CN103031012A - Composition and method for preparing diamond wire saw with composition - Google Patents
Composition and method for preparing diamond wire saw with composition Download PDFInfo
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- CN103031012A CN103031012A CN2012105394462A CN201210539446A CN103031012A CN 103031012 A CN103031012 A CN 103031012A CN 2012105394462 A CN2012105394462 A CN 2012105394462A CN 201210539446 A CN201210539446 A CN 201210539446A CN 103031012 A CN103031012 A CN 103031012A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D65/00—Making tools for sawing machines or sawing devices for use in cutting any kind of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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Abstract
The invention provides a composition and a method for preparing diamond wire saw with the composition. The composition comprises the following raw materials by weight: 85-95wt% of alpha cyan ethyl acrylate, 3-8wt% of a tackifier, 1-3wt% of a stabilizer and 2-4wt% of a polymerization inhibitor. The method solves the technical problems of irregular arrangement of diamonds, uneven wire diameter, poor processing precision and low diamond cutting utilization rate in the prior art.
Description
Technical field
The present invention relates to the field of photocuring scroll saw, especially, relate to a kind of composition, also relate to a kind of with the method for foregoing for the preparation of diamond fretsaw.
Background technology
Hard and fragile material comprises various silicon crystal, quartz crystal, sapphire, Wimet and stupalith etc.Hard and fragile material mostly is greatly electrical insulator or semi-conductor, usually has high rigidity, high fragility, high-wearing feature, high resistance to corrosion, high antioxidant, high resistivity, high temperature resistant, the performance such as magnetic conduction not.Because the property of crisp and hard material, requirements at the higher level have been proposed for the processing technology of crisp and hard material.Cutting is that cutting method mainly contains diamond saw blade cutting, the cutting of banded instrument, laser beam cutting etc. to the key step of crisp and hard material processing.These cutting methods have the advantages such as high-level efficiency, low cost, joint-cutting are narrow, not damaged, non-environmental-pollution; Wherein the diamond saw sheet cutting equipment has the advantages such as easy to operate, that efficient is high, processing quality is good, but noise is larger, can only cut by monolithic, efficient is low, the blade poor rigidity, be cut the object size limited size, saw blade easily produces runout, sideslip in the cutting process, and the parallelism that causes being cut workpiece is poor.The saw kerf of banded instrument cutting is little, and saw cutting speed is fast, and cutter material consumes the advantages such as little, that noise is little, but it requires raw material regular, and can not carry out the multi-disc cutting.The scope of application of laser beam cutting is wider, but depth of cut is limited, if adopt high power laser, the high-temperature plasma that then produces between laser and workpiece is known from experience obviously reduction working (machining) efficiency, increases the discharge difficulty of melts, and the facility investment somewhat expensive.
Diamond fretsaw is that the diamond particles with high rigidity, high-wearing feature is cemented in a kind of parting tool that the steel wire substrates is made.Diamond fretsaw can be made different diameters and length as required; Can be installed in the different processing mode of formation on the different equipment, such as reciprocation cycle (saw frame) formula, high speed band saw type, single line cutting type and multi-wire saw formula etc.Electroplating diamond wire saw is narrow because of its joint-cutting, and the advantages such as cutting efficiency height and economic environmental protection are specially adapted to cut silicon crystal, the valuable hard and fragile material cutting processing such as sapphire, magneticsubstance, pottery, crystal.
The diamond fretsaw preparation method normally adopts electric plating method to deposit layer of metal at wire embryo line, and the deposition metal in the solidified diamond particle.Metal plating is wedding agent, and diamond particles is used for machining.Prior art adopts sand method on the common composite electrodeposition, and diamond is arranged irregular in a jumble, and the diamond cutting utilization ratio is lower, and the cutting surfaces stria is darker, and the working accuracy size deviation is larger.
Summary of the invention
The object of the invention is to provide a kind of composition and for the preparation of the method for diamond fretsaw, with solve in the prior art diamond arrange irregular, wire diameter is inhomogeneous, working accuracy is poor, the technical problem that the diamond cutting utilization ratio is low.
For achieving the above object, according to an aspect of the present invention, provide a kind of composition, comprised the α cyanacrylate of 85 ~ 95wt%, the tackifier of 3 ~ 8wt%, the stablizer of 1 ~ 3wt%, the stopper of 2 ~ 4wt%.
Further, comprise the α cyanacrylate of 90wt%, the stopper of the tackifier of 5wt%, the stablizer of 2wt%, 3wt%.
Further, tackifier are Gum Rosin; Stablizer is lead sulfate tribasic; Stopper is tert-butyl catechol.
Another aspect of the present invention also provides a kind of preparation method of diamond fretsaw, may further comprise the steps:
Apply screened film: aforesaid composition is coated in the surface of embryo line, makes composition form the organic screen film with regular hole on embryo line surface by curing schedule, obtain having the embryo line of organic screen film;
Electroplate: diamond particles is attached to the hole place of the embryo line with organic screen film by plating, obtains having the diamond fretsaw of organic screen film;
Remove the organic screen film: the diamond fretsaw that will have the organic screen film is immersed in to be removed the organic screen film and obtains the diamond fretsaw first product in the organic solvent;
Reinforce and electroplate: the diamond fretsaw first product is reinforced plating step obtain diamond fretsaw.
Further, the embryo line is the steel wire of diameter 0.12 ~ 0.44mm; The particle diameter of diamond particles is 6 ~ 60 μ m, and the thickness of organic screen film is 1 ~ 5 μ m.
Further, also comprise cleaning step, cleaning step is for to carry out deoiling step with embryo line and diamond particles in strong base solution, and then the step that eliminates rust in strong acid solution again after the rinsing carries out coating step.
Further, strong base solution is Na (OH) solution of 5 ~ 10wt%, and strong acid solution is the chloroazotic acid of 2 ~ 5wt%.
Further, the solidification value of curing schedule is 80 ~ 100 ℃.
Further, organic solvent is acetone in the removal organic screen film step.
Further, plating step is with diamond particles, carries out composite electroplating with 5 ~ 20m/min speed under 40 ~ 50 ℃, makes the unscreened embryo line of being arranged in of diamond rule gap.
The present invention has following beneficial effect:
Composition provided by the invention when it is coated in the adherend surface, can form stable organic screen film on the adherend surface, can protect the adherend surface not to be subjected to the interference of outside atmosphere.The organic screen film can be removed at normal temperatures simultaneously, and is easy to clean.The present invention is applied to composition the preparation of diamond fretsaw, can be at the organic screen film of diamond fretsaw surface formation rule hole, in electroplating process, diamond particles only is bonded on the embryo line with hole, the diamond regular array, wire diameter that makes the diamond fretsaw that makes evenly, have a high cutting property.
The preparation method of diamond fretsaw provided by the invention, diamond particles can be regularly arranged, and the density of diamond particles can be adjusted by the gap of controlling organic organic screen film; Regularly arranged diamond fretsaw cutting utilization ratio is higher, and stria is more shallow, and working accuracy is higher.
Except purpose described above, feature and advantage, the present invention also has other purpose, feature and advantage.The below is with reference to figure, and the present invention is further detailed explanation.
Description of drawings
The accompanying drawing that consists of the application's a part is used to provide a further understanding of the present invention, and illustrative examples of the present invention and explanation thereof are used for explaining the present invention, do not consist of improper restriction of the present invention.In the accompanying drawings:
Fig. 1 is the schematic flow sheet of the preferred embodiment of the present invention;
Fig. 2 is the diamond fretsaw SEM figure of the preferred embodiment of the present invention;
Fig. 3 is the diamond fretsaw SEM figure of Comparative Examples of the present invention.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are elaborated, but the multitude of different ways that the present invention can be defined by the claims and cover is implemented.
One aspect of the present invention provides a kind of composition, comprises the α cyanacrylate of 85 ~ 95wt%, the tackifier of 3 ~ 8wt%, the stablizer of 1 ~ 3wt%, the stopper of 2 ~ 4wt%.The α cyanacrylate is a kind of moment sizing agent, and zero pour is-16.9 ℃, can solidify rapidly at normal temperatures; But unstable chemcial property, easily polymerization has in air in the presence of the minor amount of water, polyaddition reaction occurs easily solidify rapidly.In order to improve the stability of α cyanacrylate, prevent its premature polymerization, the present invention has added stablizer and stopper in composition, composition is solidified rapidly at normal temperatures.Simultaneously, for the bonding force of enhancing composition and bonded thing, the bright tackifier that also added in composition of this law, tackifier strengthen the cohesive strength between composition and the adherend by the wetting bonding surface of surface diffusion.
Composition according to aforementioned formula combines when it is coated in the adherend surface, can form stable organic screen film on the adherend surface, can protect the adherend surface not to be subjected to the interference of outside atmosphere.The organic screen film can be removed at normal temperatures simultaneously, and is easy to clean.The present invention is applied to composition the preparation of diamond fretsaw, can form the organic screen film that contains regular hole on the diamond fretsaw surface, in electroplating process, diamond particles only is bonded on the embryo line with hole, the diamond regular array, wire diameter that makes the diamond fretsaw that makes evenly, have a high cutting property.If the too high levels of tackifier, then the organic screen film is difficult to remove; If the content of binding agent is excessively low, then the bonding force of organic screen film and adherend is lower, easily comes off.If the content of stablizer and stopper is excessively low, then the unstable chemcial property of composition condenses together easily, causes forming organic screened film.
Further, when composition comprises the α cyanacrylate of 90wt%, during the stopper of the tackifier of 5wt%, the stablizer of 2wt%, 3wt%, the chemical property of composition is more stable, and adhesive property is better, and shield effectiveness is better.
Further, tackifier are Gum Rosin; Stablizer is lead sulfate tribasic; Stopper is tert-butyl catechol.Stopper adopts tert-butyl catechol, and polymerization inhibition effect is good at normal temperatures, when temperature is higher, does not just produce polymerization inhibition effect, makes composition can be solidified into the organic screen film.Tackifier are Gum Rosin, and are similar to the solubleness of α cyanacrylate, and Efficient Adhesive Promotion is good.Stablizer adopts lead sulfate tribasic, can improve α cyanacrylate stability at normal temperatures.
Another aspect of the present invention also provides a kind of preparation method of diamond fretsaw, may further comprise the steps:
Apply screened film: aforesaid composition is coated in the surface of embryo line, makes composition form the organic organic screen film with regular hole on embryo line surface by curing schedule, obtain having the embryo line of organic screen film;
Electroplate: diamond particles is attached to the hole place of the embryo line with organic screen film by plating, obtains having the diamond fretsaw of organic screen film;
Remove the organic screen film: the diamond fretsaw that will have the organic screen film is immersed in to be removed the organic screen film and obtains the diamond fretsaw first product in the organic solvent;
Reinforce and electroplate: the diamond fretsaw first product is reinforced plating step obtain diamond fretsaw.
The diamond arrangement is irregular in the prior art, wire diameter is inhomogeneous, working accuracy is poor in order to solve in the present invention, the technical problem that the diamond cutting utilization ratio is low, at embryo line surface brush one deck organic screen film, this organic screen film has the space of certain rule, then makes the organic screen film firmly be bonded in the surface of embryo line by curing schedule.Because the scroll saw surface has the organic screen film, in electroplating process, diamond can only stick in the space of organic screen film, and can not stick on the organic screen film, make the diamond particles rule be distributed in the embryo line around, obtain that diamond regular array, wire diameter are even, the electroplating diamond wire saw of high cutting property.Simultaneously in electroplating process, because electroplating temperature is low, electroplating time is short, and sand and reinforcing process always can destroyed or dissolvings on diamond for the organic screen film, prevent that electroplate liquid from polluting.Then with organic solvent the organic screen film around the diamond fretsaw is dissolved, do not affect the bonding force of diamond particles and embryo line, the residual quantity of organic screen film is little.The diamond fretsaw first product is reinforced plating step obtain electroplating diamond wire saw, diamond particles can firmly be bonded in the surface of embryo line, further strengthens the bonding force of diamond and embryo line.According to the diamond fretsaw of method preparation of the present invention, diamond particles can be regularly arranged, and the density of diamond particles can be adjusted by the gap of control organic screen film; Regularly arranged diamond fretsaw cutting utilization ratio is higher, and stria is more shallow, and working accuracy is higher.
Further, the embryo line is the steel wire of 0.12 ~ 0.44mm; The particle diameter of diamond particles is 6 ~ 60 μ m, and the thickness of organic screen film is 1 ~ 5 μ m.
Further, aforementioned preparation method also comprises cleaning step, and cleaning step is for to carry out deoiling step with embryo line and diamond particles in strong base solution, and then the step that eliminates rust in strong acid solution again after the rinsing carries out coating step.Embryo line and diamond particles are carried out cleaning step, remove the impurity on diamond particles and embryo line surface, make the organic screen film be bonded in better embryo line surface, guarantee simultaneously diamond particles in electroplating process with the bonding force of embryo line.
Further, strong base solution is Na (OH) solution of 5 ~ 10wt%, and strong acid solution is the chloroazotic acid of 2 ~ 5wt%, and embryo line and diamond fretsaw are not had corrodibility, do not affect the performance of embryo line and diamond particles, can guarantee to remove the oil stain on embryo line and diamond particles surface, dirty rust.
Further, the solidification value of curing schedule is 80 ~ 100 ℃ to be made, and can make the stopper in the composition lose polymerization inhibition effect, and composition can solidify rapidly on embryo line surface, forms stable organic screen film, guarantees the bonding force of organic screened film and embryo line.
Further, organic solvent is acetone in the step 3.Each component all can be dissolved in the acetone soln in the organic screen film, can rapidly the dissolving of organic screen film be removed at normal temperatures, and removal effect is good.
Further, plating step makes the unscreened gap of being arranged in of diamond rule for the embryo line that will have the organic screen film carries out composite electroplating with 5 ~ 20m/min speed by upper sand launder under 40 ~ 50 ℃.Because temperature is lower in the electroplating process, upper sand speed is fast, and the organic screen film can destroyed or dissolving in sand and the reinforcing process on diamond.If excess Temperature, upper sand speed is excessively slow, and then the organic screen film is destroyed, can't be at the diamond particles of embryo line coating surface regular distribution.
Embodiment
Below be that raw material and instrument used among the embodiment is commercially available.
Embodiment 1
Composition 1 comprises the α cyanacrylate of 95wt%, the tackifier of 3wt%, the stablizer of 1wt%, the stopper of 2wt%.
(1), to get diamond particles and the diameter that granularity is 10～20 μ m be the steel wire of 0.12mm, deoils through 10%Na (OH) aqueous solution, then the clear water rinsing, with 5% chloroazotic acid pickling, is removed surface impurity and is obtained clean diamond particles and steel wire.
(2), composition 1 is coated in clean steel wire surface, be heated to 80 ℃, making composition 1 form the thickness with regular hole on embryo line surface is the organic screen film of 1 μ m, obtains having the steel wire of organic screen film.
(3), the steel wire that will have an organic screen film under 40 ℃ with 20m/min speed by plating tank, make the diamond fretsaw that unscreened hole place in the steel wire obtains having the organic screen film that is arranged in of clean diamond rule.
The diamond fretsaw that (4), will have an organic screen film is placed on to be removed the organic screen film and obtains the diamond fretsaw first product in the acetone.
(5), the diamond fretsaw first product is reinforced plating step and obtain diamond fretsaw.
Embodiment 2
Composition 2 comprises the α cyanacrylate of 90wt%, the tackifier of 5wt%, the stablizer of 2wt%, the stopper of 3wt%.
(1), to get granularity be that the diamond particles of 40～50 μ m deoils through 10%Na (OH) aqueous solution, then the clear water rinsing, with 5% chloroazotic acid pickling, is removed surface impurity and is obtained clean diamond particles.
(2) cut-off directly be the steel wire of 0.25mm as the embryo line, embryo line oil removing 2wt% acid pickling and rust removing activation treatment in the 5wt% alkaline solution is obtained clean firm line.
(3), composition 2 is coated in clean steel wire surface, be heated to 90 ℃, making composition 2 form the thickness with regular hole on embryo line surface is the organic screen film of 3 μ m, obtains having the steel wire of organic screen film.
(4), the steel wire that will have an organic screen film under 45 ℃ with 10m/min speed by plating tank, make the diamond fretsaw that unscreened hole place in the steel wire obtains having the organic screen film that is arranged in of clean diamond rule.
The diamond fretsaw that (5), will have an organic screen film is placed on to be removed the organic screen film and obtains the diamond fretsaw first product in the acetone.
(6), the diamond fretsaw first product is reinforced plating step and obtain diamond fretsaw.
Embodiment 3
Composition 3 comprises the α cyanacrylate of 85wt%, the tackifier of 8wt%, the stablizer of 3wt%, the stopper of 4wt%.
(1), to get granularity be that the diamond particles of 50～60 μ m deoils through 10%Na (OH) aqueous solution, then the clear water rinsing, with 5% chloroazotic acid pickling, is removed surface impurity and is obtained clean diamond particles.
(2) cut-off directly be the steel wire of 0.44mm as the embryo line, embryo line oil removing 2wt% acid pickling and rust removing activation treatment in the 5wt% alkaline solution is obtained clean firm line.
(3), composition 3 is coated in clean steel wire surface, be heated to 100 ℃, making composition 3 form the thickness with regular hole on embryo line surface is the organic screen film of 5 μ m, obtains having the steel wire of organic screen film.
(4), the steel wire that will have an organic screen film under 50 ℃ with 5m/min speed by plating tank, make the diamond fretsaw that unscreened hole place in the steel wire obtains having the organic screen film that is arranged in of clean diamond rule.
The diamond fretsaw that (5), will have an organic screen film is placed on to be removed the organic screen film and obtains the diamond fretsaw first product in the acetone organic solvent.
(6), the diamond fretsaw first product is reinforced plating step and obtain diamond fretsaw.
Comparative Examples 1
Do not apply organic screened film on the steel wire surface, all the other methods are carried out according to embodiment 1.
Comparative Examples 2
Do not apply organic screened film on the steel wire surface, all the other methods are carried out according to embodiment 2.
Comparative Examples 3
Do not apply organic screened film on the steel wire surface, all the other methods are carried out according to embodiment 3,
The diamond fretsaw of embodiment 1 ~ 3 and Comparative Examples 1 ~ 3 is carried out evolution to the polycrystal silicon ingot of 850 * 850 * 320mm, detect the cut channel of polycrystal silicon ingot at microscopically.
The diamond fretsaw of embodiment 1 ~ 3 and Comparative Examples 1 ~ 3 breaking force that stretches is detected.
Diameter to the diamond fretsaw of embodiment 1 ~ 3 and Comparative Examples 1 ~ 3 is measured.
Diamond fretsaw to embodiment 1 ~ 3 and Comparative Examples 1 ~ 3 carries out the cutting efficiency detection, detection method according to:: with the diamond fretsaw of embodiment 1 ~ 3 and Comparative Examples 1 ~ 3, take linear velocity as 2.5m/s, rate of feeding is 0.5mm/min, take water as heat-eliminating medium, be that the silicon rod of 100mm carries out the cutting of 250min to diameter, investigate and solidify scroll saw and examine cutting efficiency to silicon rod.
The detected result of cut channel, stretching breaking force and the wire diameter of embodiment 1 ~ 3 and Comparative Examples 1 ~ 3 diamond fretsaw is listed in the table 1.
The performance test results table of table 1 diamond fretsaw
| Embodiment | Wire diameter | The stretching breaking force | The cutting stria | Cutting efficiency |
| Embodiment 1 | 0.140mm±0005mm | >40 | 5-10μm | 1.0-1.2mm 2/min |
| Comparative Examples 1 | 0.140mm±005mm | >20；<40 | 10-15μm | 0.8-1.0mm 2/min |
| Embodiment 2 | 0.350mm±0005mm | >170N | 10-20μm | 2.0-2.5mm 2/min |
| Comparative Examples 2 | 0.350mm±005mm | >120；<170N | 20-30μm | 1.7-2.0mm 2/min |
| Embodiment 3 | 0.500mm±0005mm | >250N | 15~20μm | 2.2-2.8mm 2/min |
| Comparative Examples 3 | 0.500mm±005mm | >180；<250N | 25~35μm | 2.0-2.2mm 2/min |
From the experimental result of table 1 as can be known, according to the diamond fretsaw of method preparation of the present invention, the cut channel of polysilicon is starkly lower than the diamond fretsaw of not processing according to the inventive method, and working accuracy obviously improves; The deviation of wire diameter is less simultaneously, and its stretching breaking force of the diamond fretsaw of embodiment 1 ~ 3 and cutting efficiency are apparently higher than Comparative Examples 1 ~ 3.
Fig. 2 is the SEM figure of the diamond fretsaw of embodiment 1, and as we know from the figure, according to the diamond fretsaw of method preparation of the present invention, the diamond particles on its scroll saw surface is regularly arranged, and wire diameter is even.
Fig. 3 is the SEM figure of the diamond fretsaw of Comparative Examples 1, as we know from the figure, according to the diamond fretsaw of the method preparation of Comparative Examples 1, the diamond particles irregular arrangement on its scroll saw surface, wire diameter is inhomogeneous, and some places are excessively thick, and some places are meticulous.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a composition is characterized in that, comprises the α cyanacrylate of 85 ~ 95wt%, the tackifier of 3 ~ 8wt%, the stablizer of 1 ~ 3wt%, the stopper of 2 ~ 4wt%.
2. composition according to claim 1 is characterized in that, comprises the α cyanacrylate of 90wt%, the stopper of the tackifier of 5wt%, the stablizer of 2wt%, 3wt%.
3. composition according to claim 1 is characterized in that, described tackifier are Gum Rosin; Described stablizer is lead sulfate tribasic; Described stopper is tert-butyl catechol.
4. a method for preparing diamond fretsaw is characterized in that, may further comprise the steps:
Apply screened film: the described composition of claims 1 to 3 any one is coated in the surface of embryo line, makes composition form the organic screen film with regular hole on embryo line surface by curing schedule, obtain having the embryo line of organic screen film;
Electroplate: diamond particles is attached to described hole place with embryo line of organic screen film by plating, obtains having the diamond fretsaw of organic screen film;
Remove the organic screen film: described diamond fretsaw with organic screen film is immersed in removes the organic screen film in the organic solvent and obtain the diamond fretsaw first product;
Reinforce and electroplate: described diamond fretsaw first product is reinforced plating step obtain diamond fretsaw.
5. method according to claim 4 is characterized in that, described embryo line is the steel wire of diameter 0.12 ~ 0.44mm; The particle diameter of described diamond particles is 6 ~ 60 μ m, and the thickness of described organic screen film is 1 ~ 5 μ m.
6. method according to claim 4, it is characterized in that also comprise cleaning step, described cleaning step is for to carry out deoiling step with embryo line and diamond particles in strong base solution, then the step that eliminates rust in strong acid solution again after the rinsing carries out described coating step.
7. method according to claim 6 is characterized in that, described strong base solution is Na (OH) solution of 5 ~ 10wt%, and described strong acid solution is the chloroazotic acid of 2 ~ 5wt%.
8. method according to claim 4 is characterized in that, the solidification value of described curing schedule is 80 ~ 100 ℃.
9. method according to claim 4 is characterized in that, organic solvent is acetone described in the described removal organic screen film step.
10. method according to claim 4 is characterized in that, described plating step is with described diamond particles, carries out composite electroplating with 5 ~ 20m/min speed under 40 ~ 50 ℃, makes the unscreened embryo line of being arranged in of diamond rule gap.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539446.2A CN103031012B (en) | 2012-12-14 | 2012-12-14 | A kind of compositions and the method for preparing diamond fretsaw thereof |
| PCT/CN2013/088895 WO2014090125A1 (en) | 2012-12-14 | 2013-12-09 | Composition and method for preparing diamond wire saw using same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210539446.2A CN103031012B (en) | 2012-12-14 | 2012-12-14 | A kind of compositions and the method for preparing diamond fretsaw thereof |
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| CN103031012A true CN103031012A (en) | 2013-04-10 |
| CN103031012B CN103031012B (en) | 2016-06-15 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014090125A1 (en) * | 2012-12-14 | 2014-06-19 | 长沙岱勒新材料科技有限公司 | Composition and method for preparing diamond wire saw using same |
| JP2015009343A (en) * | 2013-07-01 | 2015-01-19 | ワイヤーエンジプロ合同会社 | Abrasive grain electrodeposition liquid, production method of abrasive grain fixed type saw wire and abrasive grain fixed type saw wire |
| CN113717560A (en) * | 2021-09-02 | 2021-11-30 | 湖南益缘新材料科技有限公司 | Composition for preparing diamond wire, preparation method and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105527117A (en) * | 2015-12-02 | 2016-04-27 | 成都理工大学 | Field in-situ sampling method for granular mixtures |
| CN110181698B (en) * | 2019-04-25 | 2021-04-23 | 南京大学连云港高新技术研究院 | Stable-structure diamond wire and preparation method thereof |
| CN114959841B (en) * | 2022-05-25 | 2023-07-14 | 石家庄雷力工具有限公司 | Electroplating tool and electroplating process of diamond rope saw |
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| WO2014090125A1 (en) * | 2012-12-14 | 2014-06-19 | 长沙岱勒新材料科技有限公司 | Composition and method for preparing diamond wire saw using same |
| JP2015009343A (en) * | 2013-07-01 | 2015-01-19 | ワイヤーエンジプロ合同会社 | Abrasive grain electrodeposition liquid, production method of abrasive grain fixed type saw wire and abrasive grain fixed type saw wire |
| CN113717560A (en) * | 2021-09-02 | 2021-11-30 | 湖南益缘新材料科技有限公司 | Composition for preparing diamond wire, preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014090125A1 (en) | 2014-06-19 |
| CN103031012B (en) | 2016-06-15 |
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