JPH06104584A - Cooler for electronic component - Google Patents

Abstract

PURPOSE:To allow cooling even if the air flow path is narrow and the flow path resistance is high by fixing a centrifugal cooling fan directly to an electronic component thereby increasing suction pressure and delivery pressure. CONSTITUTION:A centrifugal fan 10 and a drive motor 6 therefor are fixed directly to an electronic component 7 requiring cooling. The centrifugal fan 10 comprises a shaft 3 for coupling a runner 1 to the motor 6, and a casing having an appropriate inner flow path. Air 9 is sucked through suction ports 4 on the opposite sides of the casing 2 and flows in parallel with the shaft 3 into the fan and then blown out downward through a blow-out port 5 made in the lower side of the casing 2. Consequently, the centrifugal fan 10 produces high pressure difference between suction pressure and delivery pressure. Furthermore, suction and delivery air flow is increased resulting in sufficient cooling.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts which generate a large amount of heat,
For example, the present invention relates to a cooling device such as a CPU of a computer or a laser diode.

[0002]

2. Description of the Related Art When there is an electronic component that requires a large amount of heat generation to be cooled, a radiator fin is attached to the electronic component, and at the same time, air is blown by a blower over the entire electronic device on which the electronic component is mounted to cool it. (JP-A-55-96661). Alternatively, when a blower is directly attached to the electronic component for cooling, the blower is an axial flow type (Japanese Patent Laid-Open No. 2-196454).

[0003]

When air is supplied to the entire electronic equipment to cool it, a part of the blown air flows to the electronic parts requiring cooling, which only contributes to the cooling, resulting in poor cooling efficiency. On the other hand, when an axial-flow blower is directly attached to an electronic component, a large blowing pressure cannot be obtained with an axial-flow blower.Therefore, if the electronic component is mounted at a high density, the air flow rate will decrease due to the resistance of the air flow path. , Can not be cooled sufficiently.

[0004]

In order to achieve the above object, the present invention directly attaches a centrifugal blower to individual electronic components.

[0005]

Since the centrifugal blower can increase the blowing pressure as compared with the axial flow blower, a large air flow rate can be obtained even if the air passage is narrow. Further, the blower directly attached to each electronic component effectively cools a portion of the entire system that generates a large amount of heat.

[0006]

FIG. 1 shows an embodiment of the present invention. In this embodiment, the centrifugal blower 10 is mounted on the electronic component 7 required for cooling.
And a motor 6 for driving the blower are directly attached. A plan view of this embodiment is shown in FIG. 2, and an exploded view thereof is shown in FIG. The centrifugal blower 10 comprises an impeller 1, a shaft 3 for connecting the impeller 1 to a motor 6, and a casing 2 having an appropriate internal flow path. The air flow 9 is
As indicated by a thick arrow in FIG. 1, a structure in which the air flows from the suction ports 4 on both sides of the casing 2 in parallel with the shaft 3 to be sucked by the blower and is blown downward from the blow-out port 5 on the lower surface of the casing 2. Has become. FIG. 4 is a characteristic diagram of the blower, where the line a shows the characteristic of the centrifugal type blower and the line b shows the characteristic of the axial flow type blower. As shown in this figure, the centrifugal blower can increase the pressure difference between suction and blowout as compared to the axial flow blower, so that each suction and blowout air passage has a narrow flow passage resistance, The air flow rate increases and sufficient cooling can be performed.

FIG. 5 is a cross-sectional view of a second embodiment of the present invention, in which a plurality of substrates 8 on which a plurality of electronic components 7 requiring cooling are mounted are stacked and mounted densely in an electronic device. In such a case, the upper space of the electronic component 7 becomes extremely narrow and the flow path resistance becomes large. However, in the centrifugal blower 10, even if the flow path resistance is large as shown in FIG. Since it is obtained, sufficient cooling can be performed. On the other hand, the axial flow type blower, which is the conventional cooling means, cannot essentially obtain a large differential pressure. Further, in addition to this, in the axial flow type blower, the mounting form is such that the air 9 is sucked in from above and blown out downward as shown in FIG. Increase and become even more disadvantageous. On the other hand, when the centrifugal blower is used, the suction is performed from the lateral direction as shown in FIG. 5, so that the flow resistance of the suction is small and the air flow rate can be increased.

FIG. 7 shows a third embodiment. In this embodiment, the centrifugal blower 10 is directly mounted on the electronic component 7, and the motor 6 for driving the blower is mounted on the substrate 8 along with the electronic component 7. . With such an arrangement, the blower 10 and the motor 6 can be attached even when the upper space of the electronic component 7 is narrow. Further, effective cooling can be performed by using a relatively large motor 6 having a high rotation speed and a high torque.

FIG. 8 shows a fourth embodiment. In the present embodiment, the plurality of centrifugal blowers 10 and the motor 6 are directly mounted on the electronic component 7 requiring cooling. Each individual motor drives one blower. Since the centrifugal blower 10 is smaller than the electronic component 7, a plurality of centrifugal blowers and motors can be attached to each electronic component in this way. Compared to the case where one blower is attached to one electronic component, the cooling capacity is improved, and even if one centrifugal blower or motor fails, cooling is performed with other blowers and motors. I can continue. Further, in this embodiment, two blowers are attached to one electronic component, but the number of blowers may be three or more.

FIG. 9 shows a fifth embodiment. In this embodiment, a plurality of centrifugal blowers 10 and a motor 6 for driving the blowers are directly mounted on the electronic component 7 requiring cooling, and one motor is two blowers. Are driving. In this way, by driving a plurality of blowers with a single motor, cooling can be continued even if one blower fails. Further, in this embodiment, four blowers and two motors 6 are attached to one electronic component, but the number of motors may be three or more,
Further, the number of blowers driven by each motor may be three or more.

FIG. 10 shows a sixth embodiment. In this embodiment, a plurality of centrifugal blowers 10 are directly mounted on the electronic component 7 that needs to be cooled. A motor 6 for driving the blower 10 is mounted on the substrate side by side with the electronic component 7, and each motor drives a plurality of blowers mounted on the plurality of electronic components 7. With this arrangement, the blower and the motor can be attached even if the upper space of the electronic component is narrow.
Further, effective cooling can be performed by using a relatively large motor 6 having a high rotation speed and a high torque. further,
A large number of electronic components can be cooled with a small number of motors. Further, in the present embodiment, each motor drives a total of two blowers, one mounted on each of the two electronic components 7, but one motor drives three or more blowers. May be driven to cool three or more electronic components, and a plurality of blowers driven by one motor may be provided for one electronic component.

In each of the blowers 10 shown in FIGS. 2, 7 to 10, a centrifugal blower is attached instead of the conventional axial flow blower.

FIG. 11 shows a seventh embodiment. In the present embodiment, the air 9 blown out from the blower 10 is returned to the blower 1 again.
In order to prevent the temperature of the air 9 from being locally sucked up and circulated in the same place as when it is sucked into 0 and the cooling is not sufficiently performed, a partition plate 12 is provided between the air outlet 5 and the air inlet 4 of the blower 10. Has been installed. This makes the air 9
Is not circulated locally, and cooling is performed efficiently.

FIG. 12 shows an eighth embodiment. In the present embodiment, the duct 13 sucks in low-temperature air at a place sufficiently distant from the electronic component 7 that needs to be cooled (for example, outside the housing of the electronic device on which the electronic component 7 is mounted), and the electronic component is cooled. It is blowing to 7. By doing so, the electronic component 7 can be reliably cooled.

[0015]

The present invention has the following effects.

(1) Since the electronic components are cooled by using the centrifugal blower, the suction pressure and the blowing pressure can be increased, and the cooling can be performed even when the air passage is narrow and the passage resistance is large.
As a result, high density mounting of electronic components becomes possible.

(2) Cooling efficiency is high because individual electronic components are directly cooled.

(3) Since the motor is placed beside the blower, the blower can be attached even if the upper space of the electronic component is narrower than that of the axial flow type. As a result, high-density mounting becomes possible.

(4) By attaching a plurality of blowers / motors to one electronic component, the cooling of the electronic components can be continued even if some of the blowers / motors fail.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a centrifugal fan that constitutes an electronic component cooling device of the present invention.

FIG. 2 is a plan view of the embodiment shown in FIG.

FIG. 3 is an exploded view of the embodiment shown in FIG.

FIG. 4 is a characteristic diagram of a centrifugal blower and an axial flow blower.

FIG. 5 is a sectional view showing a second embodiment of the electronic component cooling device.

FIG. 6 is a sectional view showing an example of a conventional electronic component cooling device.

FIG. 7 is a plan view showing a third embodiment of the electronic component cooling device.

FIG. 8 is a plan view showing a fourth embodiment of the electronic component cooling device.

FIG. 9 is a plan view showing a fifth embodiment of the electronic component cooling device.

FIG. 10 is a plan view showing a sixth embodiment of the electronic component cooling device.

FIG. 11 is a sectional view showing a seventh embodiment of an electronic component cooling device.

FIG. 12 is a sectional view showing an eighth embodiment of the electronic component cooling device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Centrifugal impeller 2, ... Casing, 3 ... Shaft, 4 ... Suction port, 5 ... Outlet port, 6 ... Motor, 7 ... Electronic component,
8 ... Substrate, 9 ... Air, 10 ... Centrifugal blower, 11 ... Axial blower.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Shigeo Ohashi Inventor Shigeo Ohashi 502 Jintamachi, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd.Mechanical Research Laboratory (72) Akemi Kono 502 Kintatecho, Tsuchiura-shi, Ibaraki Hitate Co., Ltd. Machinery Research Institute (72) Inventor Kazuo Sato 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd. (72) Inventor Toshio Hatada 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd.

Claims (1)

[Claims] 1. A blower for cooling electronic parts is a centrifugal type,
An electronic component cooling device, wherein the blower for cooling can be directly attached to an electronic component.