is carried out reinforces plating step and obtains diamond fretsaw.
Further, embryo line is the steel wire of diameter 0.12～0.44mm; The particle diameter of diamond particles is 6～60 μm, and the thickness of organic screen film is 1～5 μm.
Further, also including cleaning step, cleaning step, for embryo line and diamond particles are carried out deoiling step in strong base solution, carries out descaling step again in strong acid solution after rinsing, is then coated step.
Further, strong base solution is the NaOH solution of 5～10wt%, and strong acid solution is the chloroazotic acid of 2～5wt%.
Further, the solidification temperature of curing schedule is 80～100 DEG C.
Further, removing organic solvent in organic screen film step is acetone.
Further, plating step is by diamond particles, carries out composite electroplating with 5～20m/min speed at 40～50 DEG C, and what make diamond rule is arranged in unscreened embryo line gap.
The method have the advantages that
Compositions provided by the invention, when it is coated in adherend surface, can form stable organic screen film on adherend surface, it is possible to protection adherend surface is not by the interference of external environment condition. Organic screen film can be removed at normal temperatures simultaneously, easy to clean. Compositions is applied to the preparation of diamond fretsaw by the present invention, can at the organic screen film of diamond fretsaw surface formation rule hole, in electroplating process, diamond particles is only bonded on the embryo line with hole, make the diamond regular array of the diamond fretsaw prepared, wire diameter uniformly, there is high cutting performance.
The preparation method of diamond fretsaw provided by the invention, diamond particles can be regularly arranged, and the density of diamond particles can be adjusted by the gap of the organic organic screen film of control; Regularly arranged diamond wire saw cut utilization rate is higher, and stria is shallower, and machining accuracy is higher.
Except purpose described above, feature and advantage, the present invention also has other purpose, feature and advantage. Below with reference to figure, the present invention is further detailed explanation.
Accompanying drawing explanation
The accompanying drawing constituting the part of the application is used for providing a further understanding of the present invention, and the schematic description and description of the present invention is used for explaining the present invention, is not intended that inappropriate limitation of the present invention. In the accompanying drawings:
Fig. 1 is the schematic flow sheet of the preferred embodiment of the present invention;
Fig. 2 is the diamond fretsaw SEM figure of the preferred embodiment of the present invention;
Fig. 3 is the diamond fretsaw SEM figure of comparative example of the present invention.
Detailed description of the invention
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
One aspect of the present invention provides a kind of compositions, including the ethyl α-cyanoacrylate of 85～95wt%, the viscosifier of 3～8wt%, the stabilizer of 1～3wt%, 2～4wt% polymerization inhibitor. Ethyl α-cyanoacrylate is a kind of moment adhesive, and freezing point is-16.9 DEG C, at normal temperatures can quick solidification; But unstable chemcial property, is easily polymerized, under having minor amount of water to exist in atmosphere, it is easy to sudden reaction rapid solidification occurs. In order to improve the stability of ethyl α-cyanoacrylate, it is prevented that its premature polymerization, the present invention adds stabilizer and polymerization inhibitor in the composition, makes compositions rapid solidification at normal temperatures. Meanwhile, for the adhesion of enhancing composition Yu material to be bonded, this law is bright also adds viscosifier in the composition, and viscosifier pass through diffusion into the surface moistening bonding surface, make the adhesion strength between compositions and adherend strengthen.
According to the compositions that aforementioned formula combines, when it is coated in adherend surface, stable organic screen film can be formed on adherend surface, it is possible to protection adherend surface is not by the interference of external environment condition. Organic screen film can be removed at normal temperatures simultaneously, easy to clean. Compositions is applied to the preparation of diamond fretsaw by the present invention, the organic screen film containing rule hole can be formed on diamond fretsaw surface, in electroplating process, diamond particles is only bonded on the embryo line with hole, make the diamond regular array of the diamond fretsaw prepared, wire diameter uniformly, there is high cutting performance. If the too high levels of viscosifier, then organic screen film is difficult to remove; If the content of binding agent is too low, then organic screen film is relatively low with the adhesion of adherend, easy to fall off. If the content of stabilizer and polymerization inhibitor is too low, then the unstable chemcial property of compositions, it is easy to condense together, cause forming organic screened film.
Further, when compositions comprises the ethyl α-cyanoacrylate of 90wt%, the viscosifier of 5wt%, the stabilizer of 2wt%, 3wt% polymerization inhibitor time, the chemical property of compositions is more stable, and adhesive property is better, and shield effectiveness is more preferably.
Further, viscosifier are rosin resin; Stabilizer is lead sulfate tribasic; Polymerization inhibitor is tert-butyl catechol. Polymerization inhibitor adopts tert-butyl catechol, and polymerization inhibition effect is good at normal temperatures, when temperature is higher, does not just produce polymerization inhibition effect, makes compositions can be solidified into organic screen film. Viscosifier are rosin resin, similar to the dissolubility of ethyl α-cyanoacrylate, and Efficient Adhesive Promotion is good. Stabilizer adopts lead sulfate tribasic, can improve ethyl α-cyanoacrylate stability at normal temperatures.
The preparation method that another aspect of the present invention additionally provides a kind of diamond fretsaw, comprises the following steps:
Coating screened film: aforesaid compositions is coated in the surface of embryo line, makes compositions form organic organic screen film with regular hole on embryo line surface by curing schedule, obtains the embryo line with organic screen film;
Plating: by diamond particles by electroplating the hole place being attached to the embryo line with organic screen film, obtain the diamond fretsaw with organic screen film;
Remove organic screen film: the diamond fretsaw with organic screen film is soaked removing organic screen film in organic solvent and obtains diamond fretsaw first product;
Reinforce plating: diamond fretsaw first product is carried out reinforces plating step and obtains diamond fretsaw.
The present invention is to solve diamond irregular arrangement in prior art, wire diameter is uneven, machining accuracy is poor, the technical problem that diamond cut utilization rate is low, at one layer of organic screen film of embryo line surface brush, this organic screen film has the space of certain rule, then passes through curing schedule and makes organic screen film be securely bonded to the surface of embryo line. Owing to scroll saw surface has organic screen film, in electroplating process, diamond can only stick in the space of organic screen film, and can not stick on organic screen film, make being distributed in around embryo line of diamond particles rule, obtain that diamond regular array, wire diameter be uniform, the electroplating diamond wire saw of high cutting performance. Simultaneously in electroplating process, owing to electroplating temperature is low, electroplating time is short, and organic screen film sand on the diamond and reinforcing process always will not be destroyed or dissolve, it is prevented that electroplate liquid pollutes. Then being dissolved by the organic screen film around diamond fretsaw with organic solvent, do not affect the adhesion of diamond particles and embryo line, the residual quantity of organic screen film is little. Diamond fretsaw first product carrying out reinforce plating step and obtains electroplating diamond wire saw, diamond particles can be securely bonded to the surface of embryo line, further enhances the adhesion of diamond and embryo line. According to diamond fretsaw prepared by the method for the present invention, diamond particles can be regularly arranged, and the density of diamond particles can be adjusted by the gap of control organic screen film; Regularly arranged diamond wire saw cut utilization rate is higher, and stria is shallower, and machining accuracy is higher.
Further, embryo line is the steel wire of 0.12～0.44mm; The particle diameter of diamond particles is 6～60 μm, and the thickness of organic screen film is 1～5 μm.
Further, aforementioned preparation process also includes cleaning step, and cleaning step, for embryo line and diamond particles are carried out deoiling step in strong base solution, carries out descaling step again in strong acid solution after rinsing, is then coated step. Embryo line and diamond particles are carried out step, remove the impurity on diamond particles and embryo line surface, make organic screen film be bonded in embryo line surface better, ensure simultaneously diamond particles in electroplating process with the adhesion of embryo line.
Further, strong base solution is the NaOH solution of 5～10wt%, and strong acid solution is the chloroazotic acid of 2～5wt%, and embryo line and diamond fretsaw are not had corrosivity, do not affect the performance of embryo line and diamond particles, can guarantee that the oil stain removing embryo line and diamond particle surfaces, dirty rust.
Further, the solidification temperature of curing schedule is 80～100 DEG C and makes, it is possible to making the polymerization inhibitor in compositions lose polymerization inhibition effect, compositions at embryo line surface rapid solidification, can form stable organic screen film, it is ensured that the adhesion of organic screen film and embryo line.
Further, in step 3, organic solvent is acetone. In organic screen film, each component all can be dissolved in acetone soln, can be dissolved by organic screen film rapidly at normal temperatures and remove, and removal effect is good.
Further, plating step be by have the embryo line of organic screen film at 40～50 DEG C with 5～20m/min speed by sand launder carry out composite electroplating, what make diamond rule is arranged in unscreened gap. Owing in electroplating process, temperature is relatively low, upper sand speed is fast, will not be destroyed or dissolve in organic screen film sand on the diamond and reinforcing process. If temperature is too high, upper sand speed is excessively slow, then organic screen film is destroyed, it is impossible at the diamond particles of embryo line coating surface regular distribution.
Embodiment
The following is raw material used in embodiment and instrument is commercially available.
Embodiment 1
Compositions 1 includes the polymerization inhibitor of the ethyl α-cyanoacrylate of 95wt%, the viscosifier of 3wt%, the stabilizer of 1wt%, 2wt%.
(1), taking diamond particles that granularity is 10～20 μm and diameter is the steel wire of 0.12mm, deoil through 10%NaOH aqueous solution, clear water rinses, and then, with 5% chloroazotic acid pickling, removing surface impurity obtains clean diamond particles and steel wire.
(2), by compositions 1 being coated in clean steel wire surface, heating, to 80 DEG C, makes compositions 1 form the organic screen film that thickness is 1 μm with regular hole on embryo line surface, obtains the steel wire with organic screen film.
(3), by have the steel wire of organic screen film at 40 DEG C with 20m/min speed by electroplating bath, what make clean diamond rule is arranged in steel wire unscreened hole place and obtains the diamond fretsaw with organic screen film.
(4), the diamond fretsaw with organic screen film is placed removing organic screen film in acetone and obtain diamond fretsaw first product.
(5), diamond fretsaw first product being carried out reinforces plating step and obtains diamond fretsaw.
Embodiment 2
Compositions 2 includes the polymerization inhibitor of the ethyl α-cyanoacrylate of 90wt%, the viscosifier of 5wt%, the stabilizer of 2wt%, 3wt%.
(1), taking the diamond particles that granularity is 40～50 μm and deoil through 10%NaOH aqueous solution, clear water rinses, and then, with 5% chloroazotic acid pickling, removing surface impurity obtains clean diamond particles.
(2) cut-off footpath be the steel wire of 0.25mm as embryo line, embryo line oil removing 2wt% acid pickling and rust removing activation processing in 5wt% aqueous slkali is obtained clean firm line.
(3), by compositions 2 being coated in clean steel wire surface, heating, to 90 DEG C, makes compositions 2 form the organic screen film that thickness is 3 μm with regular hole on embryo line surface, obtains the steel wire with organic screen film.
(4), by have the steel wire of organic screen film at 45 DEG C with 10m/min speed by electroplating bath, what make clean diamond rule is arranged in steel wire unscreened hole place and obtains the diamond fretsaw with organic screen film.
(5), the diamond fretsaw with organic screen film is placed removing organic screen film in acetone and obtain diamond fretsaw first product.
(6), diamond fretsaw first product being carried out reinforces plating step and obtains diamond fretsaw.
Embodiment 3
Compositions 3 includes the polymerization inhibitor of the ethyl α-cyanoacrylate of 85wt%, the viscosifier of 8wt%, the stabilizer of 3wt%, 4wt%.
(1), taking the diamond particles that granularity is 50～60 μm and deoil through 10%NaOH aqueous solution, clear water rinses, and then, with 5% chloroazotic acid pickling, removing surface impurity obtains clean diamond particles.
(2) cut-off footpath be the steel wire of 0.44mm as embryo line, embryo line oil removing 2wt% acid pickling and rust removing activation processing in 5wt% aqueous slkali is obtained clean firm line.
(3), by compositions 3 being coated in clean steel wire surface, heating, to 100 DEG C, makes compositions 3 form the organic screen film that thickness is 5 μm with regular hole on embryo line surface, obtains the steel wire with organic screen film.
(4), by have the steel wire of organic screen film at 50 DEG C with 5m/min speed by electroplating bath, what make clean diamond rule is arranged in steel wire unscreened hole place and obtains the diamond fretsaw with organic screen film.
(5), the diamond fretsaw with organic screen film is placed in acetone organic solvent remove organic screen film obtain diamond fretsaw first product.
(6), diamond fretsaw first product being carried out reinforces plating step and obtains diamond fretsaw.
Comparative example 1
Being not coated by organic screen film on steel wire surface, all the other methods carry out according to embodiment 1.
Comparative example 2
Being not coated by organic screen film on steel wire surface, all the other methods carry out according to embodiment 2.
Comparative example 3
Being not coated by organic screen film on steel wire surface, all the other methods carry out according to embodiment 3,
The polycrystal silicon ingot of 850 × 850 × 320mm is carried out evolution by the diamond fretsaw of embodiment 1～3 and comparative example 1～3, detects the cut channel of polycrystal silicon ingot under the microscope.
Carry out stretching Fracture Force detection to the diamond fretsaw of embodiment 1～3 and comparative example 1～3.
The diameter of embodiment 1～3 and the diamond fretsaw of comparative example 1～3 is measured.
The diamond fretsaw of embodiment 1～3 and comparative example 1～3 is carried out cutting efficiency detection, detection method according to:: by the diamond fretsaw of embodiment 1～3 and comparative example 1～3, with linear velocity for 2.5m/s, feeding rate is 0.5mm/min, with water for cooling medium, the silicon rod that diameter is 100mm is carried out the cutting of 250min, investigates solidification scroll saw and examine the cutting efficiency to silicon rod.
The testing result of the cut channel of embodiment 1～3 and comparative example 1～3 diamond fretsaw, stretching Fracture Force and wire diameter is listed in table 1.
The performance test results table of table 1 diamond fretsaw
| Embodiment | Wire diameter | Stretch Fracture Force | Cutting stria | Cutting efficiency |
| Embodiment 1 | 0.140mm±0.005mm | >40 | 5-10μm | 1.0-1.2mm2/min |
| Comparative example 1 | 0.140mm±0.05mm | >20;<40 | 10-15μm | 0.8-1.0mm2/min |
| Embodiment 2 | 0.350mm±0.005mm | >170N | 10-20μm | 2.0-2.5mm2/min |
| Comparative example 2 | 0.350mm±0.05mm | >120;<170N | 20-30μm | 1.7-2.0mm2/min |
| Embodiment 3 | 0.500mm±0.005mm | >250N | 15～20 μm | 2.2-2.8mm2/min |
| Comparative example 3 | 0.500mm±0.05mm | >180;<250N | 25～35 μm | 2.0-2.2mm2/min |
From the experimental result of table 1 it can be seen that the diamond fretsaw prepared according to the method for the present invention, the cut channel of polysilicon is significantly lower than the diamond fretsaw not processed according to the inventive method, and machining accuracy significantly improves; Simultaneously the deviation of wire diameter is less, the diamond fretsaw of embodiment 1～3 its stretch Fracture Force and cutting efficiency apparently higher than comparative example 1～3.
Fig. 2 is the SEM figure of the diamond fretsaw of embodiment 1, it can be seen that the diamond fretsaw prepared according to the method for the present invention, the diamond particles on its scroll saw surface is regularly arranged, and wire diameter is uniform.
Fig. 3 is the SEM figure of the diamond fretsaw of comparative example 1, it can be seen that the diamond fretsaw prepared according to the method for comparative example 1, the diamond particles irregular arrangement on its scroll saw surface, wire diameter is uneven, and some places are excessively thick, and some places are meticulous.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations. All within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (6)
1. the method preparing diamond fretsaw, it is characterised in that comprise the following steps:
Coating screened film: compositions is coated in the surface of embryo line, makes compositions form the organic screen film with regular hole on embryo line surface by curing schedule, obtains the embryo line with organic screen film;
Plating: by diamond particles by electroplate be attached to described in there is the hole place of embryo line of organic screen film, obtain the diamond fretsaw with organic screen film;
Remove organic screen film: the described diamond fretsaw with organic screen film is soaked removing organic screen film in organic solvent and obtains diamond fretsaw first product;
Reinforce plating: described diamond fretsaw first product is carried out reinforces plating step and obtains diamond fretsaw;
Described compositions, including the ethyl α-cyanoacrylate of 85～95wt%, the viscosifier of 3～8wt%, the stabilizer of 1～3wt%, 2～4wt% polymerization inhibitor; Described viscosifier are rosin resin; Described stabilizer is lead sulfate tribasic; Described polymerization inhibitor is tert-butyl catechol;
Organic solvent described in described removal organic screen film step is acetone.
2. method according to claim 1, it is characterised in that described embryo line is the steel wire of diameter 0.12～0.44mm; The particle diameter of described diamond particles is 6～60 μm, and the thickness of described organic screen film is 1～5 μm.
3. method according to claim 1, it is characterized in that, also include cleaning step, described cleaning step for carrying out deoiling step by embryo line and diamond particles in strong base solution, in strong acid solution, carry out descaling step after rinsing again, then carry out described coating step.
4. method according to claim 3, it is characterised in that described strong base solution is the NaOH solution of 5～10wt%, described strong acid solution is the chloroazotic acid of 2～5wt%.
5. method according to claim 1, it is characterised in that the solidification temperature of described curing schedule is 80～100 DEG C.
6. method according to claim 1, it is characterised in that described plating step is by described diamond particles, carries out composite electroplating with 5～20m/min speed at 40～50 DEG C, what make diamond rule is arranged in unscreened embryo line gap.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539446.2A CN103031012B (en) | 2012-12-14 | 2012-12-14 | A kind of compositions and the method for preparing diamond fretsaw thereof |
| PCT/CN2013/088895 WO2014090125A1 (en) | 2012-12-14 | 2013-12-09 | Composition and method for preparing diamond wire saw using same |
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| CN201210539446.2A CN103031012B (en) | 2012-12-14 | 2012-12-14 | A kind of compositions and the method for preparing diamond fretsaw thereof |
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| CN103031012B (en) * | 2012-12-14 | 2016-06-15 | 长沙岱勒新材料科技股份有限公司 | A kind of compositions and the method for preparing diamond fretsaw thereof |
| JP6130247B2 (en) * | 2013-07-01 | 2017-05-17 | ワイヤーエンジプロ合同会社 | Abrasive electrodeposition liquid, method for producing fixed abrasive saw wire, and fixed abrasive saw wire |
| CN105527117A (en) * | 2015-12-02 | 2016-04-27 | 成都理工大学 | Field in-situ sampling method for granular mixtures |
| CN110181698B (en) * | 2019-04-25 | 2021-04-23 | 南京大学连云港高新技术研究院 | Stable-structure diamond wire and preparation method thereof |
| CN113717560A (en) * | 2021-09-02 | 2021-11-30 | 湖南益缘新材料科技有限公司 | Composition for preparing diamond wire, preparation method and application thereof |
| CN114959841B (en) * | 2022-05-25 | 2023-07-14 | 石家庄雷力工具有限公司 | Electroplating tool and electroplating process of diamond rope saw |
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| CN103131335B (en) * | 2011-11-28 | 2015-04-01 | 宝山钢铁股份有限公司 | Preparation dedicated binder of microbeam analysis standard sample and blending method thereof |
| CN103031012B (en) * | 2012-12-14 | 2016-06-15 | 长沙岱勒新材料科技股份有限公司 | A kind of compositions and the method for preparing diamond fretsaw thereof |
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- 2012-12-14 CN CN201210539446.2A patent/CN103031012B/en active Active
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| CN102144014A (en) * | 2008-12-16 | 2011-08-03 | 德莎欧洲公司 | Self-adhesive base polymer for electroluminescence masses |
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| CN103031012A (en) | 2013-04-10 |
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