CN107615902A - Cooling component is laid along plate - Google Patents
Cooling component is laid along plate Download PDFInfo
- Publication number
- CN107615902A CN107615902A CN201680022610.9A CN201680022610A CN107615902A CN 107615902 A CN107615902 A CN 107615902A CN 201680022610 A CN201680022610 A CN 201680022610A CN 107615902 A CN107615902 A CN 107615902A
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- Prior art keywords
- component
- plate
- cooling
- liquid
- midpoint
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Example herein discloses a kind of system including plate and cooling component.The plate includes first surface, second surface and the midpoint between the first surface and the second surface, the electric component of the plate support on the first surface.The second surface of the cooling component along the plate is laid, and conveys cooling liquid to the electric component to the first surface by the midpoint from the second surface across the plate.The cooling component by the midpoint from the first surface across the plate to the second surface and from the electric component along delivery pathways be heated liquid.
Description
Technical field
With the global demand increase of data exchange, the size being applied on server and load also increase.Thus, service
Device, which produces, to be exponentially increased more high-power, therefore produces more heats.
Brief description of the drawings
In the accompanying drawings, similar numeral refers to similar part or module.Detailed description below referring to the drawings, wherein：
Figure 1A -1B show the perspective view of the example board according to the disclosure, the plate include cooling component with to electric component and from
Electric component conveys liquid；
Fig. 2A -2B show the perspective view of the example system according to the disclosure, and the system includes being arranged in server tray
Plate；
Fig. 3 A-3B show the perspective view of the example system according to the disclosure, and the otch that the system is included on cabinet is seen with facilitating
It is clear；
Fig. 4 A-4B show the perspective view of the example system according to the disclosure, and the system includes the multiple clothes being arranged in cabinet
Business device and manifold；
Fig. 5 shows the graphical representation of exemplary of the representative multiple air flow speed according to the disclosure；And
Fig. 6-7 shows to manufacture the example flow diagram of plate and cooling component, so that lower surface cloth of the cooling component along the plate
If.
Embodiment
Hybrid cooling system can be used for the heat in dissipation server.Hybrid cooling system uses liquid cooling and air
Both coolings are with the heat of dissipation electric component in server.However, many heats can be dissipated in air from liquid.
The air-flow of quantity and/or increase from cooling fan for increasing cooling fan is that purpose is that cooling down remedying for dissipation heat arranges
Apply.These remedial measures may result in many other problems, such as causes static discharge, fights for air gap suitably to cool down electricity
Noise in gas part, the vibration from cooling fan, burn into increase server etc..Further, since cooling fan is expulsion
The heat that dissipates needs to work much morely, and it is poorly efficient that heat is dissipated in air from liquid.
To solve these problems, system as disclosure is illustrated, the system lays lower surface of the cooling component along plate
To convey liquid to from electric component on the upper surface of said board.Cooling component is across between described two surfaces
Midpoint is with along delivery pathways cooling liquid.The liquid of heating is back transported to down by cooling component from upper surface across the midpoint
Surface.Laying cooling component along lower surface can allow the most of of cooling component surface area to be covered by the plate.Described in covering
Surface area can maximize the amount for the heat being discharged into the liquid of cooling component.Make to be discharged into the amount of the heat in liquid most
Bigization means that less heat is dissipated in air.Reducing the amount that heat dissipates in atmosphere allows cooling fan with lower
Rotation speed of the fan works so that cooling air circulates in the server.It can be used in addition, the heat being reduced in air dissipates
Cooling fan quantity minimize, so as to save the space in server.Further reduce the quantity of cooling fan and reduce wind
Fan rotating speed strengthens the reliability of cooling fan.On the whole, the cooling fan quantity of reduction and the fan speed reduced can drop
Low power consumption.
In another example, cooling component and plate are arranged in server tray.Cooling is laid on the lower surface of plate
Component can reduce the impedance of pallet and allow the server constructs for supporting bigger array.
Figure 1A -1B show the perspective view of example board 102, and the plate includes cooling component 108.Cooling component 108 is along plate 102
Lower surface 114 lay with to electric component 106 along delivery pathways cooling liquid.Electric component 106 is located at the upper surface of plate 102
On 104.Cooling component 108 across midpoint 112 by being routed to electric component 106.Cooling component 108 convey cooling liquid with
Heat energy is siphoned away from part 106.By this way, heat energy（Such as heat）It is inhaled into cooling liquid so as to produce heated liquid
Body.After heated liquid is produced, cooling component 108 is back across midpoint 112 and by heated liquid along delivery pathways
To the lower surface 114 of plate 102.Figure 1A -1B represent the server system in the data center for data exchange, calculating, storage etc.
System.Thus, the embodiment of server may include database server, mail server, file server, domain name system
（DNS）Server, printing server, the webserver, game server, application server, barrel server, blade type service
Device, LIST SERVER, the communication server, home server, media server, proxy server can carry out data exchange
Other kinds of computing device.Although Figure 1A -1B show that plate 102 is to include cooling component 108 and electric component 106, due to this
It is for illustrative purposes and be that embodiment should not be so limited.For example, plate 102 may include to be connected to cooling component 108
Connector and the heat exchanger above electric component 106.This is discussed in detail in figure below.
Plate 102 is printed circuit board (PCB), and the printed circuit board (PCB) carrys out mechanical support using the trace, pad or other features of conduction
With electrical connection electric component.Electrical connection on plate 102 is manufactured by etching copper sheet, and the copper sheet lamination is non-conductive
Substrate.Plate 102 includes the part for being used for operating server（Such as electric component 106）.Thus, in this embodiment,
Plate 102 is included for installation into the motherboard in server.Plate 102 includes at least two surfaces：Upper surface 104 and lower surface 114.
In one embodiment, plate 102 is included in the hole on surface 104 and 114, for being passed through by cooling component 108.It is alternative
Ground, cooling component 108 can be laid until upper surface 104 by the edge of plate 102.
Upper surface 104 and lower surface 114 can be also designated correspondingly throughout the figures as first surface and second surface.Surface 104 and 114
It is parallel each other, so as to upper surface 104 plane and lower surface 114 along same linear extension.Midpoint 112 is located at surface
Between 104 and 114.If each unlimited extension in surface 104 and 114, then it is assumed that midpoint 112 is on surface 104 and 114 2
Mid-plane between person.Thus, midpoint 112 is the image point in this mid-plane.
Electric component 106 on the upper surface 104 of plate 102 is separate devices or physical entity in server, is used
In influence electronics or its related field.For example, electric component 106 may include integrated circuit, semiconductor, memory module,
CPU（CPU）, process resource, application specific integrated circuit（ASIC）, controller, processor, chipset or other types
Hardware component.
Cooling component 108 be from to the carry fluids of electric component 106（Such as water）Conduit.Cooling component 108 passes through
Cooling liquid is delivered to electric component 106 from lower surface 114 across midpoint 112 to upper surface 104.After cooling liquid is conveyed,
Cooling component 108 is by the heat suction liquid from electric component.Heated liquid is cooled component 108 from upper surface
104 are carried to lower surface 114 across midpoint 112.Back across midpoint 112, lower surface 114 edge of the cooling component 108 along plate 102
The heated liquid of delivery pathways is simultaneously moved out server.Cooling component 108 may include for example pipe, passage, pipeline or other
Liquid can be carried to electric component by the physical arrangement of type, the structure from the lower surface 114 of plate 102 across midpoint 112
106.Although cooling component 108 is shown as a continuous part, because this is for illustrative purposes and be embodiment
Should not so it be limited.For example, cooling component 108 may include to lay along lower surface 114 and by the heat above electric component 106
The first component and second component that exchanger is connected.This is discussed in detail in figure below.
Figure 1A shows to be carried through the flowing of the liquid of cooling component 108 from the lower surface 114 of plate 102.Liquid across
Cooling component 108 is entered through in lower surface 114 by the midpoint 112 of plate 102.Cooling component 108 reach electric component 106 with
Convey cooling liquid.After conveying cooling liquid, heat is passed to liquid and cooled component 108 is taken away.Cooling component 108 will
Heated liquid passes through lower surface 114 of the plate 102 along delivery pathways to plate 102 from upper surface 104.
Figure 1B shows laying of the cooling component 108 on the lower surface 114 of plate 102.As illustrated, liquid is in cooling component
The upper surface 104 that plate 102 is arrived upwardly through plate 102 is carried in 108 along lower surface 114.The cooled component of heated liquid
108 deliver from upper surface 104 along lower surface 114.
Fig. 2A -2B show the perspective view of example server 202, and the server is included in the electricity on the upper surface 104 of plate
Gas part 106.Above electric component 106, first component 214 conveys cooling liquid into heat exchanger 218, and second component
216 liquid being heated from electric component 106 along delivery pathways.Connector 110 is connected to first component 214 and second component
216, to provide the discharge of entrance of the cooling liquid by first component 214 and heated liquid from second component 216.Service
The holding plate of device pallet 220, component 214 and 216 are laid along the lower surface of plate or downside.In this embodiment, the He of component 214
216 along the lower surface of plate（It is not shown）Lay, and between the base section and plate of server tray 220.Server support
Disk 220 uses the lower surface of plate（It is not shown）To lay the component 214 and 216 for liquid distribution.So, component 214 and 216
Can be the shape of rectangle or pipe to be coupled in the minimal clearance between the basal surface of the lower surface of plate and pallet 220.Plate bag
Hole or breakthrough point are included, component 214 and 216 may reach upper surface in the hole or breakthrough point across the midpoint 112 of plate
104.Alternatively, component 214 and 216 is from the edge of plate across midpoint 112.By the way that component 214 and 216 is arranged under plate
On surface, component 214 and 216 is not exposed to air-flow, and the heat that this allows to be discharged into the certain percentage in liquid is impacted most
It is small.Component 214 and 216 is considered as cooling component（Such as the cooling component 108 in Fig. 1）A part.Component 214 and 216
Cooling liquid is conveyed to electric component 106 and from electric component 106 along the heated liquid of delivery pathways, for the mesh of cooling
's.Server 202 includes preceding mask wall, and the preceding mask wall has the hole 114 for allowing air to be flowed into from outside.In addition, service
Device 202 may include fan（It is not shown）With the recyclegas in server 202 and provide air-flow.
Fig. 2A shows server 202 from rear visual angle, and wherein connector 110 is connected to first component 214 and second component
Both 216.Connector 110 includes being used for the protruding member for being connected to cabinet rear.Connector 110 is connected into cabinet rear to carry
For concentration point, inlet and outlet of the liquid from server tray to frame is guided herein.This embodiment is by below
It is discussed in detail in figure.Although Fig. 2A shows that connector 110 is connected to both components 214 and 216 as single part, because this is
It is for illustrative purposes that embodiment should not be so limited.For example, connector 110 can be separated to be respectively connected to
Each component 214 and 216.
Heat exchanger 218 is arranged on the top of electric component 106 on the upper surface 104 of plate, the heat exchanger include into
Mouthful and outlet with along delivery pathways liquid, for the purpose of cooling.Entrance is connected to first component 214 to receive coolant
Body.Cooling liquid is then siphoned away heat by heat exchanger 218 along delivery pathways from electric component 106.Heat exchanger 218
Outlet be connected to second component 216 to discharge or go out along delivery pathways heated liquid.Heat exchanger 218 be by heat from
The equipment that electric component 106 is delivered to cooling liquid, so as to which the heat being passed produces heated liquid.Heat exchanger 218
It may include the combination between thermal resistance material and thermal conducting material.In this embodiment, heat exchanger 218 is exposed to the table in air
Face includes thermal resistance material and heat exchanger 218 includes thermal conducting material exposed to the surface of electric component 106, so that from electrical part
Heat dissipation in part 106 to liquid maximizes.In another embodiment, heat exchanger 218 includes being laid in electrical part
The cooling coil of the top of part 106, for siphoning away the heat as caused by electric component 106.
Server tray 220 is used to accommodate plate, and the plate is provided with cooling component 214 and 216, the and of electric component 106
Heat exchanger 218.Server tray 220 includes shell, and the shell is used for accommodates plate and a variety of parts to form server
202.Thus, server tray 220 provides following structure, and server 220 is arranged in cabinet in the structure.It is provided with
After the structure, multiple servers 202 can be coupled in machine box for server while also provide inside points between each server 202
From.Server tray 220 includes lower surface, at least two side walls and the antetheca with hole 114.Has the porose quilt of antetheca 114
Mask wall before being considered, it is allowed air to flow into provide the air-flow of fan circulation.In one embodiment, server support
The lower surface of disk 220 may include the structure for providing spatial tolerance, so that component 214 and 216 does not contact server tray 220.
In this embodiment, component 214 and 216（Or refer also to as cooling component）Positioned at server tray 220 base section and
Between plate.Server tray 220 can be made up of multiple material, be included but is not limited to：Metal, ceramics, plastics, polyurethane etc..
Fig. 2 B show server 202 from front visual angle, and the server includes being used to flow into air to the hole in server 202
114.Connector 110 in Fig. 2A includes Connector Cover 222, and the end cap completely cuts off heat energy the component 214 and 216 in connection
Within.In this embodiment, Connector Cover 222 is heat-insulated to avoid heat energy by connector 110（Such as heat）It is dissipated to sky
In gas.Increase the amount for the heat being discharged into the liquid for flowing through component 214 and 216 using Connector Cover 220.
Fig. 3 A-3B show multiple perspective views of system, and the otch that the system includes cutting out from cabinet 302 is seen clearly with facilitating
Chu.These illustrate the cabinet 302 for including multiple mounted servers.Cooling component and plate are installed inside cabinet 302
Server a part, and thus may not show in these figures.The rear end of cabinet 302 includes component 330, the structure
Part is prominent and couples with heat-insulated frame manifold, so as to further avoid heat from being dissipated in the air of surrounding.Embodiment party herein
In formula, the manifold is arranged towards the rear of cabinet 302 and outside the path for the air-flow that each server internal circulates.This
Embodiment is discussed in detail in the figure below.
In figure 3 a, the otch of cabinet 302 include Connector Cover 328 and cabinet separate shield with by connector relative to
Air-flow protection gets up.Connector Cover 328 and cabinet separate protection conduit system, and the conduit system is arranged on to from each
Server conveying liquid inside cabinet 302.Separating shield by Connector Cover and cabinet protects conduit system to avoid heat
Amount is dissipated in air, and increases the amount for the heat being discharged into liquid.Connector Cover 328 can be by a variety of heat insulator structures
Into including but not limited to resin, plastics, foam, polyurethane, metal or isolation heat are to avoid being dissipated to inside cabinet 302
Other kinds of heat-insulating material in air.The amount for the heat that this increase is discharged into liquid and conveyed from cabinet 302.
In figure 3b, the front portion of cabinet 302 is shown, its mesopore 114 is used to pass air into inside except cabinet 302
Fan outside allow air-flow.The otch of cabinet 302 including shell is to show to separate end cap 332.Separate end cap 332 and pipe is shown
Road, the pipeline are used to convey cooling liquid and heated liquid to from each server in cabinet 302.So, manage
Road, which is connected to, separates end cap 332, and the separation end cap is then connected to manifold.Separate end cap 332 and pipeline and connector are shown, not
The end cap 328 shown in Fig. 3 A is shown.
Fig. 4 A-4B show the perspective view of example system, and the system includes multiple servers in cabinet 302.
Each cabinet includes manifold 430, the manifold for laying pipeline, in the pipeline to each clothes out of cabinet 302
The business cooled liquid of device transmission and heated liquid.Manifold 430 towards cabinet 302 rear installation and including chamber or
Pipe, the chamber or tube capacity receive for each server transport cooling liquid out of cabinet 302 and heated liquid
Pipeline or pipe.Cabinet 302 is considered as being stacked on another cabinet to accommodate multiple servers.Potential dissipation heat arrives
Another region in air is directed towards the manifold 430 at the rear of cabinet 302.So, manifold 430 be arranged into outside cabinet 302 and after
And it is arranged into server rack（It is not shown）, the air circulation of each inside of the frame in multiple servers and leave machine
Outside the path of the air of case 302.
In Figure 4 A, system is illustrated from front visual angle, and the system has hole 114, Connector Cover 328 and installation
The manifold 430 being then arranged in cabinet rear end on server rack.In one embodiment, manifold 430 is covered with guarantor
Protect air of the manifold from leaving cabinet 302.In this embodiment, manifold 430 may include at the side of chamber or edge
Overcover is to prevent air from being mixed with manifold 430.
In figure 4b, system is shown from rear visual angle, for the purpose illustrated, shows Connector Cover 328 from the quilt of cabinet 302
Cut out.Manifold 430 is shown from front, so as to which shield is illustrated as lateral edges.Shield is used to protect the pipeline in manifold 430（Not
Show）Air from leaving cabinet.
Fig. 5 shows the graphical representation of exemplary of the representative multiple air flow speed according to the disclosure.This illustration show captured
The percentage of the heat of the amount of heat or the liquid being discharged into cooling component.So, the diagram represents the row according to the disclosure
The largest percentage for the heat being put into liquid.
Y-axis 502 is represented by the percentage of the heat being discharged into liquid of fluid acquisition.X-axis 504, which represents, enters cooling structure
The fluid temperature of part and the temperature difference entered between the anterior air themperature of server.Thus, x-axis 504 liquid and entrance
Temperature difference between air themperature represents thermal energy differential.Higher airflow rate 508 and lower airflow rate are shown in figure
506.Higher airflow rate 508, which represents, has additional cooling resource（Such as fan）Flow rate.Thus, higher flow rate 508
May include when fan more and/or rotating speed faster when.Lower airflow rate 506 is represented without additional cooling resource
And/or fan without higher rotating speed when flow rate.
For more low-flow speed 506, when the temperature difference value in x-axis 504 is identical, the liquid that is discharged into cooling component
The percent of calories of body is higher in the case of more high gas stream velocities 508.This address the situation in more high gas stream velocities 508
Under, the convective heat transfer of air is higher, it is meant that more heats are lost in air；The heat in air is lost to also with exposure
Increase in the increase of the amount of the cooling component surface area of air.Therefore, lower airflow rate 506 makes airflow rate minimum
The amount changed and then make to be discharged into the heat in liquid maximizes.If the temperature difference in x-axis 504 is very low（Such as fluid temperature
It is close with gas temperature）, thermograde is minimum, therefore is lost to the heat in air and is minimized.Therefore, capture rate is increased
The percentage of percentage or the heat being discharged into liquid, the total amount of the cooling air stream of cooling required can be reduced, this then subtracts
Few cooling resource.
Referring now to Fig. 6 and Fig. 7, the flow chart of multiple examples according to the disclosure is shown.Flow chart, which represents, to be coordinated
The process used with reference to the multiple systems and equipment of preceding figure discussion.Although being shown with particular order, flow chart be not intended to by
So limitation.On the contrary, can be expressly contemplated that, various procedures can be in a different order and/or outside the process with showing
Other processes occur simultaneously.
Fig. 6 is flow chart, the method for showing onboard to manufacture cooling component.Method can be since operation 602, in 602
Cooling component is laid along the lower surface of plate.Cooling component be to from the upper surface of plate transmission liquid physical equipment.Thus,
Cooling component provides cooling agent and removes heated liquid at work.Manufacture method continue to installation cooling component with
Make the component across the midpoint of plate.Cooling component is installed in midpoint from lower surface across plate to upper surface, and cooling component is determined
Position is into adjacent to electric component.After cooling component is positioned adjacent into electric component, cooling component can be set as by cloth from upper surface
Back across midpoint to lower surface.Cooling component is laid along lower surface allow surface area it is most of stopped by plate and/or
It is adiabatic.The surface area of covering cooling component can maximize the amount for the heat being discharged into when cooling component works in liquid.
In operation 602, manufacture method can so start：Cooling component is laid from along the lower surface of plate.Lower surface with it is upper
Surface is parallel, so as to which midpoint is considered as the image point in the plane therebetween of lower surface and upper surface.Across this under
The midpoint in plane between surface and upper surface by cooling component to be deployed to electric component.
In operation 604, after laying cooling component on the lower surface of plate, cooling component is by from lower surface across midpoint
Installed to upper surface.For example, include across midpoint：Through plate to reach upper surface；Extend through from the intermediate region of plate
Plane；And by being reached across edge to reach upper surface across the middle part of plate.
In operation 606, after cooling component is laid along the lower surface of plate and across midpoint, cooling component is oriented to
Neighbouring electric component.Cooling component is positioned adjacent into electric component to represent the close or adjacent electric component cloth of cooling component
Put.This means cooling component may be positioned so that cooling component abuts electric component.Adjacent electric component may include to cool down
Component is positioned on electric component, beside or below.Cooling component is positioned adjacent to electric component and enables cooling component
The enough liquid that the electric component on coldplate is provided.
In operation 608, after cooling component is positioned adjacent to electric component, cooling component is by the upper surface cloth from plate
It is set to lower surface.In this embodiment, this may include to lay cooling component from upper surface back across midpoint to lower surface.Will
Cooling component back means plane or intermediate region of the cooling component across plate from upper surface across midpoint to lower surface, with edge
Back lay lower surface.
Fig. 7 is the flow chart for the exemplary method for manufacturing plate, including installs electric component and cooling component.This method can be carried out
Arrive：Electric component and the installation established between the lower surface of plate and cooling component are installed in the upper surface of plate first.The cooling
Simultaneously laid across the midpoint of plate lower surface of the component along plate.After cooling component is installed with the midpoint across plate, cooling component is determined
Position is into adjacent to electric component mounted on the upper surface of plate.Based on cooling component is positioned adjacent into electric component, cool down
Component is set as from upper surface back across midpoint to lower surface by cloth.This method continues to：In electricity on the upper surface of plate
Installation heat exchanger above device part.
In operation 702, this method can so start：Electric component is installed on the upper surface of plate.Electric component is installed
It may include to adhere to the part so as to which electrical contact is connected with the contact on plate.For example, the example bag of electric component is installed
Include：Electric component is mechanically connected to plate, welding, the electrical connection that gluing or generation is between electric component and plate.
In operation 704, heat guard is installed between the lower surface of plate and cooling component.Heat guard reduces plate and cooling structure
Heat transfer between part.Thus, the heat that insulator can be made up of to be reduced in air multiple material dissipates.This ensures most
Substantial amounts of heat is discharged into the liquid of cooling component.Thus, for example, heat-insulating material may include resin, plastics, poly- ammonia
Ester, glass fibre, foam, coating etc..In one embodiment, insulator is mounted onboard to avoid heat energy from escaping into plate
In.In another embodiment, insulator is arranged on cooling component so that the amount for the heat being discharged into liquid maximizes.
In operation 706, after installation electric component and installation insulator, cooling component is laid along the lower surface of plate.
Operation 706 can be functionally similar to the operation 602 in Fig. 6.
In operation 708, cooling component is installed in this way so that lower surface of the cooling component along plate and in
Point is laid to the upper surface of plate.Operation 708 can be functionally similar to the operation 604 in Fig. 6.
In operation 710, cooling component is positioned adjacent to the electric component on the upper surface of plate.Electric component is positioned
The heat energy from cooling component is allowed to be delivered to electric component into neighbouring processing component.If environment operates in sub-optimal temperature
Under, this heat energy may include to heat and cool down electric component.Operation 710 can be functionally similar to the operation 606 in Fig. 6.
In operation 712, cooling component is deployed to the following table of plate from the position of the electric component on the upper surface of adjoining plate
Face.In this embodiment, cooling component is laid with from the upper surface of plate back across midpoint to the lower surface of plate.Operation
712 can be functionally similar to the operation 608 in Fig. 6.
In operation 714, heat exchanger is installed on the upper surface of plate.Heat exchanger is located on the upper surface of plate
Electric component above.Thus, the installation of heat exchanger include be connected to cooling component so that liquid from heat exchanger enter and
Discharge.This means the heat exchanger for being connected to cooling component is located in above electric component, for for cooling purpose conveying
Cooling liquid conveys the liquid heated for the purpose of warm heat.In the another embodiment of operation 714, have mounted
The plate of cooling component and electric component is installed in server tray.Server tray then can be installed in cabinet.Will
After server tray is installed in cabinet, manifold can be installed on the exterior section of cabinet, so that liquid can inlet and outlet peace
Cooling component on each plate in each server tray.By this way, manifold serves as the centralization of cooling component
Entrance and exit.
Although shown and described herein some embodiments, those of ordinary skill in the art will be fully understood that, for up to
Diversified alternative solution obtained to identical purpose and/or equivalent embodiment or embodiment may replace the sum shown
The embodiment of description, and without departing from the scope of the present disclosure.Those skilled in the art will readily appreciate that embodiment can be with more
Kind mode is implemented.It is intended to cover the reorganization or deformation of embodiments discussed herein.Therefore, it is intended that clearly, embodiment
It is limited solely by the equivalent of claim and claim.
Claims (15)
1. a kind of system, including：
Plate, the plate include first surface, second surface and the midpoint between the first surface and the second surface, institute
State plate be used for support electric component on the first surface；
Cooling component, the second surface of the cooling component along the plate lay with：
Pass through the midpoint from the second surface across the plate to the first surface, transmission cooling liquid to the electricity
Gas part；And
By the midpoint from the first surface across the plate to the second surface, from the electric component along path
The heated liquid of conveying.
2. system according to claim 1, including：
Heat exchanger, the heat exchanger is arranged on above the electric component on the first surface of the plate, described
Heat exchanger includes：
Entrance, for receiving the cooling liquid from the cooling component；And
Outlet, for discharging the heated liquid to the cooling component.
3. system according to claim 1, wherein by passing through institute across the midpoint of the plate, the cooling component
State plate with convey the cooling liquid and along described in delivery pathways be heated liquid.
4. system according to claim 1, wherein the first surface and the second surface are parallel to each other.
5. system according to claim 1, in addition to：
Insulator between the second surface and the cooling component, for making to be maintained in the heated liquid
The amount of heat maximizes.
6. system according to claim 1, including：
Server tray, below the second surface of the plate, for keeping the plate and wherein described cooling component
Between the pallet and the second surface of the plate.
7. system according to claim 1, in addition to：
Server tray, for keeping the plate；
Cabinet, for supporting multiple servers；And
Manifold, the manifold are connected to the cabinet, for each along cooling described in delivery pathways into multiple servers
Liquid and from multiple servers it is each along delivery pathways be heated liquid.
8. a kind of method, including：
Cooling component is laid along the lower surface of plate, the plate includes lower surface, upper surface and in the upper and lower surface
Between midpoint；
The cooling component is installed, so that the midpoint of the cooling component from the lower surface across the plate is to the upper table
Face；
The cooling component is positioned adjacent to electric component on the upper surface of said board；And
The cooling component is deployed to the lower surface from the upper surface of the plate.
9. the method according to claim 11, including：
The electric component is installed to the upper surface of the plate.
10. the method according to claim 11, including：
Heat exchanger is installed above the electric component and the cooling component on the upper surface of the plate.
11. the method according to claim 11, including：
Insulator is installed between the lower surface of the plate and the cooling component.
12. the method according to claim 11, including：
The plate with the cooling component and electric component is installed in server tray；
The server tray is installed in cabinet；And
Install manifold with to the cabinet along delivery pathways cooling liquid and from the cabinet along delivery pathways be heated liquid
Body.
13. a kind of cooling structure, including：
First component, lower surface of the first component along plate lay with：
Across the midpoint between the lower surface of the plate and upper surface；
Cooling liquid is conveyed to the electric component on the upper surface of the plate；And
Second component, the second component be connected to the first component with：
Heated liquid is received from the electric component on the upper surface of the plate；And
By the midpoint to the lower surface from the upper surface across the plate, along the liquid being heated described in delivery pathways
Body.
14. cooling structure according to claim 13, including：
Connector, the connector be connected to the first component and the second component with：
Entrance of the cooling liquid to the first component is provided；And
The heated liquid is provided from the outlet of the second component.
15. cooling structure according to claim 13, wherein, it is across the midpoint of the plate, the first component and institute
State second component and pass through the plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2016/014540 WO2017127109A1 (en) | 2016-01-22 | 2016-01-22 | Routing a cooling member along a board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107615902A true CN107615902A (en) | 2018-01-19 |
| CN107615902B CN107615902B (en) | 2023-01-31 |
Family
ID=59362820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680022610.9A Active CN107615902B (en) | 2016-01-22 | 2016-01-22 | Cooling system, cooling method, and cooling structure |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10791655B2 (en) |
| EP (1) | EP3266290B1 (en) |
| CN (1) | CN107615902B (en) |
| WO (1) | WO2017127109A1 (en) |
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|---|---|---|---|---|
| CN111163585A (en) * | 2020-01-10 | 2020-05-15 | 珠海格力电器股份有限公司 | Circuit board for controller and controller |
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| CN112954949B (en) * | 2019-12-10 | 2024-05-03 | 台达电子工业股份有限公司 | Network equipment power supply and heat dissipation system for network equipment power supply |
| DE102020107173A1 (en) | 2020-03-16 | 2021-09-16 | Bayerische Motoren Werke Aktiengesellschaft | Cooling arrangement for at least one current-carrying component of a motor vehicle |
| KR20240093894A (en) * | 2021-10-25 | 2024-06-24 | 램 리써치 코포레이션 | Microchannel assembly cooled power circuits for power boxes in substrate processing systems |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP3266290A4 (en) | 2018-11-14 |
| WO2017127109A1 (en) | 2017-07-27 |
| CN107615902B (en) | 2023-01-31 |
| US20180359881A1 (en) | 2018-12-13 |
| EP3266290B1 (en) | 2023-03-22 |
| EP3266290A1 (en) | 2018-01-10 |
| US10791655B2 (en) | 2020-09-29 |
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