CN103003026B - 阴极保护的垫调理器及使用方法 - Google Patents

阴极保护的垫调理器及使用方法 Download PDF

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Publication number
CN103003026B
CN103003026B CN201180035149.8A CN201180035149A CN103003026B CN 103003026 B CN103003026 B CN 103003026B CN 201180035149 A CN201180035149 A CN 201180035149A CN 103003026 B CN103003026 B CN 103003026B
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CN
China
Prior art keywords
cathodic protection
pad conditioner
anode
metal substrate
conditioner device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180035149.8A
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English (en)
Chinese (zh)
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CN103003026A (zh
Inventor
V·J·拉雷
林文杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN103003026A publication Critical patent/CN103003026A/zh
Application granted granted Critical
Publication of CN103003026B publication Critical patent/CN103003026B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/001—Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Prevention Of Electric Corrosion (AREA)
CN201180035149.8A 2010-07-15 2011-06-24 阴极保护的垫调理器及使用方法 Active CN103003026B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/837,055 US8496511B2 (en) 2010-07-15 2010-07-15 Cathodically-protected pad conditioner and method of use
US12/837,055 2010-07-15
PCT/US2011/041843 WO2012009139A1 (en) 2010-07-15 2011-06-24 Cathodically-protected pad conditioner and method of use

Publications (2)

Publication Number Publication Date
CN103003026A CN103003026A (zh) 2013-03-27
CN103003026B true CN103003026B (zh) 2016-01-20

Family

ID=44628604

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180035149.8A Active CN103003026B (zh) 2010-07-15 2011-06-24 阴极保护的垫调理器及使用方法

Country Status (7)

Country Link
US (1) US8496511B2 (cg-RX-API-DMAC7.html)
JP (1) JP5972264B2 (cg-RX-API-DMAC7.html)
KR (1) KR20130128370A (cg-RX-API-DMAC7.html)
CN (1) CN103003026B (cg-RX-API-DMAC7.html)
SG (1) SG187009A1 (cg-RX-API-DMAC7.html)
TW (1) TWI531444B (cg-RX-API-DMAC7.html)
WO (1) WO2012009139A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9550247B2 (en) * 2013-07-18 2017-01-24 Aps Materials, Inc. Double coupon reference cell and methods of making same
JP7232763B2 (ja) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー スペーサ及びウェハ平坦化システムを有するパッドコンディショナ
EP3691830A4 (en) * 2017-10-04 2021-11-17 Saint-Gobain Abrasives, Inc. ABRASIVE ARTICLE AND ITS FORMATION PROCESS
US11490664B2 (en) * 2018-02-23 2022-11-08 Linderton Holdings, Inc. Supporting garments and sizing systems
EP3948702A4 (en) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. POWER LOOP SOLUTIONS
WO2020206382A1 (en) 2019-04-03 2020-10-08 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6203413B1 (en) * 1999-01-13 2001-03-20 Micron Technology, Inc. Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6264536B1 (en) * 2000-02-01 2001-07-24 Lucent Technologies Inc. Reducing polish platen corrosion during integrated circuit fabrication
CN1329681A (zh) * 1998-11-03 2002-01-02 纳托尔公司 电化学机械沉积的方法和装置
CN1531747A (zh) * 2001-03-14 2004-09-22 ���̡�Ӧ�ò��Ϲɷ����޹�˾ 以电化学机械研磨法进行基材平坦化
CN1562566A (zh) * 2004-04-06 2005-01-12 北京工业大学 金属结合剂砂轮在线电解磨削修整法及其装置
CN1585835A (zh) * 2001-11-13 2005-02-23 Acm研究公司 电解抛光组件以及对导电层执行电解抛光的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2817634A (en) 1953-09-22 1957-12-24 Texas Co Device for preventing corrosion
US3022234A (en) 1958-06-30 1962-02-20 Engelhard Ind Inc Cathodic protection of ships
US5352342A (en) 1993-03-19 1994-10-04 William J. Riffe Method and apparatus for preventing corrosion of metal structures
ZA9410384B (en) 1994-04-08 1996-02-01 Ultimate Abrasive Syst Inc Method for making powder preform and abrasive articles made therefrom
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
JP3665523B2 (ja) * 1999-12-28 2005-06-29 株式会社東芝 ドレッシング方法
US7276454B2 (en) 2002-11-02 2007-10-02 Taiwan Semiconductor Manufacturing Co., Ltd. Application of impressed-current cathodic protection to prevent metal corrosion and oxidation
CA2434986A1 (en) 2003-07-11 2005-01-11 G.I. Russell & Company Ltd. Method and apparatus for instrumental analysis in remote locations
US7125324B2 (en) 2004-03-09 2006-10-24 3M Innovative Properties Company Insulated pad conditioner and method of using same
US7608173B2 (en) 2004-12-02 2009-10-27 Applied Materials, Inc. Biased retaining ring
JP2007537052A (ja) 2004-05-13 2007-12-20 アプライド　マテリアルズ　インコーポレイテッド 導電部を備えた保持リング
JP2008192749A (ja) * 2007-02-02 2008-08-21 Matsushita Electric Ind Co Ltd 研磨装置および研磨方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1329681A (zh) * 1998-11-03 2002-01-02 纳托尔公司 电化学机械沉积的方法和装置
US6203413B1 (en) * 1999-01-13 2001-03-20 Micron Technology, Inc. Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6264536B1 (en) * 2000-02-01 2001-07-24 Lucent Technologies Inc. Reducing polish platen corrosion during integrated circuit fabrication
CN1531747A (zh) * 2001-03-14 2004-09-22 ���̡�Ӧ�ò��Ϲɷ����޹�˾ 以电化学机械研磨法进行基材平坦化
CN1585835A (zh) * 2001-11-13 2005-02-23 Acm研究公司 电解抛光组件以及对导电层执行电解抛光的方法
CN1562566A (zh) * 2004-04-06 2005-01-12 北京工业大学 金属结合剂砂轮在线电解磨削修整法及其装置

Also Published As

Publication number Publication date
KR20130128370A (ko) 2013-11-26
CN103003026A (zh) 2013-03-27
US20120015589A1 (en) 2012-01-19
WO2012009139A1 (en) 2012-01-19
TWI531444B (zh) 2016-05-01
US8496511B2 (en) 2013-07-30
JP5972264B2 (ja) 2016-08-17
SG187009A1 (en) 2013-02-28
JP2013534734A (ja) 2013-09-05
TW201206628A (en) 2012-02-16

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