CN103002713B - Integrated fan motor and controller housing - Google Patents
Integrated fan motor and controller housing Download PDFInfo
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- CN103002713B CN103002713B CN201210340556.6A CN201210340556A CN103002713B CN 103002713 B CN103002713 B CN 103002713B CN 201210340556 A CN201210340556 A CN 201210340556A CN 103002713 B CN103002713 B CN 103002713B
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Abstract
The present invention relates to integrated fan motor and controller housing.Specifically, a kind of electronic device cooling system includes tubulose fan conduit and electronics housing.Tubulose fan conduit has fan conduit case, and fan conduit case accommodates fan, and fan has rotor blade and stator vanes.Electronics housing is directly installed on tubulose fan conduit so that electronics housing encloses inner space together with fan conduit case.Cooling air flow path extends into inner space from the high pressure region of tubulose fan conduit by ingate and out and enters surrounding from porus excretoriuses.Electronic device cooling system also includes three electronic device supports being arranged in inner space.First electronic device support is located immediately adjacent ingate, on fan conduit.Second electronic device support is positioned at next-door neighbour's radial outside of stator vanes, on fan conduit.3rd electronic device support is located immediately adjacent porus excretoriuses, on housing.
Description
Cross-Reference to Related Applications
The application is the continuous application part of the U.S. Patent application No. 13/050509 that on March 17th, 2011 submits to,
This is incorporated by reference into this U.S. Patent application.Also by being incorporated by the United States Patent (USP) that Pal et al. on March 21st, 2011 submits to
Application No. 13/052837.
Technical field
This invention relates generally to electronic device cooling, and more particularly relate to the air of fan motor controller
Cooling.
Background technology
Fan is generally used for dispersing heat from electronic unit, thus avoids the inefficacy of part and the life-span of elongate member.
Electronic unit in some aircrafts（Including motor controller）It is usually located at the motor controller housing being arranged on blower-casting
In.Routinely, the air stream being circulated with neighbouring fan is cooling down the electronics device being arranged in these motor controller housings
Part.The region of some this cooling system fan conduits from fan downstream by relatively cool air turns to, and makes this air
Through housing, then release in environment at floss hole in the housing.Other conventional cooling systems are by means of case
In outlet suck air for cooling from environment, and by means of air flue, this air is aspirated through housing, this sky
Gas path is close to the region of the fan conduit of upstream from housing to fan.In aircraft, provide the fan of cooling air stream permissible
It is a part for air manager system.For comparing total air stream volume of fan, the amount for the air of cooling is generally little（Logical
Often in 2% magnitude）, thus not upsetting normal fan functionality, such as cabin or washroom air circulation or be used for
Electronic compartment cools down.
Conventional Ian motor control device assembly includes the box-like fan motor controller housing with flat pedestal, this flat base
Seat is installed to adjacent cylindrical fan conduit via middle hot interface, which increases cost and the weight of total assembly.Separately
Outward, many fan motor controller housings include the mechanical fin being arranged in high heat nearby components, to increase cooling surface area.
These fins also increase cost and the weight of total assembly.
It is usually expected that taking up room of fan motor controller hardware is as little as possible.However, heating electronic device
Any increase of packaging density all makes it necessary to radiating is improved accordingly, to avoid excessive component degradation.Therefore,
Need a kind of fan motor controller housing that can increase cooling in the case of lower cost and weight.
Content of the invention
The present invention relates to a kind of electronic device cooling system, it includes tubulose fan conduit and electronics housing.Described
Tubulose fan conduit has a fan conduit case, and described fan conduit case accommodates fan, described fan have rotor blade and
Stator vanes.Described electronics housing be directly installed on described tubulose fan conduit so that described electronics housing and
Described fan conduit case encloses inner space together.Cooling air flow path is from the high-pressure zone of described tubulose fan conduit
Domain extends into described inner space by ingate and out and enters surrounding from porus excretoriuses.Described electronic device is cold
But system also includes three electronic device supports being arranged in described inner space.First electronic device support is located immediately adjacent
Described ingate, on described fan conduit.The next-door neighbour footpath that second electronic device support is positioned at described stator vanes is outside
Side, on described fan conduit.3rd electronic device support is located immediately adjacent described porus excretoriuses, on described housing.
Brief description
Fig. 1 is the perspective view of fan motor controller assemblies.
Fig. 2 is the sectional view of the fan motor controller assemblies of Fig. 1.
Fig. 3 is the perspective view of the fan conduit of fan motor controller assemblies of Fig. 1.
Fig. 4 is the transparent perspective view of the fan motor controller assemblies of Fig. 1, shows in fan motor controller housing
Part.
Fig. 5 A and 5B is the perspective view of a panel of the fan motor controller housing of Fig. 4.
Fig. 6 is the transparent perspective view of another panel of fan motor controller housing of Fig. 1.
Specific embodiment
Fig. 1 is the perspective view of fan motor controller assemblies 10.Fan motor controller assemblies 10 include housing 12 and wind
Fan conduit 14.Housing 12 is the box like structure accommodating motor controller electronic unit, and described electronic unit produces heat.Housing 12
Formed by rigidity, Heat Conduction Material, for example aluminum.Fan conduit 14 is to accommodate fan（See Fig. 2）Substantially cylindrical conduit, this fan
Drive air in activation along airflow direction, in fan conduit 14, thus produce the region of high and low relative pressure（See Fig. 2
Lower section）.Fan conduit 14 can be used, for example, the aluminum tubular conductor of aircraft air management system, such as cabin or washing room air and leads
Pipe or electronic device cooling air source.
As illustrated, housing 12 be made up of 16, two front/rear panels 18 of a top panel and two side panels 20 five
Face structure.Top panel 16 and side panel 20 are substantially rectangle, and front/rear panel 18 is shaped as the phase meeting fan conduit 14
The cylinder on adjacent surface.In the embodiment shown, front/rear panel 18 is the panel in eight faces.In other embodiments, front/rear
Panel 18 can have the other shapes on the surface meeting fan conduit 14.In certain embodiments, such as two side panels 20
Like that, both front/rear panels 18 are also identical.In other embodiments, each panel can show little difference, for example, exist
Cooling or attachment hole（It is discussed below）Position in.As fan conduit 14, panel 16,18 and 20 is by the rigid thermal conductivity bodily form
Become, such as aluminum or aluminum alloy.In certain embodiments, each panel 16,18 or 20 is single part.In other embodiments,
Some subsets of panel 16,18 and 20 can be cast or welded together become single-piece.
Housing 12 forms the inner space of closing together with fan conduit 14.Housing 12 can be bolted or soldered to fan conduit
14.In certain embodiments, one or more of panel 16,18 or 20 is removable, thus allowing to access in housing 12
The electronic unit in portion.Despite substantially cylindrical, but as shown in Figure 3 and below with reference to described by Fig. 3, fan conduit 14
Including the flat lateral parts overlapping with the position of housing 12.
Fig. 2 is the sectional view of the motor control device assembly 10 of the cutting line 2-2 through Fig. 1.As explained above, motor control
Device assembly 10 processed includes housing 12 and fan conduit 14.Fan conduit 14 comprises rotor blade 22 He in conduit enclosure 26
Stator vanes 24.Although illustrate only rotor blade 22 and the one-level of stator vanes 24, some embodiments may include multistage
Alternate rotor blade and stator vanes.Discuss as mentioned above for Fig. 1, housing 12 has by conduit enclosure 26 and panel
16th, the inner space 28 of 18 and 20 formation.In certain embodiments, as shown in Figure 3 and below with reference to described by Fig. 3, lead
The part of the restriction inner space 28 of shroud shell 26 includes substantially flat surface, and it deviate from the substantial cylindrical of fan conduit 14
Shape.Fan conduit 14 passes through ingate 30a and 30b（Collectively referenced as ingate 30）It is fluidly connected to inner space 28, and
And inner space 28 is fluidly connected to environment by porus excretoriuses 32.Ingate 30 is to be led by fan at high pressure position
The outside casting of pipe 14 or the hole getting out.Air deflection from ingate 30 go out fan conduit 14 and enter inner space 28 with
Cooling electronic device.Multiple porus excretoriuses 32 are located on panel 18 and 20, with from inner space 28 air-out.As below with reference to figure
4th, described by 5A, 5B and 6, porus excretoriuses 32 are dexterously positioned passes through electronic unit to aspirate air.By ingate 30a and
The air that 30b turns to from fan conduit 14 enters and circulates throughout inner space 28, thus cooling down its interior electronic unit, so
Left by porus excretoriuses 32 afterwards.Air is discharged to surrounding from porus excretoriuses 32（It is in low relative pressure）.In some enforcements
In example, porus excretoriuses 32 also are present in panel 16.
Housing 12 accommodates various heat generating component and provides cooling to it, and described electronic unit includes insulated gate bipolar
Transistor（IGBT）Module 100, autotransformer rectifier unit（ATRU）102nd, interphase transformer（IPT）104 and sensing
Device 106.In many examples, other electronic units of such as various types of printed substrates also be located in housing 12 so that
Cooling.In addition, as described in below with reference to Fig. 4 and 6, some electronic units are arranged on side panel 20.As illustrated, IGBT mould
Block 100 and ATRU 102 are arranged on conduit enclosure 26, and by from the sky being discharged into inner space 28 by ingate 30
The direct air cooling of gas（Convection current）And it is cold by the indirect air in the main air flow of fan conduit 14 for the conduit enclosure 26
But（Conduction）Combination cooled down.As described in below with reference to Fig. 4,5A, 5B and 6, IPT 104, induction apparatuss 106 and be arranged on
It is cooled that miscellaneous part on panel 16,18 and 20 mainly passes through direct air cooling.
IGBT module 100 is directly installed on fan conduit case 26.IGBT module 100 is by the sky from ingate 30a
The cooling of airflow convection ground, and by fan conduit case 26 and stator vanes 24 via the main air flow using fan conduit 14
Indirect air cooling conductively cooled down.In the embodiment shown, there are six ingate 30a, each its stator vanes 24 weight
Serve as cooling fins, the surface area of increase is provided, so that heat is scattered in the air stream of fan conduit 14.
The air turning to from fan conduit 14 passes by and around ATRU 102 and flows, and provides direct air cooling.At one
In embodiment, as described by U.S. Patent application No. 13/050509, ATRU 102 can be by being arranged on conduit enclosure 26
On supporting construction support light weight transformator, the application is the continuous application part of this U.S. Patent application.Real at other
Apply in example, ATRU 102 can be the conventional transformer assembly in hot potting.ATRU 102 includes air duct, leads from fan
The air in the high pressure region of pipe 14 can pass through this air duct to cool down ATRU 102.In certain embodiments, these are empty
Gas passage and ingate 30b converge so that inner space 28（Low relative pressure）High pressure region with fan conduit 14（Gao Xiang
To pressure）Between pressure differential suction air pass through ATRU 102.
By IGBT module 100 and ATRU 102 are directly installed on fan conduit case 26, fan motor controller
Assembly 10 can provide to two parts and sufficiently cool down, and do not rely on heavy between electronic unit and fan conduit 14
Hot interface.In addition, by stator vanes 24 as cooling fins make need not be independent finned heat exchanger, thus not dropping
Reduce quality further in the case of low cooling capacity.
Fig. 3 is the perspective view of fan conduit 14, shows fan conduit case 26, and it has ingate 30（Including entrance
Hole 30a and ingate 30b）, flat bearing 34, hot interface 36 and attachment hole 38.As mentioned above for Fig. 1 and 2 description, fan is led
Shroud shell 26 defines the outside of fan conduit 14, and ingate 30 provides by inner space 28（See Fig. 2）Cooling
Air stream.Attachment hole 38 is rivet hole or screw hole, and it allows front/rear panel 18 and side panel 20 to be bolted to fan conduit cover
Shell 26.In certain embodiments, by backing out bolt or screw from attachment hole 38, some panels 18 and 20 can be removable
's.As previously mentioned, some panels 18 and 20 can be welded on the appropriate location on fan conduit case 26.
Flat bearing 34 provides the conduction platform for the such as electronic unit of IGBT 100 and ATRU 102.By putting down
Bearing 34 be casted in fan conduit case 26, fan motor controller assemblies 10 it can be avoided that using conventional, detached,
Flat electronic device platform, it is connected to the cylindrical surface of fan conduit case 26 by heavy hot interface.Therefore, flat
Bearing 34 provides the more directly conduction cooling of electronic unit, and allows to reduce fan motor controller assemblies 10 simultaneously
Gross mass.Some embodiments of fan motor controller assemblies 10 also include one or more hot boundary layers 36, and it can be such as
It is conventional conductive material（For example, Thermstrate）Heat pad.Hot boundary layer 36 is thin and light weight, and defines
Hot interface between electronic unit and fan conduit case 26, it will not dramatically increase the matter of fan motor controller assemblies 10
Amount.
Fig. 4 is the transparent perspective view of fan motor controller assemblies 10, shows to be arranged in inner space 28 and is in face
Part on plate 18 and 20, including IPT 104, induction apparatuss 106, differential mode（DM）Induction apparatuss 108, resistor 110, capacitor 112
With multiple printed substrates and other electronic units.As described previously, fan motor controller assemblies 10 include housing 12
With fan conduit 14.Housing 12 is formed by 16, two front/rear panels 18 of top panel and two side panels 20, and is drained
Hole 32（Including porus excretoriuses 32a, 32b, 32c and 32d）Penetrate.IPT 104 and induction apparatuss 106 are arranged on a front/rear panel 18
On, and DM induction apparatuss 108, resistor 110 and capacitor 112 are arranged on a side panel 20.These parts are by by panel
18 or 20 heat loss through conduction and flow through or pass through electronic unit direct air stream cool down.Some parts（Such as electric capacity
Device 112）Need few cooling or do not need to cool down.Miscellaneous part（Such as IPT 104 and induction apparatuss 106）Allow for dissipating
The degeneration to minimize part for the substantial amounts of heat.Porus excretoriuses 32 in panel 16,18 and 20 from inner space 28 air-out, thus
Produce and pass through inner space 28 from fan conduit 14 and enter the continuous coo1ing air stream environment.Specifically, porus excretoriuses 32a leads to
Cross top panel 16 air-out, porus excretoriuses 32b and 32c passes through front/rear panel 18（Fig. 5 A and 5B seeing below）Air-out, and
And porus excretoriuses 32d passes through side panel 20（The Fig. 6 seeing below）Air-out.Porus excretoriuses 32b be located at IPT 104 installation site with
Suction air passes through IPT 104, to obtain enhanced direct air cooling.Porus excretoriuses 32c is located at the installation position of induction apparatuss 106
Put and pass through induction apparatuss 106 similarly to aspirate air, to obtain direct air cooling.Porus excretoriuses 32d is located at fan conduit 14
Near, and provide air stream to pass through side panel 20, but it is not on DM induction apparatuss 108 or the installation site of resistor 110,
Because these parts compare IPT 104 or induction apparatuss 106 need less cooling.In a word, porus excretoriuses 32 suction air pass through must
Must be dissipated the electronic unit of most heats, and is arranged on miscellaneous part on panel 16,18 and 20 only by space 28 internally
And by the general air stream cooling of inner space 28.Therefore, porus excretoriuses 32 are dexterously positioned and are directly passed through to provide
Need the air stream of the part of cooling.In the embodiment shown, porus excretoriuses 32a, 32b and 32d and ingate 30a is a diameter of
0.2 inch（5.1 mm）Circular hole, porus excretoriuses 32c is a diameter of 0.125 inch（3.2 mm）Circular hole, and ingate 30b
It is 0.312 × 0.188 inch（7.9×4.8 mm）Kidney shape hole.In nature, the size of ingate 30 is selected to do not cutting
It is, by making the air of surplus turn to, the cooling that motor controller electronic device provides abundance in the case of the operation of weak fan
Air stream.Ingate 30 only makes about 2% of the air stream by fan conduit 14 to turn to, the shadow of this operation for fan
Sound is negligible.Although the size of porus excretoriuses 32 is not critical, both ingate 30 and porus excretoriuses 32 must be sufficiently large
To avoid being blocked by dust or chip, and sufficiently small so that air stream concentrates on around heat-generating electronic device.Secondly, excretion
Hole 32 provides the device for discharging dampness during starting from fan motor controller assemblies 10.
Fig. 5 A and 5B is the perspective view of a front/rear panel 18 of housing 12.Fig. 5 A shows the outside of front/rear panel 18
View, and Fig. 5 B shows the inner side of front/rear panel 20.Front/rear panel 18 has porus excretoriuses 32b and 32c, and supports IPT
104 and induction apparatuss 106.
Each IPT 104 includes multiple winding cores 114, and multiple winding cores 114 are separated by space 116, space 116 and excretion
Hole 32b overlaps.Environment（Low relative pressure）With inner space 28（High relative pressure）Between pressure differential suction cooling air lead to
Cross space 116 and go out via porus excretoriuses 32b.Cold with respect to the convection current of the general air circulation in inner space 28
But, for, this directly provides enhanced cooling by the air stream of IPT 104.
Front/rear panel 18 includes inductor support 40, namely platform, induction apparatuss 106 be attached to inductor support 40 so that
Cooled down.Inductor support 40 includes multiple induction apparatuss air flues 42, and it extends to porus excretoriuses 32c from inner space 28.
Air is aspirated through air flue 42 and by between environment previously discussed and inner space 28 from inner space 28
Pressure differential flows out porus excretoriuses 32c.For the convection current from the general air circulation in inner space 28 cools down, cooling
Air provides enhanced cooling by the flowing of induction apparatuss air flue 42 for induction apparatuss 106.
Air is aspirated through space 116 and induction apparatuss air flue 42 by the positioning of porus excretoriuses 32b and 32c, thus not
Increased possible from IPT 104 and induction apparatuss 106 in the case of the quality dramatically increasing fan motor controller assemblies 10
Radiating.
Fig. 6 is the transparent perspective view of a side panel 20 of housing 12.Side panel 20 has porus excretoriuses 32d and supports DM
Induction apparatuss 108, resistor 110 and capacitor 112.Capacitor 112 produces insignificant heat.DM induction apparatuss 108 and resistor
110 is substantial heat generating device, and it must be cooled to avoid parts damages and to minimize degeneration.Different from IPT 104 or
Induction apparatuss 106, DM induction apparatuss 108 and resistor 110 are only cooled down by the recycled air stream in inner space 28；Porus excretoriuses 32d position
Near the intersection of side panel 20 and fan conduit case 26, thus not aspirating cooling air to pass through DM induction apparatuss 108 or electricity
Resistance device 110.In the alternate embodiment of the extra cooling of expectation, as described in regard to porus excretoriuses 32b and 32c in Fig. 5 A and 5B,
Electronic unit and porus excretoriuses 32d can be relocated to overlap.In the embodiment shown, porus excretoriuses 32a, 32b, 32c and 32d is common
With the air circulation providing by inner space, the electronic unit of its direct cooling heat producing.By the air circulation of inner space.
Fan motor controller assemblies 10 provide convection current and conduction cooling for electronic unit, and described electronic unit includes
IGBT module 100, ATRU 102, IPT 104, induction apparatuss 106, DM induction apparatuss 108 and resistor 110.Hotter part is by quilt
Via the air stream cooling by this part or in this nearby components for the ingate 30a and 30b and porus excretoriuses 30b and 30c guiding.
Most heats of the electronic unit in IGBT module 100 and ATRU 102 generation fan motor controller assemblies 10, and and wind
The fan conduit case 26 of fan conduit 14 directly thermally contacts, and wherein, stator vanes 24 serve as cooling fins with big surface area
Upper radiating.The position of the part in fan motor controller assemblies 10, ingate and porus excretoriuses provides with respect to prior art
For enhanced cooling, and simultaneously reduce weight in the case of part is concentrated in less space.
Although reference（One or more）Example embodiment describes the present invention, but those skilled in the art will manage
Solution, can be variously modified in the case without departing from the scope of the present invention and can replace its element with equivalent.Separately
Outward, in the case of the essential scope without departing substantially from the present invention, can many modifications may be made so that concrete condition or material adapt to this
Bright teaching.Accordingly, it is intended that, the invention is not restricted to disclosed（One or more）Specific embodiment, but this
The bright all embodiments that will include being within the purview of the appended claims.
Claims (20)
1. a kind of electronic device cooling system, including：
Tubulose fan conduit, it has fan conduit case, and described fan conduit case accommodates fan, and described fan has rotor
Blade and stator vanes；
Electronics housing, it is directly installed on described tubulose fan conduit so that described electronics housing and described wind
Fan conduit enclosure encloses inner space together；
From the high pressure region of described tubulose fan conduit, described inner space and from porus excretoriuses out is entered by ingate
And enter the cooling air flow path of surrounding；
First electronic device installation site, it is located at and enters on described fan conduit, in described inner space and described in being close to
Oral pore；
Second electronic device installation site, it is located on described fan conduit, in described inner space and from described stator
Fin is radially closely outside；With
3rd electronic device installation site, it is located on described housing, in described inner space and is close to described porus excretoriuses.
2. electronic device cooling system as claimed in claim 1, wherein, described ingate guiding cooling air stream directly passes through
It is installed in the electronic device of described first electronic device installation site.
3. electronic device cooling system as claimed in claim 1, wherein, described stator vanes serve as cooling fins, and it is from quilt
The dissipation from electronic devices being arranged on described second electronic device installation site is in the main air flow path of described fan.
4. electronic device cooling system as claimed in claim 1, wherein, described porus excretoriuses suction cooling air directly passes through quilt
It is arranged on the electronic device of described 3rd electronic device installation site.
5. electronic device cooling system as claimed in claim 1, wherein, described 3rd electronic device installation site is located at described
So that described in described porus excretoriuses suction cooling air cools down by described platform and be installed on the platform that porus excretoriuses are passed through
The electronic device of the 3rd electronic device installation site.
6. a kind of fan motor controller assemblies, including：
Tubulose fan conduit, it has fan conduit case, and described fan conduit case accommodates fan, and described fan has rotor
Blade and stator vanes；
Electronics housing, it is directly installed on described tubulose fan conduit so that described electronics housing and described wind
Fan conduit enclosure encloses inner space together；
Multiple ingates, it passes through described tubulose fan conduit, and the high pressure region of described tubulose fan conduit is fluidly connected
It is connected to described inner space；
Multiple porus excretoriuses, it passes through described electronics housing, described inner space is fluidly connected to environment, is consequently formed
From described tubulose fan conduit, surrounding is come out to described inner space and from described porus excretoriuses by described ingate
Air flow path；And
It is arranged in the multiple electronic units in described inner space, the plurality of electronic unit includes：
First electronic unit, it is arranged on described tubulose fan conduit, and serves as cooling by using described stator vanes
Fin passes through described fan conduit and is conductively cooled down to reject heat in the main air flow flow path of described fan；With
Second electronic unit, it is arranged in described electronics housing, positioned at the position of at least one of described porus excretoriuses
Place, and convectively cooled down via by the air stream of described porus excretoriuses.
7. fan motor controller assemblies as claimed in claim 6, wherein, the plurality of electronic unit also includes the 3rd electronics
Part, described 3rd electronic unit is arranged on described tubulose fan conduit, positioned at the position of at least one of described ingate
Put place, and convectively cooled down via by the air stream of described ingate.
8. fan motor controller assemblies as claimed in claim 7, wherein, the institute that described electronics housing is mounted thereon
At least a portion stating fan conduit case forms flat bearing, and wherein, described first electronic unit and described 3rd electricity
Subassembly is arranged on described flat bearing.
9. fan motor controller assemblies as claimed in claim 7, wherein, described 3rd electronic unit is closely arranged on institute
State at least one of ingate so that the air entering described inner space is directly over described 3rd electronic unit.
10. fan motor controller assemblies as claimed in claim 7, wherein, described 3rd electronic unit is autotransformer
Rectifier unit.
11. fan motor controller assemblies as claimed in claim 6, wherein, described first electronic unit is insulated gate bipolar
Transistor modular.
12. fan motor controller assemblies as claimed in claim 6, wherein, described second electronic unit is induction apparatuss and change
One of depressor.
13. fan motor controller assemblies as claimed in claim 6, wherein, described second electronic unit is closely arranged on
So that being directly over institute via the air that described porus excretoriuses leave described inner space at least one of described porus excretoriuses
State the second electronic unit.
14. fan motor controller assemblies as claimed in claim 6, wherein, described second electronic unit is attached to described row
Let out the platform that at least one of hole extends through so that leaving the air of described inner space through institute via described porus excretoriuses
State platform to cool down described second electronic unit.
15. fan motor controller assemblies as claimed in claim 6, wherein, it is described fixed that described first electronic unit is arranged on
The just radial outside of sub- fin.
A kind of 16. methods for cooling down the electronic unit in inner space, described inner space is formed at electronics housing
And fan conduit between, described fan conduit has carried rotor blade and stator vanes, and methods described includes：
Air is drawn into described inner space by ingate and by the first electronic unit from described fan conduit, described
First electronic unit is arranged on described fan conduit and is located immediately adjacent described ingate；
Air is discharged into surrounding by porus excretoriuses and by the second electronic unit from described inner space, described second
Electronic unit is arranged in electronics housing and is located immediately adjacent described porus excretoriuses；And
By described stator vanes are rejected heat to by conducting in the main air flow of described fan conduit as cooling fins
Ground cooling the 3rd electronic unit, described 3rd electronic unit is arranged on described fan conduit and is positioned at described stator vanes
Next-door neighbour's radial outside.
17. methods as claimed in claim 16, wherein, enter described inner space and via described row via described ingate
Let out the air leaving in hole and define cooling air stream, described cooling air stream radiates from the 4th electronic unit, described 4th electronics
But part is arranged in described inner space is not located on described ingate or described porus excretoriuses.
18. methods as claimed in claim 17, wherein, other not neighbouring with electronic unit ingates and other porus excretoriuses have
Help described cooling air stream.
19. methods as claimed in claim 16, wherein, described first electronic unit is autotransformer rectifier unit.
20. methods as claimed in claim 16, wherein, described second electronic unit is insulated gate bipolar transistor module, and
And described 3rd electronic unit is one of induction apparatuss or transformator.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/233,855 US8593808B2 (en) | 2011-03-17 | 2011-09-15 | Integrated fan motor and controller housing |
| US13/233855 | 2011-09-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103002713A CN103002713A (en) | 2013-03-27 |
| CN103002713B true CN103002713B (en) | 2017-03-01 |
Family
ID=47930669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210340556.6A Active CN103002713B (en) | 2011-09-15 | 2012-09-14 | Integrated fan motor and controller housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103002713B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104584A (en) * | 1992-09-09 | 1994-04-15 | Hitachi Ltd | Cooler for electronic component |
| CN101004178A (en) * | 2003-12-31 | 2007-07-25 | 奇鋐科技股份有限公司 | Fan with central inlet gas |
| CN101166409A (en) * | 2006-10-16 | 2008-04-23 | 英业达股份有限公司 | Liquid-cooling heat radiator |
| CN101321450A (en) * | 2007-06-08 | 2008-12-10 | 星普科技股份有限公司 | Method for accelerated cooling of thin type electronic device by air suction mode |
-
2012
- 2012-09-14 CN CN201210340556.6A patent/CN103002713B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104584A (en) * | 1992-09-09 | 1994-04-15 | Hitachi Ltd | Cooler for electronic component |
| CN101004178A (en) * | 2003-12-31 | 2007-07-25 | 奇鋐科技股份有限公司 | Fan with central inlet gas |
| CN101166409A (en) * | 2006-10-16 | 2008-04-23 | 英业达股份有限公司 | Liquid-cooling heat radiator |
| CN101321450A (en) * | 2007-06-08 | 2008-12-10 | 星普科技股份有限公司 | Method for accelerated cooling of thin type electronic device by air suction mode |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103002713A (en) | 2013-03-27 |
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